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US20140167803 TESTING DEVICE AND TESTING METHOD THEREOF  
Disclosed are a testing device and a testing method thereof. The testing device includes a frame, a flexible multi-layer substrate and at least one electrical testing point. The frame is...
US20080048687 PROBE, METHOD OF MANUFACTURING THE PROBE AND PROBE CARD HAVING THE PROBE  
A probe, a method of manufacturing the probe and a probe card having the probe are disclosed. The probe includes a first connecting member, a body and a tip. Specially, the body integrally...
US20110050274 Maintaining A Wafer/Wafer Translator Pair In An Attached State Free Of A Gasket Disposed Therebetween  
A wafer translator and a wafer, removably attached to each other, provides the electrical connection to electrical contacts on integrated circuits on a wafer in such a manner that the electrical...
US20080094093 UNIVERSAL ARRAY TYPE PROBE CARD DESIGN FOR SEMICONDUCTOR DEVICE TESTING  
A universal system for testing different semiconductor devices provides a probe head with a probe pattern that may be used to test different test patterns formed on different semiconductor...
US20080080277 Method and system of analyzing failure in semiconductor integrated circuit device  
A method of analyzing a failure in a semiconductor integrated circuit device may include storing defects and analog characteristics correlated with the defects in a database, detecting a fail bit...
US20100045325 Test Pad Design for Reducing the Effect of Contact Resistances  
An integrated circuit structure includes a semiconductor wafer; integrated circuit devices in the semiconductor wafer; and a plurality of test pads on a top surface of the semiconductor wafer and...
US20150115994 OPTIMIZATION OF INTEGRATED CIRCUIT RELIABILITY  
A per-chip equivalent oxide thickness (EOT) circuit sensor resides in an integrated circuit. The per-chip EOT circuit sensor determines electrical characteristics of the integrated circuit. The...
US20110006797 PROBE CARD AND TEST EQUIPMENT  
Provided are a probe card including a first area group including a plurality of first areas, each including a plurality of probes for input pad and probes for output pad, the first areas being...
US20120062269 INSPECTION TOOL AND METHODOLOGY FOR THREE DIMENSIONAL VOLTAGE CONTRAST INSPECTION  
A system and method for improved voltage contrast inspection is disclosed. In one embodiment the temporal response to voltage contrast is considered to find an optimal acquisition time. In another...
US20090072852 SYSTEM THAT DETECTS DAMAGE IN ADJACENT DICE  
A system including a tester configured to measure a first current from a first die of neighboring dice and a second current from a second die of the neighboring dice. The tester is configured to...
US20060170437 Probe card for testing a plurality of semiconductor chips and method thereof  
A probe card for that may be used to test a plurality of semiconductor chips formed on a wafer. The probe card may include a substrate; a plurality of probe blocks that form a pattern...
US20110037494 Method for Wafer-Level Testing of Integrated Circuits  
A method for wafer level testing is provided which includes providing a wafer having an integrated circuit formed thereon, applying a signal to energize the integrated circuit, the signal...
US20090224792 METHOD TO REDUCE TEST PROBE DAMAGE FROM EXCESSIVE DEVICE LEAKAGE CURRENTS  
A method is provided for predicting leakage current in a semiconductor die with a plurality of devices. A limited leakage macro is incorporated on the semiconductor die. The limited leakage macro...
US20100052709 WING-SHAPED SUPPORT MEMBERS FOR ENHANCING SEMICONDUCTOR PROBES AND METHODS TO FORM THE SAME  
Example wing-shaped support members for enhancing semiconductor device probes and methods to form the same are disclosed. A disclosed example semiconductor device probe includes a finger having a...
US20080143357 HIGH POWER COBRA INTERPOSER WTIH INTEGRATED GUARD PLATE  
A high power Cobra interposer with an integrated guard plate, which is utilized for the testing of electrical products. The guard plate and the upper die of the interposer assembly are integrated...
US20080122476 Test structure with TDDB test pattern  
A test structure includes a time dependent dielectric breakdown (TDDB) test pattern formed in a dielectric material on a wafer. The test pattern includes first and second conductive lines formed...
