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US20140099882 |
NETWORKED COMMUNICATIONS SYSTEM AND SEGMENT ADDRESSABLE COMMUNICATIONS ASSEMBLY BOX, CABLE AND CONTROLLER
A communication systems providing a fault-tolerant communications path for narrow and broad band communication comprising one or more self-powered satellite units each providing signal information... |
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US20140293626 |
THERMALLY CONDUCTIVE SHEET, PROCESS FOR PRODUCING THE SAME, AND RADIATOR UTILIZING THERMALLY CONDUCTIVE SHEET
A thermally conductive sheet includes a composition containing graphite particles (A) in the form of a scale, an elliptic sphere or a rod, a 6-membered ring plane in a crystal thereof being... |
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US20070097651 |
Thermal interface material with multiple size distribution thermally conductive fillers
A thermal interface material including a matrix and a thermally conductive filler. The thermally conductive filler includes first and a second thermally conductive particulate materials having... |
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US20050018406 |
Stack up assembly
A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed... |
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US20070000642 |
Thermally conductive member and cooling system using the same
A thermally conductive member including a thermal diffusion sheet having at least one opening with an inner periphery; and a thermally conductive elastomer piece passing through the opening of the... |
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US20050068738 |
Display apparatus having heat transfer sheet
A display apparatus includes a display panel and a heat transfer sheet mounted adjacent to one surface of the display panel. A plurality of pores are formed in the heat transfer sheet. The heat... |
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US20070169345 |
Decreasing thermal contact resistance at a material interface
A heat sink assembly in which the interface material is chemically bonded to both the heat source material and the heat sink material. The chemical bonding can lower the contact resistance that... |
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US20050168941 |
System and apparatus for heat removal
A system for removing heat from an encased electronic device. The system includes a thermal ground, conduction pathways including flexible thermal connectors that thermally coupling heat-producing... |
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US20150301568 |
Thermal Solutions and Methods for Dissipating Heat from Electronic Devices Using the Same Side of an Anisotropic Heat Spreader
Example embodiments of the present disclosure generally relate to thermal solutions and methods for dissipating or removing heat from electronic devices using the same side of an anisotropic heat... |
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US20140153192 |
MODULE CAGE WITH INTEGRATED EMI ASPECT
A receptacle assembly with improved EMI leakage reduction is described. The assembly includes a base in the form of either a guide frame or a shielding cage that received an electronic module or... |
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US20110128706 |
ELECTRONIC APPARATUS
An electronic apparatus 100 includes a heat-generating element 1, a heat-radiating plate 4 which is used in heat radiation of the heat-generating element, and a housing 10 which accommodates the... |
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US20070127212 |
Mechanical Housing
An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case... |
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US20060096737 |
Heat exchanger
A heat exchanger having a plurality of fin plates (2) provided in parallel on a face (1a) of a base (1), wherein the fin plate (2) is provided with a rectifier portion (2b) having a tapered cross... |
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US20050117299 |
Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling
A channeled heat sink and a device chassis having one or more integral condensing volumes suited for heat rejecters in conduction with two-phase cooling loops. The channeled heat sink includes a... |
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US20130308275 |
ELECTRONIC COMPONENT MOUNTING MODULE AND POWER CONVERSION APPARATUS
An electronic component mounting module according to an embodiment includes a mounting member, a pressing member, and a fastening member. The mounting member includes a component housing frame... |
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US20120038849 |
Expanded Heat Sink for Electronic Displays and Method of Producing the Same
An expanded heat sink for transferring heat from an electronic display component to a path of cooling air is disclosed. A continuous sheet may define a series of channels where the cooling air is... |
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US20050117301 |
Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling
A channeled heat sink and a device chassis having one or more integral condensing volumes suited for heat rejecters in conduction with two-phase cooling loops. The channeled heat sink includes a... |
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US20130208422 |
CONTACT COOLED ELECTRONIC ENCLOSURE
Various embodiments disclose a system and an associated method to provide cooling to a plurality of electronic components mounted proximately to one another in an electronic enclosure is... |
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US20100296252 |
INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF
Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated... |
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US20070030653 |
Anisotropic thermal solution
A process is presented for forming an anisotropic graphite article, comprising forming a laminate comprising a plurality of flexible graphite sheets which comprise graphene layers; and... |
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US20060104035 |
Edge plated printed wiring boards
Printed wiring board assemblies are described that include printed wiring boards having at least on thermally conductive plane. In addition, the printed wiring boards can also include edge plating... |
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US20060060328 |
Heat-transfer devices
Techniques for heat removal are provided. In one illustrative embodiment, a heat-transfer device is provided. The heat-transfer device comprises at least one heat-dissipating structure thermally... |
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US20150373827 |
Chip Heat Dissipation Structure and Terminal Device
A chip heat dissipation structure disposed on a printed circuit board (PCB), where the chip heat dissipation structure includes a chip card holder and at least one isolation groove; the chip card... |
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US20140321060 |
Cu-Diamond Based Solid Phase Sintered Body Having Excellent Heat Resistance, Heat Sink Using The Same, Electronic Device Using The Heat Sink, And Method For Producing Cu-Diamond Based Solid Phase Sintered Body Having Excellent Heat Resistance
An inexpensive Cu-diamond based composite material having excellent heat conductivity and heat resistance. Conventionally, an infiltration method does not provide a Cu-diamond based composite... |
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US20100008047 |
Passive thermal solution for hand-held devices
The present invention relates to a thermal solution for hand-held devices. In an embodiment, the present invention implements a thermal gap filler and a system enclosure for effective thermal... |
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US20070193718 |
Heat sinks and method of formation
