Matches 1 - 50 out of 53 1 2 >


Match Document Document Title
US20130015568 GETTER STRUCTURE WITH OPTIMIZED PUMPING CAPACITY  
Getter structure comprising at least one getter portion arranged on a support and including at least two adjacent getter material parts arranged on the support one beside the other, with different...
US20140048921 ENCAPSULATED ARRAYS OF ELECTRONIC SWITCHING DEVICES  
An electronic switching device array encapsulated in an encapsulating structure; wherein said array is exposed to one or more gas pockets between said array and said encapsulating structure.
US20110272796 Nano-structured Gasket for Cold Weld Hermetic MEMS Package and Method of Manufacture  
A structure and method for cold weld compression bonding using a metallic nano-structured gasket is provided. This structure and method allows a hermetic package to be formed at lower pressures...
US20140203421 MICRO-ELECTRO MECHANICAL SYSTEM (MEMS) STRUCTURES AND METHODS OF FORMING THE SAME  
A device includes a first substrate bonded with a second substrate structure. The second substrate structure includes an outgasing prevention structure. At least one micro-electro mechanical...
US20080136000 Micromechanical Component Having Multiple Caverns, and Manufacturing Method  
A micromechanical component having at least two caverns is provided, the caverns being delimited by the micromechanical component and a cap, and the caverns having different internal atmospheric...
US20140306312 MEMS Sensor Packaging and Method Thereof  
A micro electro mechanical systems (MEMS sensor packaging includes a first wafer having a readout integrated circuit (ROIC) formed thereon., a second wafer disposed corresponding to the first...
US20100025832 REDUCED STICTION AND MECHANICAL MEMORY IN MEMS DEVICES  
A MEMS device is packaged in a process which hydrogen (H) deuterium (D) for reduced stiction. H is exchanged with D by exposing the MEMS device with a deuterium source, such as deuterium gas or...
US20120104589 Deposition-free sealing for Micro- and Nano-fabrication  
A method for sealing through-holes in a material via material diffusion, without the deposition of a sealant material, is disclosed. The method is well suited to the fabrication and packaging of...
US20050212067 Microelectromechanical devices with lubricants and getters formed thereon  
The present invention provides a packaged microelectromechanical device having a plurality of deflectable elements formed on a substrate that has a getter and/or a lubricant disposed thereon. The...
US20130214400 MICRO-ELECTRO MECHANICAL SYSTEMS (MEMS) STRUCTURES AND METHODS OF FORMING THE SAME  
A device includes a capping substrate bonded with a substrate structure. The substrate structure includes an integrated circuit structure. The integrated circuit structure includes a top metallic...
US20090309203 GETTER ON DIE IN AN UPPER SENSE PLATE DESIGNED SYSTEM  
A microelectromechanical system (MEMS) hermetically sealed package device that is less labor intensive to construct and thus less expensive to manufacture. An example package device includes a...
US20110127660 METHODS AND MATERIALS FOR THE REDUCTION AND CONTROL OF MOISTURE AND OXYGEN IN OLED DEVICES  
Embodiments of the invention provide an electronic device which may include an interior compartment housing at least one electronic component that may be reactive to target impurities. The...
US20090236717 Organic Electronic Component With Dessicant-Containing Passivation Material  
The invention relates to an organic electronic component, such as e.g. an organic light diode or an organic solar cell with structures made of passivation material, the passivation material...
US20080131817 Gettering members, methods of forming the same, and methods of performing immersion lithography using the same  
Provided herein are gettering members that include a monitor substrate and a conditioning layer thereon. Also provided herein are methods of forming gettering layers and methods of performing...
US20140346657 THIN FILM CAPPING  
A method for sealing cavities in micro-electronic/-mechanical system (MEMS) devices to provide a controlled atmosphere within the sealed cavity includes providing a semiconductor substrate on...
US20110079889 CAVITY STRUCTURE COMPRISING AN ADHESION INTERFACE COMPOSED OF GETTER MATERIAL  
A structure comprising a cavity delimited by a first substrate and a second substrate attached to the first substrate by an adhesion interface, in which a first part of a first portion of a getter...
