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US20110233568 |
LED STREET LAMP
Disclosed is a light emitting diode (LED) street lamp using an LED as a light source and capable of minimizing a luminance deviation within an illuminated area while increasing the luminance of... |
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US20140145221 |
LED LAMP STRUCTURE WITH HEAT SINK
An LED lamp structure with a heat sink includes a reflection cup, an LED module, and a cover, in addition to the heat sink. The reflection cup has an inside bottom surface, a reflection surface,... |
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US20130105829 |
LED CHIP-BASED LIGHTING PRODUCTS AND METHODS OF BUILDING
A method of building a light-emitting diode (LED) based lighting product includes mounting a plurality of unpackaged LED chips or LEDs directly on conductors on a surface of a two-sided panel,... |
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US20110133222 |
LED LAMP WITH REMOTE PHOSPHOR COATING AND METHOD OF MAKING THE LAMP
A light emitting diode (LED) lamp includes a base with one or more LED chips, an internal cover over the LED chips, where the cover is a translucent ceramic whose thermal conductivity is greater... |
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US20110309386 |
LAMP HAVING OUTER SHELL TO RADIATE HEAT OF LIGHT SOURCE
A lamp includes an outer shell having heat conductivity, a base provided in the outer shell, and a cover provided in the outer shell. The outer shell has a light source support, and a heat... |
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US20150171289 |
Substrate Insert Molding with Deposited Light-Generating Sources
Disclosed herein are technologies related to film-insert molding (FIM) with deposited light-generating sources, such as printed light-emitting diodes. This Abstract is submitted with the... |
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US20140091329 |
LED Emitter with Improved White Color Appearance
The present disclosure involves a lighting instrument. The lighting instrument includes a board or substrate, for example, a printed circuit board substrate. The lighting instrument includes a... |
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US20120261680 |
LED Array Having Embedded LED and Method Therefor
An LED array comprises a base layer, at least one LED disposed on the base layer, and a diffusion layer including a luminescent material. The diffusion layer covers the at least one LED and the... |
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US20120043552 |
System and Method for Selected Pump LEDs with Multiple Phosphors
An LED pump light with multiple phosphors is described. LEDs emitting radiation at violet and/or ultraviolet wavelengths are used to pump phosphor materials that emit other colors. The LEDs... |
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US20120187429 |
LED LIGHT SOURCE AND METHOD OF MANUFACTURING THE SAME
After the LEDs 2 (red LEDs (R), green LEDs (G) and blue LEDs (B), or white LEDs (W)) are mounted on the frame 3, without dicing the frame 3 for dividing the LEDs 2 into pieces, the tie bar is... |
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US20110303928 |
LED LAMP
An LED lamp A includes a plurality of LED modules 2 each including an LED chip 21, and a support member 1 including a support surface 1a on which the LED modules 2 are mounted. The LED modules 2... |
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US20140197429 |
METHOD OF ARRANGING A MULTIPLICITY OF LEDS IN PACKAGING UNITS, AND PACKAGING UNIT COMPRISING A MULTIPLICITY OF LEDS
A method of arranging a multiplicity of LEDs in packaging units includes defining a desired range for at least one photometric measurement variable for each of the packaging units; selecting an... |
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US20130193463 |
Methods Of Integrating LED Chips With Heat Sinks, And Led-Based Lighting Assemblies Made Thereby
An LED-based lighting assembly includes a heat sink having at least one pedestal with an upwardly facing, upper planar surface that is raised in a vertical direction relative to an upwardly... |
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US20140110682 |
PIXEL STRUCTURE OF ELECTROLUMINESCENT DISPLAY PANEL
A pixel structure of an electroluminescent display panel having a first sub-pixel region and a second sub-pixel region is disclosed. The pixel structure includes a first organic light emitting... |
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US20120153307 |
LED LIGHTING DEVICE WITH EXCELLENT HEAT DISSIPATION PROPERTY
The present invention relates to an improved LED lighting device with good heat dissipation, comprising: a housing; a copper circuit layer, disposed on the housing; a plurality of LED chips,... |
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US20150144972 |
MATRIX LEADFRAME FOR LED PACKAGING
A leadframe (610) is formed that simplifies the packaging of light emitting elements and/or eliminates the need for stress-inducing folding after encapsulation. In particular, the folding of the... |
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US20150008457 |
FLIP-CHIP PHOSPHOR COATING METHOD AND DEVICES FABRICATED UTILIZING METHOD
