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US20110204409 |
hBN INSULATOR LAYERS AND ASSOCIATED METHODS
Electrically insulating layers having increased thermal conductivity, as well as associated devices and methods are disclosed. In one aspect, for example, a printed circuit board is provided... |
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US20140306263 |
TRANSPARENT CONDUCTIVE COATING WITH FILLER MATERIAL
An article is disclosed comprising a network-like pattern of conductive traces formed of at least partially joined nanoparticles that define randomly-shaped cells that are generally transparent to... |
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US20080042158 |
Liquid crystal display device
A display device having a display element is configured such that the extending directions of electrodes are made different from each other among upper, lower, left and right pixels. |
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US20110272695 |
PIXEL HAVING AN ORGANIC LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE PIXEL
A pixel having an organic light emitting diode (OLED) and method for fabricating the pixel is provided. A planarization dielectric layer is provided between a thin-film transistor (TFT) based... |
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US20070257274 |
Lighting Device And Method
A lighting device having a light emitting diode (LED). The device includes a metal substrate having a surface. A dielectric coating layer is superimposed on the surface of the metal substrate. A... |
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US20070080360 |
Microelectronic interconnect substrate and packaging techniques
A LED (Light Emitting Diode) substrate and packaging for a single diode or a diode array is described. The substrate includes an integral reflector(s) for the diode(s) in the form of a shaped... |
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US20100270545 |
LIGHT-EMITTING DEVICE USING VOLTAGE SWITCHABLE DIELECTRIC MATERIAL
A voltage switchable dielectric material (VSD) material as part of a light-emitting component, including LEDs and OLEDs. |
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US20070200132 |
Electrical connection for optoelectronic devices
A structure having an optical element thereon has a portion of the structure extending beyond a region having the optical element in at least one direction. The structure may include an active... |
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US20050116245 |
Hermetically sealed glass package and method of fabrication
A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. In one embodiment, the hermetically... |
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US20160014878 |
THERMAL MANAGEMENT CIRCUIT MATERIALS, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM
A thermal management circuit material comprises a thermally conductive metallic core substrate having at least one through-hole via, non-metallic dielectric layers deposited on both sides of the... |
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US20140159096 |
Micro-Interconnects for Light-Emitting Diodes
The present disclosure provides a method of fabricating a light emitting diode (LED) package. The method includes bonding a plurality of separated light emitting diode (LED) dies to a substrate,... |
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US20130146936 |
LIGHT EMITTING DIODE CHIP, LIGHT EMITTING DIODE PACKAGE STRUCTURE, AND METHOD FOR FORMING THE SAME
A light emitting diode chip, a light emitting diode package structure and a method for forming the same are provided. The light emitting diode chip includes a bonding layer, which has a plurality... |
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US20120228665 |
METHOD OF MANUFACTURING GALLIUM NITRIDE-BASED COMPOUND SEMICONDUCTOR LIGHT-EMITTING DEVICE, GALLIUM NITRIDE-BASED COMPOUND SEMICONDUCTOR LIGHT-EMITTING DEVICE, AND LAMP
Provided are a method of manufacturing a gallium nitride-based compound semiconductor light-emitting device with a low driving voltage (VI) and high light outcoupling efficiency, a gallium... |
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US20070145402 |
SEMICONDUCTOR COMPONENT WHICH EMITS RADIATION, AND METHOD FOR PRODUCING THE SAME
This invention describes a radiation-emitting semiconductor component with the a multilayered structure that contains a radiation-emitting active layer, and a window transparent to radiation that... |
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US20110278635 |
Method for producing electronic device substrate, method for manufacturing electronic device, electronic device substrate, and electronic device
A method for producing a substrate for an electronic device, that can improve light extraction efficiency, can easily produces and has high liability is provided. The method includes: a step of... |
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US20070246729 |
High efficiency LED package
A light emitting diode (LED) package is disclosed. In one embodiment, the LED package includes an LED, which emits light corresponding to an electric signal and a substrate, which is mounted to... |
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US20070090387 |
