Matches 1 - 50 out of 227 1 2 3 4 5 >


Match Document Document Title
US20140333339 BOARD, INTEGRATED CIRCUIT TESTING ARRANGEMENT, AND METHOD FOR OPERATING AN INTEGRATED CIRCUIT  
A board may include a first set of board contact pads arranged on a first side of the board, the pads configured to connect to circuit pads of a circuit under test, the positions of the pads...
US20140354321 AUTOMATED TEST MANAGEMENT SYSTEM FOR ELECTRONIC CONTROL MODULE  
An automatable management system for testing one or more electronic control modules (ECMs), in one or more machines, is disclosed. The one or more ECMs are switchably connected to a testing unit...
US20120212244 Test Board and Method of Using Same  
A test board is provided. The test board includes a test module configured to accommodate an integrated circuit (IC) device and first wirelessly enabled functional blocks located in the test...
US20110204914 MUXING INTERFACE PLATFORM FOR MULTIPLEXED HANDLERS TO REDUCE INDEX TIME SYSTEM AND METHOD  
A system for connecting a test pin of automatic test equipment (ATE) to devices for testing includes a first handler for manipulating a first portion and a second handler for manipulating a second...
US20130285692 TEST SOCKET INCLUDING ELECTRODE SUPPORTING PORTION AND METHOD OF MANUFACTURING TEST SOCKET  
The test socket includes: an elastic conductive sheet including a conductive portion and an insulating supporting portion; a sheet type connector including an electrode portion that is disposed on...
US20140049281 Diagnosis Framework to Shorten Yield Learning Cycles of Advanced Processes  
The present disclosure relates to a diagnosis framework to shorten yield learning cycles of technology node manufacturing processes from the high defect density stage to technology maturity. A...
US20130234748 TRANSFERRING ELECTRONIC PROBE ASSEMBLIES TO SPACE TRANSFORMERS  
Transferring electronic probe assemblies to space transformers. In accordance with a first method embodiment, a plurality of probes is formed in a sacrificial material on a sacrificial substrate...
US20060125504 Printed circuit board for burn-in testing  
A burn-in PCB comprising an adapter socket for receiving at least one program card; a plurality of test sockets for receiving test components; wherein one or more of the test sockets are...
US20050012516 Burn-in socket adapt to assembly sensor thereon  
A burn-in socket (1) includes a base (10) receiving an IC and a number of contacts (12) received in the base, and a pressing member (14). The base defines a slot (1024) in a wall thereof and...
US20070069756 Test fixture  
A test fixture is adapted to shield a device under test (DUT) from time dependent electromagnetic radiation.
US20150168486 Waveguides for Capturing Close-Proximity Electromagnetic Radiation Transmitted by Wireless Chips During Testing on Automated Test Equipment (ATE)  
A test fixture has a flexible plastic cable that acts as a waveguide. The Device-Under-Test (DUT) is a small transceiver and antenna that operate in the Extremely High-Frequency (EHF) band of...
US20130069685 INTEGRATED CIRCUIT TEST SOCKET HAVING TEST PROBE INSERTS  
A test socket having a lid and a base with a cavity for receipt of an integrated circuit and removable test probe inserts having test probes positioned around a perimeter of the cavity.
US20130300442 Chip Socket  
The present document relates to chip sockets which for testing integrated circuit chips. A chip socket carries an integrated circuit chip comprising a plate for mounting onto a front side of a...
US20130321012 Methods and Apparatus for Testing Small Form Factor Antenna Tuning Elements  
A test system for testing a device under test (DUT) is provided. The test system may include a DUT receiving structure configured to receive the DUT during testing and a DUT retention structure...
US20100097085 SOCKET, MODULE BOARD, AND INSPECTION SYSTEM USING THE MODULE BOARD  
The socket of the present invention includes a lid having a first protrusion on the reverse side, and a first terminal connected electrically to the first protrusion, and a main body having a...
US20150234006 INSTRUMENT FOR AUTOMATED TESTING OF DISPLAYS  
A test apparatus includes a display sled having a mount for holding a display under test (“DUT”). The display sled is supported by a frame and moves between a test position and a load position. A...
