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US20060001163 Groundless flex circuit cable interconnect  
Embodiments of the present invention include an apparatus, method, and/or system for using a groundless flex circuit cable to interconnect semiconductor packages.
US20090302447 SEMICONDUCTOR ARRANGEMENT HAVING SPECIALLY FASHIONED BOND WIRES AND METHOD FOR FABRICATING SUCH AN ARRANGEMENT  
A semiconductor arrangement includes first and second integrated circuits (dies), an electrically conductive intermediate element, and one or more bond conductors. The first and the second...
US20080237823 Aluminum Based Bonding of Semiconductor Wafers  
Aluminum or aluminum alloy on each of a pair of semiconductor wafers is thermocompression bonded. Aluminum-based seal rings or electrical interconnects between layers may be thus formed. On a MEMS...
US20100187664 ELECTRICAL CONNECTIVITY FOR CIRCUIT APPLICATIONS  
According to example configurations herein, a leadframe includes a connection interface. The connection interface can be configured for attaching an electrical circuit to the leadframe. The...
US20050161791 Multiple die-spacer for an integrated circuit  
A method of forming an integrated circuit includes placing a first die and adhering multiple spacers to the first die. The method further includes adhering a second die to the spacers. The second...
US20090174055 Leadless Semiconductor Packages  
An encapsulation technique for leadless semiconductor packages entails: (a) attaching a plurality of dice (411) to die pads in cavities (41-45, 51-55) of a leadframe, the cavities arranged in a...
US20070262434 INTERCONNECTED IC PACKAGES WITH VERTICAL SMT PADS  
An electronic component is disclosed including a plurality of semiconductor packages soldered together in a side-by-side configuration. The packages are batch processed on a substrate panel. The...
US20100314734 Processes and structures for IC fabrication  
The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the...
US20070241440 Overmolded semiconductor package with a wirebond cage for EMI shielding  
According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the...
US20100314735 Processes and structures for IC fabrication  
The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the...
US20080017965 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF  
A semiconductor device includes a plurality of chips comprising a plurality of first moisture-proof rings individually surrounding said plurality of chips, a second moisture-proof ring surrounding...
US20090026599 Memory module capable of lessening shock stress  
A memory module capable of lessening shock stresses, primarily comprises a multi-layer printed circuit board (PCB), a plurality of memory packages, and a stress-buffering layer. The memory...
US20060180910 Three-dimensional circuit module and method of manufacturing the same  
A three-dimensional circuit module has a three-dimensional structure in which a second board is bonded to a first board at a predetermined angle. The first board has a first notched concave part...
US20060027906 Exclusive memory structure applicable for multi media card and secure digital card  
An exclusive memory structure applicable for Multi Media Card and Secure Digital Card includes a casing and a substrate, in which the substrate is attached to the casing; a control chip and two or...
US20150115427 PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF  
A package structure and a packaging method thereof are provided, in which an inductor is integrated into a substrate so as to save a packaging space and thus improve the integration level and...
US20090321906 SEMICONDUCTOR DEVICE WITH PACKAGE TO PACKAGE CONNECTION  
A semiconductor package comprises a first package; a second package that is provided on the first package; and a first interconnect that comprises a bump to couple to the first package and a base...
US20070290311 BOND WIRELESS POWER MODULE WIHT DOUBLE-SIDED SINGLE DEVICE COOLING AND IMMERSION BATH COOLING  
A wire bond free power module assembly consists of a plurality of individual thin packages each consisting of two DBC wafers which sandwich one or more semiconductor die. The die electrodes and...
US20080283991 Housed active microstructures with direct contacting to a substrate  
A microstructured component with microsensors or other active mircrocomponent is provided. The microstructured component includes a substrate and at least one housing arranged on the substrate...
US20070052079 Multi-chip stacking package structure  
A multi-chip stacked package structure, including a leadframe base thin package structure with two or more chips in the stacking structure, is provided that is capable of including two or more...
US20090321905 Multi-Package Ball Grid Array  
A multi-package module that includes a multi-layer interconnect structure, a housing structure attached to the multi-layer interconnect structure, and a plurality of integrated circuit packages...
US20060249826 Multi-chip module and method of manufacture  
A multi-chip module and a method for manufacturing the multi-chip module that mitigates wire breakage. A first semiconductor chip is mounted and wirebonded to a support substrate. A spacer is...
US20100052130 SEMICONDUCTOR PACKAGE AND METHODS FOR MANUFACTURING THE SAME  
Provided is a semiconductor package. The semiconductor package includes a bonding wire electrically connecting a first package substrate and a second package substrate to each other and an...
US20060220227 High density integrated circuit having multiple chips and employing a ball grid array (BGA) and method for making same  
High density integrated circuits and more particularly to a high density integrated circuit incorporating a multiplicity of functional chips arranged on a substrate comprised of a plurality of...
US20060071314 Cavity-down stacked multi-chip package  
A cavity-down stacked multi-chip package with a plurality of packages stacked together is provided. The uppermost package has a circuit board with an opening, a heat spreader, and a chip. The heat...
US20060244130 Multi-chip semiconductor package  
The present invention discloses a multi-chip semiconductor package for packing a plurality of semiconductor chips of different functions in a signal package while allowing the plural chips to be...
US20100148334 INTERGRATED CIRCUIT PACKAGE SUPPORT SYSTEM  
A system for supporting integrated circuit packages to prevent mechanical failure of the packages at their connection to a printed circuit board or card involves bracing the packages to the board...
US20060278966 Contact-based encapsulation  
An electrical connection between two chips includes an IC pad on a first chip, an IC pad on a second chip, a first barrier metal over the IC pad of the first chip, a second barrier metal over the...