US20130105959 STRUCTURE FOR HERMETIC ENCAPSULATION OF A DEVICE AND AN ELECTRONIC COMPONENT  
An encapsulation structure comprising at least one hermetically sealed cavity in which at least the following are encapsulated: a device,an electronic component produced on a first substrate, anda...
US20070210431 Support with integrated deposit of gas absorbing material for manufacturing microelectronic microoptoelectronic or micromechanical devices  
The specification teaches a device for use in the manufacturing of microelectronic, microoptoelectronic or micromechanical devices (microdevices) in which a contaminant absorption layer improves...
US20150130039 LAYER ARRANGEMENT AND A WAFER LEVEL PACKAGE COMPRISING THE LAYER ARRANGEMENT  
The invention relates to a layer arrangement and a wafer level package comprising the layer arrangement, and in particular, the layer arrangement comprises a getter layer and further comprises a...
US20080128878 Method and Apparatus for Carbon Dioxide Gettering for a Chip Module Assembly  
A chip module assembly includes a CO2 getter exposed through a gas-permeable membrane to a chip cavity of a chip module. One or more chips is/are enclosed within the cavity. The CO2 getter...
US20120112334 PACKAGING STRUCTURE OF A MICRO-DEVICE INCLUDING A GETTER MATERIAL  
A packaging structure including at least one cavity wherein at least one micro-device is provided, the cavity being bounded by at least a first substrate and at least a second substrate integral...
US20080272475 Air Cavity Package for a Semiconductor Die and Methods of Forming the Air Cavity Package  
A die package (72) for a semiconductor die (20). A plurality of the die packages (72) are formed on a single carrier (10) by applying a body (55) of molding compound across a carrier (10) with an...
US20080185701 Hermetically Sealed Package and Methods of Making the Same  
Hermetically sealed packages having organic electronic devices are presented. A number of sealing mechanisms are provided to hermetically seal the package to protect the organic electronic device...
US20090072371 Methods And Articles Incorporating Local Stress For Performance Improvement Of Strained Semiconductor Devices  
A packaged semiconductor device (450) includes a semiconductor chip (400) having at least one selectively thinned substrate (cavity) region (410). A package (460) is provided for mounting,...
US20090261464 Getter Formed By Laser-Treatment and Methods of Making Same  
The present disclosure relates to methods of treating a silicon substrate with an ultra-fast laser to create a getter material for example in a substantially enclosed MEMS package. In an...
US20090026598 Wafer Level Packaging Integrated Hydrogen Getter  
A wafer-level package that employs one or more integrated hydrogen getters within the wafer-level package on a substrate wafer or a cover wafer. The hydrogen getters are provided between and among...
US20090001537 Gettering material for encapsulated microdevices and method of manufacture  
A method for providing improved gettering in a vacuum encapsulated microdevice is described. The method includes designing a getter alloy to more closely approximate the coefficient of thermal...
US20060076637 Method and system for packaging a display  
A package structure and method of packaging for an interferometric modulator. A transparent substrate having an interferometric modulator formed thereon is provided. A backplane is joined to the...
US20090079054 Semiconductor device, structure of mounting the same, and method of removing foreign matter from the same  
A semiconductor device includes a package defining an enclosed inner space, a semiconductor chip having a movable portion on one side and housed in the closed inner space of the package, and a...
US20070257347 CHIP STRUCTURE AND FABRICATING PROCESS THEREOF  
A chip structure comprising a substrate, a conductive layer, a plurality of bumps and a trap layer is provided. The substrate has a plurality of pads and the conductive layer is disposed on the...
US20110193098 High voltage high package pressure semiconductor package  
A hermetically sealed integrated circuit package that includes a cavity housing a semiconductor die, whereby the cavity is pressurized during assembly and when formed. The invention prevents the...
US20110156190 ELECTRONIC COMPONENT  
An electronic component includes a base member comprising a main surface, a cap member on the base member, a first concave portion between the main surface and the cap member, a second concave...
US20080296747 Micromechanical component having thin-layer encapsulation and production method  
A micromechanical component having a substrate and having a thin-layer, as well as having a cavity which is bounded by the substrate and the thin-layer, at least one gas having an internal...
