Matches 1 - 43 out of 43


Match Document Document Title
US20120326741 APPARATUS FOR TRANSMISSION TESTING OF A TELECOMMUNICATIONS JACK  
Apparatus (10) for transmission testing of a telecommunications jack (100) having a plurality of insulation displacement contacts (IDCs) (103), the apparatus (10) including: a base (30); a...
US20150048857 UNIVERSAL WATTHOUR METER SOCKET/ADAPTER FOR FIELD TESTING  
A universal meter socket for portable test equipment has low insertion and extraction forces. The universal meter socket is durable and light in weight, providing a long service life. The...
US20110309853 SECTIONAL TEST PROBE ASSEMBLY FOR ELECTRIC METER  
The test probe assembly of the invention is used for an electric meter such as a multimeter or the like. The electric meter has a main body. The test probe assembly includes a pair of insulated...
US20050270048 Spring-loaded, removable test fixture for circuit board testers  
A circuit board tester that uses an axial translation to bring a unit under test (UUT) into physical and electric contact with a series of electrical probes. The element on the tester that comes...
US20090066354 Electrostatic Discharge Test System And Electrostatic Discharge Test Method  
A method of conducting an electrostatic discharge test on an integrated circuit is described. The method comprises configuring a test board assembly to emulate characteristics of a system in which...
US20070069756 Test fixture  
A test fixture is adapted to shield a device under test (DUT) from time dependent electromagnetic radiation.
US20150168446 VERTICAL/HORIZONTAL PROBE SYSTEM AND CALIBRATION KIT FOR THE PROBE SYSTEM  
Disclosed is a probe system. The probe system includes a support member configured to grasp a circuit board to be tested vertically to a base plate, a probe-tip member having a probes that are in...
US20140159758 ASSEMBLY FOR OPTICAL BACKSIDE FAILURE ANALYSIS OF PACKAGE-ON-PACKAGE (POP) DURING ELECTRICAL TESTING  
A method and apparatus for testing a package-on-package digital device is provided. The method includes the steps of: affixing a top device onto a wing board; affixing a bottom device onto the...
US20150204909 PROBER AND NEEDLE-TIP POLISHING DEVICE FOR PROBE CARD  
A prober 10 including a probe card 16 having multiple probe needles 17 includes a needle-tip polishing unit 24, and the needle-tip polishing unit 24 includes a WAPP 28 to be contacted with needle...
US20150160262 Probe System designed for Probing of Electronic Parts Mounted into Application or Test Boards  
Apparatus for facilitating analytical probing of a packaged electronic device is provided. The device may provide a test chamber that holds the device to be tested and provides an elevated or...
US20110115513 WAFER PROBER AND FAILURE ANALYSIS METHOD USING THE SAME  
According to one embodiment, a wafer prober for conducting a backside analysis on a wafer is provided. The wafer prober includes a wafer stage and a movable plate. The wafer stage includes surface...
US20150008948 PROBER FOR TESTING DEVICES IN A REPEAT STRUCTURE ON A SUBSTRATE  
A prober for testing devices in a repeat structure on a substrate is provided with a probe holder plate, probe holders mounted on the plate, and a test probe associated with each holder. Each test...
US20110316574 PROBER FOR TESTING DEVICES IN A REPEAT STRUCTURE ON A SUBSTRATE  
A prober for testing devices in a repeat structure on a substrate is provided with a probe holder plate, probe holders mounted on the plate, and a test probe associated with each holder. Each test...
US20050231220 Terminal of IC test fixture  
A terminal of IC test fixture comprising a body, a spring contact arm and a soldering portion and there are at least one hollow holes on the body of the terminal. During testing, the electronic...
US20070152698 STRIP TEST METHOD  
A strip test method includes the following steps. First, an assembly strip is provided, wherein the assembly strip includes a plurality of semiconductor devices, each having a plurality of leads....
US20080164894 System and method for testing semiconductor integrated circuit in parallel  
A system and method for testing a semiconductor integrated circuit (IC) in parallel includes a probe chuck, a test head, and a test controller. The probe chuck loads a plurality of different types...
US20090179658 PROBER FOR TESTING DEVICES IN A REPEAT STRUCTURE ON A SUBSTRATE  
A prober for testing devices in a repeat structure on a substrate is provided with a probe holder plate, probe holders mounted on the plate, and a test probe associated with each holder. Each test...
US20080231296 Test Apparatus for the Testing of Electronic Components  
In the case of a test apparatus for testing electronic components which are present in an assembly, in particular in the form of strips, a slide-like contacting board supporting device (28), to...
US20140253162 INTEGRATED CIRCUIT TEST SYSTEM AND METHOD  
A system for testing a device under test (DUT) includes a probe card and a test module. The probe card includes probe beds electrically coupled to a circuit board and a first plurality of...
US20090179657 Printed circuit board for coupling probes to a tester, and apparatus and test system using same  
In one embodiment, a printed circuit board (PCB) has a first side and a second side. The second side is opposite the first side. The PCB has a plurality of first contacts that provide an interface...
US20090212799 METHODS AND APPARATUS THAT SELECTIVELY USE OR BYPASS A REMOTE PIN ELECTRONICS BLOCK TO TEST AT LEAST ONE DEVICE UNDER TEST  
In one embodiment, apparatus for testing at least one device under test (DUT) includes a tester input/output (I/O) node, a DUT I/O node, a remote pin electronics block, a bypass circuit, and a...
