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US20110169514 EQUIPMENT BURN-IN METHOD AND SYSTEM  
An equipment burn-in method, which includes the equipment undergoing treatment in an oven, the oven undergoing cycles including at least one temperature-rise and/or temperature-fall transition,...
US20120223729 Adhesively Attached Stand-Offs On A Portable Pack For An Electronics Tester  
The invention relates to a tester apparatus of the kind including a portable supporting structure for removably holding and testing a substrate carrying a microelectronic circuit. An interface on...
US20120206157 Structure of burn-in oven  
An improved structure of a burn-in oven includes a housing, a loading support, a cooling-fan assembly, and a motor-fan assembly. A circuit-board-space and an exhaust channel are defined inside of...
US20140253156 THIN HEATING DEVICE  
A thin heating device is provided. The thin heating device includes a first circuit board, a second circuit board, an elastic connector and a heating element. The first and second circuit boards...
US20110084718 Burn-In Testing System  
The present invention discloses a burn-in testing system including a burn-in board and a burn-in testing apparatus, the burn-in board including: a first interface component, adapted to connect...
US20120268148 AUTOMATED LOADING/UNLOADING OF DEVICES FOR BURN-IN TESTING  
The automatic loading and unloading of devices for burn-in testing is facilitated by loading burn-in boards in a magazine with the stacked boards in the magazine moved into and out of a burn-in...
US20060125504 Printed circuit board for burn-in testing  
A burn-in PCB comprising an adapter socket for receiving at least one program card; a plurality of test sockets for receiving test components; wherein one or more of the test sockets are...
US20120112776 THREE-DIMENSIONAL (3D) STACKED INTEGRATED CIRCUIT TESTING  
Testing of a three-dimensional (3D) integrated circuit includes defining a first group of parts by a region and/or layer on the 3D integrated circuit. The testing further includes applying a first...
US20050012516 Burn-in socket adapt to assembly sensor thereon  
A burn-in socket (1) includes a base (10) receiving an IC and a number of contacts (12) received in the base, and a pressing member (14). The base defines a slot (1024) in a wall thereof and...
US20120160295 SOLAR CELL CLASSIFICATION METHOD  
A method for characterizing the electronic properties of a solar cell to be used in a photovoltaic module comprises the steps of performing a room temperature IV curve measurement of the solar...
US20110068813 IN-LINE CHARACTERIZATION  
An apparatus is provided and includes a thermally isolated device under test to which first and second voltages are sequentially applied, a local heating element to impart first and second...
US20130300444 BURN IN BOARD, SYSTEM, AND METHOD  
Systems, methods, and apparatuses are provided for facilitating the use of a burn in board comprising integrated circuits. An apparatus may comprise a burn in board and a plurality of integrated...
US20110267082 Methodologies and Test Configurations for Testing Thermal Interface Materials  
Methodologies and test configurations are provided for testing thermal interface materials and, in particular, methodologies and test configurations are provided for testing thermal interface...
US20080143357 HIGH POWER COBRA INTERPOSER WTIH INTEGRATED GUARD PLATE  
A high power Cobra interposer with an integrated guard plate, which is utilized for the testing of electrical products. The guard plate and the upper die of the interposer assembly are integrated...
US20140067303 Screening Method for Electrolytic Capacitors  
A method of iteratively screening a sample of electrolytic capacitors having a predetermined rated voltage is provided. The method can include measuring a first leakage current of a first set of...
US20070035318 Donut-type parallel probe card and method of testing semiconductor wafer using same  
A donut-type parallel probe card comprises a main substrate and a plurality of probing blocks installed on a surface of the main substrate, wherein each probe block comprises a plurality of...
US20150204942 TEST BOARD WITH LOCAL THERMAL CONDITIONING ELEMENTS  
A solution for testing a set of one or more electronic device (105) is disclosed. A corresponding test board (100) comprises a support substrate (205), a set of one of more sockets (210) being...
