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US20080012122 |
INTEGRATED CIRCUIT HEAT SPREADER STACKING SYSTEM
An integrated circuit heat spreader stacking system is provided including mounting an integrated circuit on a substrate, forming a heat spreader, forming a stacking stand-off for the heat... |
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US20140210071 |
INTEGRATED STRUCTURE WITH IMPROVED HEAT DISSIPATION
An integrated structure includes a support supporting at least one chip and a heat dissipating housing, attached to the chip. The housing is thermally conductive and has a thermal expansion... |
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US20100224991 |
INTEGRATED CIRCUIT HEAT SPREADER STACKING SYSTEM
An integrated circuit heat spreader stacking system includes: an integrated circuit on a substrate; a heat spreader having a heat sink dome; a stacking stand-off for the heat spreader; and the... |
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US20130214406 |
Flexible Heat Sink With Lateral Compliance
A multi-chip module (MCM) structure comprises more than one semiconductor chip lying in a horizontal plane, the MCM having individual chip contact patches on the chips and a flexible heat sink... |
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US20140264821 |
MOLDED HEAT SPREADERS
Embodiments of the present disclosure describe techniques and configurations for molded heat spreaders. In some embodiments, a heat spreader includes a first insert having a first face and a first... |
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US20140346661 |
CHIP PACKAGE STRUCTURE AND CHIP PACKAGING METHOD
Embodiments of the present invention provide a chip package structure and a chip packaging method, which is related to the field of electronic technologies, and can protect chips and effectively... |
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US20120098118 |
COMPLIANT HEAT SPREADER FOR FLIP CHIP PACKAGING
An integrated circuit chip package is described. The integrated circuit package comprises a substrate, a chip attached to the substrate, and a heat spreader mounted over the chip for sealing the... |
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US20150061110 |
STACKED CHIP LAYOUT AND METHOD OF MAKING THE SAME
A stacked chip layout includes a central processing chip has a first area and a first active circuit block over the central processing chip, the first active circuit block has a second area. The... |
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US20090309214 |
Circuit Module Turbulence Enhancement
Turbulence inducers are provided on circuit modules. Rising above a substrate or heat spreader surface, turbulence generators may be added to existing modules or integrated into substrates or heat... |
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US20100301470 |
STUD BUMPS AS LOCAL HEAT SINKS DURING TRANSIENT POWER OPERATIONS
A thermal management configuration for a flip chip semiconductor device is disclosed. The device includes a high power silicon based die having a metal bonding surface. A plurality of... |
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US20140353817 |
HEAT DISSIPATION DEVICE EMBEDDED WITHIN A MICROELECTRONIC DIE
The subject matter of the present application relates to a heat dissipation device that is embedded within a microelectronic die. The heat dissipation device may be fabricated by forming at least... |
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US20150162259 |
INTELLIGENT CHIP PLACEMENT WITHIN A THREE-DIMENSIONAL CHIP STACK
An integrated circuit (IC) stack device for thermal management is disclosed. The IC stack device can include a primary IC having a first set of cores with a ratio of first enabled cores and first... |
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US20050046015 |
Array-molded package heat spreader and fabrication method therefor
A method for forming a heat spreader, and the heat spreader formed thereby, are disclosed. An array heat spreader having a plurality of connected heat spreader panels is formed. Slots are formed... |
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US20140306335 |
THERMAL MANAGEMENT FOR SOLID-STATE DRIVE
An electronic device including a printed circuit board (PCB) including a thermal conduction plane and at least one heat generating component mounted on the PCB and connected to the thermal... |
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US20080296757 |
Fluid spreader
A fluid spreader includes a first surface, wherein the first surface has at least one channel that continuously or discontinuously extends to an outer periphery of the first surface, allowing... |
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US20110215457 |
Dummy TSV to Improve Process Uniformity and Heat Dissipation
In a stack of chips which each include active circuit regions, a plurality of through-silicon via (TSV) structures are formed for thermally conducting heat from the multi-chip stack by patterning,... |
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US20130187262 |
DEVICES INCLUDING COMPOSITE THERMAL CAPACITORS
Embodiments of the present disclosure include devices or systems that include a composite thermal capacitor disposed in thermal communication with a hot spot of the device, methods of dissipating... |
