Matches 1 - 50 out of 331 1 2 3 4 5 6 7 >


Match Document Document Title
US20140099882 NETWORKED COMMUNICATIONS SYSTEM AND SEGMENT ADDRESSABLE COMMUNICATIONS ASSEMBLY BOX, CABLE AND CONTROLLER  
A communication systems providing a fault-tolerant communications path for narrow and broad band communication comprising one or more self-powered satellite units each providing signal information...
US20140293626 THERMALLY CONDUCTIVE SHEET, PROCESS FOR PRODUCING THE SAME, AND RADIATOR UTILIZING THERMALLY CONDUCTIVE SHEET  
A thermally conductive sheet includes a composition containing graphite particles (A) in the form of a scale, an elliptic sphere or a rod, a 6-membered ring plane in a crystal thereof being...
US20070097651 Thermal interface material with multiple size distribution thermally conductive fillers  
A thermal interface material including a matrix and a thermally conductive filler. The thermally conductive filler includes first and a second thermally conductive particulate materials having...
US20050018406 Stack up assembly  
A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed...
US20070000642 Thermally conductive member and cooling system using the same  
A thermally conductive member including a thermal diffusion sheet having at least one opening with an inner periphery; and a thermally conductive elastomer piece passing through the opening of the...
US20050068738 Display apparatus having heat transfer sheet  
A display apparatus includes a display panel and a heat transfer sheet mounted adjacent to one surface of the display panel. A plurality of pores are formed in the heat transfer sheet. The heat...
US20070169345 Decreasing thermal contact resistance at a material interface  
A heat sink assembly in which the interface material is chemically bonded to both the heat source material and the heat sink material. The chemical bonding can lower the contact resistance that...
US20050168941 System and apparatus for heat removal  
A system for removing heat from an encased electronic device. The system includes a thermal ground, conduction pathways including flexible thermal connectors that thermally coupling heat-producing...
US20150301568 Thermal Solutions and Methods for Dissipating Heat from Electronic Devices Using the Same Side of an Anisotropic Heat Spreader  
Example embodiments of the present disclosure generally relate to thermal solutions and methods for dissipating or removing heat from electronic devices using the same side of an anisotropic heat...
US20140153192 MODULE CAGE WITH INTEGRATED EMI ASPECT  
A receptacle assembly with improved EMI leakage reduction is described. The assembly includes a base in the form of either a guide frame or a shielding cage that received an electronic module or...
US20110128706 ELECTRONIC APPARATUS  
An electronic apparatus 100 includes a heat-generating element 1, a heat-radiating plate 4 which is used in heat radiation of the heat-generating element, and a housing 10 which accommodates the...
US20070127212 Mechanical Housing  
An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case...
US20060096737 Heat exchanger  
A heat exchanger having a plurality of fin plates (2) provided in parallel on a face (1a) of a base (1), wherein the fin plate (2) is provided with a rectifier portion (2b) having a tapered cross...
US20050117299 Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling  
A channeled heat sink and a device chassis having one or more integral condensing volumes suited for heat rejecters in conduction with two-phase cooling loops. The channeled heat sink includes a...
US20130308275 ELECTRONIC COMPONENT MOUNTING MODULE AND POWER CONVERSION APPARATUS  
An electronic component mounting module according to an embodiment includes a mounting member, a pressing member, and a fastening member. The mounting member includes a component housing frame...
US20120038849 Expanded Heat Sink for Electronic Displays and Method of Producing the Same  
An expanded heat sink for transferring heat from an electronic display component to a path of cooling air is disclosed. A continuous sheet may define a series of channels where the cooling air is...
US20050117301 Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling  
A channeled heat sink and a device chassis having one or more integral condensing volumes suited for heat rejecters in conduction with two-phase cooling loops. The channeled heat sink includes a...
US20130208422 CONTACT COOLED ELECTRONIC ENCLOSURE  
Various embodiments disclose a system and an associated method to provide cooling to a plurality of electronic components mounted proximately to one another in an electronic enclosure is...
US20100296252 INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF  
Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated...
US20070030653 Anisotropic thermal solution  
A process is presented for forming an anisotropic graphite article, comprising forming a laminate comprising a plurality of flexible graphite sheets which comprise graphene layers; and...
US20060104035 Edge plated printed wiring boards  
Printed wiring board assemblies are described that include printed wiring boards having at least on thermally conductive plane. In addition, the printed wiring boards can also include edge plating...
US20060060328 Heat-transfer devices  
Techniques for heat removal are provided. In one illustrative embodiment, a heat-transfer device is provided. The heat-transfer device comprises at least one heat-dissipating structure thermally...
US20150373827 Chip Heat Dissipation Structure and Terminal Device  
A chip heat dissipation structure disposed on a printed circuit board (PCB), where the chip heat dissipation structure includes a chip card holder and at least one isolation groove; the chip card...
US20140321060 Cu-Diamond Based Solid Phase Sintered Body Having Excellent Heat Resistance, Heat Sink Using The Same, Electronic Device Using The Heat Sink, And Method For Producing Cu-Diamond Based Solid Phase Sintered Body Having Excellent Heat Resistance  
An inexpensive Cu-diamond based composite material having excellent heat conductivity and heat resistance. Conventionally, an infiltration method does not provide a Cu-diamond based composite...
US20100008047 Passive thermal solution for hand-held devices  
The present invention relates to a thermal solution for hand-held devices. In an embodiment, the present invention implements a thermal gap filler and a system enclosure for effective thermal...
