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US20120133042 |
MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME
A mounting structure of chip comprises a substrate having a base, a chip on the upper surface of the base, and adhesive agents which bonds the base and the first chip. The adhesive agent is... |
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US20140339710 |
METHOD FOR BONDING WAFERS AND STRUCTURE OF BONDING PART
A method for bonding wafers includes forming a first bonding part on a surface of a first wafer by stacking a diffusion preventing layer formed of a material having low wettability with AuSn above... |
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US20130341735 |
ANODICALLY BONDED STRAIN ISOLATOR
A stress isolator that allows a sensor to be attached to materials of the same coefficient of thermal expansion and still provide the required elastic isolation between the sensor and the system... |
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US20140097463 |
ANISOTROPIC CONDUCTIVE ADHESIVE
An anisotropic conductive adhesive includes an epoxy adhesive containing an epoxy compound and a curing agent and conducive particles dispersed in the epoxy adhesive. When elastic moduluses at 35°... |
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US20120074597 |
FLEXIBLE UNDERFILL COMPOSITIONS FOR ENHANCED RELIABILITY
Underfill materials for fabricating electronic devices are described. One embodiment includes an underfill composition including an epoxy mixture, an amine hardener component, and a filler. The... |
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US20110175240 |
CHIP MODULE
A chip module and a fabricating method thereof are provided. Firstly, a substrate is provided. Next, a chip is assembled on the substrate and electrically connected with the substrate. Afterward,... |
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US20130221542 |
Functional Spacer for SIP and Methods for Forming the Same
A device includes a spacer, which includes a recess extending from a top surface of the spacer into the spacer, and a conductive feature including a first portion and a second portion continuously... |
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US20100123258 |
Low Temperature Board Level Assembly Using Anisotropically Conductive Materials
An integrated circuit may be secured to a substrate using an anisotropically conductive adhesive that may be cured at a temperature of less than 150° C. In some embodiments, an acrylic resin with... |
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US20080073799 |
MOULD HAVING NANO-SCALED HOLES
A mould includes a base having a first surface and a second surface opposite to the first surface; and a plurality of nano-scaled holes defined through the base. Each nano-scaled hole extends from... |
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US20130334713 |
ELECTROSTATIC DISCHARGE COMPLIANT PATTERNED ADHESIVE TAPE
The present disclosure relates to the field of fabricating microelectronic devices, wherein a microelectronic device substrate, such as a microelectronic wafer, may be thinned by a backgrinding... |
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US20110227233 |
Packaged Electronic Device Having Metal Comprising Self-Healing Die Attach Material
A method of assembling an electronic device and electronic packages therefrom. A die attach adhesive precursor is placed between a top surface of a workpiece and an IC die. The die attach adhesive... |
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US20140225283 |
WAFER BACK SIDE COATING AS DICING TAPE ADHESIVE
A semiconductor assembly comprises a semiconductor wafer, an adhesive coating disposed on the back side of the wafer, and a bare dicing tape, preferably UV radiation transparent. The assembly is... |
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US20120068363 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DIE PADDLES AND METHOD OF MANUFACTURE THEREOF
A method of manufacture of an integrated circuit packaging system includes: forming a package paddle group having a first package paddle electrically isolated from a second package paddle;... |
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US20130147058 |
CHIP PACKAGE AND CHIP PACKAGE METHOD
A chip package includes a substrate, a pad positioned on the substrate, a base board, at least one adhesive layer and at least one chip. The base board is positioned on the pad. At least one... |
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US20070023929 |
Laminate structure
The invention relates to a laminate structure comprising a first active layer having a first electrode potential, a second active layer having a second electrode potential, wherein the second... |
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US20070170599 |
Flip-attached and underfilled stacked semiconductor devices
A tape for use as a carrier in semiconductor assembly, which has one or more base sheets 101 of polymeric, preferably thermoplastic, material having first (101a) and second (101b) surfaces. A... |
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US20070290369 |
Resin Paste For Die Bonding And Its Use
Disclosed is a resin paste for die bonding comprising a butadiene homopolymer or copolymer (A) having a carboxylic acid terminal group, a thermosetting resin (B), a filler (C), and a printing... |