A heat sink (and method of forming a heat sink) is provided that includes a core having a central axis and a plurality of cooling fins arranged about the core. Each fin has a base and a tip. The... |
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US20100328895 |
Composite, Thermal Interface Material Containing the Composite, and Methods for Their Preparation and Use
A composite includes a thermally conductive metal matrix and silicone particles dispersed therein. The composite can be used to form a thermal interface material in an electronic device. The... |
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US20060040112 |
Thermal interconnect and interface systems, methods of production and uses thereof
Layered thermal components described herein include at least one thermal interface component and at least one heat spreader component coupled to the thermal interface component. A method of... |
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US20090097207 |
Heat Removal From Electronic Modules
An electronics assembly for an underwater well installation, comprises a housing; an electrical module located within the housing; and a resiliently deformable member located between the... |
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US20050207120 |
Thermal module with heat reservoir and method of applying the same on electronic products
The present invention discloses a thermal module with heat reservoir, which is arranged with respect to a chip, and the thermal module comprises: a housing, disposed at a appropriate position... |
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US20120236502 |
SHEET-SHAPED STRUCTURE, METHOD FOR MANUFACTURING SHEET-SHAPED STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
According to an aspect of the embodiments, a sheet-shaped structure includes a bundle structure that includes a plurality of line-shaped structures of carbon atoms, a covering layer that covers... |
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US20060221573 |
Heat sink for multiple semiconductor modules
A system for dissipating heat away from multiple semiconductor modules includes a thermal conductor having a thermally conductive base and multiple thermally conductive semiconductor module... |
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US20060219386 |
Heat dissipating assembly with composite heat dissipating structure
A heat dissipating assembly includes a fan and a composite heat dissipating structure. The composite heat dissipating structure includes a first heat sink and a second heat sink disposed adjacent... |
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US20060187643 |
Heat dissipation device and heat dissipation method for electronic equipment
According to one embodiment, fixing plates are formed to a shield case which covers a circuit board including a circuit component. When a heat sink, which has bent heat dissipation plates and can... |
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US20060012962 |
Display device
A display device, particularly a plasma display device, low in cost and small in mass, having a display panel capable of being prevented from deforming even upon application of an external force... |
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US20050211416 |
Heat sink with fins and a method for manufacturing the same
A heat sink with fins comprising a pillar-shaped base member, and a plurality of fins which are inserted into a plurality of grooves formed in the side face of said base member and then both sides... |
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US20050117300 |
Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling
A channeled heat sink and a device chassis having one or more integral condensing volumes suited for heat rejecters in conduction with two-phase cooling loops. The channeled heat sink includes a... |
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US20100079942 |
VIDEO DISPLAY APPARATUS
The present invention provides a simply usable shield cover capable of enhancing the mechanical strength of a set even if a display device is decreased in thickness. In a video display apparatus... |
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US20070115635 |
Passive cooling for fiber to the premise (FTTP) electronics
A phase change material, including multiple phase change materials of different formulations, is placed in heat transfer association with an electronics enclosure (e.g., a sealed enclosure)... |
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US20060021736 |
Pin type heat sink for channeling air flow
A pin heat sink has a plurality of pins arranged on a base plate. The plurality of pins includes a first plurality of pins arranged to create one or more funnels of air flow directed to one or... |
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US20050063158 |
Cooling device for electronic and electrical components
Cooling apparatus for electronic and electrical components, comprising a closed circuit, through which a cooling medium flows and which has an evaporator, an evaporator hood made from graphite... |
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US20080066888 |
HEAT SINK
A heat sink comprises a base panel having a top surface and a bottom surface. A plurality of pin fins extend outwardly from the top surface and each fin has a cross-sectional configuration with... |
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US20060209516 |
Electronic assembly with integral thermal transient suppression
An electronic assembly with integral thermal transient suppression includes an integrated circuit (IC) chip disposed within a cavity of an IC device package. A transient thermal suppression... |
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US20050007740 |
Optimised application of pcms in chillers
The present invention relates to the use of phase change materials in devices for cooling, in particular, electrical and electronic components. |
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US20080225489 |
Heat spreader with high heat flux and high thermal conductivity
A heat spreader for transferring heat from a heat source to a heat sink using a phase change coolant, includes an array of cells, each cell having at least one microporous wick for supporting... |
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US20070267174 |
Heat sink of plasma display apparatus
As to a heat sink manufacturing method of a plasma display apparatus according to the present invention and the manufacturing device, a widthwise direction air channel and a lengthwise direction... |
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US20060109631 |
Method and apparatus for connecting circuit cards employing a cooling technique to achieve desired temperature thresholds and card alignment
Method and apparatus for interconnecting cards carrying heat generating ICs. A heat sink having a plurality of heat tubes is placed between two cards. The ICs are mounted “face down” so that the... |
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US20100172101 |
THERMAL INTERFACE MATERIAL AND METHOD FOR MANUFACTURING THE SAME
A thermal interface material includes a carbon nanotube array having a plurality of carbon nanotubes, a matrix, and a plurality of heat conductive particles. The carbon nanotube array includes a... |
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US20080278917 |
HEAT DISSIPATION MODULE AND METHOD FOR FABRICATING THE SAME
A heat dissipation module including a substrate, a printed circuit board (PCB), and at least one light emitting diode (LED) chip is provided. A surface of the substrate has at least one... |
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US20080019097 |
THERMAL TRANSPORT STRUCTURE
A thermally manageable system is provided. The system may include a heat-generating unit, a heat-dissipating unit, and a thermal transport structure located between the heat-dissipating unit and... |