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Match Document Document Title
US20090218667 SMART CARDS AND METHODS FOR PRODUCING A SMART CARD  
The invention relates to smart cards. In one embodiment a smart card has a card body having at least a first, a second and a third layer. The first and the second layer are at least partly...
US20080021824 MULTIPLE ACCOUNT WIRELESS PAYMENT DEVICE  
A payment device includes an integrated circuit (IC) to store at least two account numbers. The payment device also includes an antenna coupled to the IC to selectively transmit a selected one of...
US20060192276 Integrated circuit and wireless IC tag  
In a wireless IC tag, on which an integrated circuit and a small antenna are integrally mounted, a radiation-shielding material covers only the integrated circuit (IC chip) portion. Thus, the area...
US20080169541 Enhanced durability multimedia card  
A memory card comprising a leadframe having a plurality of contacts. Electrically connected to the leadframe is at least one semiconductor die. A body at least partially encapsulates the leadframe...
US20050099301 Method for fitting a transponder to a metal body, and a transponder module for carrying out the method  
A method for fitting a transponder with a chip and a coil to a metal body is disclosed. The coil is wound in the form of a bar and is electrically connected at its ends to the electrical...
US20090065917 Multi-Standards Compliant Card Body  
A card body comprises a module-receiving part (3) having a cavity for receiving an electronic module ML. The card body comprises a first side part (4) coupled to the module-receiving part (3), the...
US20060202041 Integrated circuit card and a method for manufacturing the same  
A semiconductor chip is mounted onto a wiring substrate having external connecting terminals, electrodes on the semiconductor chip and wiring lines on the wiring substrate are connected together...
US20070252706 IC tag housing case  
The present invention relates to an IC tag housing case configured to house an IC tag therein, and the objective thereof is to accurately exchange information between an IC tag and a reader/writer...
US20120074481 SECURITIES, CHIP MOUNTING PRODUCT, AND MANUFACTURING METHOD THEREOF  
The invention provides an ID chip with reduced cost, increased impact resistance and attractive design, as well as products and the like mounting the ID chip and a manufacturing method thereof. In...
US20080173995 Memory card and manufacturing method of the same  
There is a need to provide a large capacity memory card for a portable communication device. A memory card 1 includes: a wiring board 2 mainly composed of a glass epoxy resin; multiple...
US20090111522 Smart Card and Method for Manufacturing Said Card  
The present invention relates to a smart card provided with an integrated circuit for identifying a user, storing and exchanging information with an electronic device, such as for example a mobile...
US20080042851 RFID tag and RFID tag production method  
The RFID tag includes: a main unit consisting of a base, a communication antenna that is wired on the base, a circuit chip that is electrically connected to the antenna and performs radio...
US20120280380 HIGH PERFORMANCE GLASS-BASED 60 GHZ / MM-WAVE PHASED ARRAY ANTENNAS AND METHODS OF MAKING SAME  
A glass-based, high-performance 60 GHz/mm-wave antenna includes cavities disposed in a phased-array antenna (PAA) substrate. The cavities are disposed below planar antenna elements. Emitter traces...
US20100244215 WIRELESS IC DEVICE  
A wireless IC device includes a radiating plate, a wireless IC chip, and a feeder circuit board, on which the wireless IC chip is mounted. The feeder circuit board includes a resonant circuit with...
US20070222052 WIRING STRUCTURE, MULTILAYER WIRING BOARD, AND ELECTRONIC DEVICE  
A wiring structure includes a general signal line, a differential signal line having a pair of signal wiring lines and a reference potential layer. The signal wiring lines respectively transmit...
US20090173795 CARD TYPE INFORMATION DEVICE AND METHOD FOR MANUFACTURING SAME  
Card type information device includes wiring board having a wiring pattern with an electronic component mounted on a first face of wiring board and an antenna connecting electrode, antenna board...