US20050099195 PROBE SHEET AND PROBE SHEET UNIT USING SAME  
It is an object of the present invention to provide a probe sheet capable of achieving correct measurement independently of a dispersion in height of electrodes of measurement objective; and a...
US20090021277 DEVICE AND METHOD FOR REPARING A MICROELECTROMECHANICAL SYSTEM  
A novel device and method for repairing MEMS systems, including probe cards for use in semiconductor testing is disclosed. In one embodiment, a probe card for use with a diagnostic computer for...
US20060250148 Probe card support plate  
According to one embodiment of the present invention a an apparatus for probing a wafer includes a probe card, a support plate, and at least one probe needle. At least a portion of the support...
US20060114008 Probe card for testing semiconductor element, and semiconductor device tested by the same  
An apparatus which reduces a contact resistance by appropriately overdriving a measuring probe of a probe card to ensure a stable contact pressure. The probe card comprises a measuring probe...
US20090179661 SEMICONDUCTOR DEVICE DEFECT TYPE DETERMINATION METHOD AND STRUCTURE  
A semiconductor defect type determination method and structure. The method includes providing a semiconductor wafer comprising a first field effect transistor (FET) comprising a first type of...
US20110050273 FAST TESTABLE WAFER AND WAFER TEST METHOD  
A fast testable wafer includes a die group, testing points located on dies, a scribe line located between the dies, and a plurality of testing pads disposed in the scribe line area. The testing...
US20070035318 Donut-type parallel probe card and method of testing semiconductor wafer using same  
A donut-type parallel probe card comprises a main substrate and a plurality of probing blocks installed on a surface of the main substrate, wherein each probe block comprises a plurality of...
US20100045316 METHOD FOR INSPECTING ELECTROSTATIC CHUCKS WITH KELVIN PROBE ANALYSIS  
A method of inspecting an electrostatic chuck (ESC) is provided. The ESC has a dielectric support surface for a semiconductor wafer. The dielectric support surface is scanned with a Kelvin probe...
US20140266283 Chip-on-Wafer Process Control Monitoring for Chip-on-Wafer-on-Substrate Packages  
An embodiment method includes providing a standardized testing structure design for a chip-on-wafer (CoW) structure, wherein the standardized testing structure design comprises placing a testing...
US20080297184 SEMICONDUCTOR TEST APPARATUS  
The present invention provides a semiconductor test apparatus that can reduce influence of noise in high-frequency measurement and that can be manufactured inexpensively by simplification of the...
US20080265927 TESTER ON A PROBE CARD  
A probe card assembly used to test electronic devices in an automated test equipment system. The probe card assembly includes a substrate having a plurality of through-holes contained therein and...
US20080012589 Wafer test card applicable for wafer test  
A wafer test card applicable for testing all the chips on a wafer in one time simultaneously comprising a base board carrying testing circuit thereon and an electric conductive spring-rubber...
US20090212793 STRUCTURES FOR TESTING AND LOCATING DEFECTS IN INTEGRATED CIRCUITS  
A method for detecting defects during semiconductor device processing can include providing a substrate having a semiconductor comprising layer with electrically isolated application and test...
US20140125374 METHOD FOR EVALUATING WAFER DEFECTS  
Provided is a method for evaluating defects in a wafer. The method for evaluating the wafer defects includes preparing a wafer sample, forming an oxidation layer on the wafer sample, measuring a...
US20090256493 Driving circuit for display device, and test circuit and test method for driving circuits  
A driving circuit, which drives a display panel in a voltage range between a high negative voltage and a high positive voltage, includes: an electric charge discharging circuit; and a test...
US20080061808 Compliance partitioning in testing of integrated circuits  
Probecard architectures partition the spring compliance required for IC testing between several different components. Such architectures can provide shorter springs, better impedance control,...
US20070182430 Probe head with machine mounting pads and method of forming same  
A probe head for testing semiconductor wafers has a probe contactor substrate have a first side and a second side. A plurality of probe contactor tips are coupled to the first side and the...
US20090295417 TEST SYSTEM, ELECTRONIC DEVICE, AND TEST APPARATUS  
Provided is a test system that tests a device under test, including a plurality of internal test circuits that are provided inside the device under test and that are used for testing an operation...
