Matches 1 - 50 out of 191 1 2 3 4 >


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US20120314054 METHOD AND MACHINE FOR EXAMINING WAFERS  
Method and machine utilizes the real-time recipe to perform weak point inspection on a series of wafers during the fabrication of integrated circuits. Each real-time recipe essentially corresponds...
US20150262350 MARKING APPARATUS AND MARKING METHOD FOR DISPLAY PANEL  
The present invention provides a marking apparatus for a display panel and a marking method for a display panel. The marking device comprises an image acquiring module, a simulated marking module...
US20110149062 Apparatus and Method for Aligning a Wafer's Backside to a Wafer's Frontside  
Structures of a backside of a wafer can be aligned to structures of a frontside of the wafer for a lithographic treatment of the backside. The wafer is transparent for electromagnetic radiation of...
US20120113247 Lighting Device For Alignment And Exposure Device Having The Same  
A ring shape lighting device, used for lighting the mark around the CCD camera, has a lighting device, a lighting brightness control device, a lighting height control device, a lighting color...
US20090238442 MACHINE VISION SYSTEM FOR THREE-DIMENSIONAL METROLOGY AND INSPECTION IN THE SEMICONDUCTOR INDUSTRY  
The system 10 of the preferred embodiment includes a structural subsystem 20 to provide both a stable platform and vibration isolation, a camera subsystem 30 to capture the image of a moving...
US20140132750 LIGHTING APPARATUS FOR MEASURING ELECTRONIC MATERIAL-PROCESSED PART AND TEST APPARATUS USING THE SAME  
The present invention relates to lighting apparatus for measuring an electronic material-processed part and the test apparatus using the same. The lighting apparatus includes a dome reflection...
US20090309965 TESTING METHOD, TESTING AND PROCESSING SYSTEM, PROCESSING DEVICE, TESTING DEVICE, MANUFACTURING/TESTING DEVICE, AND MANUFACTURING/TESTING METHOD  
An inspecting method for grasping the inspection result on an intermediate (or an n-th) treatment without long extension of time, in case predetermined treatments of a predetermined number (N...
US20110131806 ALIGNMENT MARK RECOGNITION METHOD AND PRINTED WIRING BOARD MANUFACTURING METHOD  
A method for recognizing alignment marks includes preparing a substrate having multiple alignment marks including alignment marks positioned adjacent to each other, and recognizing the alignment...
US20120092484 DEFECT INSPECTION METHOD AND APPARATUS THEREFOR  
To effectively utilize the polarization property of an inspection subject for obtaining higher inspection sensitivity, for the polarization of lighting, it is necessary to observe differences in...
US20110102575 HIGH SPEED DISTRIBUTED OPTICAL SENSOR INSPECTION SYSTEM  
An electronics assembly line includes a first electronics assembly machine and a second electronics assembly machine. The first electronics assembly machine has a first electronics assembly...
US20130100275 APPARATUS AND METHOD TO ESTIMATE THE POTENTIAL EFFICIENCY OF A POLYCRYSTALLINE SOLAR CELL  
A method for estimating the efficiency of a solar cell to be manufactured from a wafer is disclosed, wherein the efficiency estimate is obtained from a density of crystallite boundaries on a...
US20100201802 RESIN COMPOSITION AND USE THEREOF  
The resin composition includes a color pigment (A) and a curable resin (B) and gives a cured film satisfying the following requirements (I), (II), (III), (IV) and (V): (I) the maximum...
US20070013772 In-circuit test fixture with integral vision inspection system  
An in-circuit test fixture performs both electrical tests on a Printed Circuit Assembly (“PCA”) and reads distinguishing features of a feature of interest of the PCA. The in-circuit test fixture...
US20090268021 Imaging Position Correction Method, Imaging Method, and Substrate Imaging Apparatus  
An imaging method for imaging an image on a substrate at an accurate position while relatively moving the substrate and the imaging unit. The imaging method includes the steps of taking an image...
US20140210993 AUTOMATIC PROGRAMMING OF SOLDER PASTE INSPECTION SYSTEM  
A system for measuring solder paste stencil aperture positions and sizes is provided. The system includes at least one camera configured to acquire images of the stencil and an alignment target. A...
US20130016205 Die Bonder  
A die bonder that eliminates the need for moving a recognition camera for capturing an image related to adhesive application and achieves high reliability with high throughput is disclosed. The...
