Matches 1 - 50 out of 53 1 2 >


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US20150171289 Substrate Insert Molding with Deposited Light-Generating Sources  
Disclosed herein are technologies related to film-insert molding (FIM) with deposited light-generating sources, such as printed light-emitting diodes. This Abstract is submitted with the...
US20120126453 PELLET LOADER WITH PELLET SEPARATOR FOR MOLDING IC DEVICES  
A pellet loading apparatus includes a tablet pusher including a support surfaces including a pusher mechanism coupled thereto for vertical movement upon actuation. A tablet holder on the tablet...
US20130037990 Molding Wafer Chamber  
A bottom chase and a top chase of a molding system form a cavity to house a molding carrier and one or more devices. The molding carrier is placed in a desired location defined by a guiding...
US20150011128 PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING SAME, AND METHOD OF MOUNTING THE CIRCUIT BOARD IN A CONNECTOR SOCKET  
A circuit board that is to be mounted in a connector socket includes a plurality of electrical connectors located along a side edge of the circuit board. Retention bosses are formed on first and...
US20090279269 WATERPROOF METHOD FOR ELECTRONIC DEVICE AND WATERPROOF ELECTRONIC DEVICE  
A waterproof method for an electronic device and a waterproof electronic device are provided. The electronic device comprises a printed circuit board, which comprises a board, a plurality of...
US20150117035 Heat Sink for Chip Mounting Substrate and Method for Manufacturing the Same  
Provided is a heat sink for a chip mounting substrate in which a heat dissipation material is embedded. The heat sink includes: an accommodation portion configured to accommodate a substrate...
US20070135550 Negative thermal expansion material filler for low CTE composites  
The present invention relates to a filler featuring a negative coefficient of thermal expansion and a bi-modal size distribution of filler particles. In an embodiment, the filler has micron and...
US20100330823 Cast grid array (CGA) package and socket  
A cast grid array (CGA) package comprises shaped solder posts which may be reflowed and connected directly to a circuit board, such as mother board, or remain in a solid state with the shape...
US20110255255 HOUSING FOR A CIRCUIT THAT IS TO BE IMPLANTED IN-VIVO AND PROCESS OF MAKING THE SAME  
The present invention provides a biocompatible circuit assembly that includes a circuit encased within a housing. In some embodiments, the housing is a PMMA housing and before the circuit is...
US20060055080 Semiconductor package having flash-free contacts and techniques for manufacturing the same  
Techniques for forming packaged semiconductor devices having top surfaces with flash-free electrical contact surfaces are described. According to one aspect, a molding cavity is provided which has...
US20090026656 VENTED MOLD FOR ENCAPSULATING SEMICONDUCTOR COMPONENTS  
A mold system for forming a mold cap on a semiconductor component includes a mold base and a mold lid that together define a mold cavity. The mold base supports the semiconductor component within...
US20090321988 CHIP PACKAGING PROCESS  
In a chip packaging process, an upper and a lower mold chases are provided. A thickness adjusting film is then provided below the upper mold chase and/or above the lower mold chase. Next, a...
US20140353010 Electronic Component and Method of Manufacturing the Electronic Component  
An electronic component includes a flexible printed circuit board which has a main body, a fixing portion and a connecting portion, and an insulating portion integrally molded to the fixing...
US20130255848 INFORMATION CARRYING CARD COMPRISING CROSSLINKED POLYMER COMPOSITION, AND METHOD OF MAKING THE SAME  
The disclosure provides a core layer for an information carrying card, resulting information carrying card, and methods of making the same. A core layer for an information carrying card comprises...
US20080265462 PANEL/WAFER MOLDING APPARATUS AND METHOD OF THE SAME  
The present invention provides an apparatus and a method for panel/wafer molding. The present invention discloses a base with a first separation layer, an upper molding base with a second...
US20100243743 RADIO FREQUENCY IDENTIFICATION TAG AND METHOD FOR MANUFACTURING THE SAME  
A radio frequency identification tag is provided. The radio frequency identification tag includes a base, an antenna formed on the base, an integrated circuit chip electrically connected to the...
US20120286050 MOLDED CHIP CARD AND METHOD FOR MANUFACTURING SAME  
The invention relates to a chip card comprising, a molded card body made by means of injection molding and, an integrated circuit chip, as well as to a method for manufacturing such a card. The...