US20090237105 Semiconductor Arrangement and Method for the Measurement of a Resistance  
A semiconductor arrangement has a semiconductor body (CP), comprising a semiconductor layer (HL) with a first (AB11, AB12) and at least one second (AB21, AB22) conducting terminal areas,...
US20080012595 Wafer test card using electric conductive spring as wafer test interface  
A wafer test card for testing the electric property of the chips on a wafer comprising a base board and a group of electric conductive springs or electric conductive spring pins connected to the...
US20080246505 SEMICONDUCTOR DEVICE TEST SYSTEM AND METHOD  
A semiconductor device test method and system. One embodiment provides a method for testing semiconductor devices forming a group of semiconductor devices to be tested. For addressing or selection...
US20060125508 On wafer testing of RFID tag circuit with pseudo antenna signal  
An RFID tag circuit is described having a pair of signal paths that flow to an input of a demodulator of the RFID tag circuit. A first of the signal paths couple the demodulator to an antenna port...
US20120062270 COMPLIANT PRINTED CIRCUIT WAFER PROBE DIAGNOSTIC TOOL  
Diagnostic tools for testing wafer-level IC devices, and a method of making the same. The first diagnostic tool can include a first compliant printed circuit with a plurality of contact pads...
US20080036483 Probe card for flip chip testing  
A probe card for testing a flip chip device is provided. In one embodiment, the probe card comprises a printed circuit board having a first surface and a second surface, the first surface...
US20080303542 TESTING CIRCUIT AND INTEGRATED CIRCUIT  
A testing circuit includes at least two contact terminals and a plurality of first resistors. The contact terminals are located on a substrate and respectively connected to two ends of an original...
US20150015299 TRANSLATORS COUPLEABLE TO OPPOSING SURFACES OF MICROELECTRONIC SUBSTRATES FOR TESTING, AND ASSOCIATED SYSTEMS AND METHODS  
Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods are disclosed. An arrangement in accordance with one embodiment includes a...
US20070145989 Probe card with improved transient power delivery  
In high current integrated circuit wafer test applications, a high capacitance density capacitor may be formed in association with a probe card at a position closer to a wafer under test. This...
US20080233663 SINGULATED BARE DIE TESTING  
There is testing of individual dice prior to their inclusion in a multi-chip package. A wafer is sawn into individual dice and the dice are placed onto a die tray. If the tray is not full, then...
US20100327900 POLISHING HEAD TESTING WITH MOVABLE PEDESTAL  
A polishing head is tested in a test station having a pedestal for supporting a test wafer and a controllable pedestal actuator to move a pedestal central wafer support surface and a test wafer...
US20090058456 MANUFACTURING SYSTEM, MANUFACTURING METHOD, MANAGING APPARATUS, MANAGING METHOD AND COMPUTER READABLE MEDIUM  
There is provided a manufacturing system for manufacturing an electronic device through a plurality of manufacturing stages. The manufacturing system includes a plurality of manufacturing...
US20080094082 Die Infrared Transceiver Bus  
A semiconductor wafer adapted to wirelessly transfer data to a testing system. The wafer comprises a plurality of dies, each die adjacent another die and each die comprising an infrared...
US20100052724 CIRCUIT AND METHOD FOR PARALLEL TESTING AND SEMICONDUCTOR DEVICE  
Disclosed is a test circuit including a first transfer circuit, a second transfer circuit and comparators and performing parallel testing of a plurality of chips under test. The first transfer...
US20070024313 Chuck top, wafer holder having the chuck top, and wafer prober having the chuck top  
A chuck top allowing reliable recognition of a wafer mounted on a wafer-mounting surface or on a chuck top conductive layer by a camera such as a CCD and hence allowing wafer inspection without...
US20060103404 System and method for testing dynamic resistance during thermal shock cycling  
A system includes a temperature chamber (100), a text fixture (402), a test coupon (400), a data acquisition unit (404), an ohmmeter (406) and a computer (410). The temperature chamber (100)...

Matches 1 - 50 out of 218 1 2 3 4 5 >