Match Document Document Title
US20110204409 hBN INSULATOR LAYERS AND ASSOCIATED METHODS  
Electrically insulating layers having increased thermal conductivity, as well as associated devices and methods are disclosed. In one aspect, for example, a printed circuit board is provided...
US20140306263 TRANSPARENT CONDUCTIVE COATING WITH FILLER MATERIAL  
An article is disclosed comprising a network-like pattern of conductive traces formed of at least partially joined nanoparticles that define randomly-shaped cells that are generally transparent to...
US20080042158 Liquid crystal display device  
A display device having a display element is configured such that the extending directions of electrodes are made different from each other among upper, lower, left and right pixels.
US20110272695 PIXEL HAVING AN ORGANIC LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE PIXEL  
A pixel having an organic light emitting diode (OLED) and method for fabricating the pixel is provided. A planarization dielectric layer is provided between a thin-film transistor (TFT) based...
US20070257274 Lighting Device And Method  
A lighting device having a light emitting diode (LED). The device includes a metal substrate having a surface. A dielectric coating layer is superimposed on the surface of the metal substrate. A...
US20070080360 Microelectronic interconnect substrate and packaging techniques  
A LED (Light Emitting Diode) substrate and packaging for a single diode or a diode array is described. The substrate includes an integral reflector(s) for the diode(s) in the form of a shaped...
US20100270545 LIGHT-EMITTING DEVICE USING VOLTAGE SWITCHABLE DIELECTRIC MATERIAL  
A voltage switchable dielectric material (VSD) material as part of a light-emitting component, including LEDs and OLEDs.
US20070200132 Electrical connection for optoelectronic devices  
A structure having an optical element thereon has a portion of the structure extending beyond a region having the optical element in at least one direction. The structure may include an active...
US20050116245 Hermetically sealed glass package and method of fabrication  
A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. In one embodiment, the hermetically...
US20160014878 THERMAL MANAGEMENT CIRCUIT MATERIALS, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM  
A thermal management circuit material comprises a thermally conductive metallic core substrate having at least one through-hole via, non-metallic dielectric layers deposited on both sides of the...
US20140159096 Micro-Interconnects for Light-Emitting Diodes  
The present disclosure provides a method of fabricating a light emitting diode (LED) package. The method includes bonding a plurality of separated light emitting diode (LED) dies to a substrate,...
US20130146936 LIGHT EMITTING DIODE CHIP, LIGHT EMITTING DIODE PACKAGE STRUCTURE, AND METHOD FOR FORMING THE SAME  
A light emitting diode chip, a light emitting diode package structure and a method for forming the same are provided. The light emitting diode chip includes a bonding layer, which has a plurality...
US20120228665 METHOD OF MANUFACTURING GALLIUM NITRIDE-BASED COMPOUND SEMICONDUCTOR LIGHT-EMITTING DEVICE, GALLIUM NITRIDE-BASED COMPOUND SEMICONDUCTOR LIGHT-EMITTING DEVICE, AND LAMP  
Provided are a method of manufacturing a gallium nitride-based compound semiconductor light-emitting device with a low driving voltage (VI) and high light outcoupling efficiency, a gallium...
US20070145402 SEMICONDUCTOR COMPONENT WHICH EMITS RADIATION, AND METHOD FOR PRODUCING THE SAME  
This invention describes a radiation-emitting semiconductor component with the a multilayered structure that contains a radiation-emitting active layer, and a window transparent to radiation that...
US20110278635 Method for producing electronic device substrate, method for manufacturing electronic device, electronic device substrate, and electronic device  
A method for producing a substrate for an electronic device, that can improve light extraction efficiency, can easily produces and has high liability is provided. The method includes: a step of...
US20070246729 High efficiency LED package  
A light emitting diode (LED) package is disclosed. In one embodiment, the LED package includes an LED, which emits light corresponding to an electric signal and a substrate, which is mounted to...
