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Match Document Document Title
US20110002082 HIGH CAPACITANCE MULTILAYER WITH HIGH VOLTAGE CAPABILITY  
New designs for multilayer ceramic capacitors are described with high voltage capability without the need of coating the part to resist surface arc-over. One design combines a high overlap area...
US20130050894 MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING MULTI-LAYERED CERAMIC CAPACITOR THEREON  
Disclosed herein is a mounting structure of a circuit board having a multi-layered ceramic capacitor thereon, the multi-layered ceramic capacitor including dielectric sheets laminated thereon and...
US20140071587 Capacitors in Integrated Circuits and Methods of Fabrication Thereof  
In one embodiment, a capacitor includes a first via level having first metal bars and first vias, such that the first metal bars are coupled to a first potential node. The first metal bars are...
US20080310076 CONTROLLED ESR DECOUPLING CAPACITOR  
Disclosed are apparatus and methodology for providing controlled equivalent series resistance (ESR) decoupling capacitor designs having broad applicability to signal and power filtering...
US20150213952 MULTILAYER CAPACITOR WITH INTEGRATED BUSBAR  
Embodiments are directed to obtaining a specification of at least one operational requirement for at least one capacitor, generating a design of the at least one capacitor to satisfy the at least...
US20110141655 MULTILAYER CERAMIC CAPACITOR  
Disclosed is multilayer ceramic capacitor. The multilayer ceramic capacitor includes a capacitive part including dielectric layers and first and second internal electrodes alternately laminated...
US20110049674 INTERDIGITATED VERTICAL PARALLEL CAPACITOR  
An interdigitated structure may include at least one first metal line, at least one second metal line parallel to the at least one first metal line and separated from the at least one first metal...
US20100027190 Multilayer Capacitor and Method for Adjusting Equivalent Series Impedance of Same  
A multilayer capacitor operable to allow adjustment of its equivalent series resistance substantially independent of its equivalent series inductance is disclosed. The multilayer capacitor can be...
US20080310078 Method of implementing low ESL and controlled ESR of multilayer capacitor  
Disclosed is a method of implementing controlled equivalent series resistance (ESR) having low equivalent series inductance (ESL) of a multi-layer chip capacitor which includes a plurality of...
US20110096463 MULTILAYER CAPACITOR  
Disclosed is a multilayer capacitor capable of improving reliability and further reducing ESL. In a width direction, a second principal-surface electrode portion is greater than a first...
US20110149468 THREE-DIMENSIONAL CAPACITOR AND TOPOLOGICAL DESIGN METHOD FOR SUCH A CAPACITOR  
A three-dimensional capacitor is formed from a multilayer of superposed electrodes. The electrodes are formed within respective metallization levels of an integrated circuit. At least two...
US20140262463 EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME  
There is provided an embedded multilayer ceramic electronic component including a ceramic body including dielectric layers, having first and second main surfaces, first and second side surfaces,...
US20090097186 DENSITY-CONFORMING VERTICAL PLATE CAPACITORS EXHIBITING ENHANCED CAPACITANCE AND METHODS OF FABRICATING THE SAME  
Density-conforming vertical plate capacitors exhibiting enhanced capacitance and methods for fabricating density-conforming vertical plate capacitors exhibiting enhanced capacitance are provided....
US20130088810 MULTILAYER CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING THE SAME  
Disclosed herein are a multilayer ceramic capacitor and a method for manufacturing the same. The multilayer ceramic capacitor includes: a capacitor main body having dielectric layers and inner...
US20090219669 CAPACITOR  
A capacitor includes a first terminal having a first polarity, a second terminal having a second polarity opposed to the first polarity, and a plurality of columnar portions for connecting the...
US20090147440 LOW INDUCTANCE, HIGH RATING CAPACITOR DEVICES  
Methodologies and structures are disclosed for providing multilayer electronic devices having low inductance and high ratings, such as for capacitor devices for uses involving faster pulsing and...
