Matches 1 - 50 out of 104 1 2 3 >


Match Document Document Title
US20130001899 ELECTROSTATIC CHUCK ASSEMBLY  
Embodiments of electrostatic chucks for substrate processing are provided herein. In some embodiments, an electrostatic chuck may include a puck for supporting a substrate, the puck formed from a...
US20130026720 ELECTROSTATIC CHUCK  
An electrostatic chuck comprises: a ceramic plate provided with recesses on a major surface and provided with an electrode in an inner part of the ceramic plate; a temperature regulating plate...
US20120247678 ELECTRODE ASSEMBLY AND PLASMA PROCESSING APPARATUS  
An electrode assembly of a plasma processing apparatus that enables damage to an electrode plate to be prevented, and enables an increase in the number of parts to be prevented, so that the...
US20130154205 Right Angle Attachment For Power Tools  
A right angle attachment for use with a power tool that includes a housing having a handle portion and a gear case attached to the handle portion and supporting first and second right angle gears...
US20070182109 QUICK CONNECT/DISCONNECT CHUCKS  
Described herein are a quick connect/disconnect chucks for use with a milling machine or lathe for holding a tool or work piece.
US20120242049 MOIL GUIDE  
A moil guide having a sleeve that has an opening adapted to receive at least a portion of a linerbolt. The moil guide also has a magnetic attachment device attached to the sleeve. The magnetic...
US20090056112 ELECTROSTATIC CHUCK MEMBER, METHOD OF MANUFACTURING THE SAME, AND ELECTROSTATIC CHUCK DEVICE  
A plurality of protruded portions is formed through embossing and is distributed and arranged regularly or irregularly on an electrostatic chuck surface, and has a circular or almost circular top...
US20140103612 DIELECTRIC LAYER FOR ELECTROSTATIC CHUCK AND ELECTROSTATIC CHUCK  
A dielectric layer for an electrostatic chuck is formed of a ceramic material having a first phase including aluminum oxide and a second phase including composite carbonitride (Ti, Me)(C, N) that...
US20130093146 CERAMIC-METAL BONDED BODY  
To form an electrostatic chuck, a bonding sheet is applied onto the upper surface of a cooling plate and then the cooling plate is placed in a vacuum dryer at a pressure of 2,000 Pa or less for a...
US20110221145 ELECTROSTATIC CHUCK  
An electrostatic chuck featuring a chuck support structure, and a plurality of discrete electrostatic components. Each of the electrostatic components features at least one termination attached to...
US20100044974 EDGE RINGS FOR ELECTROSTATIC CHUCKS  
A disclosed device for use with an electrostatic chuck configured to hold a substrate in a plasma environment comprises an edge ring configured to be placed either in contact with portions of only...
US20130147129 WAFER SUPPORTING STRUCTURE  
A wafer supporting structure for improving the critical dimension uniformity of a wafer, including: a chuck, a plurality of pin holes, and a platform positioned under the chuck. The chick has a...
US20080315536 ELECTROSTATIC CHUCK AND METHOD OF MANUFACTURING THE SAME  
There is provided an electrostatic chuck. The electrostatic chuck includes: a ceramic base containing alumina and first flux; an electrostatic electrode built in the ceramic base; and a ceramic...
US20110297650 ASSEMBLY FOR DELIVERING RF POWER AND DC VOLTAGE TO A PLASMA PROCESSING CHAMBER  
A triaxial rod assembly for providing both RF power and DC voltage to a chuck assembly that supports a workpiece in a processing chamber during a manufacturing operation. In embodiments, a rod...
US20110272899 WAFER MOUNT DEVICE AND MANUFACTURING METHOD THEREOF  
An adhesive layer 30 that bonds the back surface of the plate 12 capable of attracting a wafer W and the front surface of a cooling plate 20 together includes a main adhesive portion 31, which is...
US20140099485 METHODS FOR BONDING SUBSTRATES  
Methods for bonding substrates, forming assemblies using the same, along with improved methods for refurbishing said assemblies are disclosed that take advantage of at least one channel formed in...
US20100156054 HIGH TEMPERATURE ELECTROSTATIC CHUCK BONDING ADHESIVE  
Methods and apparatus for bonding an electrostatic chuck to a component of a substrate support are provided herein. In some embodiments, an adhesive for bonding components of a substrate support...