US20110316201 Wafer Level Packaging Using Blade Molding  
In accordance with an embodiment, a molding apparatus comprises a screen having a planar top surface; a recess in the screen and extending below the planar top surface; a blade capable of...
US20070235897 MOLD APPARATUS AND METHOD  
An apparatus and method for producing an article by molding is disclosed. In one embodiment, the apparatus includes a mold with an upper part, a lower part and at least one mold cavity, and has a...
US20060043640 Method and system for multi-stage injection in a transfer molding system  
A system and method for multi-stage injection in a transfer molding system. Some exemplary embodiments may be a method used in a transfer molding system comprising compressing a molding compound,...
US20050035491 Moulding apparatus and method  
The present invention provides a method of moulding an article, the method comprising the steps of providing a mould (20) having a mould cavity (41); providing first and second films (26, 28), at...
US20120012949 PRESSURE SENSOR PACKAGE SYSTEMS AND METHODS  
Embodiments relate to integrated circuit (IC) sensors and sensing systems and methods. In an embodiment, an IC sensor device includes at least one sensing element; a framing element disposed...
US20090179347 Structure of embedded active components and manufacturing method thereof  
A structure of embedded active components and the manufacturing method thereof are provided. The manufacturing steps involve providing a molding plate, and setting several active components on the...
US20110261550 USE OF CONDUCTIVE PAINT AS A METHOD OF ELECTROMAGNETIC INTERFERENCE SHIELDING ON SEMICONDUCTOR DEVICES  
A conductive paint electromagnetic interference (EMI) shield for an electronic module or device. The conductive paint is composed of metal particles suspended in a fluidic carrier. In one...
US20090189310 SEMICONDUCTOR CHIP COMPRESSION MOLDING METHOD AND MOLD FOR COMPRESSION MOLDING  
By clamping upper and lower molds, a semiconductor chip and a stacking connection electrode are immersed in a resin material heated and molten in a cavity coated with a mold release film. The mold...
US20050104251 Integrated circuit chip packaging process  
An integrated circuit chip packaging process includes the steps of: (a) preparing a ceramic substrate having sub-substrates, each sub-substrate having connecting pads, and then attaching a...
US20100149929 TIME DEPENDENT-TEMPERATURE INDEPENDENT COLOR CHANGING LABEL  
A timing device for indicating a passage of a duration of time is disclosed. The timing device in accordance with the embodiments of the invention has a grid array architecture. The grid array...
US20060255504 Method and casting mold for producing a protective layer on integrated components  
In a method for producing an integrated component, a carrier strip is provided with at least one arrangement of chips. A casting mold is placed over the carrier strip in such a way that the...
US20150118499 ACTIVE ESTER RESIN, THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF SAME, SEMICONDUCTOR ENCAPSULATION MATERIAL, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM  
A cured product exhibits good heat resistance and flame retardancy as well as low dielectric constant and low loss tangent. A phosphorus-containing compound (i) obtained by a reaction between an...
US20090166923 Methods and Apparatus to Evenly Clamp Semiconductor Substrates  
Methods and apparatus to evenly clamp semiconductor substrates in a transfer mold process are disclosed. A disclosed split mold base includes a first plate having a first surface, a second plate...
US20050106784 Method and apparatus for forming a flip chip semiconductor package and method for producing a substrate for the flip chip semiconductor package  
Specifications of a flip chip package and mold compound for a package are provided to a mold flow simulator and locations of void formation in the package during molding, identified. Subsequently,...
US20120141722 TWO-COLOR MOLDING EQUIPMENT AND TWO-COLOR MOLDED PRODUCT  
A two-color molding equipment for shaping a two-color molded product by placing a film in primary mold tool configured by a fixed mold and a movable mold, injecting a resin into a first cavity to...
US20100096772 RELEASE FILM FOR SEMICONDUCTOR RESIN MOLDS  
A process of sealing a semiconductor substrate by contacting the semiconductor substrate with a surface of a release layer (I) of a gas barrier release film that is in the form of a mold, which...
US20060267162 Lead frame, semiconductor device, method for producing semiconductor device, and injection mold  
A lead frame 11 is positioned in an injection mold as appropriate, and sealing resin is injected along the flow of resin RF from a runner portion 12. The sealing resin is injected into a cavity...
