Matches 1 - 50 out of 74 1 2 >


Match Document Document Title
US20130094141 HEAT REMOVAL IN COMPACT COMPUTING SYSTEMS  
A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.
US20150043160 Adjustable Heat Sink Supporting Multiple Platforms and System Configurations  
An adjustable heat sink which allows factory, service, or customers to adjust the width of the heat sink to take advantage of some or all available unpopulated DIMM space to optimize cooling and...
US20120092825 ELECTRONIC DEVICE WITH HEAT DISSIPATION MODULE  
An electronic device includes a mainframe module and a heat dissipation module. The mainframe module includes a base panel and a motherboard attached on the base panel. The motherboard has a first...
US20150062802 HEAT PIPE ASSEMBLIES  
Heat pipe assemblies for Information Handling Systems (IHSs). In some embodiments, an IHS may comprise a motherboard including a Central Processing Unit (CPU); a cooling system coupled to the...
US20100309624 INDUSTRIAL COMPUTER  
An industrial computer includes a first casing, a second casing, a storage unit, a cover, and a heat dissipation unit. The second casing and the first casing form a closed casing, and the outside...
US20110304981 COMPUTER SERVER SYSTEM AND COMPUTER SERVER THEREOF  
An exemplary computer server system includes a cabinet and a server mounted in the cabinet. The servers includes a casing, an electronic component mounted in the casing, a heat dissipation device...
US20100309623 INDUSTRIAL COMPUTER  
An industrial computer includes a first casing, a second casing, a storage unit, and a heat dissipation unit. The second casing and the first casing form a closed casing, and outside of the second...
US20150170993 COMPUTER SYSTEMS, PARTS OF A HOUSING FOR A COMPUTER SYSTEM, HEAT EXCHANGERS, AND METHODS FOR ASSEMBLING PARTS OF A COMPUTER SYSTEM  
According to various embodiments, a computer system may be provided. The computer system may include: a housing with a protrusion; a heat generating device; a heat exchanger; and a heat pipe...
US20130077232 THERMAL MANAGEMENT INFRASTRUCTURE FOR IT EQUIPMENT IN A CABINET  
The present invention attempts to reduce the thermal resistance with the use of heat-transfer devices (e.g., vapor chambers) placed directly on the heat-generating components in IT equipment and...
US20150253823 SUPPORT FRAME WITH INTEGRATED THERMAL MANAGEMENT FEATURES  
This invention describes a novel solution to providing heat redistribution and cooling to electronic devices. According to various embodiments, heat produced during the operation of the processing...
US20130050936 HEAT TRANSFERRING MODULE AND START UP METHOD OF ELECTRONIC DEVICE  
A heat transferring module adapted to an electronic device is provided. The electronic device includes at least one heat source and a plurality of ready-to-heat elements. The heat transferring...
US20130135822 COOLING MODULE  
A cooling module applicable in an electronic device is provided. The electronic device includes a plurality of first heat sources and a plurality of second heat sources. The cooling module...
US20120057297 HEAT DISSIPATION IN COMPUTING DEVICE  
A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk...
US20130328741 INTERNAL COMPONENTS OF A PORTABLE COMPUTING DEVICE  
The present application describes various embodiments of systems and methods for providing internal components for portable computing devices having a thin profile. More particularly, the present...
US20100259897 HEAT DISSIPATION DEVICE  
A heat dissipation device dissipates heat generated by a heat-generating electronic element mounted on a top surface printed circuit board. The printed circuit board defines a plurality of first...
US20150124399 HEAT DISSIPATING ASSEMBLY AND ELECTRONIC DEVICE USING THE SAME  
A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and...
US20070097626 Structure for heat dissipation in a portable computer  
The structure for heat dissipation in a portable computer according the present invention is a structural design that provides an additional heat dissipation room in the main containing space...
US20100110627 THERMAL MODULE CAPABLE OF DISSIPATING HEAT GENERATED BY A PLURALITY OF HEAT SOURCES AND RELATED COMPUTER SYSTEM  
A thermal module includes a base including a first plate having a first side for connecting with a first heat source so as to conduct heat generated by the first heat source, and a second plate...
US20090323276 HIGH PERFORMANCE SPREADER FOR LID COOLING APPLICATIONS  
Apparatuses, systems, and methods for a heat spreader plate and pulsating heat pipes to transfer heat sourced from one or more electronic components are described herein. Other embodiments may...
US20100214740 Phase-Separated Evaporator, Blade-Thru Condenser and Heat Dissipation System Thereof  
A phase-separated evaporator includes a boiler plate and a phase separation chamber that includes a housing, connected to the boiler plate, having a gas port and a liquid port; and a phase...
US20100220439 FLAT HEAT PIPE RADIATOR AND APPLICATION THEREOF  
A flat radiator with flat type heat pipe and its application for portable computers is provided. The heat pipe in a radiator use tubular type and plate type structures. An air convective extended...
US20150077929 SHEET-TYPE HEAT PIPE AND MOBILE TERMINAL USING THE SAME  
Provided is a sheet-type heat pipe that has a sufficient heat transport capability and can be effortlessly installed in a thin chassis. The sheet-type heat pipe is made of a sealed container...
US20080218961 HEAT DISSIPATION MODULE AND DESKTOP HOST USING THE SAME  
A heat dissipation module suitable for a desktop host includes a case, a power supply with a fan, and a mother board. The power supply and the mother board are disposed in the case. The mother...
US20080186671 COOLING DEVICE OF HEATING ELEMENT AND AN ELECTRONIC DEVICE USING THE SAME  
In the electronic device such as computer and server which is operated in full day time and having high load condition in a limited time schedule, a suitable cooling device is provided for the...
