Matches 1 - 50 out of 71 1 2 >


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US20070295496 Diamond Composite Heat Spreader  
A composite heat spreader is disclosed in one embodiment of the invention as including an input interface to conduct heat from a heat source, such as an integrated circuit, and an output interface...
US20080029883 Diamond composite heat spreaders having low thermal mismatch stress and associated methods  
A diamond composite heat spreader having a low thermal mismatch stress can improve reliability and cost of diamond-based heat spreaders. A diamond composite heat spreader can have a diamond film...
US20090309214 Circuit Module Turbulence Enhancement  
Turbulence inducers are provided on circuit modules. Rising above a substrate or heat spreader surface, turbulence generators may be added to existing modules or integrated into substrates or heat...
US20100019380 INTEGRATED CIRCUIT WITH MICRO-PORES CERAMIC HEAT SINK  
An integrated circuit includes an integrated circuit device, a micro-pores ceramic heat sink and a heat conductive medium. The micro-pores ceramic heat sink is placed on a surface of the...
US20060186535 Semi-conductor die mount assembly  
A die mount assembly including a semiconductor die and die mount is provided. The semiconductor die may be a light emitting diode die that is attached to the die mount forming an electrical and...
US20080048304 HEAT SLUG FOR PACKAGE STRUCTURE  
A heat slug is provided for a package structure, including a main body and a plurality of protrusions. The main body has a surface in which at least one ditch is defined. Each protrusion is...
US20100102442 Heat spreader having single layer of diamond particles and associated methods  
A heat spreader is presented which can provide effective thermal management in a cost effective manner. The heat spreader includes a plurality of diamond particles arranged in a single layer...
US20070267173 Radiator for heat sink device  
A radiator for a heat sink device is formed by an extruded aluminum. The radiator comprises a base and a heat conductive metallic element. The base has a plurality of fins on a side and at least...
US20130154085 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT CONDUCTION AND METHOD OF MANUFACTURE THEREOF  
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate; mounting a lid base over the substrate, the...
US20100038758 SEMICONDUCTOR MODULE WITH TWO COOLING SURFACES AND METHOD  
A semiconductor module with two cooling surfaces and method. One embodiment includes a first carrier with a first cooling surface and a second carrier with a second cooling surface. The first...
US20070114658 Integrated Circuit Micro-Cooler with Double-Sided Tubes of a CNT Array  
Heat sink structures employing carbon nanotube or nanowire arrays exposed from both opposite surfaces of the structure to reduce the thermal interface resistance between an integrated circuit chip...
US20100200984 ADJUSTABLE THREADED CORES FOR LED THERMAL MANAGEMENT  
Adjustable threaded cores for LED thermal management. The cores provide a direct thermal path between a LED and a heat sink while minimizing gaps and stresses between materials. The system...
US20070126116 Integrated Circuit Micro-Cooler Having Tubes of a CNT Array in Essentially the Same Height over a Surface  
Heat sink structures employing carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink, where the nanotubes are cut to...
US20090146295 Ceramic substrate having thermal via  
The present invention relates to a ceramic substrate having a thermal via passing through the substrate for purposes of radiating heat to the outside, wherein the ceramic substrate has a...
US20120241943 Diamond Particle Mololayer Heat Spreaders and Associated Methods  
Thermally regulated semiconductor devices having reduced thermally induced defects are provided, including associated methods. Such a device can include a heat spreader having a monolayer of...
US20070075420 Microelectronic package having direct contact heat spreader and method of manufacturing same  
A method of fabricating a microelectronic package having a direct contact heat spreader, a package formed according to the method, a die-heat spreader combination formed according to the method,...
US20150084182 COOLING ASSEMBLY USING HEATSPREADER  
Various embodiments relate to a microchip die cooling assembly comprising a circuit board; a microchip having an exposed die attached to the circuit board; a heatspreader having a top side and a...
US20100110637 HIGH THERMAL CONDUCTIVITY METAL MATRIX COMPOSITES  
Discontinuous diamond particulate containing metal matrix composites of high thermal conductivity and methods for producing these composites are provided. The manufacturing method includes...
US20100140790 CHIP HAVING THERMAL VIAS AND SPREADERS OF CVD DIAMOND  
An integrated circuit chip having a heat spreader comprising CVD diamond extending along the chip support body and thermal vias extending through the support body in regions free of active devices...
US20060118816 Press pack power semiconductor module  
The high-power pack semiconductor module (1) comprises a layer (3, 4), which is brought into direct contact with one or both of the main electrodes of the Si semiconductor chip, (2), said layer...
US20090114934 Led light emitter with heat sink holder and method for manufacturing the same  
An LED light emitter with heat sink holder and a method for manufacturing it are both disclosed. The LED light emitter with heat sink holder includes a heat sink holder and at least an LED chip....
US20060065974 Reactive gettering in phase change solders to inhibit oxidation at contact surfaces  
A method for forming a high thermal conductivity heat sink to IC package interface is disclosed. The method uses reactive getter materials added to a two phase solder system having a phase change...
US20060006526 Thermal interposer for cooled electrical packages  
The specification describes electrical assemblies comprising actively cooled components wherein a thermal interposer is used to limit heat transfer between the ambient and the cooled components....
US20080191236 Cooling Device for a Light-Emitting Semiconductor Device and a Method of Manufacturing Such a Cooling Device  
A cooling device for cooling a light-emitting semiconductor device, such as a LED device (20), comprises a ceramic plate (15) having coolant-conveying channels (12) incorporated therein. The...
US20080197483 Lidless semiconductor cooling  
A system for cooling a semiconductor includes a heat sink in thermal contact with the semiconductor, a thermal interface material (TIM) layer disposed between the heat sink and the semiconductor,...