US20140167805 REDUCED FOOTPRINT TEST SOCKET SYSTEM  
A test socket system has a housing with a screw that extends through central openings in the housing and a pusher block. Positioned below the pusher block is an integrated circuit and positioned...
US20080030210 Test socket  
A test socket includes a socket body (20) having a passageway (42), and a terminal (30) insertable into the passageway. The passageway has a portion with an interior contour (421) in a...
US20100201389 INTEGRATED UNIT FOR ELECTRICAL/RELIABILITY TESTING WITH IMPROVED THERMAL CONTROL  
In accordance with an aspect, a thermally-controllable integrated unit is configured to hold devices under test. The integrated unit includes at least one heater board, comprised of a...
US20100315112 SOCKET ADAPTER FOR TESTING SINGULATED ICS WITH WAFER LEVEL PROBE CARD  
An integrated probe card and socket adapter includes probe needles for probing a wafer including a plurality of CSP IC each having a plurality of bumps. A socket adapter includes a socket body...
US20140159758 ASSEMBLY FOR OPTICAL BACKSIDE FAILURE ANALYSIS OF PACKAGE-ON-PACKAGE (POP) DURING ELECTRICAL TESTING  
A method and apparatus for testing a package-on-package digital device is provided. The method includes the steps of: affixing a top device onto a wing board; affixing a bottom device onto the...
US20150015293 On-Center Electrically Conductive Pins For Integrated Testing  
A structure and method for providing a contact pin between a device under test (DUT) and a load board which provides upper and lower contact point which are axial aligned is disclosed. The pin has...
US20120242363 Non-Linear Vertical Leaf Spring  
An electrically conductive contact element can include a first base and a second base with elongate, spaced apart leaves between the bases. A first end of each leaf can be coupled to the first...
US20110080187 Device Interface Board with Cavity Back for Very High Frequency Applications  
In one embodiment, a device interface board is provided which includes a printed circuit board with a DUT interface structure, such as socket, associated with a DUT side of the printed circuit...
US20150241474 INTEGRATED CIRCUIT (IC) TEST SOCKET USING KELVIN BRIDGE  
An integrated circuit test socket is adapted to use with Kelvin connectors by creating closely spaced connectors and counter-rotating links that are nested to conserve space. The connectors are...
US20080197867 SOCKET SIGNAL EXTENDER  
A socket signal extender (SSE), and a system and method of testing an assembled device under test (DUT) board employing an SSE. In one embodiment, the SSE includes a cover having a portion...
US20120299614 Test socket with a rapidly detachable electrical connection module  
A test socket includes a test base and at least one electrical connection module. The at least one electrical connection module is detachably mounted in the test base and each one of the at least...
US20120249176 TEST STRUCTURE AND MEASUREMENT METHOD THEREOF  
A test structure including a substrate, at least one conductive plug, a first conductive trace and a second conductive trace is provided. The substrate has a first area and a second area. The at...
US20140266281 TESTING HOLDERS FOR CHIP UNIT AND DIE PACKAGE  
A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural...
US20060014308 Procedure for arranging chips of a first substrate on a second substrate  
The invention relates to a method for arranging chips of a first substrate on a second substrate, in which the chips are grouped at least into first chips and into second chips, the first chips of...
US20130106458 HOLDER FOR MEASUREMENT AND MEASUREMENT APPARATUS  
A holder for measurement configured to be capable of holding an object of measurement, the object of measurement included a package including a plurality of semiconductor chips and a conduction...
US20080278186 PIPELINE TEST APPARATUS AND METHOD  
A pipeline test apparatus is provided. The pipeline test apparatus includes a test board. A plurality of stages of sockets are installed on the test board. Each socket is configured to be...
US20110304349 LATERAL COUPLING ENABLED TOPSIDE ONLY DUAL-SIDE TESTING OF TSV DIE ATTACHED TO PACKAGE SUBSTRATE  
A method of topside only dual-side testing of an electronic assembly includes providing a singulated through substrate via (TSV) die flip chip attached to a die support including a package...
