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US20130016313 |
PIXEL UNIT AND DISPLAY PANEL HAVING THE SAME
In a pixel unit and a display panel having the pixel unit, the pixel unit includes a pixel portion configured to display a color, and a transmissive portion configured to transmit light. The pixel... |
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US20110241058 |
LED HEAT DISSIPATING MODULE
A light emitting diode (LED) heat dissipating module includes an aluminum base plate, at least one connecting hole formed on aluminum base plate, and a copper pillar installed in the connecting... |
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US20110080747 |
LED LIGHT STRUCTURE
A LED light structure is designed to replace a LED unit easily by user as the LED unit is broken, and a plate member disposed in the LED light structure is removed quickly as replacement. In... |
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US20110278629 |
LED THERMAL MANAGEMENT
Thermal management solutions for higher power LEDs. In accordance with embodiments, a heat sink, preferably copper, is connected directly to the thermal pad of an LED. Directly connecting the LED... |
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US20110278633 |
LED Light Bulb With Integrated Heat Sink
The use of an LED light source coupled with an integrated heat sink is described in this application. The most preferred embodiments of the present invention comprise an LED light source... |
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US20120025216 |
PHOSPHOR SUSPENDED IN SILICONE, MOLDED/FORMED AND USED IN A REMOTE PHOSPHOR CONFIGURATION
A light emitting package comprising a support hosting at least one light emitting diode. A light transmissive dome comprised of a silicone including a phosphor material positioned to receive light... |
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US20110089460 |
LIGHT EMITTING DIODE ASSEMBLY
An electronic assembly includes a Light Emitting Diode (LED) mounted on a top surface of a heat spreader, at least two electrical contacts co-planar with the heat spreader, and at least one heat... |
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US20140225152 |
WIRING BOARD AND LIGHT EMITTING DEVICE USING SAME, AND MANUFACTURING METHOD FOR BOTH
A wiring board includes a base in which plate wirings formed of a metal plate are integrally formed with an insulating portion made of resin or a resin composition and surface wirings electrically... |
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US20100320497 |
LED bracket structure
The present invention relates to a new LED bracket structure and in particular to a bracket that adopts the structure in which the upper section and lower section are made of different materials,... |
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US20110012161 |
MANUFACTURING METHODS AND INSTALLATION PROCEDURES WHICH CONFORMING TO THE INTERNATIONAL SAFETY CODES AND REGULATIONS FOR AC LED LAMP
An alternating-current (AC) light-emitting diode (LED) lamp conforming to international safety regulations and a method for making the same are provided, wherein the core technique involves a... |
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US20110297973 |
LED WITH AN ADSORPTION PLATE
The present invention relates to an LED with an adsorption plate attached thereto, and more particularly, to an LED which is covered with a light transmitter made of a light-transmitting material... |
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US20130168724 |
WARM WHITE LIGHT LED CHIP WITH HIGH BRIGHTNESS AND HIGH COLOR RENDERING
A warm white light LED chip with high brightness and high color rendering includes a white light part emitting a white light, a colored light part emitting a colored light with a wavelength of 580... |
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US20130134454 |
WATER RESISTANT LED DEVICES AND AN LED DISPLAY INCLUDING SAME
The disclosure provides an LED package including a first plastic portion having a mounting surface and a lower surface. In some embodiments, the LED package includes a second portion surrounding... |
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US20100025719 |
BOND PAD DESIGN FOR ENHANCING LIGHT EXTRACTION FROM LED CHIPS
An improved bond pad design for increased light extraction efficiency for use in light emitting diodes (LEDs) and LED packages. Embodiments of the present invention incorporate a structure that... |
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US20130187189 |
HEAT SINK BIMETALLIC PILLAR BUMP AND THE LED HAVING THE SAME
The invention relates to a heat sink bimetallic pillar bump that is mainly disposed inside of a LED. The heat sink bimetallic pillar bump comprises a heat absorbing section composed of a first... |
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US20120241807 |
Mounting Structure for Solid State Light Sources
A mounting structure for solid-state light sources, for example of the LED type, comprises a support board; a submount mounted on said support board and having at least one solid-state light... |
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US20130256721 |
LED Light with Electrostatic Protection and Backlight Module Using the LED Light
