Matches 1 - 50 out of 206 1 2 3 4 5 >


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US20120133042 MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME  
A mounting structure of chip comprises a substrate having a base, a chip on the upper surface of the base, and adhesive agents which bonds the base and the first chip. The adhesive agent is...
US20140339710 METHOD FOR BONDING WAFERS AND STRUCTURE OF BONDING PART  
A method for bonding wafers includes forming a first bonding part on a surface of a first wafer by stacking a diffusion preventing layer formed of a material having low wettability with AuSn above...
US20130341735 ANODICALLY BONDED STRAIN ISOLATOR  
A stress isolator that allows a sensor to be attached to materials of the same coefficient of thermal expansion and still provide the required elastic isolation between the sensor and the system...
US20140097463 ANISOTROPIC CONDUCTIVE ADHESIVE  
An anisotropic conductive adhesive includes an epoxy adhesive containing an epoxy compound and a curing agent and conducive particles dispersed in the epoxy adhesive. When elastic moduluses at 35°...
US20120074597 FLEXIBLE UNDERFILL COMPOSITIONS FOR ENHANCED RELIABILITY  
Underfill materials for fabricating electronic devices are described. One embodiment includes an underfill composition including an epoxy mixture, an amine hardener component, and a filler. The...
US20110175240 CHIP MODULE  
A chip module and a fabricating method thereof are provided. Firstly, a substrate is provided. Next, a chip is assembled on the substrate and electrically connected with the substrate. Afterward,...
US20130221542 Functional Spacer for SIP and Methods for Forming the Same  
A device includes a spacer, which includes a recess extending from a top surface of the spacer into the spacer, and a conductive feature including a first portion and a second portion continuously...
US20100123258 Low Temperature Board Level Assembly Using Anisotropically Conductive Materials  
An integrated circuit may be secured to a substrate using an anisotropically conductive adhesive that may be cured at a temperature of less than 150° C. In some embodiments, an acrylic resin with...
US20080073799 MOULD HAVING NANO-SCALED HOLES  
A mould includes a base having a first surface and a second surface opposite to the first surface; and a plurality of nano-scaled holes defined through the base. Each nano-scaled hole extends from...
US20130334713 ELECTROSTATIC DISCHARGE COMPLIANT PATTERNED ADHESIVE TAPE  
The present disclosure relates to the field of fabricating microelectronic devices, wherein a microelectronic device substrate, such as a microelectronic wafer, may be thinned by a backgrinding...
US20110227233 Packaged Electronic Device Having Metal Comprising Self-Healing Die Attach Material  
A method of assembling an electronic device and electronic packages therefrom. A die attach adhesive precursor is placed between a top surface of a workpiece and an IC die. The die attach adhesive...
US20140225283 WAFER BACK SIDE COATING AS DICING TAPE ADHESIVE  
A semiconductor assembly comprises a semiconductor wafer, an adhesive coating disposed on the back side of the wafer, and a bare dicing tape, preferably UV radiation transparent. The assembly is...
US20120068363 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DIE PADDLES AND METHOD OF MANUFACTURE THEREOF  
A method of manufacture of an integrated circuit packaging system includes: forming a package paddle group having a first package paddle electrically isolated from a second package paddle;...
US20130147058 CHIP PACKAGE AND CHIP PACKAGE METHOD  
A chip package includes a substrate, a pad positioned on the substrate, a base board, at least one adhesive layer and at least one chip. The base board is positioned on the pad. At least one...
US20070023929 Laminate structure  
The invention relates to a laminate structure comprising a first active layer having a first electrode potential, a second active layer having a second electrode potential, wherein the second...
US20070170599 Flip-attached and underfilled stacked semiconductor devices  
A tape for use as a carrier in semiconductor assembly, which has one or more base sheets 101 of polymeric, preferably thermoplastic, material having first (101a) and second (101b) surfaces. A...
US20070290369 Resin Paste For Die Bonding And Its Use  
Disclosed is a resin paste for die bonding comprising a butadiene homopolymer or copolymer (A) having a carboxylic acid terminal group, a thermosetting resin (B), a filler (C), and a printing...