Methods for fabricating light emitting diode (LED) chips one of which comprises flip-chip mounting a plurality of LEDs on a surface of a submount wafer and forming a coating over said LEDs. The... |
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US20120025216 |
PHOSPHOR SUSPENDED IN SILICONE, MOLDED/FORMED AND USED IN A REMOTE PHOSPHOR CONFIGURATION
A light emitting package comprising a support hosting at least one light emitting diode. A light transmissive dome comprised of a silicone including a phosphor material positioned to receive light... |
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US20090283778 |
Electroluminescent display useful for displaying a predetermined pattern
An electroluminescent display comprising semiconductor nanocrystals, wherein the semiconductor nanocrystals are selected to emit light at a predetermined wavelength and are disposed in a... |
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US20110297971 |
LED LIGHTING DEVICE
An LED lighting device A1 includes a plurality of LED chips 32, an LED unit 2 in which the LED chips 32 are mounted, and a mount 1 holding the LED unit 2. This arrangement allows the appearance or... |
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US20130134447 |
LOW-LIGHT-EMITTING-ANGLE HIGH-LUMINANCE UV LED NAIL LAMP STRUCTURE AND LED LIGHT SOURCE MODULE THEREOF
A low-light-emitting-angle high-luminance ultraviolet (UV) light-emitting diode (LED) nail lamp structure and an LED light source module thereof are provided. The UV LED nail lamp structure... |
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US20130168703 |
DEPOSITION OF PHOSPHOR ON DIE TOP BY STENCIL PRINTING
A method for depositing a layer of phosphor-containing material on a plurality of LED dies includes disposing a template with a plurality of openings on an adhesive tape and disposing each of a... |
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US20150228634 |
LED CIRCUIT
An LED circuit (40) comprises integrated circuit LEDs (50) each mounted over a respective LED control circuit (42). The LED control circuits (42) are electrically connected together to by the... |
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US20120097988 |
LED Module
A LED module has a LED chip, LED packaging materials, a metal base circuit board, a power connection cable, a heat sink that also functions as a metal case; and an optional potting material. The... |
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US20120049205 |
Structure of light-emitting diode (LED)
A stricture of light-emitting diode includes a substrate, a board, light-emitting dies, and packages. The board forms spaced reflection receptacles, each of which has a side wall forming an... |
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US20130106812 |
DISPLAY PANEL, DISPLAY UNIT, AND ELECTRONIC UNIT
A display panel includes: a plurality of first wirings extending in a row direction; a plurality of second wirings extending in a column direction; and a plurality of pixels each arranged in... |
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US20130313516 |
LED LAMPS WITH IMPROVED QUALITY OF LIGHT
LED lamps having improved light quality are disclosed. The lamps emit more than 500 lm and more than 2% of the power in the spectral power distribution is emitted within a wavelength range from... |
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US20130175558 |
LED LIGHTING DEVICES
Packaged chip-on-board (COB) LED arrays are provided where a color conversion medium is distributed within a glass containment plate, rather than silicone, to reduce the operating temperature of... |
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US20120061694 |
LIGHT-EMITTING STRUCTURE
An embodiment of the present application discloses a light-emitting structure, comprising a first unit; a second unit; a trench formed between the first unit and the second unit, and having a less... |
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US20140183565 |
Light-Emitting Module Board and Manufacturing Method of the Light-Emitting Module Board
A light-emitting module board includes a metal board provided with an insulating layer, a light-emitting part and a white insulating film. The light-emitting part includes plural LED chips mounted... |
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US20120032203 |
LED UNIT
The LED unit 100 comprises a plurality of the LED module 1 and the heat radiation plate. Each the LED module 1 comprises the LED chip and the package for incorporating the LED chip therein; the... |
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US20110297973 |
LED WITH AN ADSORPTION PLATE
The present invention relates to an LED with an adsorption plate attached thereto, and more particularly, to an LED which is covered with a light transmitter made of a light-transmitting material... |
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US20110073886 |
LED multi-side light source bracket
The present invention relates to a LED multi-side light source bracket, in particular to the bracket design that extends in the rectangular shape directly above the conducting pin for distribution... |
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US20140306243 |
