Matches 1 - 12 out of 12


Match Document Document Title
US20100025846 METAL CAP WITH RINGED PROJECTION TO BE WELDED TO STEM AND RINGED GROOVE PROVIDED IMMEDIATELY INSIDE OF RINGED PROJECTION AND OPTICAL DEVICE HAVING THE SAME  
An optical device with a CAN package is disclosed, where the cap is resistance-welded to the stem without causing failures due to fragments by the welding flying within the package. The cap of the...
US20060043575 Chip module  
A chip module including a chip having an integrated circuit and a stiffening element which is connected to the chip. The stiffening element includes a first part which extends parallel to the...
US20050269695 Surface-mount chip-scale package  
A chip-scale package and method of manufacturing a chip-scale package are provided. The chip-scale package includes a mounting portion defined by a plurality of metal layers formed on each of a...
US20130270427 PHOTOELECTRIC DEVICE PACKAGE AND DETACHABLE PACKAGE STRUCTURE  
A photoelectric device package and a detachable package structure are provided. The photoelectric device package includes a bottom-plate, a top-plate, at least one photoelectric device, and at...
US20060220238 Multi-functional metal shield case and method for making the same  
A multi-functional metal shield case and a method for making the same are provided. The multi-functional metal shield case includes a metal main body and an electrically non-conductive and heat...
US20060103005 Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate  
The invention relates to a metal-ceramic substrate for electric circuits or modules, said substrate comprising a ceramic layer which is provided with at least one metallic layer of a first type...
US20100019368 SEMICONDUCTOR CHIP PACKAGE, STACKED PACKAGE COMPRISING SEMICONDUCTOR CHIPS AND METHODS OF FABRICATING CHIP AND STACKED PACKAGES  
A semiconductor chip package includes a substrate having a cavity, a stacked package comprising the semiconductor chip package, and methods of fabricating the chip and the stacked packages....
US20080006936 Superfine-circuit semiconductor package structure  
A superfine-circuit semiconductor package structure includes a carrier board, a support board having at least one through hole and mounted on the carrier board, at least one semiconductor chip...
US20100165595 Semiconductor package and plasma display device including the same  
Provided are a semiconductor package and a plasma display device including the same. The semiconductor package includes a film substrate that relays a signal between a circuit board and a display...
US20160052781 WAFER LEVEL PACKAGING OF MEMS  
A MEMS device is formed by applying a lower polymer film to top surfaces of a common substrate containing a plurality of MEMS devices, and patterning the lower polymer film to form a headspace...
US20150318226 SEMICONDUCTOR PACKAGE  
Provided is semiconductor package, including a semiconductor chip; an upper structure over the semiconductor chip, the upper structure having a first thermal expansion coefficient; and a lower...
US20150001702 SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE  
To obtain a semiconductor module that can fix itself onto a fixing object while enabling further miniaturization, in addition to alleviating load applied on a molded resin, a semiconductor module...

Matches 1 - 12 out of 12