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US20110241023 |
MULTICHIP LIGHT EMITTING DIODE (LED) AND METHOD OF MANUFACTURE
The present invention provides a multichip LED and method of manufacture in which white light is produced. Specifically, a plurality of electrically interconnected LED chips (e.g., interconnected... |
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US20130075762 |
OPTICALLY TRANSMISSIVE METAL ELECTRODE, ELECTRONIC DEVICE, AND OPTICAL DEVICE
According to one embodiment, an optically transmissive metal electrode includes a plurality of first and second metal wires. The first metal wires are disposed along a first direction, and extend... |
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US20050002613 |
LED device
An LED device including an LED and an optical transmitter both disposed lateral to one another on a common circuit board, the optical transmitter including a light input surface arranged to... |
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US20150263186 |
PHOTOSENSOR
A photosensor simplifies the resin molding process for an emitter element, a receiver element, and a luminous element forming an operation indicator lamp. The photosensor includes an emitter... |
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US20120138962 |
LIGHT EMITTING DIODE PACKAGE
A light emitting diode package includes a number of light emitting diode chips, a number of color sensor modules, and a reflecting cup around the light emitting diode chips. Each light emitting... |
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US20070023765 |
Acicular ITO for LED array
In an array of LEDs coupled between a transparent substrate and an electrode, a light emitting surface of each LED is in electrical contact with a region of acicular ITO. By contacting the light... |
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US20070131945 |
Light-emitting semiconductor device with open-bypass function
This invention discloses a light-emitting semiconductor device with open-bypass function, which comprises two terminals providing a current, at least one LED unit and a bypass switch. Electrodes... |
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US20140184062 |
SYSTEMS AND METHODS FOR A LIGHT EMITTING DIODE CHIP
Provided is a light emitting diode (LED) chip. The LED chip includes a substrate and a mesa structure formed from a heterostructure grown on the substrate. The mesa structure includes an LED mesa... |
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US20110215341 |
Biometric Sensor Assembly With Integrated Visual Indicator
A biometric sensor assembly comprises a substrate to which is mounted a die containing sensor circuitry, at least one conductive bezel having a visual indicator region formed therein, and... |
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US20050269578 |
Optoelectronic devices
This invention relates to optoelectronic devices of improved efficiency. In particular it relates to light emitting diodes, photodiodes and photovoltaics. By careful design of periodic... |
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US20140167074 |
Intensity Scattering LED Apparatus
An Intensity Scattering LED apparatus which comprises an uneven surface on the tip of the epoxy encapsulation layer of the LED to act as a scattering lens such that the light beam on the normal... |
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US20050156176 |
Method for printing organic devices
In accordance with the invention, a method for fabricating an organic electronic device is disclosed. The method consists primarily of 1) depositing a first organic solution by inkjet or other... |
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US20050121736 |
Receiver optical subassembly
A receiver optical subassembly for transforming received optical signal into electrical signal includes at least a ceramic substrate, a photo receiver and a transimpedance amplifier. There are... |
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US20070090374 |
Flat Lamp Panel
A flat lamp panel includes a top substrate and a bottom substrate. The bottom substrate includes at least an electrode pair, a dielectric layer, and a first phosphor layer covering the up surface... |
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US20070228396 |
Light emitting unit and lighting apparatus
A light emitting unit, comprises: a light emitting element; a plurality of lead frames to which said light emitting element is electrically connected; and a package in which said lead frames are... |
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US20070131944 |
Dual organic electroluminescent display and method of making same
A dual display unit comprising two OLED displays separately fabricated on two substrates. Each of the substrates has a peripheral area surrounding the respective display. A getter element is... |
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US20150108506 |
SINGULATING HYBRID INTEGRATED PHOTONIC CHIPS
During a fabrication technique, trenches are defined partially through the thickness of a substrate. Then, photonic integrated circuits are coupled to the substrate. These photonic integrated... |
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US20070278500 |
Package module of light emitting diode
A package module of a light emitting diode includes a substrate, a first light emitting diode and a transistor. The first light emitting diode is disposed on the substrate, and the transistor is... |
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US20050151141 |
Luminescence diode chip
A luminescence diode chip with a semiconductor body having an epitaxially grown semiconductor layer sequence with an active zone and a radiation coupling-out area, the active zone emitting an... |
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US20070096118 |
Synthetic jet cooling system for LED module
An LED assembly is provided herein. The assembly comprises a thermally conductive housing (201), wherein a portion of said housing is equipped with a plurality of fins (203); an LED (205) disposed... |
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US20130248887 |
OPTICAL ELECTRONIC PACKAGE
An optical electronic package includes transmitting chip and a receiving chip fixed to a wafer. A transparent encapsulation structure is formed by a transparent plate and a transparent... |
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US20140225130 |
Light-Emitting Device
A light-emitting device having the quality of an image high in homogeneity is provided. A printed wiring board (second substrate) (107) is provided facing a substrate (first substrate) (101) that... |
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US20110031509 |
LED MODULE AND LIGHTING DEVICE USING THE SAME
The LED module comprises a flexible wiring substrate and surface mounting type LED packages. The flexible wiring substrate is formed at its surface with power supply terminals which comprises a... |
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US20110215342 |
LED PACKAGING WITH INTEGRATED OPTICS AND METHODS OF MANUFACTURING THE SAME
Methods and structures are provided for wafer-level packaging of light-emitting diodes (LEDs). An array of LED die are mounted on a packaging substrate. The substrate may include an array of... |
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US20060102919 |
Display device and electronic appliance using the same
The present invention provides a display device including a nonvolatile memory circuit to which data can be added without increasing the number of manufacturing steps, and an electronic appliance... |
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US20070246717 |
Light source having both thermal and space efficiency