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US20150014865 |
CONNECTION ARRANGEMENT OF AN ELECTRIC AND/OR ELECTRONIC COMPONENT
The connection arrangement (100, 200, 300, 400) comprises at least one electric and/or electronic component (1). The at least one electric and/or electronic component (10) has at least one... |
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US20140346684 |
CONNECTION METHOD, CONNECTION STRUCTURE, INSULATING ADHESIVE MEMBER, ELECTRONIC COMPONENT HAVING ADHESIVE MEMBER, AND METHOD FOR MANUFACTURING SAME
An insulating adhesive film is formed by laminating a first insulating adhesive layer which contains a filler in an insulating adhesive composition and a second insulating adhesive layer which... |
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US20100127409 |
MICROELECTRONIC DEVICE WAFERS INCLUDING AN IN-SITU MOLDED ADHESIVE, MOLDS FOR IN-SITU MOLDING ADHESIVES ON MICROELECTRONIC DEVICE WAFERS, AND METHODS OF MOLDING ADHESIVES ON MICROELECTRONIC DEVICE WAFERS
A microelectronic device wafer includes an adhesive molded in-situ on the wafer. Adhesives and wafers are positioned in molds and a method that includes drawing in the molds at least a partial... |
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US20110169022 |
BOARD MODULE AND METHOD OF MANUFACTURING SAME
A liquid crystal display device (100) includes a glass substrate (110) having an LSI chip (130) and an FPC board (140) mounted thereon. A component ACF (150a) made of a single sheet is used to... |
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US20090218703 |
Lamination Tape for Reducing Chip Warpage and Semiconductor Device Containing Such Tape
A lamination tape is disclosed which includes a base film with an adhesive layer on one side wherein the coefficient of thermal expansion (CTE) of the adhesive layer is adapted so as to reduce... |
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US20060202355 |
Nanostructured friction enhancement using fabricated microstructure
Described herein are fabricated microstructures to adhere in shear to a contact surface. A fabricated microstructure comprises a substrate and a plurality of nano-fibers attached to the substrate.... |
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US20090230567 |
METHOD OF POST-MOLD GRINDING A SEMICONDUCTOR PACKAGE
A method of grinding a molded semiconductor package to a desired ultra thin thickness without damage to the package is disclosed. Prior to grinding a molded package to a desired package thickness,... |
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US20080061449 |
Semiconductor Component Arrangement
A semiconductor component arrangement having a semiconductor component, a mount, and an adhesive, wherein the adhesive connects the semiconductor component to the mount and the adhesive contains a... |
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US20070262470 |
Module With Built-In Semiconductor And Method For Manufacturing The Module
The present invention provides a module with a built-in semiconductor that can suppress a reduction in yield caused by a crack or failure of a semiconductor device in the process of mounting a... |
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US20150035173 |
ADHESIVES FOR BONDING HANDLER WAFERS TO DEVICE WAFERS AND ENABLING MID-WAVELENGTH INFRARED LASER ABLATION RELEASE
Methods are provided to form adhesive materials that are used to temporarily bond handler wafers to device wafers, and which enable mid-wavelength infrared laser ablation release techniques to... |
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US20110147952 |
DICING DIE-BONDING FILM
The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer (2) on a substrate material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive... |
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US20140084491 |
METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
A method for manufacturing an electronic device, the method includes: applying an adhesive film on a package board; placing an electronic component on the package board with a bump therebetween;... |
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US20080150163 |
Mounting structure for semiconductor element
A mounting structure for a semiconductor element is disclosed. The semiconductor element is bonded to a die pad through an adhesive film, which is formed by applying a predetermined amount of a... |
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US20130154125 |
ADHESIVE FILM AND ELECTRONIC DEVICE INCLUDING THE SAME
An adhesive film includes an amine curing agent and a phenolic curing agent, and has a ratio of a storage modulus at 170° C. after 80% or more curing to a storage modulus at 40° C. before curing... |
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US20070126129 |
Die bonding adhesive tape
Disclosed is a die bonding adhesive tape, which eliminates the requirement for additional adhesive tape for attaching a ring frame, decreases the curing time period upon die bonding, essentially... |
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US20150194331 |
CYCLIC OLEFIN POLYMER COMPOSITIONS AND POLYSILOXANE RELEASE LAYERS FOR USE IN TEMPORARY WAFER BONDING PROCESSES
The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics... |
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US20130049233 |
CHIP PACKAGE AND METHOD FOR MAKING SAME
