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Match Document Document Title
US20110141692 CONDUCTION COOLED CIRCUIT BOARD ASSEMBLY  
A conduction cooled circuit board assembly may include a frame and at least one circuit board attached to the frame, having at least one area to be cooled. The assembly may also include at least...
US20130329357 GASKETS FOR THERMAL DUCTING AROUND HEAT PIPES  
The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the...
US20110096502 PRINTED CIRCUIT BOARD ASSEMBLY  
A printed circuit board assembly includes a heat sink, a back board, and a securing member. The heat sink is configured to be mounted on a heat generating element of a printed circuit board. The...
US20120106084 Heat Pipe, Method For Manufacturing A Heat Pipe, And A Circuit Board With A Heat Pipe Function  
A heat pipe for cooling an exothermic body by the vaporization and condensation of an enclosed cooling medium is disclosed. The heat pipe comprises a flat plate-like upper plate, a flat plate-like...
US20140160679 INTERFACE CARD COOLING UISNG HEAT PIPES  
A device may have: a frame section having a cage with a first receiving portion and a second receiving portion, the second receiving portion receiving a module; a first plate having an end, the...
US20120244742 LOW PROFILE HEAT DISSIPATING SYSTEM WITH FREELY-ORIENTED HEAT PIPE  
A heat dissipating system adapted to dissipate heat generated from an IC package mounted onto a socket connector, comprises a heat dissipating device comprising a heat spreader embedded with at...
US20130070418 HEAT DISSIPATION MODULE  
An electronic device includes printed circuit board having an electronic component and a heat dissipation module mounted the printed circuit board. The heat dissipation module includes a base with...
US20110149516 ELECTRONIC SYSTEM AND HEAT DISSIPATION DEVICE THEREOF  
A heat dissipation device for an electronic component mounted on a circuit board includes a heat pipe and a fastening assembly. The heat pipe includes an evaporation section and a condensation...
US20110292608 HEAT DISSIPATION DEVICE  
An exemplary heat dissipation device includes first and second heat sinks adapted for being thermally attached to first and second electronic components, respectively; and a heat pipe thermally...
US20140192480 MOBILE COMPUTING DEVICE DOCK STATION WITH HEADSET JACK HEAT PIPE INTERFACE  
An improved electronic communications system 100 features a holder assembly 104 such as a mobile computing device dock station 106 and dock heat exchanger providing an external heat sink 162 which...
US20110075371 ELECTRONIC DEVICE  
According to one embodiment, an electronic device includes a housing, a circuit board, a thermally radiative section, a first heat generator, a second heat generator, a first heat receiving block,...
US20120281358 COOLED ELECTRONIC SYSTEM WITH THERMAL SPREADERS COUPLING ELECTRONICS CARDS TO COLD RAILS  
Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card...
US20150062802 HEAT PIPE ASSEMBLIES  
Heat pipe assemblies for Information Handling Systems (IHSs). In some embodiments, an IHS may comprise a motherboard including a Central Processing Unit (CPU); a cooling system coupled to the...
US20140321059 HEAT DISSIPATION MODULE WITH HEAT PIPE  
A heat dissipation module configured on a substrate having a heat producing element thereon includes a holder configured on the substrate and a heat sink having a base opposite to the heat...
US20120218711 COOLING SYSTEM FOR ELECTRONIC EQUIPMENT  
In a cooling system for an electronic device of the present invention, server rooms in which a plurality of servers are placed, an evaporator which is provided close to each of the servers, and...
US20110063798 HEAT-MANAGEMENT SYSTEM FOR A CABINET CONTAINING ELECTRONIC EQUIPMENT  
A heat-management system is described for use in a cabinet containing electronic equipment (15) that produces a flow of heated air when in operation. The system comprises: an evaporator (32)...
US20120307452 PORTABLE ELECTRONIC DEVICE WITH HEAT PIPE  
An exemplary portable electronic device includes a printed circuit board, a heat generating electronic component mounted on the printed circuit board, a shell housing the printed circuit board,...