LIGHT EMITTING DEVICE
A light emitting device includes a frame, a plurality of first light emitting units and a plurality of second light emitting units. The frame includes a base, a plurality of first pillars and a... |
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US20130146901 |
COMPRESSION VOLUME COMPENSATION
A liquid-filled light emitting diode (LED) bulb including a base, a shell, one or more LEDs, a thermally conductive liquid, and a bladder. The shell is connected to the base and the thermally... |
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US20130134454 |
WATER RESISTANT LED DEVICES AND AN LED DISPLAY INCLUDING SAME
The disclosure provides an LED package including a first plastic portion having a mounting surface and a lower surface. In some embodiments, the LED package includes a second portion surrounding... |
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US20150249182 |
Double-Sided LED and Fabrication Method Thereof
A double-sided LED has a double-sided light emitting structure formed by electroplating or electrocasting without the need for wire bonding. The double-sided light emitting gives the chip a... |
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US20100038656 |
Nitride LEDs based on thick templates
Thick HVPE templates of nitrides enhance both the growth conditions and resulting device performance of LEDs, power devices, solar cells, and other electrical elements. The use of HVPE templates... |
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US20130105825 |
LIGHT EMITTING DIODE ARRAY
A light emitting diode array comprises a plurality of light emitting diode units connected in series and arranged for forming an array with n rows and m columns. At least one of the numbers m and... |
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US20130214296 |
HEAT SPREADING SUBSTRATE WITH EMBEDDED INTERCONNECTS
Heat spreading substrate with embedded interconnects. In an embodiment in accordance with the present invention, an apparatus includes a metal parallelepiped comprising a plurality of wires inside... |
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US20130306994 |
DISPLAY PANEL
A display panel includes a fiber reinforced plastic substrate having a first lattice pattern with a first lattice period P, and a pixel layer disposed on the substrate having a second lattice... |
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US20120074437 |
LED UNIT HAVING UNIFORM LIGHT EMISSION
An LED unit includes a plurality of LEDs connected to each other and a plate supporting the LEDs. Each LED includes a base, a chip mounted on the base, a pair of leads fixed to the base and... |
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US20090267086 |
Thermal Management For LED
A method and system for removing heat from an LED facilitates the fabrication of LEDs having enhanced brightness. A thermally conductive interposer can be attached to the top of the LED. Heat can... |
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US20120007106 |
ORGANIC LIGHT EMITTING DIODE DISPLAY
An organic light emitting diode (OLED) display according to an exemplary embodiment includes an organic light emitting display panel that includes an organic light emitting member, a polarizing... |
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US20140299893 |
Conductive Connector For Use With Circuit Board, and LED Module Having the Same
A conductive connector for use with circuit boards is characterized in that a conductive connection plug and a conductive connection socket are disposed on two circuit boards, respectively. The... |
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US20120187428 |
METHOD FOR THE PRODUCTION OF WHITE LEDS AND WHITE LED LIGHT SOURCE
For the production of a white LED having a predetermined color temperature, a blue LED (2a-2d) or a UV LED is coated with a conversion layer (5) which absorbs the blue light or UV light and emits... |
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US20130234126 |
ORGANIC EL DISPLAY PANEL AND METHOD FOR MANUFACTURING SAME
The present invention provides an organic EL display panel such that, even when a light emitting layer is formed in a line bank, generation of brightness unevenness and emission color unevenness... |
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US20150214445 |
LED (LIGHT-EMITTING DIODE) ENCAPSULATION AND MANUFACTURING METHOD THEREOF
The present invention provides an LED encapsulation and a manufacturing method thereof. The LED encapsulation includes: a first frame (10), a plurality of LED elements (20), encapsulant (30), and... |
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US20130009179 |
COMPACT OPTICALLY EFFICIENT SOLID STATE LIGHT SOURCE WITH INTEGRATED THERMAL MANAGEMENT
A compact and efficient LED array lighting component comprising a circuit board with an array of LED chips mounted on it and electrically interconnected. A plurality of primary lenses is included,... |
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US20140077177 |
LIFETIME OLED DISPLAY
Light emitting devices including sub-pixels having different numbers of emissive layers are provided. At least one sub-pixel of a first color may include a single emissive layer, and at least one... |