US20100264949 FLEXURE BAND AND USE THEREOF IN A PROBE CARD ASSEMBLY  
A flexure band can comprise structures configured to have elastic properties. Such a band can be stretched but will return generally to its original shape after forces that stretched the band are...
US20140062515 Sequential Burn-In Test Mechanism  
A method includes performing a burn-in test on an integrated circuit (IC) by removing power from a first component block within the IC and applying a maximum burn-in voltage and temperature to a...
US20150028908 HIGH SPEED TESTER COMMUNICATION INTERFACE BETWEEN TEST SLICE AND TRAYS  
A tester system is disclosed. The tester system comprises a tester module operable to generate test signals for testing a plurality of DUTs. It also comprises a plurality of cables operable to...
US20140375345 BURN-IN SOCKET WITH A HEAT SINK  
An burn-in socket electrically connecting an IC package to a PCB, comprises a base, a cover, a plurality of contacts and a block-shaped heat sink. The base defines a receiving space for the IC...
US20130127482 BURN-IN TEST APPARATUS WITH FUNCTION OF ENERGY RECYCLING  
A new electrical recycling apparatus for AC/DC power converter is provided to recycle the electricity in direct current to the input ends of the power converter to be tested to save a stage of...
US20080094091 Dynamic Burn-in Systems and Apparatuses  
A burn-in apparatus with a radio frequency signal generator is provided. One embodiment includes a printed circuit board to carry a plurality of semiconductor devices for a burn-in process and a...
US20060279306 Test equipment of semiconductor devices  
An test equipment includes a tester board that can be housed in a chamber, a plurality of sockets that are attached on a first main surface of the tester board and mounted respectively with...
US20070035291 IC sorter  
Provided are an IC sorter, a method for sorting a burn-in IC, an IC sorted using the method. The IC sorter according to one embodiment of the present invention includes a board table onto which a...
US20100039134 HIGH-POWER OPTICAL BURN-IN  
Semiconductor lasers are aged to identify weak or flawed devices, resulting in improved reliability of the remaining devices. The lasers can be aged using a high-power optical burn-in that...
US20140084953 COMPLIANT THERMAL CONTACT DEVICE AND METHOD  
Examples of thermal contact devices and methods are shown. Compliant thermal contact devices are shown that include interleaved conducting structures to provide a high thermal conduction contact...
US20090187368 Burn-In Tests To Produce Fabricated Integrated Circuits With Reduced Variations Due To Process Spread  
An aspect of the present invention enables burn-in tests to reduce variations due to process spread in fabricated integrated circuits (IC). Fabricated ICs are classified into multiple categories...
US20090212809 DEVICE TEST AND DEBUG USING POWER AND GROUND TERMINALS  
The present disclosure describes a novel method and apparatus for using a device's power and ground terminals as a test and/or debug interface for the device. According to the present disclosure,...
US20140049277 TEST APPARATUS AND MOVABLE TEST CHAMBER THEREOF  
A test apparatus includes a plurality of rails, a plurality of test zones and a movable test chamber. The test zones are located between the rails. The movable test chamber includes a passageway,...
US20100308853 Method and apparatus for the prevention of untested or improperly tested printed circuit boards from being used in a fire pump control system  
The present invention relates to a method and apparatus for preventing untested or improperly tested printed circuit boards from being used in a fire pump control system by interrogating each...
US20120326740 BURN-IN TESTING APPARATUS  
A testing apparatus includes a thermal control chamber including a test room, which temperature is controlled within a testing temperature range; a carrier frame including a direction guiding unit...
US20050017749 Electronic devices mounted on electronic equipment board test system and test method  
An electronic device test system includes electronic equipment having a board on which pluralities of electronic devices are mounted and isolation means which isolates from surrounding air an...
US20090027077 METHOD AND APPARATUS FOR IDENTIFYING OUTLIERS FOLLOWING BURN-IN TESTING  
A method includes performing burn-in testing of a device in a tester to generate post burn-in data. Pre-burn-in data associated with the device is compared to the post burn-in data. The device is...