US20130093145 ELECTROSTATIC CHUCK  
An electrostatic chuck comprises a ceramic dielectric body having an electrode formed on a surface of the ceramic dielectric body; a ceramic substrate supporting the ceramic dielectric body; and a...
US20120285619 ELECTROSTATIC CHUCK HAVING A PLURALITY OF HEATER COILS  
An electrostatic chuck for receiving a substrate in a substrate processing chamber comprises a ceramic puck having a substrate receiving surface having a plurality of spaced apart mesas, an...
US20090243236 ELECTROSTATIC CHUCK AND MANUFACTURING METHOD THEREOF  
An electrostatic chuck of a stack structure includes a metal layer interposed between insulating layers and a groove formed at a peripheral portion of the electrostatic chuck to have a width...
US20100229693 DETACHABLE SCREWDRIVER ASSEMBLY  
A detachable screwdriver assembly has a handle, a connecting tube, a workpiece. The handle is rubber or plastic. The connecting tube is mounted in the handle and has a tool mount. The workpiece is...
US20130155568 EXTENDED AND INDEPENDENT RF POWERED CATHODE SUBSTRATE FOR EXTREME EDGE TUNABILITY  
Apparatus for processing substrates are provided herein. In some embodiments, an apparatus for processing a substrate may include a substrate support comprising a first electrode disposed within...
US20110215538 TOOL CONNECTOR HAVING MULTIPLE SEATING POSITIONS  
A tool connector generally includes a tool receiving portion configured for reciprocating between first and second work tool seating positions, wherein the tool receiving portion is normally...
US20100019462 APPARATUS FOR INCREASING ELECTRIC CONDUCTIVITY TO A SEMICONDUCTOR WAFER SUBSTRATE WHEN EXPOSURE TO ELECTRON BEAM  
An apparatus for increasing electric conductivity to a wafer substrate when exposures to electron beam irradiation is disclosed. More specifically, a more free mechanical contact between a wafer...
US20140042716 ELECTROSTATIC CHUCK DEVICE  
An electrostatic chuck device includes an electrostatic chuck section (2), which has a principal surface that is a mounting surface on which a plate-like sample (W) is placed, and has an internal...
US20120248715 ELECTROSTATIC CHUCK  
According to one embodiment, an electrostatic chuck includes: a ceramic dielectric substrate, an electrode, and a conductive member. The ceramic dielectric substrate has a first major surface on...
US20140057052 WAFER SUPPORT DEVICE  
A wafer support device is provided. The wafer support device includes a plurality of support portions; and a bottom area located among the support portions, wherein the bottom area has a...
US20140202635 MOUNTING TABLE AND PLASMA PROCESSING APPARATUS  
A mounting table includes an electrostatic chuck having a mounting surface and a backside opposite to the mounting surface, a first through hole being formed in the mounting table; a base joined...
US20100078899 ADJUSTABLE THERMAL CONTACT BETWEEN AN ELECTROSTATIC CHUCK AND A HOT EDGE RING BY CLOCKING A COUPLING RING  
A clockable device for use with an electrostatic chuck configured to hold a substrate in a plasma environment is disclosed. The clockable device comprises a first portion of the electrostatic...
US20080258411 POWER SUPPLY APPARATUS AND DEPOSITION METHOD USING THE POWER SUPPLY APPARATUS  
A power supply apparatus includes a power supply mechanism which supplies, from an external power supply, electric power to be supplied to an electrostatic chuck. The power supply mechanism...
US20140008880 ELECTROSTATIC CHUCK DEVICE  
An electrostatic chuck device (1) according to the invention includes an electrostatic chuck section (2) that has a principal surface as a placement surface on which a plate-shaped sample is...
US20140203526 TEMPERATURE MANAGEMENT OF ALUMINIUM NITRIDE ELECTROSTATIC CHUCK  
An unseasoned substrate support assembly includes a ceramic body and a thermally conductive base bonded to a lower surface of the ceramic body. The substrate support assembly further includes an...
US20080052948 Spin head and substrate treating method using the same  
A spin head includes a rotatable plate, first chucking pins and second chucking pins for supporting a edge portion of a substrate loaded on the plate, and a driving unit for selectively driving...