US20070090387 Solid state light sheet and encapsulated bare die semiconductor circuits  
An electronically active sheet includes a bottom substrate having a bottom electrically conductive surface. A top substrate having a top electrically conductive surface is disposed facing the...
US20080283862 Side-emission type semiconductor light-emitting device and manufacturing method thereof  
A side-emission type semiconductor light-emitting device 10 includes a substrate 12, and the substrate 12 is provided with a case 14 formed of a resin having opacity and reflectivity. The...
US20070252161 LED MOUNTING STRUCTURES  
An LED assembly may include a substrate, an elongate mounting structure that is formed in or on the substrate, and an LED that is mechanically secured to the elongate mounting structure. A light...
US20060027828 Light-emitting diode lamp  
An LED lamp (30) comprising a circuit board (22) on which electrode patterns are formed, a reflective frame (31) provided on the circuit board (22) and having a concave portion (32), a light...
US20160247982 LIGHT-EMITTING DEVICE  
A light-emitting device including a light-emitting unit, an electrode unit, and an insulating unit is provided. The light-emitting unit includes an illuminator and a packaging sealant. The...
US20100320500 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING AN EVEN COATING THICKNESS USING ELECTRO-LESS PLATING AND RELATED DEVICE  
A method of manufacturing a semiconductor device includes forming a diffusion barrier layer on a substrate, and forming at least two features on the substrate such that the diffusion barrier layer...
US20090108276 High Efficiency Dilute Nitride Light Emitting Diodes  
A light-emitting diode comprising AlnInmGa1-m-nNcAsvSbkP1-c-v-k where 0.001
US20080035948 Light emitting diode package  
A light emitting diode package for preventing an electric short circuit among semiconductor layers and with excellent bonding strength. The light emitting diode package includes a package...
US20070120140 Semiconductor apparatus with thin semiconductor film  
A semiconductor apparatus includes a substrate having at least one terminal, a thin semiconductor film including at least one semiconductor device, the thin semiconductor film being disposed and...
US20050104081 Semiconductor light emitting diode and method for manufacturing the same  
Provided is a light emitting diode including a base substrate having a via hole, a buffer layer having a via hole which is partially overlapped with the via hole of the base substrate, a first...
US20160240758 LIGHT EMITTING DIODE  
Provided is a light emitting diode (LED) mounted on a carrier substrate and including a semiconductor epitaxial structure and at least one electrode pad structure. The semiconductor epitaxial...
US20160240740 LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES  
A light emitting diode (LED) package includes a package body having a recessed portion, a first lead electrode and a second lead electrode spaced apart from each other, and a light emitting device...
US20130056784 Organic Light-Emitting Display Device and Method of Fabricating the Same  
An organic electro-luminescence device capable of reducing a resistance of a cathode electrode to enhance brightness uniformity at each location within the device is described. The organic...
US20130032851 OPTOELECTRONIC ARCHITECTURE HAVING COMPOUND CONDUCTING SUBSTRATE  
Optoelectronic device modules, arrays optoelectronic device modules and methods for fabricating optoelectronic device modules are disclosed. The device modules are made using a starting substrate...
US20120187444 TEMPLATE, METHOD FOR MANUFACTURING THE TEMPLATE AND METHOD FOR MANUFACTURING VERTICAL TYPE NITRIDE-BASED SEMICONDUCTOR LIGHT EMITTING DEVICE USING THE TEMPLATE  
Disclosed herein is a method for manufacturing a template. The method includes growing a first nitride layer on a substrate; etching a top surface of the first nitride layer by supplying a...
US20120112238 MICROELECTRONIC INTERCONNECT SUBSTRATE AND PACKAGING TECHNIQUES  
A LED (Light Emitting Diode) substrate and packaging for a single diode or a diode array is described. The substrate includes an integral reflector(s) for the diode(s) in the form of a shaped...
US20120007135 SEMICONDUCTOR DEVICE  
An exemplary semiconductor device is provided. The semiconductor device includes a semiconductor stacked layer and a conductive structure. The conductive structure is located on the semiconductor...