US20100195281 Hybrid Industrial Networked Computer System  
A Kitchen Display System (KDS) includes a workstation including a first Personal Computer (PC)-based controller, a fanless workstation including a second PC-based or a non-PC-based controller...
US20100091450 HEAT DISSIPATING HINGE FOR PORTABLE ELECTRONIC DEVICE  
A portable electronic device includes a housing receiving a heat generating electrical component therein, a display unit and a heat dissipating hinge pivotably interconnecting the housing and the...
US20090213537 Housing for a Computer  
A housing for a computer or multi-media equipment or the like includes at least one heat-generating component. The housing may have a respective cooling body on opposing walls and a heat...
US20060232928 Heat sink for multiple components  
In accordance with certain embodiments, a computer system having multiple electronic components, and a heat sink having cantilever portions disposed against the multiple electronic components.
US20100073866 COOLING DEVICE AND ELECTRONIC EQUIPMENT INCLUDING COOLING DEVICE  
A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between...
US20080130221 Thermal hinge for lid cooling  
A thermal hinge couples a computing platform to a lid. The thermal hinge includes a hinge block that has a groove passing through the hinge block and a hinge pillar to couple to the lid. The hinge...
US20130050935 CONTAINER DATA CENTER HAVING HIGH HEAT DISSIPATING EFFICIENCY  
A container data center includes a container, servers, a monitoring device, a cooling system, and a controller. The container is divided into first regions and a second region which are separated...
US20110141684 SYSTEMS AND METHODS FOR COOLING A BLADE SERVER INCLUDING A DISK COOLING ZONE  
A method and apparatus adapted to cool a blade server positioned within a rack of other blade servers include transferring heat from a heat source in the blade server to a cooling zone positioned...
US20080225478 Heat Exchange System for Blade Server Systems and Method  
A heat exchange system for blade server systems is disclosed, wherein said blade server system contains a plurality of server blades arranged in a blade center, wherein the heat exchange system...
US20110277475 POWER REGENERATION FOR AN INFORMATION HANDLING SYSTEM  
A power regeneration system for use with an information handling system is disclosed. The power regeneration system may include a thermosiphon in thermal communication with a heated component of...
US20090161313 HEAT DISSIPATING STRUCTURE  
A heat dissipating structure for a heat source includes a position-adjusting unit, a first heat dissipating element, a second heat dissipating element and a first heat conducting element. The...
US20150212556 MULTI-COMPONENT SHARED COOLING SYSTEM  
Multi-component shared cooling systems include a chassis housing a first heat exchanger device and a second heat exchanger device. A first component such as, for example, a system processor, is...
US20060087811 Heat dissipation device for lowering temperature of an airflow  
A heat dissipation device includes a fan (20) generating an airflow, a hydrophilic member (44) deposited on a flowing path of the airflow, a case (30) containing liquid therein and a pipe (42)...
US20120314363 HEAT TRANSFER SYSTEM  
The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is...
US20140368991 RENEWABLE ENERGY BASED DATACENTER COOLING  
A data center is cooled through hydronic convection mechanisms, geothermal mechanisms or combinations thereof. The individual computing devices of such a data center are cooled through a thermally...
US20150212555 ORTHOGONALLY HINGED INDIVIDUALIZED MEMORY MODULE COOLING  
A memory module cooling system includes a liquid cooled manifold assembly and a heat spreader assembly rotateably attached to the liquid cooled manifold assembly about an axis perpendicular to the...
US20050007735 Electronic apparatus having a reserve tank and a circulation path of liquid coolant for cooling a heat-generating component  
An electronic apparatus is provided with a circulating path used to circulate liquid coolant between a heat-receiving portion thermally connected to a CPU that generates heat and a heat-radiating...
US20150220122 HANDHELD DEVICE WITH HEAT PIPE  
A handheld device including a circuit board including at least one electronic component, a heat pipe disposed on the electronic component to absorb heat generated from the electronic component and...
US20070070599 Portable computer  
A portable computer (100) includes a main body (200), a cover (300) and a thermally conductive hinge (400). The main body has at least one heat generating device (210) and a heat conductor (230)...
US20090080151 HEAT TRANSFER SYSTEM  
The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is...
US20130182388 DATA CENTER MODULE  
A module for data center is presented, which is used for heat sinking of a heat source. The module for data center includes a first chamber, a second chamber, and a heat pipe. The heat source is...
US20120106073 DATA CENTER MODULE  
A module for data center is presented, which is used for heat sinking of a heat source. The module for data center includes a first chamber, a second chamber, and a heat pipe. The heat source is...
US20100066219 COVER STRUCTURE AND ELECTRONIC DEVICE USING THE SAME  
A cover structure comprises: a substrate defined a sliding slot and an opening adjacent to the sliding slot; a covering board defined a receiving portion; an alignment plate defined a salient...
US20130271913 TECHNIQUES FOR COMPUTING DEVICE COOLING USING A SELF-PUMPING FLUID  
Techniques for computing device cooling using a self-pumping cooling fluid are described. For example, an apparatus may comprise one or more heat-generating components, a housing forming a cavity...
US20100271774 HEAT DISSIPATION DEVICE  
A heat dissipation device is adapted for dissipating heat generated from an add-on card which has a plurality of processors thereon. The heat dissipation device includes a vapor chamber and a...
US20140268553 SYSTEM FOR COOLING MULTIPLE IN-LINE CENTRAL PROCESSING UNITS IN A CONFINED ENCLOSURE  
A system for cooling multiple in-line CPUs in a confined enclosure is provided. In an embodiment, the system may include a front CPU and a front heat sink that may be coupled to the front CPU. The...

Matches 1 - 50 out of 74 1 2 >