US20100052869 COMBINATION FULL-DUPLEX AND HALF-DUPLEX ELECTRONIC IDENTIFICATION TAG  
Transponders are disclosed that are configurable to operate in an HDX mode and/or an FDX-B mode and that use a switchable load impedance across the transponders' resonant antenna circuit to induce...
US20070164415 Semiconductor device including bus with signal lines  
A semiconductor memory device has the group of longest signal lines configured in a twisted wiring scheme, the group of signal lines of intermediate length configured in a shield wiring scheme,...
US20090283602 Integrated Circuit Transponder, Method of Producing an Integrated Circuit and Method of Producing a Transponder  
In a method of producing an integrated circuit (1, 91, 131) for a transponder (2, 112) a photoresist layer (11) is applied on a first surface (8) of a semiconductor device (3). A patterned mask...
US20050023665 Curable encapsulant compositions  
The present invention is directed to a photocurable composition for use as in particular an encapsulant, capable of curing at wavelengths greater than 290 nm. Reaction products of these...
US20070176622 Id chip and ic card  
The present invention provides an ID chip or an IC card in which the mechanical strength of an integrated circuit can be enhanced without suppressing a circuit scale. An ID chip or an IC card of...
US20100032487 CHIP MODULE FOR AN RFID SYSTEM  
The invention relates to a chip module for an RFID system, in particular for an RFID-label, a coupling label for use in an RFID-label, an RFID-Inlay for an RFID-label, and an RFID label produced...
US20110062240 DEVICE AND METHOD FOR PROVIDING AN INTEGRATED CIRCUIT WITH A UNIQUE INDENTIFICATION  
A device and method for providing an integrated circuit with a unique identification. The device is usable on an integrated circuit (IC) for generating an identification (ID) identifying the IC...
US20070158803 Memory packaging structure of mini SD card  
A memory packaging structure of mini SD card, the main implementation technology thereof comprises: to perform the pin adjustment to the: memory originally employing TSOP (Thin Small Out-Line...
US20080191331 System in package semiconductor device suitable for efficient power management and method of managing power of the same  
Provided are a system in package (SIP) semiconductor device suitable for efficient power management, and a method of managing power of the SIP semiconductor device. The SIP semiconductor device...
US20090079053 TAPE SUBSTRATE AND SEMICONDUCTOR MODULE FOR SMART CARD, METHOD OF FABRICATING THE SAME, AND SMART CARD  
Provided are a tape substrate for a smart card, a method of fabricating the same, and a semiconductor module and a smart card using the tape substrate. The tape substrate includes at least one...
US20060081970 Memory card module with an inlay design  
A memory card module with an inlay design includes a substrate having an upper surface on which an upper cavity is formed, and a lower surface on which at least a lower cavity corresponding to the...
US20070029655 Jig structure for manufacturin a stacked memory card  
A jig structure for manufacturing a stacked memory card, wherein the stacked memory card has a substrate forming with a package area and at least a electrical element, the jig structure is formed...
US20080173996 SEMICONDUCTOR CARD PACKAGE AND METHOD OF FORMING THE SAME  
A semiconductor card package and a method of manufacturing the semiconductor cared package are provided. The package may include a housing having a cavity. The cavity may have a size corresponding...
US20060087016 IC (integrated circuit) card  
An IC card according to the present invention reduces or prevents a deterioration or damage on an electronic device to which the IC card is mounted. A buffer section made of a thermoplastic resin...
US20060261456 Micromodule, particularly for chip card  
An electronic micromodule, particularly for smart card, comprises an electrically insulating substrate, at least one conductive sheet in an electrically conductive material, which rear face is...
US20080251905 Package-on-package secure module having anti-tamper mesh in the substrate of the upper package  
A package-on-package (POP) secure module includes a first ball grid array (BGA) package, and a second BGA package. The first BGA includes an array of bond balls that is disposed on a side of a...