US20150014865 CONNECTION ARRANGEMENT OF AN ELECTRIC AND/OR ELECTRONIC COMPONENT  
The connection arrangement (100, 200, 300, 400) comprises at least one electric and/or electronic component (1). The at least one electric and/or electronic component (10) has at least one...
US20140346684 CONNECTION METHOD, CONNECTION STRUCTURE, INSULATING ADHESIVE MEMBER, ELECTRONIC COMPONENT HAVING ADHESIVE MEMBER, AND METHOD FOR MANUFACTURING SAME  
An insulating adhesive film is formed by laminating a first insulating adhesive layer which contains a filler in an insulating adhesive composition and a second insulating adhesive layer which...
US20100127409 MICROELECTRONIC DEVICE WAFERS INCLUDING AN IN-SITU MOLDED ADHESIVE, MOLDS FOR IN-SITU MOLDING ADHESIVES ON MICROELECTRONIC DEVICE WAFERS, AND METHODS OF MOLDING ADHESIVES ON MICROELECTRONIC DEVICE WAFERS  
A microelectronic device wafer includes an adhesive molded in-situ on the wafer. Adhesives and wafers are positioned in molds and a method that includes drawing in the molds at least a partial...
US20110169022 BOARD MODULE AND METHOD OF MANUFACTURING SAME  
A liquid crystal display device (100) includes a glass substrate (110) having an LSI chip (130) and an FPC board (140) mounted thereon. A component ACF (150a) made of a single sheet is used to...
US20090218703 Lamination Tape for Reducing Chip Warpage and Semiconductor Device Containing Such Tape  
A lamination tape is disclosed which includes a base film with an adhesive layer on one side wherein the coefficient of thermal expansion (CTE) of the adhesive layer is adapted so as to reduce...
US20060202355 Nanostructured friction enhancement using fabricated microstructure  
Described herein are fabricated microstructures to adhere in shear to a contact surface. A fabricated microstructure comprises a substrate and a plurality of nano-fibers attached to the substrate....
US20090230567 METHOD OF POST-MOLD GRINDING A SEMICONDUCTOR PACKAGE  
A method of grinding a molded semiconductor package to a desired ultra thin thickness without damage to the package is disclosed. Prior to grinding a molded package to a desired package thickness,...
US20080061449 Semiconductor Component Arrangement  
A semiconductor component arrangement having a semiconductor component, a mount, and an adhesive, wherein the adhesive connects the semiconductor component to the mount and the adhesive contains a...
US20070262470 Module With Built-In Semiconductor And Method For Manufacturing The Module  
The present invention provides a module with a built-in semiconductor that can suppress a reduction in yield caused by a crack or failure of a semiconductor device in the process of mounting a...
US20150035173 ADHESIVES FOR BONDING HANDLER WAFERS TO DEVICE WAFERS AND ENABLING MID-WAVELENGTH INFRARED LASER ABLATION RELEASE  
Methods are provided to form adhesive materials that are used to temporarily bond handler wafers to device wafers, and which enable mid-wavelength infrared laser ablation release techniques to...
US20110147952 DICING DIE-BONDING FILM  
The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer (2) on a substrate material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive...
US20140084491 METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE  
A method for manufacturing an electronic device, the method includes: applying an adhesive film on a package board; placing an electronic component on the package board with a bump therebetween;...
US20080150163 Mounting structure for semiconductor element  
A mounting structure for a semiconductor element is disclosed. The semiconductor element is bonded to a die pad through an adhesive film, which is formed by applying a predetermined amount of a...
US20130154125 ADHESIVE FILM AND ELECTRONIC DEVICE INCLUDING THE SAME  
An adhesive film includes an amine curing agent and a phenolic curing agent, and has a ratio of a storage modulus at 170° C. after 80% or more curing to a storage modulus at 40° C. before curing...
US20070126129 Die bonding adhesive tape  
Disclosed is a die bonding adhesive tape, which eliminates the requirement for additional adhesive tape for attaching a ring frame, decreases the curing time period upon die bonding, essentially...
US20150194331 CYCLIC OLEFIN POLYMER COMPOSITIONS AND POLYSILOXANE RELEASE LAYERS FOR USE IN TEMPORARY WAFER BONDING PROCESSES  
The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics...