US20130088836 HEAT DISSIPATION STRUCTURE FOR ELECTRONIC DEVICE  
A heat dissipation structure in which an IC chip that generates heat is mounted on a substrate and a heat dissipation sheet is interposed between a cover member and the IC chip to dissipate heat,...
US20120063092 HEAT-DISSIPATING DEVICE AND ELECTRIC APPARATUS HAVING THE SAME  
A heat-dissipating device and an electronic apparatus having the same are disclosed. The heat-dissipating device includes a heat-transferring heat pipe unit having a wick type of a heat pipe, in...
US20080073061 Variable depth microchannels  
A channel heat exchanger and cooling system with plan-wise variable rate of cooling that corresponds, in part, to a plan-wise variable heat flux and a method of manufacturing and using same.
US20140146475 FLEXIBLE THERMAL INTERFACE FOR ELECTRONICS  
A planar heat pipe for removing heat from an electronic device. The heat pipe includes a planar portion defining a cool end of the heat pipe and a plate portion mounted to the electronic device...
US20080266803 Phase change cooled electrical bus structure  
A technique for cooling electrical bus structures is disclosed, in which a phase change heat spreader is thermally coupled to the bus. A continuous phase change cycle occurs within the heat...
US20120162918 Passive Cabinet Cooling  
An arrangement and a method for transferring surplus heat away from electronic components. An arrangement (300) at a rack (302) for transfering surplus heat away from at least one heat generating...
US20130044432 LOOP HEAT PIPE, AND ELECTRONIC APPARATUS INCLUDING LOOP HEAT PIPE  
There is provided a loop heat pipe which includes an evaporator that internally includes at least one wick built, a condenser, a liquid pipe and a vapor pipe that connect the evaporator and the...
US20130120937 HEAT DISSIPATION MODULE  
A heat dissipation module for an electronic component is provided. The heat dissipation module includes a supporting structure and a heat pipe. The supporting structure is adjacent to the heat...
US20110110042 ELECTRONIC DEVICE ASSEMBLY WITH HEAT DISSIPATION DEVICE  
An exemplary electronic device assembly includes a printed circuit board with an electronic component thereon, and a heat dissipation device. The heat dissipation device includes a heat sink...
US20080205003 Redundant Cooling Systems And Methods  
Redundant cooling systems and methods are disclosed. In an exemplary embodiment, a method for redundant cooling system of computer systems and other electronics may comprise thermally connecting a...
US20140078673 HEAT TRANSFER ASSEMBLY WITH HEAT PIPE BRACE AND METHOD FOR ASSEMBLING A HEAT TRANSFER ASSEMBLY  
An electronics device and method for assembling a heat transfer assembly of the same. An electronics device includes a circuit board, a chassis that houses the circuit board, a heat pipe...
US20080087406 Cooling system and associated method for planar pulsating heat pipe  
A cooling assembly, system, and method are provided. The cooling assembly includes a plate comprising a plurality of channels defined in a surface of the plate and at least one pulsating heat pipe...
US20150062804 VALVE CONTROLLED, NODE-LEVEL VAPOR CONDENSATION FOR TWO-PHASE HEAT SINK(S)  
Apparatuses are provided for cooling an electronic component(s), which include a heat sink coupled to the electronic component(s), and having a coolant-carrying channel for a first coolant. The...
US20140285971 HAND POWER TOOL  
A hand power tool, in particular an angle grinder, includes a drive unit, an electronic unit, and a cooling device configured, at least partially, to cool the drive unit and/or the electronic...
US20150062820 HEAT TRANSFER FOR ELECTRONIC EQUIPMENT  
An apparatus is provided that includes a planar heat conducting material that comprises a first heat sink conduction portion configured to conduct heat between a first integrated circuit and a...