US20050104732 Chip scale package for a transponder  
The invention relates to a transponder device which comprises a chip (5) and an antenna (8), the chip (5) being connected to the antenna (8), the transponder is characterized by the fact that the...
US20100096736 Semiconductor Device and Manufacturing Method Thereof  
A structure capable of changing the characteristic value of an element after the formation of the element in order to prevent the increase of the manufacturing cost and delay in the delivery of a...
US20100090014 SEMICONDUCTOR DEVICE AND RFID TAG CHIP  
The present invention provides a reference power supply circuit which does not require trimming and prevents occurrence of deadlock of a band gap reference circuit. An RFID tag chip related to the...
US20070023884 Package  
The invention relates to a package, e.g. a blister package, comprising two spaced apart first and second walls formed and joined to each other to define a cavity between them, said walls having...
US20060289979 Bridge modules for smart labels  
The invention relates to module bridges for smart labels for positioning chip modules (5) on carries (12) and for the bridging connection of connection elements of the chip modules (5) to...
US20060273436 Arrangement, apparatus, and associated method, for providing stored data in secured form for purposes of identification and informational storage  
Card member apparatus, and an associated method, for storing and permitting selectable use of informational data associated with a subject. Identifying indicia stored at a first storage element,...
US20070200215 SMART CARD MODULE AND SUBSTRATE FOR A SMART CARD MODULE  
A chip card module including a substrate with a first side and an opposite second side. Contact areas are arranged on the first side, and a first conductor structure is arranged on the second...
US20050179122 IC card  
A reinforcing plate 11 is bonded to an IC chip 6 mounted on an IC module 2. Sealing resin 10 used for absorbing the impact on the IC chip 6 has the modulus of elasticity of 1 GPa or less and a...
US20100052128 DEVICE FOR DETECTING AN ATTACK AGAINST AN INTEGRATED CIRCUIT  
An integrated circuit including an intrusion attack detection device. The device includes a single-piece formed of a conductive material and surrounded with an insulating material and includes at...
US20070152071 Package method for flash memory card and structure thereof  
A package method for a flash memory card and structure thereof is disclosed. A plurality of independent memory card module substrates are arranged on the substrate and those memory card module...
US20070171076 LOW-FREQUENCY RADIO TAG ENCAPSULATING SYSTEM  
A sturdy radio tag has an antenna and semiconductor chip tuned to low frequency, encapsulated using a low-temperature, low-pressure, low-viscosity injection molding process.
US20100038763 Semiconductor structure with communication element  
In one embodiment, a structure includes a semiconductor chip including a communication element for performing a wireless communication function where the communication element has a communication...
US20060145323 Multi-chip package mounted memory card  
A multi-chip package mounted memory card includes at least one multi-chip package mounted on a printed circuit board, and card connectors connected to electrode terminals on the multi-chip package...
US20070241439 RFID package structure  
The present invention provides a radio frequency identification (RFID) package structure for improving a low data reading rate of the conventional RFID transponder structure to overcome the...
US20070108576 Packaging structure of RSMMC memory card  
The present invention provides a packaging structure of a RSMMC memory card. The packaging structure comprises a substrate having a plurality of integrated circuit (IC) devices and passive devices...
US20090108425 Stacked package and method of manufacturing the same  
In one embodiment, the stacked package includes a first chip disposed over a package substrate. The first chip has at least one first chip dummy pad, and the first chip dummy pad is not...
US20080251904 CURING LAYERS OF A SEMICONDUCTOR PRODUCT USING ELECTROMAGNETIC FIELDS  
A semiconductor product including a substrate, a semiconductor chip fitted to the substrate, and a layer, which contains coated particles, located adjacent to the semiconductor chip, wherein the...
US20080315383 CHIP FRAME FOR OPTICAL DIGITAL PROCESSOR  
A chip frame for an optical digital processor has a body with a concave seat integrally protruding downward from a bottom surface of the body. Multiple dents are defined on the bottom surface of...

Matches 1 - 50 out of 90 1 2 >