US20100194416 ELECTRICAL CONNECTING APPARATUS  
An embodiment of an electrical connecting apparatus comprises a probe base plate and a plurality of contacts provided with tips to be pressed against electrodes of a device under test and arranged...
US20090174420 TEST APPARATUS, PROBE CARD, AND TEST METHOD  
There is provided a test apparatus for testing a device under test. The test apparatus includes a plurality of drivers that respectively output a plurality of test signals to a same terminal of...
US20070103179 SOCKET BASE ADAPTABLE TO A LOAD BOARD FOR TESTING IC  
A socket base adaptable to a load board for testing semiconductor devices is disclosed. The socket base includes a first fixing element having coupling plates, a probe element, and a second fixing...
US20070229103 Socket, a circuit component having the socket and an information processing system having the circuit component  
A socket for mounting an IC device having an opening formed in the socket body is disclosed. At least a probe in electrical contact with the IC device is partly exposed to the opening and cooled...
US20090284277 PROBE APPARATUS AND METHOD FOR CORRECTING CONTACT POSITION  
A probe apparatus includes a movable mounting table for supporting an object to be tested; a probe card disposed above the mounting table and having a plurality of probes to come into contact with...
US20070001692 Socket and electronic appliances using socket  
The present invention is made with the aim of suppressing heat generation and thus reducing voltage drop, regarding a socket comprising probes to be connected to an electronic device such as an IC...
US20150168483 TESTER AND TEST APPARATUS FOR TESTING SEMICONDUCTOR DEVICES HAVING THE SAME  
A tester includes a level controller for independently restricting the central deformation and the peripheral deformation of a probe card. The level controller includes a single upper plate, a...
US20080054261 SEMICONDUCTOR PACKAGE HAVING TEST PADS ON TOP AND BOTTOM SUBSTRATE SURFACES AND METHOD OF TESTING SAME  
A semiconductor package and testing method is disclosed. The package includes a substrate having top and bottom surfaces, a semiconductor chip mounted in a centrally located semiconductor chip...
US20090153164 Contactor Assembly for Integrated Circuit Testing  
The present invention provides a contactor assembly (100,200,300) for testing of semiconductor devices (DUT). The contactor assembly (100,200,300) includes a plurality of probes (20,22,24), a...
US20080252311 Verifying an assembly manufacturing process  
Apparatus and method for performing a verification buy-off operation during an assembly manufacturing process, such as during printed circuit board (PCB) manufacturing. A processing device is...
US20080017856 Wafer and semiconductor device testing method  
At least three pads 10A, 10B, 10C are provided on a scribe line 8 located adjacent to a chip region 2. The three pads are a power pad 10A connected to a power potential portion 5 in the chip...
US20100213959 Test section unit, test head and electronic device testing apparatus  
A test section unit provided to a test head body includes a plurality of sockets to be attached with electronic devices to be tested and a performance board as a main substrate. All of the sockets...
US20050225343 Device and method of testing an electronic component  
Device (1) and method for testing an electronic component (21), which device comprises a testing mechanism (2) and a mounting mechanism (3) comprising a component contact surface (14) on a side...
US20080284455 PROBE APPARATUS  
A probe apparatus includes a load port for mounting therein a carrier having therein a plurality of substrates; a plurality of probe apparatus main bodies, each having a probe card having probes...
US20110018564 WAFER PROBER FOR SEMICONDUCTOR INSPECTION AND INSPECTION METHOD  
A wafer prober is provided with a tray which supports a wafer at a set position, transports it to a processing position of the wafer and is placed at the processing position; one or more alignment...
US20150130488 INSPECTION APPARATUS  
An inspection apparatus capable of reducing the effect of noises is provided. An inspection apparatus according to the present invention includes a work table 26 on which an object, a fixed body...
US20110285415 Connector And Semiconductor Testing Device Using The Same  
A ground terminal has a cylindrical main body. A signal terminal has a terminal main body that is disposed on the inside of the cylindrical main body, and a connecting plate portion that extends...
US20100213958 SYSTEMS AND METHODS FOR PROVIDING A SYSTEM-ON-A-SUBSTRATE  
This relates to systems and methods for providing a system-on-a-substrate. In some embodiments, the necessary components for an entire system (e.g., a processor, memory, accelerometers, I/O...
US20160125776 METHOD AND DEVICE FOR DETECTING DEFECT OF DISPLAY PANEL  
A method and device for detecting a defect of a display panel, the method comprises steps of: connecting at least one electrical test pad on the display panel to a first detecting terminal, and...
US20160116502 TEST PROBE, TEST PROBE COMPONENT AND TEST PLATFORM  
The present invention discloses a test probe, a test probe component, and a test platform. The test probe comprises a probe body, wherein one end of the probe body is of a hollow design, thereby...
US20150276849 SEMICONDUCTOR AUTOMATIC TEST EQUIPMENT  
A backing apparatus for use in a semiconductor automatic test equipment including: a probe card holder configured to rigidly affix one or more first portions of a flexible probe card to the probe...
US20110291683 APPARATUS AND METHOD FOR ELECTROSTATIC DISCHARGE (ESD) REDUCTION  
A substrate support unit adapted for a system for testing or processing of a substrate is provided. The substrate support unit includes a support table having at least one substrate carrier...

Matches 1 - 43 out of 43