US20110012151 LIGHT EMITTING DEVICE  
A light emitting device includes: a mounting member including a recess; a light emitting element provided in the recess and made of a semiconductor; an electrostatic discharge protection element...
US20100059789 NITRIDE SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR FABRICATING THEREOF  
Disclosed is a nitride semiconductor light-emitting device, including a substrate, a nitride semiconductor layer including a first conductive layer, an active layer and a second conductive layer...
US20100019267 LED OF SIDE VIEW TYPE AND THE METHOD FOR MANUFACTURING THE SAME  
A side view type light emitting diode (LED) and a method of manufacturing the same are disclosed. In one embodiment, the LED includes i) a pair of lead frames, ii) a reflector surrounding the lead...
US20080012125 Light Emitting Diode Package  
Provided is a light emitting diode package. The light emitting diode package includes a base, a light emitting diode mounted in the base, and a driving chip mounted in the base to drive the light...
US20110186899 SEMICONDUCTOR DEVICE WITH A VARIABLE INTEGRATED CIRCUIT CHIP BUMP PITCH  
A semiconductor device is described that comprises an integrated circuit substrate comprising a plurality of bonding pads for enabling electrical connectivity to a chip circuit. The bonding pads...
US20090321779 SIDE VIEW LIGHT EMITTING DIODE PACKAGE  
A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the...
US20090173956 CONTACT FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE  
An AlGaInP light emitting device is formed as a thin, flip chip device. The device includes a semiconductor structure comprising an AlGaInP light emitting layer disposed between an n-type region...
US20070152226 LED lamps  
A high power LED lamp has a GaN chip placed over an AlGaInP chip. A reflector is placed between the two chips. Each of the chips has trenches diverting light for output. The chip pair can be...
US20070114557 Flip-chip light emitting diode device without sub-mount  
A light emitting diode (10) has a backside and a front-side with at least one n-type electrode (14) and at least one p-type electrode (12) disposed thereon defining a minimum electrodes separation...
US20060284207 Light emitting diode package with metal reflective layer and method of manufacturing the same  
The invention relates to an LED package having a metal reflective layer for focusing and emitting light through a side of the package, and a manufacturing method of the same. The LED package...
US20050133810 Opto-electronic assembly having an encapsulant with at least two different functional zones  
A radiation emitting device of the present invention includes at least one radiation emitter, first and second electrical leads electrically coupled to the radiation emitter, and an integral...
US20110291147 OHMIC CONTACTS FOR SEMICONDUCTOR STRUCTURES  
A composition and method for formation of ohmic contacts on a semiconductor structure are provided. The composition includes a TiAlxNy material at least partially contiguous with the semiconductor...
US20070187708 LED Illumination Apparatus and Card-Type LED Illumination Source  
An LED illumination includes an insertable and removable LED illumination source having a feeder terminal on one surface of a substrate on which an LED has been mounted; a thermal conductor...
US20130126933 ELECTRONIC DEVICE CONTACT STRUCTURES  
Electronic device contact structures are disclosed.
US20130020609 SEMICONDUCTOR LIGHT-EMITTING DEVICE HAVING STACKED TRANSPARENT ELECTRODES  
This application is related to a semiconductor light-emitting device including a substrate, a semiconductor epitaxial layer over the substrate and having a first surface distant from the...
US20120175667 LED LIGHT DISPOSED ON A FLEXIBLE SUBSTRATE AND CONNECTED WITH A PRINTED 3D CONDUCTOR  
An example includes subject matter (such as an apparatus) comprising a planar substrate including a first surface that is planar, at least one bare light emitting diode (“LED”) die coupled to the...
US20120113328 MOUNTING SUBSTRATE FOR SEMICONDUCTOR LIGHT EMITTING ELEMENT, BACKLIGHT CHASSIS, DISPLAY DEVICE AND TELEVISION RECEIVER  
Disclosed are a mounting substrate for semiconductor light emitting elements, a backlight chassis containing the substrate, a display device and a television receiver. The substrate is easily...