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US20150076686 |
Chip Stacking Packaging Structure
A chip stacking packaging structure is provided for achieving high-density stacking and improving a heat dissipation efficiency of the chip stacking packaging structure. The chip stacking... |
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US20080012124 |
CURABLE PROTECTANT FOR ELECTRONIC ASSEMBLIES
Latent thermal initiators and protectant compositions that remain shelf stable at elevated temperatures, yet readily cure during a solder bump reflow process or other high temperature processing.... |
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US20100059880 |
SEMICONDUCTOR MODULE AND AN ELECTRONIC SYSTEM INCLUDING THE SAME
A three-dimensional semiconductor module and an electronic system including the same are provided. The semiconductor module includes a module substrate, a logic device formed on a part of the... |
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US20090121343 |
CARBON NANOTUBE STRUCTURES FOR ENHANCEMENT OF THERMAL DISSIPATION FROM SEMICONDUCTOR MODULES
Disclosed are embodiments of an improved semiconductor wafer structure having protected clusters of carbon nanotubes (CNTs) on the back surface and a method of forming the improved semiconductor... |
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US20140264820 |
PASTE THERMAL INTERFACE MATERIALS
Embodiments of the present disclosure describe techniques and configurations for paste thermal interface materials (TIMs) and their use in integrated circuit (IC) packages. In some embodiments, an... |
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US20150262904 |
Package with Embedded Heat Dissipation Features
An integrated circuit package and a method of fabrication of the same are introduced. An opening is formed in a substrate. An embedded heat dissipation feature (eHDF) is placed in the opening in... |
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US20060113657 |
Designated MOSFET and driver design to achieve lowest parasitics in discrete circuits
Apparatus are described for a pair of MOSFET power transistors, a MOSFET driver, and an idealized circuit layout utilized in a power stage such as that of a power conversion system. The power... |
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US20150048494 |
PHASE CHANGING ON-CHIP THERMAL HEAT SINK
A method of forming an on-chip heat sink includes forming a device on a substrate. The method also includes forming a plurality of insulator layers over the device. The method further includes... |
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US20140183699 |
PHASE CHANGING ON-CHIP THERMAL HEAT SINK
A method of forming an on-chip heat sink includes forming a device on a substrate. The method also includes forming a plurality of insulator layers over the device. The method further includes... |
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US20080290502 |
INTEGRATED CIRCUIT PACKAGE WITH SOLDERED LID FOR IMPROVED THERMAL PERFORMANCE
An integrated circuit die includes a circuit surface and a back surface opposite the circuit surface. An underbump metallurgy is formed on a back surface. A layer of solder is formed on the... |
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US20150262908 |
HEAT PIPE AND METHOD OF MANUFACTURING THE SAME
A method of manufacturing a heat pipe, including the steps of: forming in a substrate a cylindrical opening provided with a plurality of ring-shaped recessed radially extending around a central... |
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US20100140792 |
GRAPHITE NANOPLATELETS FOR THERMAL AND ELECTRICAL APPLICATIONS
This disclosure concerns a procedure for bulk scale preparation of high aspect ratio, 2-dimensional nano platelets comprised of a few graphene layers, Gn. n may, for example, vary between about 2... |
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US20150179543 |
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES PROVIDING THERMOELECTRIC COOLING AND METHODS FOR COOLING SUCH INTEGRATED CIRCUIT STRUCTURES
Three-dimensional integrated circuit structures providing thermoelectric cooling and methods for cooling such integrated circuit structures are disclosed. In one exemplary embodiment, a... |
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US20130093074 |
MULTI-DIE INTEGRATED CIRCUIT STRUCTURE WITH HEAT SINK
An integrated circuit structure can include a first die including a first surface and a second surface and a second die including a first surface and a second surface. The first surface of the... |
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US20150200149 |
THERMAL IMPROVEMENT FOR HOTSPOTS ON DIES IN INTEGRATED CIRCUIT PACKAGES
Methods and apparatuses for improved integrated circuit (IC) packages are described herein. In an aspect, an IC device package includes an IC die having a contact pad, where the contact pad is... |
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US20110037167 |
METHOD AND PACKAGE FOR CIRCUIT CHIP PACKAGING
A method of assembling a bent circuit chip package and a circuit chip package having a bent structure. The circuit chip package includes: a substrate having a first coefficient of thermal... |