The present invention provides an LED light with electrostatic protection and a backlight module using the LED light. The LED light includes a carrying frame, a light-emitting die mounted in the... |
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US20120287606 |
LED LIGHT SOURCE ASSEMBLY, BACK LIGHT MODULE AND LIQUID CRYSTAL DISPLAY DEVICE
The present disclosure provides an LED light source assembly which includes an LED chip and a printed circuit board. The LED chip is arranged on the printed circuit board. At least a hole... |
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US20130062641 |
LED LAMP
A LED lamp is disclosed which has a plurality of light unit, each of the light unit has at least one flat metal lead for heat dissipation and the lower part of the metal lead is mounted on a heat... |
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US20130020606 |
CIRCUIT BOARD WITH THERMO-CONDUCTIVE PILLAR
An LED device with improved circuit board LED support structure is presented. A top surface of a thermally-conductive substrate of this LED device comprises a thermally-conductive pillar. The... |
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US20100065882 |
GLASS FOR COVERING OPTICAL ELEMENT, GLASS-COVERED LIGHT-EMITTING ELEMENT AND GLASS-COVERED LIGHT-EMITTING DEVICE
A glass-covered light-emitting element and a glass-covered light-emitting device are provided, which are covered with a glass having a low glass transition point and a thermal expansion... |
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US20110301909 |
TEMPERATURE MEASUREMENT SYSTEM FOR A LIGHT EMITTING DIODE (LED) ASSEMBLY
A temperature measurement system is provided for a light emitting diode (LED) assembly that includes an LED having two semiconductors joined together at an LED junction. The system includes a... |
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US20110316038 |
SUBSTRATE COMPRISING ALUMINUM/GRAPHITE COMPOSITE, HEAT DISSIPATION PART COMPRISING SAME, AND LED LUMINESCENT MEMBER
A process for producing a substrate, which comprises processing an aluminum/graphite composite into plates having a thickness of 0.5-3 mm using a multi-wire saw under the following conditions (1)... |
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US20130193476 |
LIGHT EMITTING DEVICE WITH REDUCE EPI STRESS
Elements are added to a light emitting device to reduce the stress within the light emitting device caused by thermal cycling. Alternatively, or additionally, materials are selected for forming... |
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US20080029780 |
Solid state device
A solid state device has a solid state component, a power receiving/supplying portion that mounts the solid state component thereon for receiving/supplying electrical power from/to the solid state... |
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US20120235206 |
LIGHTING DEVICE AND METHOD FOR CONTACTING A LIGHTING DEVICE
A lighting device may include a printed circuit board, wherein the printed circuit board has wiring on at least one of the front side and the back side thereof, the respective wiring is covered by... |
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US20110175135 |
Circuit Board For LED
A submount comprising a chip mounting area, a first bonding pad and a connecting portion is provided. An LED chip is mounted on the chip mounting area. The first bonding pad is electrically... |
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US20130214316 |
LED DEVICE WITH STRUCTURE FOR PRECISELY LOCATING LEDS THEREON AND METHOD FOR MANUFACTURING THE SAME
An SMT LED device includes an LED and a circuit board supporting the LED. A pair of first solder pads are formed on the circuit board and spaced from each other. The LED includes two solder slugs... |
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US20110108865 |
SILICONE BASED REFLECTIVE UNDERFILL AND THERMAL COUPLER
In one embodiment, a flip chip LED is formed with a high density of gold posts extending from a bottom surface of its n-layer and p-layer. The gold posts are bonded to submount electrodes. An... |
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US20130075781 |
LED WITH HONEYCOMB RADIATING HEAT DISSIPATION DEVICE
An LED with a honeycomb radiating heat dissipation device includes a sapphire substrate, an LED epitaxy layer on the sapphire substrate, a thermally conductive binding layer, an intermediate heat... |
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US20130168722 |
SURFACE-MOUNTING LIGHT EMITTING DIODE DEVICE AND METHOD FOR MANUFACTURING THE SAME
An SMT LED device includes an LED and a circuit board carrying the LED. The circuit board has two copper pads thereon, each being provided with a solder on an inner later side thereof which faces... |
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US20140306259 |
LIGHT EMITTING DIODE
A siloxane compound comprises a plurality of siloxane repeating units and at least a portion of the siloxane repeating units are cyclosiloxane repeating units conforming to a specified structure.... |
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US20120132952 |
LIGHT-EMITTING DIODE LAMP WITH LOW THERMAL RESISTANCE