US20070273013 Packaging for Micro Electro-Mechanical Systems and Methods of Fabricating Thereof  
Embodiments of the present disclosure provide systems and methods for producing micro electro-mechanical device packages. Briefly described, in architecture, one embodiment of the system, among...
US20140175405 ELECTRONIC DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF  
A package structure of an electronic device is provided. The substrate of such package structure has at least one embedded gas barrier structure, which protects the electronic device mounted...
US20100013071 ORGANIC LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF  
The present invention relates to an organic light emitting device and a manufacturing method thereof. A manufacturing method of an organic light emitting device according to an exemplary...
US20080191336 Subminiature electronic device having hermetic cavity and method of manufacturing the same  
The invention discloses a subminiature electronic device with a hermetic cavity and method of manufacturing the same. It particularly relates to a chip type or chip scale packaged electronic...
US20100270667 SEMICONDUCTOR PACKAGE WITH MULTIPLE CHIPS AND SUBSTRATE IN METAL CAP  
A semiconductor package includes a first semiconductor chip, a second semiconductor chip, a first substrate, a second substrate and a metal cap. The chips are electrically connected to the first...
US20100084752 SYSTEMS AND METHODS FOR IMPLEMENTING A WAFER LEVEL HERMETIC INTERFACE CHIP  
Systems and methods for enabling hermetic sealing at the wafer level during fabrication of a microelectromechanical sensor (MEMS) device. The MEMS device has a specialized hermetic interface chip...
US20080283989 Wafer level package and wafer level packaging method  
Provided are a wafer level package and a wafer level packaging method, which are capable of performing an attaching process at a low temperature and preventing contamination of internal devices....
US20170133327 ELECTRIC MODULE COMPRISING A TENSIONING DEVICE  
An electrical module includes at least one electrical component and at least one hollow body which is filled or can be filled with a medium, particularly a fluid. The hollow body exerts a pressing...
US20170110381 EXTERNAL GETTERING METHOD AND DEVICE  
Disclosed embodiments include external gettering provided by electronic packaging. An external gettering element for a semiconductor substrate, which may be incorporated as part of an electronic...
US20170011977 WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER  
An electronic device and methods of manufacture thereof. One or more methods may include providing a lid wafer having a cavity and a surface surrounding the cavity and a device wafer having a...
US20160308161 OLED PACKAGE STRUCTURE AND OLED PACKAGING METHOD  
The present invention provides an OLED package structure and an OLED packaging method. The OLED package structure includes a substrate (1), a package lid (2) arranged opposite to the substrate...
US20160181168 Environmental hardened packaged integrated circuit  
A packaged integrated circuit for operating reliably at elevated temperatures is provided. The packaged integrated circuit includes a modified extracted die, which includes one or more extended...
US20160176703 MULTI-LEVEL GETTER STRUCTURE AND ENCAPSULATION STRUCTURE COMPRISING SUCH A MULTI-LEVEL GETTER STRUCTURE  
Getter structure comprising at least: one support;one first layer of getter material arranged on the support;one second layer of getter material such that the first layer of getter material is...
US20160049342 Module Arrangement For Power Semiconductor Devices  
A module arrangement for power semiconductor devices, including one or more power semiconductor modules, wherein the one or more power semiconductor modules include a substrate with a first...
US20160035589 SEMICONDUCTOR DEVICE, RELATED MANUFACTURING METHOD, AND RELATED ELECTRONIC DEVICE  
A method for manufacturing semiconductor device may include the following steps: performing an etching process to remove a sacrificial layer from a first composite structure, wherein the first...
US20160031706 SEMICONDUCTOR DEVICE, RELATED MANUFACTURING METHOD, AND RELATED ELECTRONIC DEVICE  
A semiconductor device may include an enclosure structure. The semiconductor device may further include a getter for absorb gas molecules. The getter may be positioned (and enclosed) inside the...
US20150279755 WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER  
An electronic device and methods of manufacture thereof. One or more methods may include providing a lid wafer having a cavity and a surface surrounding the cavity and a device wafer having a...

Matches 1 - 50 out of 53 1 2 >