US20140354797 CALIBRATION BLOCK FOR MEASURING WARPAGE, WARPAGE MEASURING APPARATUS USING THE SAME, AND METHOD THEREOF  
Disclosed herein are a calibration block for measuring warpage, a warpage measuring apparatus using the same, and a method thereof. The calibration block includes a substrate having one planar...
US20060210142 Pattern inspection method and apparatus  
A color image of an inspection object is taken by an imaging means capable of taking a color image to obtain color information of an RGB color space. A gray-scale image of a color component of the...
US20140307082 WORK VISUAL INSPECTION DEVICE AND WORK VISUAL INSPECTION METHOD  
The work, visual inspection device 30 composes a conveyance table 2 which holds and conveys works W1 and W2 and camera units 8, 9, 10, 11, 12 and 13 which capture images of the works conveyed by...
US20120062727 PART-MOUNTING SYSTEM  
It is an objective to provide a part-mounting system that makes it possible to quickly ascertain a defective judgment location and input a result of judgment of the defective judgment location...
US20130208104 Custom color or polarization sensitive CCD for separating multiple signals in Autofocus projection system  
An autofocus (AF) system and method is provided that maps the topography of a substrate such as a semiconductor wafer, in a manner that corrects for Goos Hanchen (GH) effect. In addition, a new...
US20080316457 METHOD AND APPARATUS FOR QUANTIFICATION OF ILLUMINATION NON-UNIFORMITY IN THE MASK PLANE OF A LITHOGRAPHIC EXPOSURE SYSTEM  
This disclosure relates to lithography using pulsed laser illumination. In particular it relates to lithography for producing electronic devices on wafers using multi-mode excimer and molecular...
US20140267683 METHOD OF FABRICATING A LIGHT EMITTING DIODE DISPLAY WITH INTEGRATED DEFECT DETECTION TEST  
A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom...
US20150054940 QUALIFYING PATTERNS FOR MICROLITHOGRAPHY  
Disclosed are methods and apparatus for qualifying a photolithographic reticle. A reticle inspection tool is used to acquire at least two images at different imaging configurations from each...
US20130182101 Generating a Wafer Inspection Process Using Bit Failures and Virtual Inspection  
Methods and systems for generating a wafer inspection process are provided. One method includes storing output of detector(s) of an inspection system during scanning of a wafer regardless of...
US20090073104 Liquid crystal display capable of split-screen displaying and computer system using same  
An exemplary liquid crystal display includes a liquid crystal panel having at least two pixel regions, a mode selector configured to provide a mode selection signal, and a timing controller...
US20140043463 TDI Sensor Modules With Localized Driving And Signal Processing Circuitry For High Speed Inspection  
An inspection system for inspecting a surface of a wafer/mask/reticle can include a modular array. The modular array can include a plurality of time delay integration (TDI) sensor modules, each...
US20120019651 INSTALLATION OF 3D INSPECTION OF ELECTRONIC CIRCUITS  
An installation of optical inspection of integrated circuits or the like, comprising: a photographic system placed above a scene in a plane defined by a first and a second direction, the...
US20150170356 OPTICAL INSPECTION SYSTEM FOR PRINTED CIRCUIT BOARD OR THE LIKE  
An optical inspection system inspects points of interest on an item. A two-axis gimbal holds a camera and is controlled to adjust an angle of incidence and angle of approach of a line of sight of...
US20120086796 COORDINATE FUSION AND THICKNESS CALIBRATION FOR SEMICONDUCTOR WAFER EDGE INSPECTION  
A system may include a support configured to rotatably support a wafer. The system may also include an imager for generating an image of a wafer, where the image includes a first coordinate...
US20140267682 LINEAR/ANGULAR CORRECTION OF PICK-AND-PLACE HELD COMPONENT AND RELATED OPTICAL SUBSYSTEM  
A pick-and-place machine and method includes use of a passive component feeder cartridge including a feeder gear. Rotation of the feeder gear causes a component-bearing tape to be fed through the...
US20130100276 High Speed Autofocus System  
A method and apparatus for optimizing inspection high-speed optical inspection of parts using intelligent image analysis to determine optimal focus using high numerical aperture (NA) optics,...
US20120013731 COMPONENT PRESENCE/ABSENCE JUDGING APPARATUS AND METHOD  
A component presence/absence judging apparatus judges the presence/absence of a component through a registration step and an inspection step. The registration step comprises an ante-mounting color...
US20070236566 Liquid crystal display having matrix-converting circuit and method of transmitting signals therein  
An exemplary liquid crystal display (3) includes a matrix-converting circuit (316) and an inverse-matrix-converting circuit (327). The matrix-converting circuit receives an RGB (red green blue)...
