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US20150293283 |
NEAR-INFRARED ABSORBING COMPOSITION, NEAR-INFRARED BLOCKING FILTER, METHOD FOR PRODUCING NEAR-INFRARED BLOCKING FILTER, CAMERA MODULE AND METHOD FOR MANUFACTURING CAMERA MODULE
A near-infrared blocking filter includes a near-infrared absorbing substance, has a film thickness of 300 μm or less, and has a visible light transmissivity in a wavelength range of 450 nm to 550... |
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US20060146172 |
Miniaturized utility device having integrated optical capabilities
A miniaturized utility device having integrated optical capabilities for use on a high aspect ratio system, wherein the miniaturized utility device comprises: (a) a micro camera comprising a solid... |
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US20090015706 |
Auto focus/zoom modules using wafer level optics
A disclosed example camera module includes a substrate, an integrated circuit image capture device (ICD) mounted on the substrate, the image capture device having an array of light sensors on its... |
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US20080136956 |
Internal noise reducing structures in camera systems employing an optics stack and associated methods
A camera system may include an optics stack including first and second substrates secured together in a stacking direction, one of the first and seconds substrates including an optical element, a... |
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US20130002858 |
Mechanisms for Conserving Power in a Compressive Imaging System
A system and method for conserving power in compressive imaging. An optical subsystem separates an incident light stream into a primary light stream and a secondary light stream. The primary light... |
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US20090181729 |
DEVICE CASE WITH OPTICAL LENSES
A carrying case for a portable electronic device such as a digital music player or mobile telephone having a digital camera includes a lens for modifying an optical input of the digital camera.... |
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US20110211105 |
LENS ARRAY
A lens array includes: a substrate in which a plurality of through holes are formed; and a plurality of lenses provided in the substrate by burying the plurality of through holes. A part of the... |
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US20100265385 |
Light Field Camera Image, File and Configuration Data, and Methods of Using, Storing and Communicating Same
Certain devices and methods are directed to acquiring, generating and/or outputting image data corresponding to a scene. In one aspect, the method comprises (i) acquiring light field data which is... |
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US20090256931 |
Camera module, method of manufacturing the same, and electronic system having the same
A camera module, a method of manufacturing the same, and an electronic system having the same are provided. The camera module includes an image sensor chip having an active plane and a backside, a... |
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US20070236596 |
SOLID-STATE IMAGE PICKUP DEVICE, A CAMERA MODULE AND A METHOD FOR MANUFACTURING THEREOF
A solid-state image pickup device includes a solid-state image sensor chip having a solid-state image sensor having a photosensitive element formed on a main surface of a semiconductor substrate... |
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US20050231626 |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
A microelectronic imager comprising an imaging unit and an optics unit attached to the imaging unit, and methods for packaging microelectronic imagers. In one embodiment, the imaging unit can... |
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US20120069232 |
CURVILINEAR CAMERA LENS AS MONITOR COVER PLATE
Disclosed are various implementations of a camera lens that can be positioned between a display device and a user viewing the display device. The camera lens can be transparent to allow such... |
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US20110304763 |
IMAGE SENSOR CHIP AND CAMERA MODULE HAVING THE SAME
An image sensor chip, a camera module, and devices incorporating the image sensor chip and camera module include a light receiving unit on which light is incident, a logic unit provided to... |
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US20090219430 |
DIGITAL CAMERA HAVING A BRACKETING CAPABILITY
A digital camera generates a plurality of photograph image as a bracket image of an object. The digital camera comprises a setting processor that sets a plurality of steps for first and second... |
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US20080259178 |
SOLID-STATE IMAGING DEVICE, SIGNAL PROCESSING METHOD FOR THE SAME, AND IMAGING APPARATUS
Disclosed herein is a solid-state imaging device, including, a pixel array unit, driving means, and analog-to-digital conversion means. |
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US20050190283 |
Method and apparatus for macro-focus
A device for arranging a distance between an optical element and an image sensor. The device includes a housing mechanically coupled to the optical element, a frame mechanically coupled to the... |
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US20050275750 |