US20070215328 Coated heat sink  
A coated heat sink includes: a copper base seat, an aluminum heat-dissipating seat, a plurality of heat pipes, a solder, a heat-conducting adhesive glue, and a plurality of heat-dissipating fins....
US20130027883 FLOW BOILING HEAT SINK STRUCTURE WITH VAPOR VENTING AND CONDENSING  
A heat sink, and cooled electronic structure and cooled electronic apparatus utilizing the heat sink, are provided. The heat sink is fabricated of a thermally conductive structure which includes...
US20060137860 Heat flux based microchannel heat exchanger architecture for two phase and single phase flows  
An apparatus, system, and method to cool a non-uniform heat source using a micro-channel heat exchanger.
US20110069454 LIQUID-COOLED ELECTRONICS APPARATUS AND METHODS OF FABRICATION  
Liquid-cooled electronics apparatuses and methods are provided. The cooled electronics apparatuses include a liquid-cooled cold rail and an electronics subassembly. The liquid-cooled cold rail has...
US20060207750 Heat pipe with composite capillary wick structure  
A heat pipe (20) includes a metal casing (22) having an evaporating section (70) and a condensing section (80). A first type of capillary wick (241) is provided in the evaporating section and a...
US20100321888 ELECTRONIC DEVICE  
According to one embodiment, an electronic device includes a printed wiring board, a first heat generating part and a second heat generating part secured to one surface of the printed wiring...
US20140071626 VAPOR CONDENSER WITH THREE-DIMENSIONAL FOLDED STRUCTURE  
A vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with...
US20130039011 HEAT-DISSIPATING MODULE  
A heat-dissipating module applied to a circuit board having an electronic element is disclosed. The heat-dissipating module includes a plurality of connecting portions, a contacting portion and a...
US20130135822 COOLING MODULE  
A cooling module applicable in an electronic device is provided. The electronic device includes a plurality of first heat sources and a plurality of second heat sources. The cooling module...
US20150116941 FABRICATING COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER  
Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold...
US20140043766 MULTI-LAYER MESH WICKS FOR HEAT PIPES  
Methods for fabricating heat pipes and heat pipes therefrom are provided. The heat pipe (400) includes a heat pipe body (402) having an inner cavity (408), and a wick structure (404) disposed in...
US20140268572 ADVANCED COOLING FOR POWER MODULE SWITCHES  
A system includes an electronic device, a heat spreader with a vapor chamber attached to a bottom end of the electronic device, so that heat flows from the electronic device to the heat spreader,...
US20070056713 Integrated cooling design with heat pipes  
Methods and apparatus are provided for a cooling system (100) for cooling a microelectronic device (102). The system includes a heat sink (104) and first and second heat pipes (106, 108). The heat...
US20070240859 Capillary structure of heat pipe  
A capillary structure of a heat pipe includes a hollow pipe body and a capillary structure adhered to the inner wall of the pipe body. The main part of the pipe body is provided with at least one...
US20120069522 THERMAL MODULE AND ELECTRONIC DEVICE INCORPORATING THE SAME  
An electronic device includes a circuit board and a thermal module mounted thereon. The circuit board has a heat-generating chip and an electromagnetic interference (EMI) source mounted thereon....
US20130070420 FLOW BOILING HEAT SINK WITH VAPOR VENTING AND CONDENSING  
A method is provided for facilitating extraction of heat from a heat-generating electronic component. The method includes providing a heat sink, the heat sink including a thermally conductive...
US20060243427 Heat pipe heat sink and method for fabricating the same  
A heat pipe heat sink and a method for making the same are disclosed. A heat pipe heat sink 1 has a heat block 2 which is heat exchangeably mounted to a heat exchange object, and the heat block 2...
US20150055300 HEAT DISSIPATION STRUCTURE AND HANDHELD ELECTRONIC DEVICE WITH THE HEAT DISSIPATION STRUCTURE  
A heat dissipation structure includes a heat conduction support body disposed in a handheld electronic device. The heat conduction support body has a first face and a second face opposite to the...

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