US20120061880 MOLDING APPARATUS AND MOLDING METHOD FOR PACKAGING SEMICONDUCTOR  
A molding apparatus for packaging a semiconductor device includes an upper mold having a first cavity, a lower mold having a second cavity corresponding to the first cavity, and a selective flow...
US20100230792 Premolded Substrates with Apertures for Semiconductor Die Packages with Stacked Dice, Said Packages, and Methods of Making the Same  
Disclosed are premolded substrates for semiconductor die packages and methods of making such substrates. An exemplary premolded substrate comprises a leadframe having a first surface, a second...
US20100219517 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND MOLDING DIE  
Provided is a method for manufacturing a semiconductor device in which movement of an island in resin sealing is prevented. A molding die includes an upper die and a lower die. The upper and lower...
US20100213623 Method Of Manufacturing A Semiconductor Device And A Semiconductor Device Produced Thereby  
A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable silicone composition which is fed...
US20100213595 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF AND ENCAPSULATING METHOD THEREOF  
A semiconductor package, a manufacturing method thereof and an encapsulating method thereof are provided. The semiconductor package includes a substrate, a flip chip, a plurality of conductive...
US20100133722 SEMICONDUCTOR DEVICE MANUFACTURING METHOD  
A method for a semiconductor device includes the following processes. A first seal layer is formed in a cavity of a first mold, the first seal layer being in a liquid state. A second seal layer is...
US20100001432 APPARATUS FOR PASSIVATING A COMPONENT AND METHOD FOR PRODUCING THE APPARATUS  
An apparatus for passivating a component in a housing, the component including a substrate; the housing completely surrounding the substrate in a first substrate region; the housing being provided...
US20160190412 PACKAGE, LIGHT-EMITTING DEVICE, AND METHOD FOR MANUFACTURING THE SAME  
A package includes a plurality of electrode pairs, each electrode pair including a first electrode on one side and a second electrode on another side in a plan view. The first electrode is...
US20160141187 METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT WITH IMPRINT, INTEGRATED CIRCUIT WITH IMPRINT, DEVICE FOR FORMING AN INTEGRATED CIRCUIT WITH IMPRINT AND VERIFICATION SYSTEM FOR AN INTEGRATED CIRCUIT WITH IMPRINT  
According to various embodiments, a method of manufacturing an integrated circuit may include providing a film structure having at least one of at least one recess or at least one protrusion, and...
US20160133808 METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT  
A method of manufacturing an optoelectronic component includes providing a leadframe, wherein the leadframe has a first leadframe section and a second leadframe section, and the first leadframe...
US20160130136 ENVIRONMENTAL SENSOR STRUCTURE  
A device in which an electronic circuit positioned within a cavity of a package housing is encased by a bubble restrictor material, with a media resistant material overlaying the bubble restrictor...
US20150235872 Curable Silicone Composition, Method For Producing Semiconductor Device, And Semiconductor Device  
The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane composed of: (A-1) a linear organopolysiloxane having at least two silicon-bonded alkenyl...
US20140145369 APPARATUSES AND METHODS FOR FABRICATING SEMICONDUCTOR PACKAGES  
An apparatus for fabricating a semiconductor package may include a mold and a molding plate. The mold may define a mold cavity with the mold being configured to receive a circuit board in the mold...
US20130020669 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, RESIN SEALING APPARATUS, AND SEMICONDUCTOR DEVICE  
When a resin sealed package is molded with use of a release film for the purpose of preventing generation of a flash on a surface of a seal glass, the seal glass may be broken by being compressed...
US20130005087 METHOD AND APPARATUS FOR MOLDING SEMICONDUCTOR DEVICE  
An apparatus for molding a semiconductor device includes an upper mold chase and a lower mold chase. The mold chases are capable of being aligned with each other, forming spaced cavities for...
US20120280425 MOLD FOR MEASURING FLOW CHARACTERISTICS, METHOD FOR MEASURING FLOW CHARACTERISTICS, RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS  
According to the invention, a mold for measuring flow characteristics which is used to measure the flow characteristics of a resin composition, which is a measurement subject, by injecting the...

Matches 1 - 50 out of 53 1 2 >