Wafer-level packaged microelectronic imagers and processes for wafer-level packaging
The following disclosure describes several embodiments of (1) methods for wafer-level packaging of microelectronic imagers, (2) methods of forming electrically conductive interconnects in... |
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US20050270405 |
Image pickup device and camera module
The surface of the image pickup device 21 is covered by a transparent conductive member 26 that is made of, for example, a transparent conductive past resin and that is electrically connected to a... |
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US20050122417 |
Solid-state image sensor and manufacturing method thereof
A solid-state image sensor of the present invention has optical units separating incident light into a plurality of color lights, each of which separates the incident light into one of the color... |
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US20050099532 |
Image pickup device and a manufacturing method thereof
The thin image pickup device has a substrate, an electromagnetic receiving area thereon as photoelectric converting elements, a peripheral circuit, and embedded trenches passing through the... |
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US20140111680 |
Mobile communicator with curved sensor camera
Methods and apparatus for combining a mobile communication device having a camera (150) that includes a curved sensor (160) are disclosed. The present invention offers higher quality pictures that... |
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US20100321494 |
COMPACT DOME CAMERA
A compact video capture system is provided with a folded optical assembly to reduce a relative system size while providing improved lens performance. The folded lens and optical assembly allow for... |
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US20060197862 |
Camera module and the manufacturing process thereof
This invention provides a camera module and a manufacturing process thereof. The camera module is compatible with surface mount technology (SMT) machines for bonding onto a main board. The camera... |
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US20060055811 |
Imaging system having modules with adaptive optical elements
A compound sensor imaging system having lenses moveable relative to one another and their respective detectors. The movement may be controlled by a computer. The patterns of movement may be... |
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US20070146534 |
Camera module package
The invention relates to a camera module package including a lens barrel having at least one lens therein and an IR filter installed at a lower end thereof. The package also includes a housing... |
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US20050200718 |
Image photographing apparatus and method
An image photographing apparatus is capable of photographing a still image and a motion picture through separate, dedicated lenses. The image photographing apparatus has a first lens of a first... |
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US20150124152 |
NEAR-INFRARED ABSORPTIVE COMPOSITION, NEAR-INFRARED CUT FILTER USING NEAR-INFRARED ABSORPTIVE COMPOSITION, METHOD FOR MANUFACTURING NEAR-INFRARED CUT FILTER, AND CAMERA MODULE AND METHOD FOR MANUFACTURING CAMERA MODULE
Provided is a near-infrared absorptive compositions which having excellent near-infrared shielding property even if they are formed into thin films, being able to apply, and inhibited... |
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US20080252771 |
CAMERA MODULE WITH COMPACT PACKAGING OF IMAGE SENSOR CHIP AND METHOD OF MANUFACTURING THE SAME
An exemplary camera module includes a lens module, a base, an image sensor chip, a bonding layer, and an imaging lens. The lens module is disposed on the base. The lens module is optically aligned... |
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US20130135515 |
DIGITAL IMAGING SYSTEM
A digital imaging system for imaging an object is provided comprising a photosensor array arranged in an image plane and a plurality of microlenses arranged so as to direct light from the object... |
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US20100309353 |
SOLID-STATE IMAGING DEVICE AND SEMICONDUCTOR DEVICE
According to one embodiment, a solid-state imaging device includes a substrate, a lens, a lens holder, and a metal shield. The substrate includes a pixel region having a first well and has a... |
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US20070126914 |
Solid state imaging device
A solid state imaging element including light receiving elements and microlenses is placed in a recess of a ceramic package. A black resin fills space between the ceramic package and the solid... |
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US20050264677 |
Solid-state imaging device, semiconductor wafer and camera module
A light-permeable lid provided oppositely to a photodetector of a solid-state imaging element includes a glass substrate, and an infrared-ray shielding film formed on one side of the glass... |
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US20050212947 |
Image capture apparatus
A solid state imaging device is consisted of an image sensor chip having a light receiving portion, a frame-like spacer attached on the image sensor chip so as to surround the light receiving... |