US20120279045 Compound Tool With Screwdriver Attachment  
A punch down tool, a receiver for a punch down tool, and a work end adapter for a punch down tool, for terminating electrical conductors and turning fasteners, are disclosed. The work end adapter...
US20120227886 Substrate Assembly Carrier Using Electrostatic Force  
A portable electrostatic chuck carrier includes a holder having a dielectric top surface, and bipolar electrodes under the dielectric top surface. The bipolar electrodes includes positive...
US20070228673 Centering process in chucking work and apparatus therefor  
A process and apparatus for centering accurately and speedy a workpiece on a magnet chuck mounted on a work spindle. A pair of action pads spaced away from one another comes into engagement with...
US20090243235 ELECTROSTATIC CHUCK AND METHOD FOR MANUFACTURING THE SAME  
The electrostatic chuck includes a base including an aluminum nitride-containing member; a dielectric layer formed on the base including a member having a volume resistivity of at least 1×1015...
US20130285336 ALUMINA SINTERED BODY, MEMBER INCLUDING THE SAME, AND SEMICONDUCTOR MANUFACTURING APPARATUS  
An alumina sintered body contains alumina as a main component and titanium. The alumina sintered body further contains at least one element selected from the group consisting of lanthanum,...
US20080217870 Bit mounting devices  
A bit mounting device includes a holder that may be mounted to a spindle of the power tool or may be a part of the spindle. A bit push member is disposed within a bit receiving hole that is formed...
US20140346743 MULTI-ZONED PLASMA PROCESSING ELECTROSTATIC CHUCK WITH IMPROVED TEMPERATURE UNIFORMITY  
An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of inner...
US20120091104 MULTI-ZONED PLASMA PROCESSING ELECTROSTATIC CHUCK WITH IMPROVED TEMPERATURE UNIFORMITY  
An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of inner...
US20130127124 PERIPHERAL RF FEED AND SYMMETRIC RF RETURN WITH RF STRAP INPUT  
Systems and methods are presented for a peripheral RF feed and symmetric RF return for symmetric RF delivery. According to one embodiment, a chuck assembly for plasma processing is provided. The...
US20150061237 ELECTROSTATIC CHUCK AND SHOWERHEAD WITH ENHANCED THERMAL PROPERTIES AND METHODS OF MAKING THEREOF  
Embodiments of the present disclosure generally provide chamber components with enhanced thermal properties and methods of enhancing thermal properties of chamber components including bonding...
US20120248716 METHOD FOR PRODUCING ELECTROSTATIC CHUCK AND ELECTROSTATIC CHUCK  
A method for producing an electrostatic chuck includes the steps of (a) placing a ceramic slurry in a molding die, the ceramic slurry containing a ceramic powder, a solvent, a dispersing agent,...
US20140159325 SUBSTRATE SUPPORT ASSEMBLY HAVING METAL BONDED PROTECTIVE LAYER  
A substrate support assembly comprises a ceramic body and a thermally conductive base bonded to a lower surface of the ceramic body. The substrate support assembly further comprises a protective...
US20130187349 SCAN HEAD AND SCAN ARM USING THE SAME  
A scan head assembled to a scan arm for an ion implanter and a scan arm using the same are provided, wherein the scan head is capable of micro tilting a work piece and comprises a case, a shaft...
US20090230636 ELECTROSTATIC CHUCK  
An electrostatic chuck includes (a) a cooling device serving as an RF electrode, including a gas supply port penetrating through the cooling device, the gas supply port extending from one main...
US20120104703 ELECTROSTATIC CHUCK AND SHOWERHEAD WITH ENHANCED THERMAL PROPERTIES AND METHODS OF MAKING THEREOF  
Embodiments of the present invention generally provide chamber components with enhanced thermal properties and methods of enhancing thermal properties of chamber components including bonding...
US20140159324 COMPLIANT MICRO DEVICE TRANSFER HEAD ARRAY WITH METAL ELECTRODES  
Compliant monopolar and bipolar micro device transfer head arrays and methods of formation from SOI substrates are described. In an embodiment, an array of compliant transfer heads are formed over...
US20150115552 MAGNETIC CHUCK  
A magnetic chuck comprising: a lower plate to which a conductive magnetic body for fixing one side of a warped workpiece by magnetic force is coupled; a main body made of a magnetic material and...

Matches 1 - 50 out of 104 1 2 3 >