US20140320633 ENHANCED ILLUMINATION CONTROL FOR THREE-DIMENSIONAL IMAGING  
A system for sensing a three-dimensional topology of a circuit board is provided. An illumination source generates patterned illumination from a first point of view. At least one camera acquires...
US20090273669 METHOD AND SYSTEM FOR DETECTING CRITICAL DEFECTS  
A system and method for evaluating a criticality of a defect. The method may include: obtaining information indicative of at least one spatial relationship between at least one inspected pattern...
US20130100277 WORKBENCH FOR MANUFACTURING OR CHECKING ELECTRICAL WIRING HARNESSES  
A workbench and an assistance method for manufacturing or checking electrical wiring harnesses. The workbench comprises: an assembly board; image projection devices on the assembly board; optical...
US20120019650 INSTALLATION OF OPTICAL INSPECTION OF ELECTRONIC CIRCUITS  
An installation of optical inspection of integrated circuits or the like, comprising: a planar conveyor along a first direction of the objects to be analyzed and a photographic system placed above...
US20130147942 ALIGNMENT METHOD FOR ASSEMBLING SUBSTRATES IN DIFFERENT SPACES WITHOUT FIDUCIAL MARK AND ITS SYSTEM  
An alignment method for assembling substrates in different spaces without fiducial mark and its system are provided, and the alignment method has steps of: pre-defining partially standard...
US20110007146 SUBSTRATE INSPECTION DEVICE AND SUBSTRATE INSPECTION METHOD  
An inspection process before component mounting for all component mounting positions on which components are to be mounted is performed when a reenter mode is not set by operation of a reenter...
US20110199477 METHOD FOR IMAGING WORKPIECE SURFACES AT HIGH ROBOT TRANSFER SPEEDS WITH REDUCTION OR PREVENTION OF MOTION-INDUCED DISTORTION  
A method is provided for imaging a workpiece by capturing successive frames of an elongate stationary field of view transverse to a workpiece transit path of a robot, while the workpiece is...
US20090252400 METHOD FOR MOUNTING ELECTRONIC COMPONENT  
In order to recognize grid-like reference marks on a jig plate positioned in a mounting area by means of a substrate recognizing camera respectively, to obtain a positional shift amount of a...
US20130088585 SURFACE IMAGING WITH MATERIALS IDENTIFIED BY COLOR  
An imaging system receives a height measurement and a resistance measurement, the measurements being made at a two-dimensional position on a surface. A display system maps the resistance to a...
US20130162808 COMPONENT MOUNTING DEVICE, A COMPONENT MOUNTING METHOD, AN IMAGING DEVICE AND AN IMAGING METHOD  
A first illuminating devices, when the component adsorbed by an adsorbing nozzle and located in an imaging field of vision is a surface mounted component, illuminate the bottom surface of a...
US20150187060 WAFER DEFECT INSPECTION APPARATUS AND METHOD FOR INSPECTING A WAFER DEFECT  
It is judged whether or not an average gray level of an image of a wafer W that is an inspection target and that has been imaged by the light receiving part 2 is in the defect detectable range. A...
US20140078289 Die Bonder and Method of Position Recognition of Die  
A die bonder comprises a storage unit which stores the image of the wafer taken by an imaging unit, a recognition pattern included the outline of a die formed on the wafer, and a recognition...
US20140347465 READY FOR ROTATION STATE DETECTION DEVICE, METHOD OF DETECTING READY FOR ROTATION STATE AND SUBSTRATE PROCESSING APPARATUS  
A ready for rotation state detection device is configured to detect a state in which a substrate, which is placed on a concave portion formed in a surface of a turntable, will not fly out of the...
US20120062726 Optical alignment systems for forming LEDs having a rough surface  
An alignment system for aligning a wafer when lithographically fabricating LEDs having an LED wavelength λLED is disclosed. The system includes the wafer. The wafer has a roughened alignment mark...
US20140184782 SYSTEM OF MEASURING WARPAGE AND METHOD OF MEASURING WARPAGE  
Disclosed herein are a system for measuring a warpage and a method for measuring a warpage. The system for measuring a warpage includes: a heating plate portion heating the sample; and a reference...
US20090245618 Performing OPC on Hardware or Software Platforms with GPU  
Optical proximity correction techniques performed on one or more graphics processors improve the masks used for the printing of microelectronic circuit designs. Execution of OPC techniques on...

Matches 1 - 50 out of 191 1 2 3 4 >