US20070052078 MATRIX PACKAGE SUBSTRATE STRUCTURE, CHIP PACKAGE STRUCTURE AND MOLDING PROCESS THEREOF  
A matrix package substrate molding process is provided. First, a matrix package substrate with a plurality of package units for disposing chips on the package units is provided. Next, an...
US20100001389 PACKAGE STRUCTURE FOR RADIO FREQUENCY MODULE AND MANUFACTURING METHOD THEREOF  
A package structure for radio frequency module and a manufacturing method thereof are provided. The package structure includes a multi-layer substrate, a first chip, a second chip, a number of...
US20090166833 SEMICONDUCTOR UNIT WHICH INCLUDES MULTIPLE CHIP PACKAGES INTEGRATED TOGETHER  
A semiconductor unit includes an interface plate, a supporting plate integrally formed with the interface plate, two chip packages positioned at opposite sides of the supporting plate, and leading...
US20090230531 Semiconductor Package with Penetrable Encapsulant Joining Semiconductor Die and Method Thereof  
A semiconductor device is made by mounting a first semiconductor die to a first substrate, forming a first encapsulant over the first semiconductor die, and forming a second encapsulant over the...
US20060038275 Method and apparatus for manufacturing stacked-type semiconductor device  
A method of manufacturing a stacked-type semiconductor device, comprises: arranging a plurality of stacked chips obtained by stacking semiconductor chips on a plurality of stages on a support...
US20100052129 MULTI-CHIP PACKAGE AND MANUFACTURING METHOD  
Manufacturing method and a multi-chip package, which comprises a conductor pattern (1) and insulation (2), and, inside the insulation, a first component (3), the contact terminals (4) of which...
US20080173992 SEMICONDUCTOR DEVICE INCLUDING ISOLATION LAYER  
A semiconductor device includes a carrier, a semiconductor chip including an active area on a first face and a separate isolation layer applied to a second face, and an adhesion material coupling...
US20070164417 Design and fabrication method for microsensor  
A method for fabricating a micro-sensor device comprising the steps of fabricating on a parent substrate (10) at least one sensor element (21); forming an interconnect layer (32) having first and...
US20070132079 Power Semiconductor Component With Semiconductor Chip Stack In A Bridge Circuit And Method For Producing The Same  
A power semiconductor component (30) with power semiconductor chip stack (14) has a base power semiconductor chip (16) and a power semiconductor chip (17) stacked on the rear side of the base...
US20090243061 Complex Semiconductor Packages and Methods of Fabricating the Same  
Disclosed are complex semiconductor packages, each including a large power module package which includes a small semiconductor package, and methods of manufacturing the complex semiconductor...
US20070120240 Circuit substrate and method of manufacture  
An aspect of the present invention comprises a method of producing a circuit substrate comprising providing a substrate, coating the substrate with a conductive layer, patterning the conductive...
US20100237481 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL SIDED CONNECTION AND METHOD OF MANUFACTURE THEREOF  
A method of manufacture of an integrated circuit packaging system includes: attaching an integrated circuit having a through via over a substrate with the through via coupled to the substrate;...
US20080157317 HIGH CAPACITY MEMORY MODULE USING FLEXIBLE SUBSTRATE  
A memory module includes a module substrate and a plurality of package units mounted to the module substrate such that they partially overlap each other. Each package unit has at least one memory...
US20090108427 Techniques for Modular Chip Fabrication  
Techniques for modular chip fabrication are provided. In one aspect, a modular chip structure is provided. The modular chip structure comprises a substrate; a carrier platform attached to the...
US20090057861 INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH SIDE-BY-SIDE AND OFFSET STACKING  
An integrated circuit package-in-package system includes: mounting a first integrated circuit device over a substrate; mounting an integrated circuit package system having an inner encapsulation...
US20060102992 Multi-chip package  
A multi-chip package includes a substrate having first and second substrate pads, ball pads electrically connected to the first and second substrate pads, a first chip attached on the substrate...
US20060017146 IC with stably mounted chip  
An IC with stably mounted chip includes a chip, a leadframe, a bridge, and an encapsulating compound. The bridge is a flat arch made of a sheet material and includes a horizontal fixing section...
US20110089551 SEMICONDUCTOR DEVICE WITH DOUBLE-SIDED ELECTRODE STRUCTURE AND ITS MANUFACTURING METHOD  
According to the present invention, a recess portion is formed in a package substrate which is formed of a multilayer organic substrate having a multilayer wiring, and an LSI chip is accommodated...
US20060208348 Stacked semiconductor package  
In a stacked semiconductor package, since electric power is supplied to a second semiconductor package through a first semiconductor package, a power supply path becomes complicated and...
US20090273067 MULTI-CHIP DISCRETE DEVICES IN SEMICONDUCTOR PACKAGES  
Semiconductor packages that contain multiple dies containing discrete devices and methods for making such devices are described. The semiconductor package contains both a first die containing...
US20110084376 MODULAR LOW STRESS PACKAGE TECHNOLOGY  
A protective modular package assembly with one or more subassemblies, each having a base element, a sidewall element coupled to the base element, and a semiconductor device disposed within and...
US20130221510 METHODS FOR BONDING MATERIAL LAYERS TO ONE ANOTHER AND RESULTANT APPARATUS  
Methods and apparatus provide for a structure, including: a first glass material layer; and a second material layer bonded to the first glass material layer via bonding material, where the bonding...
US20090200651 Multi-chip package  
A multi-chip package structure is provided with a first chip, a substrate adjacent to the first chip, a plurality of contacts connecting the first chip and the substrate, a second chip disposed...

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