A chip package includes a substrate, a pad, a double-sided adhesive tape, a chip, and a sealing member. The pad is arranged on the substrate and has a top surface facing away from the substrate.... |
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US20050017375 |
Ball grid array package substrate and method for manufacturing the same
A ball grid array package substrate includes a substrate body having a surface. A least a ball pad and a solder mask are formed on the surface of the substrate body. The solder mask has an opening... |
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US20150115444 |
WAFER ARRANGEMENT, A METHOD FOR TESTING A WAFER, AND A METHOD FOR PROCESSING A WAFER
According to various embodiments, a wafer arrangement may be provided, the wafer arrangement may include: a wafer including at least one electronic component having at least one electronic contact... |
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US20100264553 |
PACKAGED ELECTRONIC DEVICE HAVING METAL COMPRISING SELF-HEALING DIE ATTACH MATERIAL
A method of assembling an electronic device and electronic packages therefrom. A die attach adhesive precursor is placed between a top surface of a workpiece and an IC die. The die attach adhesive... |
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US20120086014 |
Semiconductor Device Having Glue Layer And Supporter
A plurality of metal patterns are disposed on a substrate. A support structure is provided between the plurality of metal patterns. The support structure has a supporter and a glue layer. Each of... |
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US20140264950 |
CHIP ARRANGEMENT AND A METHOD OF MANUFACTURING A CHIP ARRANGEMENT
In various embodiments, a chip arrangement is provided. The chip arrangement may include a chip carrier and a chip mounted on the chip carrier. The chip may include at least two chip contacts and... |
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US20060255476 |
Electronic assembly with controlled solder joint thickness
An electronic assembly includes a bare IC die or a leadless electronic component having at least one electrically conductive contact formed on a surface of the component and a leadframe or a... |
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US20080128900 |
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROELECTRONIC DEVICES
Packaged microelectronic devices and methods of manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a method of manufacturing a microelectronic device includes... |
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US20080224329 |
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROELECTRONIC DEVICES
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed. In one embodiment, a method for forming a microelectronic device includes attaching a... |
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US20070182025 |
Laminate structure and method of producing the same
The invention relates to a laminate structure comprising a first carrier layer with a surface, a first active surface being electrically conducting and being supported by the first carrier layer,... |
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US20080296783 |
RESIN MOLDED SEMICONDUCTOR DEVICE
A semiconductor device includes a circuit board, a wiring part, a protective coating glass, and a resin part. The circuit board has an approximately rectangular shape. The protective coating glass... |
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US20060270118 |
Surface mount type semiconductor device and method of manufacturing the same
A surface mount type semiconductor device comprises a support substrate having mutually opposed first and second surfaces, and having a slit at a central part thereof, a semiconductor element... |
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US20140061905 |
Polyol Photosensitizers, Carrier Gas UV Laser Ablation Sensitizers, and Other Additives and Methods For Making and Using Same
Disclosed are photo sensitizers that include a polyol moiety covalently bonded to a fused aromatic moiety. Also disclosed is a method for improving UV laser ablation performance of a coating, such... |
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US20110133345 |
MANUFACTURING METHOD FOR ELECTRONIC DEVICE
There is provided an electronic device manufacturing method capable of manufacturing a device having a preferable communication characteristic at a low cost with a high productivity. The... |
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US20060006508 |
Semiconductor device in which semiconductor chip is mounted on lead frame
A semiconductor device including a lead frame having a plurality of inner leads having end portions and a plurality of outer leads integrated with the inner leads, the inner leads having first... |
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US20140327124 |
POWER TRANSISTOR WITH HEAT DISSIPATION AND METHOD THEREFORE
A device comprising a substrate, an integrated circuit (IC) die attached to the substrate on one side, a plurality of contact pads on an active side of the IC die, a plurality of thermally and... |
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US20140001655 |
POWER TRANSISTOR WITH HEAT DISSIPATION AND METHOD THEREFOR
A device comprising a substrate, an integrated circuit (IC) die attached to the substrate on one side, a plurality of contact pads on an active side of the IC die, a plurality of thermally and... |