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US20050057900 |
Heat dissipating circulatory system with sputtering assembly
A heat dissipating circulatory system (8) includes a pool (7) for receiving an operating fluid, a pump (3), a heat spreader (2) and a condenser (4). A first pipe (51) interconnects an output end... |
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US20120162918 |
Passive Cabinet Cooling
An arrangement and a method for transferring surplus heat away from electronic components. An arrangement (300) at a rack (302) for transfering surplus heat away from at least one heat generating... |
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US20140133099 |
AIR-COOLING AND VAPOR-CONDENSING DOOR ASSEMBLY
A method is provided which includes providing a cooling apparatus which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly... |
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US20110019364 |
System And Method For Attaching Liquid Cooling Apparatus To A Chassis
A system for attaching liquid cooling apparatus includes a fan, a chassis and a grill. The chassis is configured to house electronic components in an interior volume and has an air flow opening... |
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US20140362530 |
COOLING DEVICE
A device for cooling at least two distinct heat sources comprises a closed circuit in which a diphasic fluid flows. At least one capillary evaporator is configured to be placed in thermo contact... |
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US20080307806 |
COOLING SYSTEM AND METHOD UTILIZING THERMAL CAPACITOR UNIT(S) FOR ENHANCED THERMAL ENERGY TRANSFER EFFICIENCY
A cooling system and method are provided which include a facility cooling unit, a cooling tower, and one or more thermal capacitor units. The facility cooling unit, which includes a heat... |
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US20090040722 |
HEAT DISSIPATION MODULE AND DETACHABLE EXPANSION CARD USING THE SAME
A heat-dissipation module dissipating heat for a heat-generating element on circuit board and including a heat-transferring base, a base, a first heat-dissipation unit, a heat pipe and a second... |
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US20100302729 |
HIGH POWER SOLID STATE POWER CONTROLLER PACKAGING
A high power solid state power controller packaging system and power panel are disclosed. The high power solid state power controller packaging system includes a plurality of discrete power... |
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US20070217152 |
Integrated liquid cooled heatsink system
An integrated liquid cooled heatsink that combines all the components of a typical liquid cooling heatsink system in one single assembly. This integrated heatsink system combines a forced... |
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US20130314874 |
HEAT RADIATION SYSTEM FOR POWER MODULE
Disclosed herein is a heat radiation system for a power module, including: a heat radiation member having an internal space and a cooling medium circulated in the internal space; a heat generation... |
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US20100110634 |
METHOD AND APPARATUS FOR AN ENVIRONMENTALLY-PROTECTED ELECTRONIC EQUIPMENT ENCLOSURE
A method and apparatus for an electronic equipment enclosure that provides directed airflow only to those volumes within the enclosure that require the airflow. The electronic equipment enclosure... |
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US20090103266 |
COOLING SYSTEM EMPLOYING A HEAT EXCHANGER WITH PHASE CHANGE MATERIAL, AND METHOD OF OPERATION THEREOF
A heat exchanger for use, e.g., in a rear door of a server rack in a computer room, made up of pipes clad with a layer of a phase change material, such as a paraffin, so that latent heat is... |
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US20080011455 |
Composite heat-dissipating module
A composite heat-dissipating module includes a base, at least one fin unit, a stirring unit, and at least two horizontal air-feeding units. The base includes a top face, a bottom face, and a... |
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US20100265659 |
ELECTRIC DRIVE
An electric drive is disclosed which includes at least a choke unit, a power step unit, and a capacitor unit for implementing power supply to an electricity-consuming device. A cooling arrangement... |
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US20100202108 |
Aircraft Electronics Cooling Apparatus For An Aircraft Having A Liquid Cooling System
The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system (2), the aircraft electronics cooling system providing a thermal coupling... |
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US20070246199 |
Heat dispensing assembly
A heat dispensing assembly includes a centrifugal fan eccentrically installed in a base which has an outlet defined in a side thereof and a cover is mounted on the base. A plurality of fins are... |
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US20050168947 |
Chip packaging module with active cooling mechanisms
The invention is directed to structure and methods of improving the cooling capacity of chip packaging modules. The chip packaging module has a substrate with thin-film wiring on one side and... |
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US20120106083 |
LIQUID COOLING SYSTEM FOR AN ELECTRONIC SYSTEM
A liquid cooling system for an electronic system includes a plurality of cooling modules that are adapted to circulate a liquid coolant therethrough. Each cooling module is configured to be... |
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US20120120603 |
AUTOMATICALLY RECONFIGURABLE LIQUID-COOLING APPARATUS FOR AN ELECTRONICS RACK
An apparatus is provided for cooling an electronics rack, which includes an electronic subsystem across which air passing through the rack flows. A cooling unit provides, via system coolant supply... |
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US20100078150 |
RACKMOUNT REAR DOOR HEAT EXCHANGER
