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US20110216505 Aircraft Electronics Cooling Apparatus For An Aircraft Having A Liquid Cooling System  
The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system (2), the aircraft electronics cooling system providing a thermal coupling...
US20070188993 Quasi-radial heatsink with rectangular form factor and uniform fin length  
In some embodiments, a heatsink includes a thermally conductive core and at least ten thermally conductive fins extending quasi-radially from the thermally conductive core, wherein most of the...
US20060196640 VAPOR CHAMBER WITH BOILING-ENHANCED MULTI-WICK STRUCTURE  
A heat transfer device includes a chamber with a condensable fluid with an evaporative region coupled to a heat source. Within the chamber is a boiling-enhanced multi-wick structure.
US20150257249 Heat Sink With Protrusions On Multiple Sides Thereof And Apparatus Using The Same  
Embodiments of a thermal management unit and an electronic apparatus utilizing the thermal management unit are described. In one aspect, the thermal management unit includes a heat sink. The heat...
US20090040726 Vapor chamber structure and method for manufacturing the same  
A vapor chamber structure includes a casing, a working fluid, a wick layer, a plurality of structure strengthening bodies, and a plurality of backflow accelerating bodies. The casing has an...
US20060067052 Liquid cooling system  
In some embodiments, a multi-processor system board has at least a first processor installed on the system board and at least a first liquid cooling system configured to provide dedicated cooling...
US20060000584 Advanced microelectronic heat dissipation package and method for its manufacture  
Heat dissipation during the operation of integrated circuit chips is an old problem that continues to get worse. The present invention significantly ameliorates this by placing an embedded heat...
US20140321056 ELECTRONIC SUBSTRATE HOUSING EQUIPMENT AND ELECTRIC APPARATUS  
An electronic substrate 200A mounts a heater element 220. A chassis 300A houses an electronic substrate 200 in an airtight manner. A cooling unit 400 cools the electronic substrate 200. The...
US20160120067 SYSTEM AND METHODS FOR COOLING ELECTRONIC EQUIPMENT  
Systems and methods for cooling an inverter of a variable frequency drive that drives a compressor in a cooling system for electronic equipment are disclosed. The system includes a first fluid...
US20070284089 Method, apparatus and system for carbon nanotube wick structures  
A method, apparatus and system are described for carbon nanotube wick structures. The system may include a frame and an apparatus. The apparatus may include a heat exchanger, a cold plate with a...
US20060243425 INTEGRATED CIRCUIT HEAT PIPE HEAT SPREADER WITH THROUGH MOUNTING HOLES  
A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the...
US20160073548 COOLING MODULE, COOLING MODULE MOUNTING BOARD AND ELECTRONIC DEVICE  
A cooling module includes a casing that stores a heating element and a coolant in which the heating element is immersed; and a liquid channel through which a cooling liquid that condenses vapor of...
US20130208422 CONTACT COOLED ELECTRONIC ENCLOSURE  
Various embodiments disclose a system and an associated method to provide cooling to a plurality of electronic components mounted proximately to one another in an electronic enclosure is...
US20120206880 THERMAL SPREADER WITH PHASE CHANGE THERMAL CAPACITOR FOR ELECTRICAL COOLING  
A cooling assembly comprises an electronic component, a thermal spreader, a cold plate, and a phase change thermal capacitor. The thermal spreader conducts heat freely between the electronic...
US20100157535 HEAT-TRANSPORTING DEVICE AND ELECTRONIC APPARATUS  
A heat-transporting device includes a working fluid, a vessel, a vapor-phase flow path, a liquid-phase flow path, and an intermediate layer. The working fluid transports heat using a phase change....
US20090097205 ELECTRONIC EQUIPMENT SYSTEM  
In a space of a data center or the like where many disk array apparatuses and electronic equipment systems are arranged, it is an object of the present invention to reduce the energy required for...
US20060144573 Cooling device and electronic device  
In a cooling device, an electronic component is attached to one surface on one side of a heat pipe so that heat can be conveyed, a first heat-radiating fin is provided on another surface on...
