Matches 1 - 50 out of 88 1 2 >


Match Document Document Title
US20070023929 Laminate structure  
The invention relates to a laminate structure comprising a first active layer having a first electrode potential, a second active layer having a second electrode potential, wherein the second...
US20050012225 Wafer-level chip scale package and method for fabricating and using the same  
A packaged semiconductor device (a wafer-level chip scale package) containing a conductive adhesive material as an electrical interconnect route between the semiconductor die and a patterned...
US20120080808 ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE  
Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a...
US20140332984 ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE  
Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a...
US20090072382 MICROELECTRONIC PACKAGE AND METHOD OF FORMING SAME  
A microelectronic package includes a carrier (110, 210, 410, 1110) having a first surface (111, 211, 411, 1111) and an opposing second surface (112, 212, 412, 1112), an adhesive layer (120, 220,...
US20110193244 ADHESIVE FILM AND PROCESS FOR PREPARING THE SAME AS WELL AS ADHESIVE SHEET AND SEMICONDUCTOR DEVICE  
An object of the present invention is to provide a die-adhering adhesive film which can be laminated on a back of a wafer at a temperature lower than a softening temperature of a protecting tape...
US20140291870 RESIN COMPOSITION, RESIN COMPOSITION SHEET, SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR  
A resin composition excellent in both characteristics of preservation stability and connection reliability is provided by a resin composition that contains (a) an epoxy compound, (b) a...
US20140131897 Warpage Control for Flexible Substrates  
A flexible substrate may be provided having a first side and a second side. A device may be electrically coupled to the first side of the flexible substrate through one or more electrical...
US20080261039 Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor Device  
An adhesive sheet comprising a release substrate 10, a substrate film 14, and a first tacky-adhesive layer 12 placed between the release substrate 10 and the substrate film 14, wherein an annular...
US20110084408 THERMOSETTING DIE-BONDING FILM  
An object of the present invention is to provide a thermosetting die-bonding film that is capable of preventing warping of an adherend by suppressing curing contraction of the film after die...
US20110057331 THERMOSETTING DIE BONDING FILM, DICING DIE BONDING FILM AND SEMICONDUCTOR DEVICE  
An object of the present invention is to provide a thermosetting die-bonding film with which a die-bonding film is suitably broken with a tensile force. The object is achieved by a thermosetting...
US20070126129 Die bonding adhesive tape  
Disclosed is a die bonding adhesive tape, which eliminates the requirement for additional adhesive tape for attaching a ring frame, decreases the curing time period upon die bonding, essentially...
US20160254247 Fan-out WLP with package  
Described herein are microelectronic packages and methods of making such packages. Consistent with an example embodiment, the package includes a microelectronic unit. Conductive traces are...
US20100295190 PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, METHOD FOR FORMING ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE  
A photosensitive adhesive composition comprising (A) an alkali-soluble polymer, (B) a thermosetting resin, (C) one or more radiation-polymerizable compounds and (D) a photoinitiator, wherein the...
US20080251947 COF FLEXIBLE PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE  
A COF flexible printed wiring board, used for a semiconductor device, contains an insulating layer, a wiring pattern formed of a conductor layer on one side of the insulating layer, on which a...
US20050263908 Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device  
A material for forming an insulating film with low dielectric constant of this invention is a solution including a fine particle principally composed of a silicon atom and an oxygen atom and...
US20050263906 Electronic system including a semiconductor device with at least one semiconductor die, a carrier, and an encapsulant that fills a space between the die and the carrier and covers intermediate conductive elements that connect the die and the carrier  
An electronic system includes a processor and at least one semiconductor device with at least one semiconductor die and a carrier. One or more intermediate conductive elements may extend from bond...
US20120156502 ADHESIVE FILM, MULTILAYER CIRCUIT BOARD, ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE  
Disclosed is an adhesive film in which the adhesive film contains a thermosetting resin (A), a curing agent (B), a compound having flux activity (C) and a film forming resin (D), the minimum melt...
US20060202356 Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device  
A material for forming an insulating film with low dielectric constant of this invention is a solution including a fine particle principally composed of a silicon atom and an oxygen atom and...
US20060097402 Semiconductor device having flip-chip package and method for fabricating the same  
A semiconductor device having a flip-chip package and a method for fabricating the same are provided. A flip-chip package after being tested to be functionally workable is mounted on a carrier and...
US20050263907 Method of manufacturing semiconductor device and support structure for semiconductor substrate  
A method of manufacturing a semiconductor device is disclosed. The method comprises a first step of grinding a second principle surface of a semiconductor substrate opposite to a first principle...
US20080122119 METHOD AND APPARATUS FOR CREATING RFID DEVICES USING MASKING TECHNIQUES  
A method for creating a plurality of semiconductor assemblies that includes the steps of creating a plurality of quasi-wafers, each quasi-wafer comprising a plurality of semiconductor devices;...
US20070023924 Semiconductor device and method of manufacturing the same  
Provided is a semiconductor device having a semiconductor chip mounted over a substrate, in which an interconnect is formed, by using an adhesive layer to permit contact conduction between a stud...
US20170158922 INKJET PHOTO- AND HEAT-CURABLE ADHESIVE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND ELECTRONIC PART  
Provided is a photocurable and thermosetting adhesive for inkjet which can increase the thickness accuracy of an adhesive layer formed by curing an adhesive and can further cause the adhesive...
US20060055036 Method of manufacturing semiconductor device, semiconductor device, and mounting structure of semiconductor device  
A method of manufacturing a semiconductor device, including the following steps, forming a resin layer on a surface of a semiconductor chip, the surface is provided with a bump formed thereon, the...