A light-emitting diode (LED) structure with an improved heat transfer path with a lower thermal resistance than conventional LED lamps is provided. For some embodiments, a surface-mountable... |
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US20100320490 |
LIGHT EMITTING DIODE PACKAGING STRUCTURE
A light emitting diode (LED) packaging structure includes a base, a transparent layer, and an LED chip. The transparent layer is provided between the LED chip and the base to increase a relative... |
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US20140124824 |
ENCAPSULATION HOUSING AND LED MODULE WITH THE SAME
An encapsulation housing for a LED module, may include an upper housing and a lower housing joined together and defining together a cavity, wherein at least one of the upper housing and the lower... |
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US20120313133 |
HETEROSTRUCTURE CONTAINING IC AND LED AND METHOD FOR FABRICATING THE SAME
A heterostructure contains an IC and an LED. An IC and an LED are initially provided. The IC has at least one first electric-conduction block and at least one first connection block. The IC... |
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US20150008473 |
LED LIGHT
Provided is an LED light which may include a base plate, an LED module disposed under the base plate, a plurality of heat pipes provided over the base plate, and a plurality of heat dissipation... |
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US20110049559 |
LIGHT-EMITTING DIODE LAMP WITH LOW THERMAL RESISTANCE
A light-emitting diode (LED) structure with an improved heat transfer path with a lower thermal resistance than conventional LED lamps is provided. For some embodiments, a surface-mountable... |
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US20150129910 |
System and Method for Connecting LED Devices
To connect multiple LED devices, each LED device is placed in a holder. A first wire is connected to a first wire connection point on the holder and a second wire is connected to a second wire... |
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US20120268968 |
HEAT RADIATING PRINTED CIRCUIT BOARD AND CHASSIS ASSEMBLY HAVING THE SAME
The present invention relates to a heat radiating printed circuit board (PCB) and a chassis assembly having the same, the heat-radiating PCB characterized by: a circuit pattern unit mounted with a... |
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US20110156083 |
Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof
A light emission module is provided. The light emission module includes a substrate, a plurality of LED chips disposed on the substrate, a fluorescent colloid and a package colloid surrounding the... |
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US20130009186 |
LED LAMPS
A high power LED lamp has a GaN chip placed over an AlGaInP chip. A reflector is placed between the two chips. Each of the chips has trenches diverting light for output. The chip pair can be... |
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US20120305980 |
LED LAMPS
A high power LED lamp has a GaN chip placed over an AlGaInP chip. A reflector is placed between the two chips. Each of the chips has trenches diverting light for output. The chip pair can be... |
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US20120305978 |
LED LAMPS
A high power LED lamp has a GaN chip placed over an AlGaInP chip. A reflector is placed between the two chips. Each of the chips has trenches diverting light for output. The chip pair can be... |
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US20120161193 |
LED LAMPS
A high power LED lamp has a GaN chip placed over an AlGaInP chip. A reflector is placed between the two chips. Each of the chips has trenches diverting light for output. The chip pair can be... |
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US20110241062 |
LED lamps
A high power LED lamp has a GaN chip placed over an AlGaInP chip. A reflector is placed between the two chips. Each of the chips has trenches diverting light for output. The chip pair can be... |
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US20110266560 |
WHITE-EMITTING LED CHIPS AND METHOD FOR MAKING SAME
Methods and devices for light emitting diode (LED) chips are provided. In one embodiment of a method, a pre-formed capping wafer is provided, with the capping wafer comprising a conversion... |
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US20120018773 |
ALTERNATING-CURRENT LIGHT EMITTING DIODE STRUCTURE WITH OVERLOAD PROTECTION
The present invention relates to an alternating current (AC) light emitting diode (LED) structure with overload protection, which comprises an AC LED, a heat dissipating unit and an overload... |
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US20110220958 |
ILLUMINATION DEVICE AND METHOD FOR MANUFACTURING THE SAME
The present invention relates to a method for easily manufacturing an illumination device in which a surface mount chip-type LED is used, and a wiring board is formed into a truncated conical or... |
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US20120056215 |
LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES
Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body.... |