US20070193718 Heat sinks and method of formation  
A heat sink (and method of forming a heat sink) is provided that includes a core having a central axis and a plurality of cooling fins arranged about the core. Each fin has a base and a tip. The...
US20100328895 Composite, Thermal Interface Material Containing the Composite, and Methods for Their Preparation and Use  
A composite includes a thermally conductive metal matrix and silicone particles dispersed therein. The composite can be used to form a thermal interface material in an electronic device. The...
US20060040112 Thermal interconnect and interface systems, methods of production and uses thereof  
Layered thermal components described herein include at least one thermal interface component and at least one heat spreader component coupled to the thermal interface component. A method of...
US20090097207 Heat Removal From Electronic Modules  
An electronics assembly for an underwater well installation, comprises a housing; an electrical module located within the housing; and a resiliently deformable member located between the...
US20050207120 Thermal module with heat reservoir and method of applying the same on electronic products  
The present invention discloses a thermal module with heat reservoir, which is arranged with respect to a chip, and the thermal module comprises: a housing, disposed at a appropriate position...
US20120236502 SHEET-SHAPED STRUCTURE, METHOD FOR MANUFACTURING SHEET-SHAPED STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE  
According to an aspect of the embodiments, a sheet-shaped structure includes a bundle structure that includes a plurality of line-shaped structures of carbon atoms, a covering layer that covers...
US20060221573 Heat sink for multiple semiconductor modules  
A system for dissipating heat away from multiple semiconductor modules includes a thermal conductor having a thermally conductive base and multiple thermally conductive semiconductor module...
US20060219386 Heat dissipating assembly with composite heat dissipating structure  
A heat dissipating assembly includes a fan and a composite heat dissipating structure. The composite heat dissipating structure includes a first heat sink and a second heat sink disposed adjacent...
US20060187643 Heat dissipation device and heat dissipation method for electronic equipment  
According to one embodiment, fixing plates are formed to a shield case which covers a circuit board including a circuit component. When a heat sink, which has bent heat dissipation plates and can...
US20060012962 Display device  
A display device, particularly a plasma display device, low in cost and small in mass, having a display panel capable of being prevented from deforming even upon application of an external force...
US20050211416 Heat sink with fins and a method for manufacturing the same  
A heat sink with fins comprising a pillar-shaped base member, and a plurality of fins which are inserted into a plurality of grooves formed in the side face of said base member and then both sides...
US20050117300 Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling  
A channeled heat sink and a device chassis having one or more integral condensing volumes suited for heat rejecters in conduction with two-phase cooling loops. The channeled heat sink includes a...
US20100079942 VIDEO DISPLAY APPARATUS  
The present invention provides a simply usable shield cover capable of enhancing the mechanical strength of a set even if a display device is decreased in thickness. In a video display apparatus...
US20070115635 Passive cooling for fiber to the premise (FTTP) electronics  
A phase change material, including multiple phase change materials of different formulations, is placed in heat transfer association with an electronics enclosure (e.g., a sealed enclosure)...
US20060021736 Pin type heat sink for channeling air flow  
A pin heat sink has a plurality of pins arranged on a base plate. The plurality of pins includes a first plurality of pins arranged to create one or more funnels of air flow directed to one or...
US20050063158 Cooling device for electronic and electrical components  
Cooling apparatus for electronic and electrical components, comprising a closed circuit, through which a cooling medium flows and which has an evaporator, an evaporator hood made from graphite...
US20080066888 HEAT SINK  
A heat sink comprises a base panel having a top surface and a bottom surface. A plurality of pin fins extend outwardly from the top surface and each fin has a cross-sectional configuration with...
US20060209516 Electronic assembly with integral thermal transient suppression  
An electronic assembly with integral thermal transient suppression includes an integrated circuit (IC) chip disposed within a cavity of an IC device package. A transient thermal suppression...
US20050007740 Optimised application of pcms in chillers  
The present invention relates to the use of phase change materials in devices for cooling, in particular, electrical and electronic components.
US20080225489 Heat spreader with high heat flux and high thermal conductivity  
A heat spreader for transferring heat from a heat source to a heat sink using a phase change coolant, includes an array of cells, each cell having at least one microporous wick for supporting...
US20070267174 Heat sink of plasma display apparatus  
As to a heat sink manufacturing method of a plasma display apparatus according to the present invention and the manufacturing device, a widthwise direction air channel and a lengthwise direction...
US20060109631 Method and apparatus for connecting circuit cards employing a cooling technique to achieve desired temperature thresholds and card alignment  
Method and apparatus for interconnecting cards carrying heat generating ICs. A heat sink having a plurality of heat tubes is placed between two cards. The ICs are mounted “face down” so that the...
US20100172101 THERMAL INTERFACE MATERIAL AND METHOD FOR MANUFACTURING THE SAME  
A thermal interface material includes a carbon nanotube array having a plurality of carbon nanotubes, a matrix, and a plurality of heat conductive particles. The carbon nanotube array includes a...
US20080278917 HEAT DISSIPATION MODULE AND METHOD FOR FABRICATING THE SAME  
A heat dissipation module including a substrate, a printed circuit board (PCB), and at least one light emitting diode (LED) chip is provided. A surface of the substrate has at least one...
US20080019097 THERMAL TRANSPORT STRUCTURE  
A thermally manageable system is provided. The system may include a heat-generating unit, a heat-dissipating unit, and a thermal transport structure located between the heat-dissipating unit and...

Matches 1 - 50 out of 331 1 2 3 4 5 6 7 >