US20080123297 Hybrid clamshell blade system  
A hybrid clamshell system encapsulates two of the six sides of an electronic circuit board to provide a high heat density solution and environmental protection. The clamshell enclosures seal to...
US20070153480 MULTI-FLUID COOLANT SYSTEM  
A system using a multi-fluid coolant. Immiscible or miscible fluids may be put through one or more channels. A device to be cooled may be thermally coupled to the channels. The boiling point of...
US20060144565 Heat dissipation devices and fabrication methods thereof  
This invention id related to a heat dissipation device comprises a case having a heat dissipation path, a backflow path, a first link path, and a second link path for working fluid to circulate...
US20080043436 THERMAL MODULE  
A thermal module (10) includes a chassis (11) of an enclosure of an electronic device, a fin assembly (13) and a centrifugal blower (14) for producing an airflow flowing through the fin assembly....
US20070089864 HEAT PIPE WITH COMPOSITE WICK STRUCTURE  
A heat pipe (10) includes a longitudinal casing (12) having an evaporator section (121) and a condenser section (122), a major wick structure (14) disposed in an inner wall of the casing, at least...
US20070012429 Heat Transfer Device  
A heat transfer device includes a vapor chamber that houses a phase change material such as water. The heat transfer device may be selectively formed from a combination of polymeric and...
US20050207120 Thermal module with heat reservoir and method of applying the same on electronic products  
The present invention discloses a thermal module with heat reservoir, which is arranged with respect to a chip, and the thermal module comprises: a housing, disposed at a appropriate position...
US20170156240 COOLED POWER ELECTRONIC ASSEMBLY  
A power electronic assembly comprising a power electronic module incorporating multiple of semiconductor power electronic switch components, the power electronic module comprising a base plate, a...
US20120307452 PORTABLE ELECTRONIC DEVICE WITH HEAT PIPE  
An exemplary portable electronic device includes a printed circuit board, a heat generating electronic component mounted on the printed circuit board, a shell housing the printed circuit board,...
US20070158052 HEAT-DISSIPATING DEVICE AND METHOD FOR MANUFACTURING SAME  
A vacuum heat-dissipating device (300) includes a container (310), a top wall (320) coupled to the container, and working fluid sealed in the heat-dissipating device. The container includes a...
US20070115635 Passive cooling for fiber to the premise (FTTP) electronics  
A phase change material, including multiple phase change materials of different formulations, is placed in heat transfer association with an electronics enclosure (e.g., a sealed enclosure)...
US20050284616 Advanced microelectronic heat dissipation package and method for its manufacture  
Heat dissipation during the operation of integrated circuit chips is an old problem that continues to get worse. The present invention significantly ameliorates this by placing an embedded heat...
US20100157533 HEAT-TRANSPORTING DEVICE, ELECTRONIC APPARATUS, AND METHOD OF PRODUCING A HEAT-TRANSPORTING DEVICE  
A heat-transporting device includes a working fluid, a vessel, a vapor-phase flow path, and a liquid-phase flow path. The working fluid transports heat using a phase change. The vessel seals in...
US20060243427 Heat pipe heat sink and method for fabricating the same  
A heat pipe heat sink and a method for making the same are disclosed. A heat pipe heat sink 1 has a heat block 2 which is heat exchangeably mounted to a heat exchange object, and the heat block 2...
US20050063158 Cooling device for electronic and electrical components  
Cooling apparatus for electronic and electrical components, comprising a closed circuit, through which a cooling medium flows and which has an evaporator, an evaporator hood made from graphite...
US20070263355 HEAT DISSIPATION SYSTEM  
A heat dissipation system is used for dissipating heat generated by an electronic device. The heat dissipation system includes a computer enclosure containing the electronic device therein. The...
US20070068657 Sheet -shaped heat pipe and method of manufacturing the same  
A sheet-shaped heat pipe including working fluid, a partition plate having a vapor flow path which is formed by a concave portion provided in a spacer and through which vapor of the working fluid...
