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US20150034975 OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE OR STRAY LIGHT, AND FABRICATION METHODS FOR SUCH MODULES  
Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided...
US20130341650 PHOTOSENSOR CHIP PACKAGE STRUCTURE  
A photosensor chip package structure comprises a substrate, a light-emitting chip and a photosensor chip including an ambient light sensing unit and a proximity sensing unit. The substrate has a...
US20080277673 CAVITY EXPLORATION WITH AN IMAGE SENSOR  
A head of a cavity exploration device, with an integrated circuit support which has first and second surfaces and a plurality of through-holes associated with corresponding first and second...
US20050002613 LED device  
An LED device including an LED and an optical transmitter both disposed lateral to one another on a common circuit board, the optical transmitter including a light input surface arranged to...
US20090057687 LIGHT EMITTING DIODE MODULE  
The present invention relates to a light emitting diode (LED) module (10) comprising a substrate (12) having plural indents (14) and flattish portions (20) in between the indents, and LEDs (16)...
US20050020922 Materials and methods for near-infrared and infrared intravascular imaging  
Vasculature can be imaged with emissive semiconductor nanocrystals, for example, in the near infrared.
US20130075765 INFRARED LIGHT-EMITTING DIODE AND TOUCH SCREEN  
This invention discloses an infrared light-emitting diode. The infrared light-emitting diode comprises: only one core for emitting infrared light; a packaging body which at least comprises a first...
US20080210952 PHOTO INTERRUPTER, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC EQUIPMENT USING THE SAME  
A photo interrupter has a lead frame assembly that has a lead frame having connector terminals for external connection, a light-emitting mold, a light-receiving mold, and a connector mold. The...
US20140239315 PACKAGE STRUCTURE OF OPTICAL TRANSCEIVER COMPONENT  
The invention provides a package structure of optical transceiver component, comprising: a metal base; a plurality of pins, at least one optical emitting diode and/or at least one optical...
US20120025211 COMPACT SENSOR PACKAGE STRUCTURE  
The present invention discloses a compact sensor package structure, which comprises a package body, an LED chip and a sensor chip. The package body has a first room, a second room, a first hole...
US20130320360 DIFFUSION TYPE LED APPARATUS UTILIZING DYE-SENSITIZED SOLAR CELLS  
An LED luminaire has a dye-sensitized solar cell for converting light emitted from a light source to electric energy and uses the converted electric energy. Since the dye-sensitized solar cell...
US20050121736 Receiver optical subassembly  
A receiver optical subassembly for transforming received optical signal into electrical signal includes at least a ceramic substrate, a photo receiver and a transimpedance amplifier. There are...
US20080296589 Solid-State Lighting Device Package  
The present invention provides a lighting device package, which can provide a means for efficient thermal access to the lighting device package in addition to a desired level of light extraction...
US20090159900 Infrared Proximity Sensor Package with Reduced Crosstalk  
Disclosed are various embodiments of an infrared proximity sensor package comprising an infrared transmitter die, an infrared receiver die, a housing comprising outer sidewalls, a first recess, a...
US20110200066 CHIP MODULE PACKAGE STRUCTURE  
A chip module package structure applied to an optical input device includes a cover body, a first chip module, and a second chip module. The first chip module and the second chip module are...
US20120097982 Lighting Device  
A lighting device including an electroluminescent (EL) material is connected to an external power supply easily and the convenience is improved. In a lighting device having a light-emitting...
US20140239314 PHOTOCOUPLER  
A photocoupler includes: a light emitting element; a first photodiode array; a second photodiode array; a third photo diode array; an enhancement-mode MOSFET; a first depletion-mode MOSFET; and a...
US20130075764 OPTICAL MODULE PACKAGE STRUCTURE  
An optical module package structure includes a light-emitting chip and a light sensor chip respectively installed in a first cavity and a second cavity in a substrate, a reflective layer coated on...
US20140008551 DETECTION OF EMISSION RADIATION OF UV LIGHT EMITTING DIODE BY STRUCTURALLY IDENTICAL UV LIGHT RECEIVING DIODE  
A UV light emitting diode (UV-LED) is arranged in a weathering chamber and a UV light receiving diode, which is constructed on the same material basis as the UV LED, is arranged relative to the UV...
US20130009173 OPTICAL ELECTRONIC PACKAGE  
An electronic package includes a substrate wafer having front and rear faces and a through passage having a front window and a blind cavity communicating laterally with the front window. A...
US20090315042 OPTICAL MODULE AND OPTICAL PICKUP APPARATUS  
An optical module includes: a base plate; a light emitting element mounted on the base plate; an integrated circuit element of the light receiving element built-in type mounted on the base plate...
US20080087900 Integrated-Type Led And Manufacturing Method Thereof  
The present invention provides an integrated-type LED and method for manufacturing the same. This integrated-type LED comprises a base board which having a preplaced circuit and at least one LED...
US20060011929 Rotating display device  
A device for displaying an image is provided. The device includes a hub that is configured to rotate about a first axis and a motor configured to rotate the hub about the first axis. A plurality...
US20130315533 PREMOLDED CAVITY FOR OPTOELECTRONIC DEVICE  
An optoelectronic device is disclosed. The optoelectronic device may be employed as a single or multi-channel opto-coupler that electrically isolates one circuit from another circuit. The...
US20080204415 Optical Coordinates Input Apparatus, Optical Sensor Module and Method For Assembling Thereof  
In an optical coordinate input apparatus, a body includes an opening portion adjacent to a reflective surface, and a circuit board is installed in the body. An optical sensor module is installed...
US20080315215 Semiconductor Module  
A semiconductor module (A1) comprises a semiconductor device (10) provided with a semiconductor chip, and a conductive cover (6) for electromagnetic shielding bonded to the semiconductor device...