Solid state light sheet and encapsulated bare die semiconductor circuits
An electronically active sheet includes a bottom substrate having a bottom electrically conductive surface. A top substrate having a top electrically conductive surface is disposed facing the... |
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US20080283862 |
Side-emission type semiconductor light-emitting device and manufacturing method thereof
A side-emission type semiconductor light-emitting device 10 includes a substrate 12, and the substrate 12 is provided with a case 14 formed of a resin having opacity and reflectivity. The... |
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US20070252161 |
LED MOUNTING STRUCTURES
An LED assembly may include a substrate, an elongate mounting structure that is formed in or on the substrate, and an LED that is mechanically secured to the elongate mounting structure. A light... |
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US20060027828 |
Light-emitting diode lamp
An LED lamp (30) comprising a circuit board (22) on which electrode patterns are formed, a reflective frame (31) provided on the circuit board (22) and having a concave portion (32), a light... |
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US20160247982 |
LIGHT-EMITTING DEVICE
A light-emitting device including a light-emitting unit, an electrode unit, and an insulating unit is provided. The light-emitting unit includes an illuminator and a packaging sealant. The... |
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US20100320500 |
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING AN EVEN COATING THICKNESS USING ELECTRO-LESS PLATING AND RELATED DEVICE
A method of manufacturing a semiconductor device includes forming a diffusion barrier layer on a substrate, and forming at least two features on the substrate such that the diffusion barrier layer... |
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US20090108276 |
High Efficiency Dilute Nitride Light Emitting Diodes
A light-emitting diode comprising AlnInmGa1-m-nNcAsvSbkP1-c-v-k where 0.001
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US20080035948 |
Light emitting diode package
A light emitting diode package for preventing an electric short circuit among semiconductor layers and with excellent bonding strength. The light emitting diode package includes a package... |
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US20070120140 |
Semiconductor apparatus with thin semiconductor film
A semiconductor apparatus includes a substrate having at least one terminal, a thin semiconductor film including at least one semiconductor device, the thin semiconductor film being disposed and... |
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US20050104081 |
Semiconductor light emitting diode and method for manufacturing the same
Provided is a light emitting diode including a base substrate having a via hole, a buffer layer having a via hole which is partially overlapped with the via hole of the base substrate, a first... |
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US20160240758 |
LIGHT EMITTING DIODE
Provided is a light emitting diode (LED) mounted on a carrier substrate and including a semiconductor epitaxial structure and at least one electrode pad structure. The semiconductor epitaxial... |
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US20160240740 |
LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES
A light emitting diode (LED) package includes a package body having a recessed portion, a first lead electrode and a second lead electrode spaced apart from each other, and a light emitting device... |
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US20130056784 |
Organic Light-Emitting Display Device and Method of Fabricating the Same
An organic electro-luminescence device capable of reducing a resistance of a cathode electrode to enhance brightness uniformity at each location within the device is described. The organic... |
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US20130032851 |
OPTOELECTRONIC ARCHITECTURE HAVING COMPOUND CONDUCTING SUBSTRATE
Optoelectronic device modules, arrays optoelectronic device modules and methods for fabricating optoelectronic device modules are disclosed. The device modules are made using a starting substrate... |
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US20120187444 |
TEMPLATE, METHOD FOR MANUFACTURING THE TEMPLATE AND METHOD FOR MANUFACTURING VERTICAL TYPE NITRIDE-BASED SEMICONDUCTOR LIGHT EMITTING DEVICE USING THE TEMPLATE
Disclosed herein is a method for manufacturing a template. The method includes growing a first nitride layer on a substrate; etching a top surface of the first nitride layer by supplying a... |
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US20120112238 |
MICROELECTRONIC INTERCONNECT SUBSTRATE AND PACKAGING TECHNIQUES
A LED (Light Emitting Diode) substrate and packaging for a single diode or a diode array is described. The substrate includes an integral reflector(s) for the diode(s) in the form of a shaped... |
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US20120007135 |
SEMICONDUCTOR DEVICE
An exemplary semiconductor device is provided. The semiconductor device includes a semiconductor stacked layer and a conductive structure. The conductive structure is located on the semiconductor... |