A heat exchange apparatus is provided and includes an external structure to support an airflow cooled computing device, first and second doors, each of which includes a heat transfer surface,... |
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US20100265653 |
HEATSINKS AND A SPRING IN A BAFFLE SLOT BETWEEN ADJACENT COMPONENTS
A baffle has a slot, with the slot positioned between first and second adjacent components when the baffle is installed above the components. A pair of heatsinks are inserted into the slot, with... |
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US20060279930 |
Cooling apparatus of liquid-cooling type
A cooling apparatus comprises an outlet port through which cooling air is applied in a radial direction, a plurality of heat radiating fins which are arranged at intervals and which surround the... |
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US20150092349 |
IMPLEMENTING REDUNDANT AND HIGH EFFICIENCY HYBRID LIQUID AND AIR COOLING FOR CHIPSTACKS
A method and apparatus are provided for implementing redundant and high efficiency hybrid liquid and air cooling for chipstacks. The apparatus includes an electronic module having a chipstack of... |
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US20080298016 |
COOLING AN ELECTRONIC DEVICE UTILIZING SPRING ELEMENTS WITH FINS
A method for cooling an electronic device includes forming a spring structure by coupling a plurality of spring elements with a fin portion oriented at an angle, wherein a first end of the fin... |
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US20130188314 |
VAPOR PHASE COOLING APPARATUS AND ELECTRONIC EQUIPMENT USING SAME
A vapor phase cooling apparatus (10) includes: a housing (11) including a heat receiver (14a) configured to receive heat generated by an electronic component (50) that is a heat generating source,... |
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US20080110594 |
AIR/FLUID COOLING SYSTEM
The present invention is an air/fluid cooling system. In one embodiment an apparatus for dissipating heat from a heat-generating device includes a base having a first side configured for thermal... |
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US20070047203 |
Integral liquid cooling computer housing
The invention provides an integral liquid cooling computer housing including a computer housing, which is provided with an accommodating platform and a movable cover at one side thereof. Component... |
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US20070107880 |
Heat sink structure
The invention relates to a heat sink structure, which includes a central heat conducting body having a plurality of cooling fins extending from the periphery of the central heat conducting body, a... |
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US20060039111 |
[HIGH-PERFORMANCE TWO-PHASE FLOW EVAPORATOR FOR HEAT DISSIPATION]
A high-performance two-phase flow evaporator is disclosed to include an electronic device, a casing, a heat sink provided at the top side of the casing and defining with the casing an enclosed... |
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US20060250772 |
Liquid DIMM Cooler
A liquid cooled heat sink for electronic circuit boards is described. A heat sink base includes a liquid cooling arrangement to remove heat from the base. An arrangement of cooling fins extends... |
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US20090268404 |
ENERGY EFFICIENT APPARATUS AND METHOD FOR COOLING AN ELECTRONICS RACK
Apparatus and method are provided for cooling an electronics rack in an energy efficient, dynamic manner. The apparatus includes one or more extraction mechanisms for facilitating cooling of the... |
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US20060187638 |
System and method for liquid cooling of an electronic device
In certain embodiments, a system and method for liquid cooling of an electronic device, including a heat exchanger disposed adjacent an electronic component within a housing of the electronic... |
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US20170181322 |
SCALABLE RACK-MOUNT AIR-TO-LIQUID HEAT EXCHANGER
An Information Handling System (IHS) includes at least one node provisioned with heat-generating components and an air passage that enables air to pass through the node and exit the node as... |
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US20170181319 |
COOLING APPARATUS
The invention relates to a cooling apparatus, comprising a first evaporator section with first channels, and a first condenser section with second channels. In order to provide adequate cooling... |
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US20170027088 |
COOLING APPARATUS FOR COOLING ELECTRONIC DEVICE IN AIRCRAFT
A cooling device applicable to an airplane having a pressurized cabin and a ram air channel for cooling an electronic device arranged in the pressurized cabin, is comprised of a partition wall... |
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US20160352242 |
POWER CONVERSION APPARATUS
A frame portion is a plate-like member to which a cooler is attached for cooling an electric circuit element configured to operate for power conversion that causes generation of heat. The... |
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US20160105998 |
Electronic Component Cooling
A cooling device for cooling at least one electronic component, as well as an electronic assembly with a cooling device and an electronic component. The cooling device has at least one cooling... |
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US20160100503 |
SYSTEMS AND METHODS FOR COOLING A PROBE DISPOSED ABOUT A HOT GAS PATH
A system for cooling a probe disposed about a hot gas path is disclosed herein. The system may include a probe holder having a main body including an inner passage, an intermediate passage, and an... |
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US20150351216 |
PASSIVE SYSTEM OF POWERING AND COOLING WITH LIQUID METAL AND METHOD THEREOF
Example embodiments disclose a passive system of power and cooling with a liquid metal for a digital system. The passive system may include a digital device operatively coupled to a printed... |