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US20150108631 |
3DIC Packages with Heat Dissipation Structures
A package includes a first die and a second die underlying the first die and in a same first die stack as the first die. The second die includes a first portion overlapped by the first die, and a... |
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US20050012204 |
High efficiency semiconductor cooling device
A semiconductor device has a cooling circuit located around a semiconductor circuit on the first surface. The cooling circuit includes a cooling cell with a semiconductor area of a second... |
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US20140252541 |
SYSTEMS AND METHODS FOR POWER TRAIN ASSEMBLIES
A power train assembly is provided. The power train assembly includes a component package including a first transistor having a first gate, a first drain, and a first source, a second transistor... |
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US20080296756 |
HEAT SPREADER COMPOSITIONS AND MATERIALS, INTEGRATED CIRCUITRY, METHODS OF PRODUCTION AND USES THEREOF
Near net shape heat spreader components are disclosed that comprise at least one pressure-treated powder material. Heat spreaders are also described that include at least one near net shape heat... |
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US20130313701 |
HIGH-VOLTAGE SWITCH WITH A COOLING DEVICE
A high-voltage switch comprises one or more high-voltage transistors and a cooling substrate which may be manufactured from an electrically insulating material and on and/or through which a... |
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US20120018873 |
METHOD AND PACKAGE FOR CIRCUIT CHIP PACKAGING
A method and a package for circuit chip package having a bent structure. The circuit chip package includes: a substrate having a first coefficient of thermal expansion (CTE); a circuit chip,... |
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US20100117222 |
Void Reduction in Indium Thermal Interface Material
Thermal interface materials and method of using the same in packaging are provided. In one aspect, a thermal interface material is provided that includes an indium preform that has a first surface... |
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US20090127701 |
Thermal attach for electronic device cooling
Embodiments of thermal cooling devices and systems including dies and thermal attaches having surface features are described in this application. The thermal attach may have a surface feature,... |
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US20150155218 |
3DIC Packaging with Hot Spot Thermal Management Features
A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the... |
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US20080237843 |
Microelectronic package including thermally conductive sealant between heat spreader and substrate
A microelectronic package. The package includes a substrate; a die mounted onto the substrate; an integrated heat spreader mounted onto the substrate, and thermally coupled to a backside of the... |
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US20080142954 |
Multi-chip package having two or more heat spreaders
A multi-chip package may include at least one integrated circuit die disposed on a substrate, and a local heat spreader is thermally coupled with the die. A global heat spreader is thermally... |
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US20080236175 |
MICROARCHITECTURE CONTROL FOR THERMOELECTRIC COOLING
An integrated circuit is cooled by microarchitecture controlled Peltier effect cooling. In one embodiment, a temperature sensor thermally coupled to at least a portion of the integrated circuit of... |
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US20070023893 |
LED package structure and manufacturing method, and LED array module
An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the... |
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US20150014841 |
HEAT-TRANSFER STRUCTURE
An apparatus comprising a first substrate having a first surface, a second substrate having a second surface facing the first surface and an array of metallic raised features being in contact with... |
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US20140217574 |
COMPOSITES COMPRISED OF ALIGNED CARBON FIBERS IN CHAIN-ALIGNED POLYMER BINDER
A method for enhancing internal layer-layer thermal interface performance and a chip stack of semiconductor chips using the method. The method includes adding a thermosetting polymer to the... |
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US20080290504 |
Compliant thermal contactor
One embodiment of the present invention is a compliant thermal contactor that includes a resilient metal film having a plurality of first thermally conductive, compliant posts disposed in an array... |
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US20090057880 |
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, STACKED MODULE, CARD, SYSTEM AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
A semiconductor device capable of improving the efficiency of dispersing heat via a dummy pad. The semiconductor device may be included in a semiconductor package, stack module, card, or system.... |