A light source that is both thermally and spatially efficient can be achieved by attaching a light source, such as an LED chip, to a flexible circuit and positioning a light conductive material... |
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US20130153932 |
METHOD FOR MANUFACTURING PHOTOCOUPLER, AND PHOTOCOUPLER LEAD FRAME SHEET
A method for manufacturing a photocoupler includes: mounting light emitting devices and light receiving devices on a lead frame sheet; positioning the lead frame sheet with respect to a die by... |
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US20090321750 |
SURFACE MOUNT DEVICE
The disclosed subject matter is directed to a reliable surface mount device using a ceramic package, and includes LED devices that are simply composed and incorporate the use of the surface mount... |
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US20140091326 |
Light Blocking Structure in Leadframe
A semiconductor proximity sensor (100) has a flat leadframe (110) with a first (110a) and a second (110b) surface, the second surface being solderable; the leadframe includes a first (111) and a... |
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US20140070101 |
GAS COMPONENT DETECTION DEVICE
An optical path of infrared rays (see the broken lines in FIG. 1) is modified to a substantially U-like shape by a first reflecting mirror and a second reflecting mirror. An incidence angle of the... |
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US20080123328 |
Solar-powered illuminator
A solar-powered illuminator, which includes an integrated light receiving and emitting device having a solar chip and a LED chip, a rechargeable battery and an Application-Specific Integrated... |
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US20080017870 |
Semiconductor light-emitting means and light-emitting panel comprising the same
A semiconductor light-emitting means (56) comprises a transparent substrate (12), on which light-emitting diodes (26, 28) are arranged. These and electrodes (14, 36) used for contacting them are... |
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US20060091406 |
Illuminating apparatus, method for fabricating the same and display apparatus using the same
An illuminating apparatus has a reduced number of mounting spots by soldering or the like to permit an increased yield rate and a reduced cost. The illuminating apparatus has light emitting... |
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US20110108857 |
HOUSING FOR HIGH-POWER LEDS
The present invention relates to a housing for radiation-emitting or radiation-receiving optoelectronic components, such as LEDs, and to a method for producing said housing. The housing comprises... |
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US20100238448 |
Photoelectric Sensor for Sensing a Target
Disclosed herein is an exemplary photoelectric sensor having an emitting portion for emitting light toward a target and a receiving portion for receiving, through a receive lens, reflected light... |
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US20060011928 |
Surface-mountable light-emitting diode and/or photodiode and method for the production thereof
A surface-mountable miniature luminescent diode with a chip package which has a leadframe (16) and a semiconductor chip (22) which is arranged on the leadframe (16) and is in electrical contact... |
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US20090315041 |
OPTICAL MEMBER AND METHOD FOR MANUFACTURING OF OPTICAL MEMBER
There is provided an optical member 1 in which a fixation member 3 supporting the light emitting member 2 is fixed to a housing 5 supporting a light receiving member 4, so as to have clearances... |
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US20060038187 |
LED and method of manufacturing the same
An LED can include a pair of electrode members, and an LED chip joined to a chip mount portion disposed at the extremity of one of the pair of electrode members. The LED chip can be electrically... |
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US20060237730 |
Peltier cooler with integrated electronic device(s)
A Peltier effect cooling device is formed in combination with an electronic device to form a unique thermal and electrical relationship. An electronic device to be cooled is placed in a serial... |
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US20130049019 |
DISPLAY DEVICE
Exemplary embodiments of the described technology relate generally to display devices including dye-sensitized solar cells. The display device according to an exemplary embodiment includes a... |
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US20070194330 |
High efficiency LEDs with tunnel junctions
An LED made from a wide band gap semiconductor material and having a low resistance p-type confinement layer with a tunnel junction in a wide band gap semiconductor device is disclosed. A... |
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US20070267637 |
Light emitting package and light emitting package array
Example embodiments may include a light emitting device package. The light emitting device package may include a light emitting device, a package body including a cavity having a bottom surface on... |
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US20120025209 |
OPTICAL CONNECTION THROUGH SINGLE ASSEMBLY OVERHANG FLIP CHIP OPTICS DIE WITH MICRO STRUCTURE ALIGNMENT
A system includes an optical transceiver assembly, including a flip chip connection of a semiconductor die with a photonic transceiver that overhangs a substrate to which it is to be connected.... |
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US20070018175 |
Light emitting diodes with improved light collimation
A light emitting diode with improved light collimation comprises a substrate-supported LED die disposed within a transparent dome. A portion of the dome laterally circumscribe the die comprises... |
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US20050156177 |
Light-emitting device with enlarged area of active luminescence region
A light-emitting device is provided, having an enlarged area of active luminescence region to enhance the brightness, mainly comprising a second epitaxy layer and at least one first epitaxy layer... |
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US20060011926 |
Light-emitting diode device with resecurable connection
An LED device includes a scrambler portion, a substrate portion having a light-emitting diode (“LED”) and a substrate layer attached to the LED, an electrical connection between the LED and the... |
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US20120286295 |
Organic Light-Emitting Display Device
An organic light-emitting display device comprises a substrate including a plurality of light-emitting regions separated by a non-light-emitting region, an organic light-emitting element disposed... |
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US20130181232 |
Optocoupler with Surface Functional Coating Layer
Various embodiments of methods and devices are provided for an optocoupler comprising an optically reflective compound comprising silicone and inner and outer surfaces. A molding compound... |
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US20120146025 |
Light-Emitting Device, Electronic Device, and Lighting Device
A light energy reuse type light-emitting device with low power consumption is provided by converting light from a light-emitting device into electric power efficiently for reuse. Also, a light... |
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US20070241346 |
Light emitting device and method for producing light emitting device
A light emitting device of the present invention includes: a substrate including wire patterns separated from each other on a basic material and a runner section to which sealing resin is poured,... |