US20110133346 ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME  
An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for...
US20100102459 SEMICONDUCTOR DEVICE  
The semiconductor device includes: a semiconductor chip; a die pad for holding the semiconductor chip; a lead; and a sealing resin material for sealing the semiconductor chip, the die pad and an...
US20050017375 Ball grid array package substrate and method for manufacturing the same  
A ball grid array package substrate includes a substrate body having a surface. A least a ball pad and a solder mask are formed on the surface of the substrate body. The solder mask has an opening...
US20170033081 STACK PACKAGE AND METHOD FOR MANUFACTURING THE STACK PACKAGE  
A stack package may include a substrate, and a first semiconductor chip mounted over the substrate. The stack package may include a support member disposed over the substrate and the first...
US20110057332 SEMICONDUCTOR CHIP WITH CONDUCTIVE ADHESIVE LAYER AND METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE  
A method of manufacturing a semiconductor chip with a conductive adhesive layer including steps of: forming a conductive adhesive layer on back side of a wafer on which a semiconductor element is...
US20050056946 Electrical circuit assembly with improved shock resistance  
An assembly of the present invention includes a substrate and an integrated circuit device adapted to be electrically and mechanically attached to the substrate. Electrically conductive connecting...
US20100007017 INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD FOR THE SAME  
The present invention discloses an inter-connecting structure for a semiconductor package and a method for the same. The inter-connecting structure for the semiconductor package comprises a...
US20070296089 Use of a die-attach composition for high power semiconductors, method for attaching same to a printed circuit board and semiconductor device manufactured thereby  
The Directive 2002/95/EC of the European Parliament and of the Council promulgated that from 1 Jul. 2006 new electrical and electronic equipment must no longer contain lead. Accordingly, lead-free...
US20100109168 CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS  
A method of providing connectivity to a microsized device, the method includes the steps of providing an ablative base material having at least a top surface; providing a die having a first and...
US20070170599 Flip-attached and underfilled stacked semiconductor devices  
A tape for use as a carrier in semiconductor assembly, which has one or more base sheets 101 of polymeric, preferably thermoplastic, material having first (101a) and second (101b) surfaces. A...
US20060113683 Doped alloys for electrical interconnects, methods of production and uses thereof  
Lead free solder compositions are described herein that include at least one solder material; at least one dopant material, wherein the dopant is present in the material in an amount of less than...
US20070290369 Resin Paste For Die Bonding And Its Use  
Disclosed is a resin paste for die bonding comprising a butadiene homopolymer or copolymer (A) having a carboxylic acid terminal group, a thermosetting resin (B), a filler (C), and a printing...
US20070262470 Module With Built-In Semiconductor And Method For Manufacturing The Module  
The present invention provides a module with a built-in semiconductor that can suppress a reduction in yield caused by a crack or failure of a semiconductor device in the process of mounting a...
US20080157398 Semiconductor device package having pseudo chips  
The present invention provides a semiconductor device package having pseudo chips structure comprising a first substrate with die receiving through holes formed thereon; a first die having first...
US20050253281 Vibration-assisted method for underfilling flip-chip electronic devices  
A semiconductor assembly comprising an integrated circuit chip with a first plurality of metallic contact pads exposed, having a pitch center-to-center of less than 180 μm. A metallic bump of...
US20120153508 THERMOSETTING DIE-BONDING FILM  
An object of the present invention is to provide a thermosetting die-bonding film having both storage modulus and high adhering strength that are necessary in manufacturing a semiconductor device...
US20080116590 Semiconductor device  
A semiconductor device includes a resin package, a lower pad embedded in the package, an upper pad embedded in the package at a distance from the lower pad, a lower semiconductor element bonded to...
US20070007668 Microelectronic assembly with underchip optical window, and method for forming same  
A microelectronic assembly includes an integrated circuit die spaced apart from a substrate and connected by bump interconnections, and an polymeric encapsulant molded about the die. The...
US20140159256 ANISOTROPIC CONDUCTIVE FILMS AND SEMICONDUCTOR DEVICES CONNECTED BY THE SAME  
An anisotropic conductive film, a method for preparing a semiconductor device, and a semiconductor device, the anisotropic conductive film including a base film, the base film having a storage...
US20120133042 MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME  
A mounting structure of chip comprises a substrate having a base, a chip on the upper surface of the base, and adhesive agents which bonds the base and the first chip. The adhesive agent is...
US20060255476 Electronic assembly with controlled solder joint thickness  
An electronic assembly includes a bare IC die or a leadless electronic component having at least one electrically conductive contact formed on a surface of the component and a leadframe or a...
US20080237894 INTEGRATED CIRCUIT PACKAGE AND METHOD FOR THE SAME  
Disclosed are an integrated circuit chip package and a method of connecting an integrated circuit chip and an attachment subject to each other while interposing an adhesive therebetween. The...
US20070262426 Semiconductor Housings Having Coupling Coatings  
A semiconductor housing having a coupling coating is disclosed. In one embodiment, the semiconductor housing includes a leadframe for equipping with a semiconductor chip and for enveloping with a...
US20060022317 Chip-under-tape package structure and manufacture thereof  
The invention discloses a chip-under-tape package structure including a flexible substrate, a chip, a plurality of connecting members, a plurality of stud bumps, and a potting adhesive. The...
US20120168943 PLASMA TREATMENT ON SEMICONDUCTOR WAFERS  
A semiconductor package and method of forming the same is described. The semiconductor package is formed from a semiconductor die cut from a semiconductor wafer that has a passivation layer. The...

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