US20070006997 Heat sink structure  
A heat sink has a first vent and a second vent. The heat sink includes at least a first heat-dissipating fin having a first wall positioned at the first vent.
US20160128234 COOLING DEVICE AND ELECTRONIC APPARATUS  
A cooling device including: a heat receiver in which a working fluid is enclosed, a heat sink in which the working fluid is enclosed, an air tube made of metal so as to have flexibility, the air...
US20120147561 HEAT DISSIPATION DEVICE, HEAT DISSIPATION METHOD FOR COMMUNICATION DEVICE, AND COMMUNICATION DEVICE  
Embodiments of the present invention disclose a heat dissipation device, including: a closed shell and a temperature control device. The temperature control device includes: a cold storage medium...
US20080236795 LOW-PROFILE HEAT-SPREADING LIQUID CHAMBER USING BOILING  
Systems and fabrication methods are disclosed for a heat spreader to cool a device. The heat spreader has first and second opposing proximal surfaces defining a chamber having a liquid therein;...
US20160021786 ELECTRONIC APPARATUS  
According to one embodiment, an electronic apparatus includes a housing, a heat-producing element, a first heat absorber, a second heat absorber and a heat transfer member. The heat-producing...
US20090190303 HEAT DISSIPATION PLATE, GAP ADJUSTING JIG FOR HEAT DISSIPATION AND MOTHERBOARD  
A gap adjusting jig for heat dissipation is suitable to hold at least a heat source of a plate-shaped module. The gap adjusting jig for heat dissipation includes a first heat dissipation plate and...
US20100302734 HEATSINK AND METHOD OF FABRICATING SAME  
A heatsink assembly for cooling a heated device includes a ceramic substrate having a plurality of cooling fluid channels integrated therein. The ceramic substrate includes a topside surface and a...
US20080135215 HEAT DISSIPATION DEVICE  
A heat dissipation device includes a heat sink including a base and a plurality of fins on the base. Each of the fins includes a body stamped with at least a flap toward an adjacent fin. A...
US20070000646 HEAT DISSIPATION DEVICE WITH HEAT PIPE  
A heat dissipation device is for contacting with a heat generating electronic device to remove heat from the electronic device. The heat dissipation device includes a base, a plurality of fins...
US20050099775 Pumped liquid cooling for computer systems using liquid metal coolant  
Apparatus and method are provided to enable cooling electronic components in computer systems using liquid metal as a coolant. The liquid metal coolant extracts heat generated by an electronic...
US20130063896 HEATSINK APPARATUS AND ELECTRONIC DEVICE HAVING SAME  
A heatsink apparatus performs cooling by circulating a working fluid and causing a phase change between a liquid phase and a gas phase. The heatsink apparatus includes a box-shaped heat receiver,...
US20090180250 PEAK-LOAD COOLING OF ELECTRONIC COMPONENTS BY PHASE-CHANGE MATERIALS  
Cooling device for electronic components, in particular for power electronics in an aircraft, comprising an energy storage device which is in heat-conducting communication with at least one...
US20080093056 THERMAL MODULE  
A thermal module (100) includes a centrifugal blower (10) including a base plate (142), a top cover (16) and a sidewall (144) disposed between the base plate and the top cover and defining two air...
US20060037737 Heat dissipation apparatus and vapor chamber thereof  
A heat dissipation apparatus and a vapor chamber thereof. The heat dissipation apparatus comprises a heat sink and a vapor chamber for dissipating heat from a heat source of an electric device....
US20160029511 ELECTRONIC DEVICE INCLUDING HEATING ELEMENT  
A heat transfer apparatus is provided. The heat transfer apparatus includes a first thermal conductor. The heat transfer apparatus also includes a second thermal conductor. The heat transfer...
US20110075369 ELECTRONIC DEVICE  
An electronic device including a heat generation element, a heat dissipation plate, and a heat pipe is provided. The heat dissipation plate includes a top surface, a bottom surface, a pair of...
Matches 1 - 50 out of 242 1 2 3 4 5 >