US20140340107 BGA TEST SOCKET  
For testing a high density BGA package, a central pressure block is designed to press against the chip of the package during test in a test socket. High density socket probe causes high pressure...
US20080174331 Structure of test area for a semiconductor tester  
Devices and methods for DC and SLT (system level test) integration are disclosed. The DC circuit and the SLT circuit are integrated into the same device. Therefore, the DUT (device under testing)...
US20070080703 Camera based pin grid array (PGA) inspection system with pin base mask and low angle lighting  
An inspection system, for inspecting pin grid arrays on integrated circuit devices includes a pin base mask configured to receive a device having a pin grid array. A dark-field, low-angle lighting...
US20060290366 Monitoring multiple electronic devices under test  
An apparatus and method for monitoring temperatures of multiple electronic devices under test are described herein.
US20080238460 Accurate alignment of semiconductor devices and sockets  
Methods and apparatus to provide accurate alignment for semiconductor sockets are described. In one embodiment, a carrier is utilized to align a device under test with a test socket. In some...
US20150168450 Coaxial Impedance-Matched Test Socket  
A coaxial impedance-matched test socket having a socket body with a structure similar to a system of redistributed coaxial cable inserts, where the core of each insert comprises a pogo pin, a...
US20110248737 TEST APPARATUS AND CONNECTION DEVICE  
It is an object to use an additional circuit to increase speed and functioning of an existing test apparatus at a low cost. Provided is a test apparatus that is connected to a socket board...
US20110074457 System For Testing Electronic Components  
An improved efficiency system for testing electronic components in a motherboard/daughterboard assembly in which the daughterboard is mounted in spaced parallel relationship the to motherboard...
US20090261852 Ducted Test Socket  
A ducted test socket for thermally testing a device under test (DUT) is provided that can accommodate a large DUT and will improve the thermal transfer efficiency between a precision temperature...
US20130021052 Wafer prober integrated with full-wafer contacter  
Methods and apparatus for testing unsingulated integrated circuits on a wafer include adapting a wafer prober for use with full-wafer-contacter disposed on the wafer. Some embodiments include...
US20070159188 Method for testing electronic modules using board with test contactors having beam contacts  
A pass through test system for testing an electronic module includes an interface board, and test contactors movably mounted to the interface board for electrically engaging terminal contacts on...
US20140225636 TEST SYSTEMS WITH A PROBE APPARATUS AND INDEX MECHANISM  
A probe apparatus has probe wires with a contact pattern on one side. The contact pattern is for contacting a respective contact pattern on another test equipment or component, such as a circuit...
US20090153168 HI-FIX BOARD, TEST TRAY, TEST HANDLER, AND METHOD FOR MANUFACTURING PACKAGED CHIPS  
A hi-fix board, a test tray, a test handler, and a packaged chip manufacturing method are provided. The hi-fix board includes: test sockets to which packaged chips to be tested are connected; and...
US20150153387 TEST SOCKET INCLUDING CONDUCTIVE PARTICLES IN WHICH THROUGH-HOLES ARE FORMED AND METHOD FOR MANUFACTURING SAME  
The present invention relates to a test socket that is disposed between a blood test device and a test apparatus to electrically connect a terminal of the blood test device and a pad of the test...
US20110156739 TEST KIT FOR TESTING A CHIP SUBASSEMBLY AND A TESTING METHOD BY USING THE SAME  
A test kit for testing a chip subassembly and a testing method by using the same is provided. The chip subassembly includes at least two stacked chips each having a number of electric contacts is...
US20130135002 TEST ELECTRONICS TO DEVICE UNDER TEST INTERFACES, AND METHODS AND APPARATUS USING SAME  
In one embodiment, an interface includes a plurality of test electronics to DUT interfaces. Each test electronics to DUT interface has at least one test electronics interface, at least one DUT...
US20090015279 Socket, and test apparatus and method using the socket  
An apparatus for testing electric characteristics of a test object including first connection terminals on a bottom surface and second connection terminals on a top surface, the apparatus...

Matches 1 - 50 out of 227 1 2 3 4 5 >