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US20110012151 |
LIGHT EMITTING DEVICE
A light emitting device includes: a mounting member including a recess; a light emitting element provided in the recess and made of a semiconductor; an electrostatic discharge protection element... |
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US20100059789 |
NITRIDE SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR FABRICATING THEREOF
Disclosed is a nitride semiconductor light-emitting device, including a substrate, a nitride semiconductor layer including a first conductive layer, an active layer and a second conductive layer... |
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US20100019267 |
LED OF SIDE VIEW TYPE AND THE METHOD FOR MANUFACTURING THE SAME
A side view type light emitting diode (LED) and a method of manufacturing the same are disclosed. In one embodiment, the LED includes i) a pair of lead frames, ii) a reflector surrounding the lead... |
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US20080012125 |
Light Emitting Diode Package
Provided is a light emitting diode package. The light emitting diode package includes a base, a light emitting diode mounted in the base, and a driving chip mounted in the base to drive the light... |
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US20110186899 |
SEMICONDUCTOR DEVICE WITH A VARIABLE INTEGRATED CIRCUIT CHIP BUMP PITCH
A semiconductor device is described that comprises an integrated circuit substrate comprising a plurality of bonding pads for enabling electrical connectivity to a chip circuit. The bonding pads... |
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US20090321779 |
SIDE VIEW LIGHT EMITTING DIODE PACKAGE
A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the... |
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US20090173956 |
CONTACT FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE
An AlGaInP light emitting device is formed as a thin, flip chip device. The device includes a semiconductor structure comprising an AlGaInP light emitting layer disposed between an n-type region... |
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US20070152226 |
LED lamps
A high power LED lamp has a GaN chip placed over an AlGaInP chip. A reflector is placed between the two chips. Each of the chips has trenches diverting light for output. The chip pair can be... |
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US20070114557 |
Flip-chip light emitting diode device without sub-mount
A light emitting diode (10) has a backside and a front-side with at least one n-type electrode (14) and at least one p-type electrode (12) disposed thereon defining a minimum electrodes separation... |
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US20060284207 |
Light emitting diode package with metal reflective layer and method of manufacturing the same
The invention relates to an LED package having a metal reflective layer for focusing and emitting light through a side of the package, and a manufacturing method of the same. The LED package... |
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US20050133810 |
Opto-electronic assembly having an encapsulant with at least two different functional zones
A radiation emitting device of the present invention includes at least one radiation emitter, first and second electrical leads electrically coupled to the radiation emitter, and an integral... |
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US20110291147 |
OHMIC CONTACTS FOR SEMICONDUCTOR STRUCTURES
A composition and method for formation of ohmic contacts on a semiconductor structure are provided. The composition includes a TiAlxNy material at least partially contiguous with the semiconductor... |
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US20070187708 |
LED Illumination Apparatus and Card-Type LED Illumination Source
An LED illumination includes an insertable and removable LED illumination source having a feeder terminal on one surface of a substrate on which an LED has been mounted; a thermal conductor... |
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US20130126933 |
ELECTRONIC DEVICE CONTACT STRUCTURES
Electronic device contact structures are disclosed. |
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US20130020609 |
SEMICONDUCTOR LIGHT-EMITTING DEVICE HAVING STACKED TRANSPARENT ELECTRODES
This application is related to a semiconductor light-emitting device including a substrate, a semiconductor epitaxial layer over the substrate and having a first surface distant from the... |
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US20120175667 |
LED LIGHT DISPOSED ON A FLEXIBLE SUBSTRATE AND CONNECTED WITH A PRINTED 3D CONDUCTOR
An example includes subject matter (such as an apparatus) comprising a planar substrate including a first surface that is planar, at least one bare light emitting diode (“LED”) die coupled to the... |
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US20120113328 |
MOUNTING SUBSTRATE FOR SEMICONDUCTOR LIGHT EMITTING ELEMENT, BACKLIGHT CHASSIS, DISPLAY DEVICE AND TELEVISION RECEIVER
Disclosed are a mounting substrate for semiconductor light emitting elements, a backlight chassis containing the substrate, a display device and a television receiver. The substrate is easily... |