US20110079796 NANO STRUCTURED LEDS  
An embodiment relates to a nanowire-containing LED device with optical feedback comprising a substrate, a nanowire protruding from a first side the substrate, an active region to produce light, a...
US20080308817 Galvanic Isolator Having Improved High Voltage Common Mode Transient Immunity  
A galvanic isolator having a transmitter die, a receiver die, and a lead frame is disclosed. The transmitter die includes an LED having first and second contacts for powering the LED, and the...
US20110044368 OPTICAL DEVICE  
An optical device is disclosed. The optical device includes a first packaging unit and a second packaging unit. The first packaging unit includes a first lead frame and a sensor electrically...
US20080087901 OPTICAL COUPLING TYPE SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING OPTICAL COUPLING TYPE SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE  
In an embodiment of an optical coupling type semiconductor device according to the present invention, in an optical coupling type semiconductor device that is provided with lead frames on which a...
US20140353687 LED MODULE AND IMAGE SENSOR MODULE  
An LED module includes first through third LED chips and two Zener diodes for preventing excessive voltage application to the first and the second LED chips. A first lead includes a mount portion...
US20090127569 SEMICONDUCTOR LIGHT EMITTING MODULE AND IMAGE READER USING THE SAME  
A semiconductor light emitting module is provided with a supporting conductor including a die bonding pad, and with a plurality of semiconductor light emitting elements bonded to the die bonding...
US20120086019 SUBSTRATE FOR DISPLAY PANEL, AND DISPLAY DEVICE  
Disclosed is a substrate for display panel that includes, in a pixel, a PIN diode 21 that conducts currents of different values based on the amount of light received, a first inorganic insulating...
US20100096640 SELF-ASSEMBLED HETEROGENEOUS INTEGRATED OPTICAL ANALYSIS SYSTEM  
Optical analysis system fluidically self-assembled using shape-coded freestanding optoelectronic components and a template having shape-coded recessed binding sites connected by an embedded...
US20130105822 INTEGRATED SENSING PACKAGE STRUCTURE  
An integrated Sensing package structure includes a substrate made of IR blocking material. The substrate has a first receiving compartment and a second receiving compartment concavely formed on...
US20080251795 Photoelectric element package with temperature compensation  
A photoelectric element package with temperature compensation includes a substrate, and a first light-emitting element, a second light-emitting element, a photosensitive element, and a drive...
US20110297831 Small Low-Profile Optical Proximity Sensor  
In an embodiment, the invention provides a proximity sensor including a transmitter die, a receiver die, an ASIC die, a lead frame, wire bonds, a first transparent encapsulant, a second...
US20060255343 SEMICONDUCTOR APPARATUS, PRINT HEAD, AND IMAGE FORMING APPARATUS  
A semiconductor apparatus includes a substrate; and a plurality of semiconductor thin films formed on said substrate, each of said semiconductor thin films having a pn-junction, and electrodes of...
US20150236000 OPTOELECTRONIC ASSEMBLY AND METHOD OF OPERATING AN OPTOELECTRONIC ASSEMBLY  
An optoelectronic assembly includes at least one first component that emits first electromagnetic radiation and at least one first photosensitive component that controls the first component. The...
US20060022206 Display device, driving method thereof and electronic appliance  
A light emitting element has a property that a resistance value (internal resistance value) thereof changes according to the ambient temperature. Specifically, assuming that the room temperature...
US20140306230 LED COMPONENT BY INTEGRATING EPITAXIAL STRUCTURE AND PACKAGE SUBSTRATE TOGETHER AND METHOD OF MANUFACTURING THE SAME  
The present invention discloses an integral LED component which integrates LED epitaxial structures electrodes and interconnect with a package substrate together and an integral manufacturing...
US20090140266 PACKAGE INCLUDING ORIENTED DEVICES  
An package such as an optocoupler package is disclosed. The optocoupler package includes a leadframe structure comprising a first die attach pad comprising a first die attach pad surface and a...
US20080142816 Tunable White Point Light Source Using a Wavelength Converting Element  
A uniform high brightness light source is provided using a plurality of light emitting diode (LED) chips with slightly different pump wavelengths with a wavelength converting element that includes...
US20150028358 PACKAGE STRUCTURE OF AN OPTICAL MODULE  
The present invention relates to a package structure of an optical module. The light emitting chip and the light receiving chip are disposed on the light emitting region and the light receiving...
US20140084307 OPTOELECTRONIC DEVICE  
An optoelectronic device having an optoelectronic component that receives or generates radiation and has a main radiation passage surface, wherein the component is assigned an aperture which...
US20150028357 PACKAGE STRUCTURE OF AN OPTICAL MODULE  
This invention relates to a package structure of an optical module. A light emitting and light receiving chips are disposed on a light emitting and light receiving region of the substrate,...
US20140021491 MULTI-COMPOUND MOLDING  
In certain embodiments, a semiconductor package includes a leadframe, a light emitter die disposed on the leadframe, and a light detector die disposed on the leadframe adjacent to the light...
US20100012953 OPTICAL SEMICONDUCTOR DEVICE  
First and second optical semiconductor elements are respectively mounted on first and second mount beds. First and second lead terminals are respectively arranged around the first and the second...
US20130292706 Infrared Attenuating Or Blocking Layer In Optical Proximity Sensor  
An optical proximity sensor is provided that comprises an infrared light emitter an infrared light detector, a first molded optically transmissive infrared light pass component disposed over and...
US20140374777 LIGHT EMITTING DEVICE AND OPTICAL DEVICE  
A light emitting device is capable of enhancing the radiant intensity on a single direction. The light emitting device includes a substrate and an LED chip bonded to the substrate, wherein the...

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