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US20120075518 |
IMAGING UNIT
An imaging unit includes a housing having an opening; a positioning portion provided in the housing; an imaging optical system including a bending optical system having two reflecting surfaces... |
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US20110134303 |
IMAGE PICKUP DEVICE AND MANUFACTURING METHOD THEREOF
An image pickup device and a manufacturing method thereof are disclosed. The image pickup device includes a printed circuit board (PCB), an image sensor module, an optical lens module, a fluidic... |
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US20100328420 |
Optical adapters for mobile devices with a camera
Portable, mobile, lightweight, removable, low cost, easy to manufacture, easy to ship, easy to transport, easy to store, and easy to use optical adapters that provides an effective means of... |
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US20060109367 |
Image pickup module and manufacturing method of image pickup module
An image pickup module of the present invention includes a cover in the form of a tube, and a lens holder. The cover is fixed (bonded) to a base in a state in which its leg section is in contact... |
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US20090059055 |
OPTICAL DEVICE AND METHOD FOR FABRICATING THE SAME
An optical device includes: an optical element including an imaging region, a peripheral circuit region formed at the rim of the imaging region and including a plurality of electrode portions, and... |
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US20080136955 |
INTEGRATED CAMERA AND ASSOCIATED METHODS
A method for forming a camera including an integrated optical subsystem, includes aligning a plurality of second dies with a plurality of first dies, each first die having a second die aligned... |
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US20110234883 |
TETRAFORM MICROLENSES AND METHOD OF FORMING THE SAME
A lens is formed to support and tilt at least one microlens formed on the lens. The degree and direction of slope of the microlens can be controlled based on desired focal characteristics to... |
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US20070285554 |
APPARATUS METHOD AND SYSTEM FOR IMAGING
There is provided in accordance with some embodiments of the present invention an optical assembly including a set of optical paths, wherein two or more optical paths receive an image from a... |
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US20150146076 |
Image Pickup Optical System and Image Pickup Apparatus Using the Same
An image pickup optical system made of five lenses, includes in order from an object side, an aperture stop, a first lens L1 having a positive refracting power, a second lens L2 having a negative... |
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US20070236591 |
Method for mounting protective covers over image capture devices and devices manufactured thereby
A method for manufacturing camera modules including image capture devices with protective covers is disclosed. The method includes providing a unitary transparent substrate including a plurality... |
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US20060227236 |
Camera module and method of manufacturing the same
The present invention relates to a camera module, and more particularly, to a camera module which is miniaturized by changing the structure of a housing joined to a PCB on which a standardized... |
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US20130083229 |
EMI SHIELD FOR CAMERA MODULE
Embodiments of the invention describe an electro-magnetic interference (EMI) shield cover disposed over a wafer level camera module. Said camera module includes substrate having a plurality of... |
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US20110001205 |
Image sensor and semiconductor device including the same
Example embodiments relate to a three-dimensional image sensor including a color pixel array on a substrate, a distance pixel array on the substrate, an RGB filter on the color pixel array and... |
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US20100033607 |
SOLID STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME
A solid state imaging device includes: a solid state imaging element including a light receiving element, a microlens formed above the light receiving element, a first transparent layer formed on... |
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US20090002532 |
SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREOF, AND CAMERA MODULE
An optical filter layer composed of an infrared cut filter layer, an optical low pass filter layer and the like is formed on a glass substrate. The optical filter layer is made either by attaching... |
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US20150077619 |
LENS OPTICAL UNIT AND IMAGING DEVICE
Provided is a lens optical unit, including at least one lens arranged at an object side of a solid-state image sensor. An imaging plane of the image sensor has a non-planar shape causing a sag... |
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US20120038813 |
CAMERA MODULE
A camera module includes an image sensor package including an image sensor chip and a chip cover layer protecting the image sensor chip, a first lens disposed above the image sensor package to be... |