US20090079063 MICROELECTRONIC PACKAGE AND METHOD OF COOLING AN INTERCONNECT FEATURE IN SAME  
A microelectronic package comprises a substrate (110, 310), a die (320) supported by the substrate, an interconnect feature (130, 230, 330) connecting the die and the substrate to each other, and...
US20060269670 Systems and methods for thermal management of electronic components  
A heat-conducting medium for placement between a heat source and heat sink to facilitate transfer of heat from the source to the sink is provided. The heat-conducting medium can include a disk...
US20090273062 SEMICONDUCTOR PACKAGE HEAT SPREADER  
A semiconductor heat spreader from a unitary metallic plate is provided. The unitary metallic plate is formed into a panel, channel walls, at least two feet, and at least one external reversing...
US20060049513 Thin module system and method with thermal management  
A flex circuit populated with integrated circuits on one or both sides and in one or more fields along the flex circuitry is wrapped about an edge of a supporting substrate. In preferred...
US20080011451 HEAT SINK FOR ELECTRONIC DEVICE  
A heat sink includes a dissipating heat element and a thermal conducting element securely mounted on the dissipating heat element. The dissipating heat element has a base and a plurality of fins...
US20060180901 Method and apparatus for increasing the immunity of new generation microprocessors from ESD events  
A method and apparatus for increasing the immunity of new generation microprocessors from electrostatic discharge events involve shielding the microprocessors at the die level. A gasket of a lossy...
US20050017351 Silicon on diamond wafers and devices  
A heat dissipation device includes a first silicon layer, a second silicon layer, and a diamond layer sandwiched between the first silicon layer and the second silicon layer. A method for forming...
US20060278975 Ball grid array package with thermally-enhanced heat spreader  
A ball grid array (BGA) package having a thermally enhanced dummy chip is provided. In one embodiment, the package comprises a substrate. A chip is attached to the substrate. A heat spreader is...
US20050258534 Arrangement for receiving an electronic component capable of high power operation  
An arrangement, for receiving an electronic component capable of high power operation, comprising: an organic substrate comprising an upper surface, a lower surface and an aperture extending...
US20050087864 Cavity-down semiconductor package with heat spreader  
A cavity-down semiconductor package mainly includes a heat spreader, a substrate, and a chip. The substrate has an outer surface, an inner surface opposing to the outer surface and an opening...
US20060108681 Semiconductor component package  
A semiconductor component package and method of fabrication are disclosed. The package employs a heat dissipating element embedded within the protective material over the component. The heat...
US20090309215 SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING SEMICONDUCTOR MODULE  
A semiconductor module (10) includes a heat sink (1), an electronic component (2), a semiconductor device (3), and a thermally-conductive sheet member (4). The thermally-conductive sheet member...
US20060091528 High heat dissipation flip chip package structure  
A high heat dissipation flip chip package structure including a substrate, a chip, a supporting structure, and a heat spreader is provided. The substrate has a substrate surface. The chip has an...
US20070152325 Chip package dielectric sheet for body-biasing  
A chip package includes a thermal interface material disposed between a die backside and a heat sink. A dielectric sheet is also disposed between the die backside and the heat sink. The dielectric...
US20070063339 Heat dissipating assembly for heat dissipating substrate and application  
In a heat dissipating assembly for heat dissipating substrate and application, a heat dissipating substrate is made of a graphite layer and a thermal conductive metal layer covered onto the...
US20060103016 Heat sinking structure  
High performance integrated circuits generally have high heat generating capabilities. During powering up of these integrated circuits under typical operating conditions, heat generation is...
US20090008773 Mounted Semiconductor Device And A Method For Making The Same  
A method for mounting a semiconductor device onto a composite substrate, including a submount and a heat sink, is described. According to one aspect of the invention, the materials for the...
US20050116336 Nano-composite materials for thermal management applications  
Nano-composite materials with enhanced thermal performance that can be used for thermal management in a wide range of applications, including heat sinks, device packaging, semiconductor device...
US20090166852 SEMICONDUCTOR PACKAGES WITH THERMAL INTERFACE MATERIALS  
A method comprises providing a layer of nano particles between a semiconductor die and a slug; and sintering the layer of nano particles to provide thermal interface material to bond the...
US20060255453 Tightly engaged heat dissipating apparatus and method for manufacturing the same  
A method for manufacturing a tightly engaged heat dissipating apparatus includes the steps of providing a thermal-conductive base, forming a plurality of grooves on one surface of the base and...
US20050067693 Semiconductor device and manufacturing method thereof  
Disclosed is a semiconductor device including a SiC substrate and a heat conductor formed in a hole in the SiC substrate and made of a linear structure of carbon elements.
US20060043582 Method for heat dissipation on semiconductor device  
A device and method wherein a thermo electric generator device is disposed between stacks of a multiple level device, or is provided on or under a die of a package and is conductively connected to...
US20060071328 Semiconductor substrate structure  
A semiconductor substrate structure with a highly heat-conductive advantage increases packaging good rate and quality. Using semiconductor chip packaging, an electronic chip is easily made highly...
US20060289988 Integrated circuit with heat conducting structures for localized thermal control  
An integrated circuit die includes a substrate having an upper surface, at least one active device formed in a first area of the upper surface of the substrate, and a plurality of layers formed on...
US20070085199 INTEGRATED CIRCUIT PACKAGE SYSTEM USING ETCHED LEADFRAME  
An integrated circuit package system includes a conductive substrate. A heat sink and a plurality of leads are etched in the substrate to define a conductive film connecting the heat sink and the...

Matches 1 - 50 out of 71 1 2 >