US20050248908 Termination coating  
A termination coating for use with surface mount components for electrical devices, such as base metal multilayer ceramic capacitors. The coating is capable of application at low temperatures and...
US20140104750 MULTI-LAYERED CERAMIC CAPACITOR  
There is provided a multi-layered ceramic capacitor including: a ceramic body formed by multi-layering a plurality of dielectric layers; a plurality of first and second internal electrodes...
US20100309606 Capacitor Arrangement And Method For Making Same  
One or more embodiments relate to a semiconductor chip including a capacitor arrangement, the capacitor arrangement comprising: a first capacitor; and a second capacitor stacked above the first...
US20080225463 LAYERED CAPACITOR AND MOUNTING STRUCTURE  
A layered capacitor includes a capacitor body that is divided into two first capacitor sections and a second capacitor section. The first capacitor sections are disposed at ends in a...
US20090316330 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF  
A multilayer ceramic electronic component includes dummy conductor patterns on a ceramic green sheet laminated in an earlier stage of the lamination and sheet-by-sheet crimping process that have...
US20090231779 MULTILAYER CAPACITOR AND MOUNTED STRUCTURE THEREOF  
In a multilayer capacitor, widths of lead conductors of internal electrode and widths of lead conductors of internal electrode in an ESR control section are smaller than any one of widths of...
US20110266040 MULTILAYER CERAMIC CAPACITOR, PRINTED CIRCUIT BOARD INCLUDING THE SAME, METHODS OF MANUFACTURING THEREOF  
There are provided a multilayer ceramic capacitor, a printed circuit board including the same, a method of manufacturing the multilayer ceramic capacitor, and a method of manufacturing the printed...
US20110096464 MULTILAYER CAPACITOR  
Disclosed is a multilayer capacitor capable of improving adhesiveness of layers of an element body and improving reliability. Outer edge 12a, 12c, and 12d of a second principal-surface electrode...
US20120043854 CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME  
A ceramic electronic component has a ceramic element assembly, external electrodes, and metal terminals. The external electrodes are arranged on the surface of the ceramic element assembly. The...
US20120092806 PROTECTION STRUCTURE FOR METAL-OXIDE-METAL CAPACITOR  
A capacitor structure includes first and second sets of electrodes and a plurality of line plugs. The first set of electrodes has a first electrode and a second electrode formed in a first...
US20140312743 CERAMIC ELECTRONIC COMPONENT  
A ceramic electronic component includes a ceramic base, first and second internal electrodes, and first and second external electrodes. The first external electrode is disposed at a first end...
US20090057827 CAPACITOR EMBEDDED IN INTERPOSER, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING CAPACITOR EMBEDDED IN INTERPOSER  
As for electrode pads for a semiconductor integrated circuit element, some of electrode pads for signal transmission are coupled to Ti films. Others of the electrode pads for signal transmission...
US20140174800 EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME, AND PRINTED CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT  
There is provided an embedded multilayer ceramic electronic component, including a ceramic body including dielectric layers, first internal electrodes and second internal electrodes disposed to...
US20090296312 CHIP-TYPE ELECTRONIC COMPONENT  
A chip-type electronic component has: a ceramic element body; a plurality of first and second internal electrodes arranged in the ceramic element body so as to be opposed at least in part to each...
US20100309605 THREE-TERMINAL METAL-OXIDE-METAL CAPACITOR  
An MOM capacitor includes a first metal plate; a second metal plate in close proximity to the first metal plate; a third metal plate in close proximity to the first metal plate, and at least one...
US20060274476 Low loss thin film capacitor and methods of manufacturing the same  
In accordance with the teachings described herein, low loss thin film capacitors and methods of manufacturing the same are provided. A low loss thin-film capacitor structure may include first and...
US20070103846 Multilayer vertically integrated array technology  
The present subject matter is directed to methods and apparatus for providing a multilayer array component with interdigitated electrode layer portions configured to selectively provide signal...