US20130049233 CHIP PACKAGE AND METHOD FOR MAKING SAME  
A chip package includes a substrate, a pad, a double-sided adhesive tape, a chip, and a sealing member. The pad is arranged on the substrate and has a top surface facing away from the substrate....
US20050017375 Ball grid array package substrate and method for manufacturing the same  
A ball grid array package substrate includes a substrate body having a surface. A least a ball pad and a solder mask are formed on the surface of the substrate body. The solder mask has an opening...
US20150115444 WAFER ARRANGEMENT, A METHOD FOR TESTING A WAFER, AND A METHOD FOR PROCESSING A WAFER  
According to various embodiments, a wafer arrangement may be provided, the wafer arrangement may include: a wafer including at least one electronic component having at least one electronic contact...
US20100264553 PACKAGED ELECTRONIC DEVICE HAVING METAL COMPRISING SELF-HEALING DIE ATTACH MATERIAL  
A method of assembling an electronic device and electronic packages therefrom. A die attach adhesive precursor is placed between a top surface of a workpiece and an IC die. The die attach adhesive...
US20120086014 Semiconductor Device Having Glue Layer And Supporter  
A plurality of metal patterns are disposed on a substrate. A support structure is provided between the plurality of metal patterns. The support structure has a supporter and a glue layer. Each of...
US20140264950 CHIP ARRANGEMENT AND A METHOD OF MANUFACTURING A CHIP ARRANGEMENT  
In various embodiments, a chip arrangement is provided. The chip arrangement may include a chip carrier and a chip mounted on the chip carrier. The chip may include at least two chip contacts and...
US20060255476 Electronic assembly with controlled solder joint thickness  
An electronic assembly includes a bare IC die or a leadless electronic component having at least one electrically conductive contact formed on a surface of the component and a leadframe or a...
US20080128900 PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROELECTRONIC DEVICES  
Packaged microelectronic devices and methods of manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a method of manufacturing a microelectronic device includes...
US20080224329 PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROELECTRONIC DEVICES  
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed. In one embodiment, a method for forming a microelectronic device includes attaching a...
US20070182025 Laminate structure and method of producing the same  
The invention relates to a laminate structure comprising a first carrier layer with a surface, a first active surface being electrically conducting and being supported by the first carrier layer,...
US20080296783 RESIN MOLDED SEMICONDUCTOR DEVICE  
A semiconductor device includes a circuit board, a wiring part, a protective coating glass, and a resin part. The circuit board has an approximately rectangular shape. The protective coating glass...
US20060270118 Surface mount type semiconductor device and method of manufacturing the same  
A surface mount type semiconductor device comprises a support substrate having mutually opposed first and second surfaces, and having a slit at a central part thereof, a semiconductor element...
US20140061905 Polyol Photosensitizers, Carrier Gas UV Laser Ablation Sensitizers, and Other Additives and Methods For Making and Using Same  
Disclosed are photo sensitizers that include a polyol moiety covalently bonded to a fused aromatic moiety. Also disclosed is a method for improving UV laser ablation performance of a coating, such...
US20110133345 MANUFACTURING METHOD FOR ELECTRONIC DEVICE  
There is provided an electronic device manufacturing method capable of manufacturing a device having a preferable communication characteristic at a low cost with a high productivity. The...
US20060006508 Semiconductor device in which semiconductor chip is mounted on lead frame  
A semiconductor device including a lead frame having a plurality of inner leads having end portions and a plurality of outer leads integrated with the inner leads, the inner leads having first...
US20140327124 POWER TRANSISTOR WITH HEAT DISSIPATION AND METHOD THEREFORE  
A device comprising a substrate, an integrated circuit (IC) die attached to the substrate on one side, a plurality of contact pads on an active side of the IC die, a plurality of thermally and...
US20140001655 POWER TRANSISTOR WITH HEAT DISSIPATION AND METHOD THEREFOR  
A device comprising a substrate, an integrated circuit (IC) die attached to the substrate on one side, a plurality of contact pads on an active side of the IC die, a plurality of thermally and...

Matches 1 - 50 out of 206 1 2 3 4 5 >