US20060273809 Method of designing an application specific probe card test system  
A method is provided for design and programming of a probe card with an on-board programmable controller in a wafer test system. Consideration of introduction of the programmable controller is...
US20140103947 THERMAL RELIABILITY TESTING SYSTEMS WITH THERMAL CYCLING AND MULTIDIMENSIONAL HEAT TRANSFER  
Devices, methods, and systems for facilitating heat transfer around an electronic component during thermal-cycle testing are presented. A system may include a core, a plurality of solid state...
US20100244882 Burn-In Test Method and System  
A method for performing a burn-in test of a metal wire for a signal transmission of a semiconductor device including driving a first terminal of the metal wire with a first voltage and forming a...
US20100033204 SEMICONDUCTOR INSPECTION APPARATUS AND SEMICONDUCTOR INTEGRATED CIRCUIT  
In a wafer-level burn-in test, a sufficient power supply current must be supplied to operate semiconductor integrated circuits on a wafer, but the power supply current sometimes exceeds an...
US20060103402 Semiconductor apparatus  
A semiconductor apparatus according to the present invention comprises a semiconductor wafer, a plurality of semiconductor chips provided on the semiconductor wafer, a dicing lane provided between...
US20100289514 INSPECTION APPARATUS  
An inspection apparatus is provided to perform an accurate temperature control, cut a noise wave, overcome contact failure, and improve inspection accuracy. The inspection apparatus includes a...
US20140167798 SYSTEM FOR POST-PROCESSSING OF ELECTRONIC COMPONENTS  
A method of post-processing a plurality of electronic components in a post-processing machine after fabrication of the electronic components including providing a carrier with align fixtures,...
US20070013404 Apparatus, customer tray, and method for testing semiconductor packages  
Provided is electrical test equipment and method for testing semiconductor packages in an in-tray state. The equipment may include a loading site configured to receive a customer tray having a...
US20110043231 SYSTEM FOR POST-PROCESSING OF ELECTRONIC COMPONENTS  
A method of post-processing a plurality of electronic components in a post-processing machine after fabrication of the electronic components including providing a carrier with align fixtures,...
US20080309361 Method of Monitoring Burn-In Apparatus  
A method of monitoring a burn-in apparatus, which brings a heater and a temperature sensor into contact with various devices under test during a burn-in test and controls power consumption of the...
US20060132167 Contactless wafer level burn-in  
A method and apparatus for performing a wafer-level burn-in. The method comprises the steps of providing the wafer into a burn-in chamber; and outputting a power and a test initiation signal to a...
US20140354313 Method for Temporary Electrical Contacting of a Component Arrangement and Apparatus Therefor  
A method for temporary electrical contacting of a component arrangement with a plurality of contact surfaces is described. A connection support includes a plurality of connection surfaces, on...
US20100176836 Wafer Level Burn-In and Electrical Test System and Method  
A burn-in and electrical test system (20) includes a temperature controlled zone (22) and a cool zone (24) separated by a transition zone 25. The temperature controlled zone (22) is configured to...
US20090160472 WAFER-LEVEL BURN-IN METHOD AND WAFER-LEVEL BURN-IN APPARATUS  
Temperature control in wafer-level burn-in is performed such that a set temperature used for the temperature control is corrected using a correction value calculated from the generated heat...
US20130285686 Systems and Methods for Thermal Control  
The present invention relates generally to a system and a method for thermal control. More particularly, the invention encompasses an apparatus for thermal control and management of at least one...
US20150061711 Overclocking as a Method for Determining Age in Microelectronics for Counterfeit Device Screening  
An invention employing testing, e.g., overclocking, to determine undesirable conditions in a device under test (DUT) is provided. An exemplary apparatus and method includes artificially aging a...

Matches 1 - 50 out of 78 1 2 >