US20090310276 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME  
A multilayer ceramic electronic component includes external terminal electrodes that are formed by direct plating on the first and second side surfaces of a ceramic body including stacked ceramic...
US20080204971 Integrated multilayer chip capacitor module and integrated circuit apparatus having the same  
An integrated multilayer chip capacitor module including: plurality of multilayer chip capacitors arranged close to one another and co-planar with one another; and a capacitor support...
US20100128413 MULTILAYER CAPACITOR  
In a capacitor body, a single second capacitor unit is interposed between two first capacitor units. The width direction dimension of each of extended portions of first and second internal...
US20110273815 ELECTRONIC COMPONENT  
In an electronic component, a first capacitor conductor includes a first exposed portion exposed between insulating layers at a surface of a laminate including a first shorter side and two longer...
US20100188799 CONTROLLED ESR LOW INDUCTANCE CAPACITOR  
Multilayer capacitors incorporate both low inductance (ESL) and controlled Equivalent Series Resistance (ESR) features into a cost-effective unitary device. Internal electrode patterns generally...
US20120314338 MULTILAYER CAPACITOR AND METHOD OF MANUFACTURING SAME  
In a multilayer capacitor 1, burned layers 17A, 17B are formed so as to cover all of lead conductors 12A, 12B drawn from inner electrodes 6A, 6B to end faces of a multilayer body 2. This can keep...
US20100243307 LEADED MULTI-LAYER CERAMIC CAPACITOR WITH LOW ESL AND LOW ESR  
A multi-layered ceramic capacitor with at least one chip and with first base metal plates in a parallel spaced apart relationship and second base metal plates in a parallel spaced apart...
US20110102969 MULTILAYER CAPACITOR, MOUNTING STRUCTURE THEREOF, AND METHOD OF MANUFACTURING SAME  
A multilayer capacitor 1 comprises a capacitor element body 2 constituted by a plurality of dielectric layers 10; inner electrodes 3, 4, disposed within the capacitor element body 2, having main...
US20150041199 MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN  
A multilayer ceramic electronic component to be embedded in a board includes: a ceramic body including dielectric layers; first and second internal electrodes formed in the ceramic body; and...
US20120169299 Method of Using a Container for a Refrigerated Fluid, and a Corresponding Container  
A container for a refrigerated fluid having an external container and an internal container between which an evacuated intermediate space is situated, which contains a superinsulator formed by...
US20110037536 CAPACITANCE ELEMENT AND RESONANCE CIRCUIT  
A capacitance element includes a first electrode, a second electrode, a third electrode, a fourth electrode, a first dielectric portion, a second dielectric portion, and a third dielectric...
US20090310277 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MAKING THE SAME  
A multilayer ceramic electronic component includes a ceramic body including a plurality of ceramic layers, the ceramic body having a first main surface and a second main surface and a plurality of...
US20090284896 LAMINATED CERAMIC ELECTRONIC COMPONENT  
A laminated ceramic electronic component includes a ceramic element and two external electrodes on both end surfaces of the ceramic element. The ceramic element includes a function part and lead...
US20100067170 CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME  
A ceramic electronic component that is hardly influenced by a stress generated when an external electrode containing a metal sintered compact is formed at the end of the ceramic component body,...
US20090296311 CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME  
A ceramic electronic component has a ceramic element assembly, external electrodes, and metal terminals. The external electrodes are arranged on the surface of the ceramic element assembly. The...
US20100302704 LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR  
A method for manufacturing a laminated electronic component includes the steps of preparing a component main body having a laminated structure, the component main body including a plurality of...
US20090040686 ENERGY CONDITIONER STRUCTURES  
Disclosed are energy conditioner structures, method of making and using them wherein the structure comprises a sequence of conductive layers including a first A layer, a G layer, and a first B...

Matches 1 - 50 out of 85 1 2 >