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Match Document Document Title
US20150158721 MEMS Device with Sealed Cavity and Release Chamber and Related Double Release Method  
Disclosed is a MEMS device having lower, upper and release chambers with a similar pressure and/or a similar gaseous chemistry. The MEMS device includes a top MEMS plate and a bottom MEMS plate....
US20060157838 Multimedia card and transfer molding method  
A semiconductor card is made using a method which, in one molding step, forms a plastic body on a substrate attached to a surrounding frame by narrow connecting segments spanning a peripheral...
US20070262429 Perimeter stacking system and method  
A stacked module employs flexible circuitry to connect CSP integrated circuits. A flexible circuit with obverse and reverse sides is disposed between two CSPs oriented face-to-face with the flex...
US20070187808 Customizable power and ground pins  
A configurable logic array composed of: a multiplicity of logic cells, each containing look-up tables, a multiplicity of customizable I/O cells, each containing a multiplicity of pads; and a...
US20050118447 Stiffener, a method of manufacturing a stiffener, and a semiconductor device with a stiffener  
The object of the present invention is to provide: a novel stiffener with superior cosmetic appearance and adhesive qualities and that is easy to make; a method for making the same; and a...
US20060199298 Creation of hermetically sealed dielectrically isolating trenches  
The invention relates to a method and an assembly for forming structures that are dielectrically insulated from each other by means of filled hermetically sealed isolation trenches for the...
US20070216004 BLANK INCLUDING A COMPOSITE PANEL WITH SEMICONDUCTOR CHIPS AND PLASTIC PACKAGE MOLDING COMPOUND AND METHOD AND MOLD FOR PRODUCING THE SAME  
A blank and a semiconductor device are include a composite panel with semiconductor chips embedded in a plastic package molding compound. The blank includes a composite panel with semiconductor...
US20070235848 Substrate having conductive traces isolated by laser to allow electrical inspection  
A semiconductor die substrate panel, and method of forming same, are disclosed wherein plating bars are severed for example by a laser after electroplating of the substrate. Severing the plating...
US20080222876 SYSTEM FOR ATTACHING ELECTRONIC COMPONENTS TO MOLDED INTERCONNECTION DEVICES  
A system for connecting electrical devices to one another is provided. This system includes a horizontal or non-horizontal substrate and an anchor connected to or formed integrally with the...
US20060157834 Plastic molding die  
A plastic molding die provided with a cavity where a plastic material is put in, wherein a part of an inner surface of the cavity is configured with an elastic body. A molding portion...
US20110006381 MEMS PACKAGE AND METHOD FOR THE PRODUCTION THEREOF  
An MEMS package is proposed, wherein a chip having MEMS structures on its top side is connected to a rigid covering plate and a frame structure, which comprises a polymer, to form a sandwich...
US20080005897 Flexible wiring sheet, display apparatus and manufacturing method thereof  
A flexible wiring sheet operable to electrically connect with an electronic apparatus includes a flexible sheet, a wiring line formed on the flexible sheet, an electric terminal which connects...
US20110012247 SOCKET TYPE MEMS BONDING  
A method for fabricating an integrated circuit device is disclosed. The method includes providing a first substrate; bonding a second substrate to the first substrate, the second substrate...
US20080001273 Semiconductor package having optimal interval between bond fingers for reduced substrate size  
A semiconductor package includes a semiconductor chip having a plurality of bonding pads, and a substrate having a first surface on which a plurality of bond fingers are arranged and a second...
US20080067652 INTEGRATED MEMS PACKAGING  
A micro-electromechanical systems (MEMS) package that includes a substrate onto which is disposed or otherwise formed an active MEMS device, a first barrier wall for preventing sealant from...
US20100001307 ENCAPSULATION FOR ELECTRONIC AND/OR OPTOELECTRONIC DEVICE  
A method of processing a flexible encapsulation scheme to encapsulate a flexible device, such as a display device in order to provide structural support for the display module. An upper...
US20070228538 INTEGRATED CIRCUIT DIE WITH PEDESTAL  
An integrated circuit die is provided having a body portion having a singulation side and a pedestal portion extending from the body portion and having a singulation side coplanar with the...
US20070252254 Molded SiP package with reinforced solder columns  
An integrated circuit, and a semiconductor die package formed therefrom, are disclosed including solder columns for adding structural support to the package during the fabrication process.
US20070117265 Semiconductor Device with Improved Stud Bump  
The objective of this invention is to provide a type of semiconductor device enabling highly reliable flip chip connection. Semiconductor chip for flip chip assembly has gold stud bumps on a...
US20080265387 SMUDGE RESISTANT COATING FOR ELECTRONIC DEVICE DISPLAYS  
An apparatus and method is provided for preventing smudges (608) including oils and dust from collecting on a portable electronic device display (110, 150, 200, 300). A plurality of islands (606)...
US20050082650 Integrated circuit packaging system  
A system may include an integrated circuit die, an integrated circuit package coupled to a first face of the integrated circuit die, mold compound in contact with the integrated circuit die and...
US20070210426 Gold-bumped interposer for vertically integrated semiconductor system  
A semiconductor system (100) enabled by an interposer (101) with non-reflow metal studs (251), preferably gold, coated with reflow metals (252), preferably solder. The studs are on exit ports...
US20070290305 Power Semiconductor Module and Fabrication Method Thereof  
An elastic printed board is provided so that stress applied by the silicon gel is absorbed by the printed board. Further, the printed board is formed to be so narrow that the stress may be...
US20060267171 Semiconductor device modules, semiconductor devices, and microelectronic devices  
Supports (40) of microelectronic devices (10) are provided with underfill apertures (60) which facilitate filling underfill gaps (70) with underfill material (74). The underfill aperture may have...
US20060145321 Microcomponent holder and method for manufacture thereof  
Provided is a microcomponent holder for retaining a micro-scale component. The microcomponent holder includes at least one aperture for receiving a micro-scale component therein. At least one...
US20070246812 High reliability power module  
A high reliability power module which includes a plurality of hermetically sealed packages each having electrical terminals formed from an alloy of tungsten copper and brazed onto a surface of a...
US20080230883 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOLDED STRIP PROTRUSION  
An integrated circuit package system includes an in-line strip, attaching an integrated circuit die over the in-line strip, and applying a molding material with a molded segment having a molded...
US20070152310 Electrical ground method for ball stack package  
A microelectronic package including a dielectric element with at least one conductive ground pad. The package may also include a microelectronic element with at least one ground contact exposed at...
US20050121757 Integrated circuit package overlay  
A system may include an integrated circuit package substrate, a plurality of integrated circuit die attached to the integrated circuit package substrate, and a stiffener strip attached to the...
US20100019364 SAW DEBRIS REDUCTION IN MEMS DEVICES  
An improved MEMS device and method of making. Channels are formed in a first substrate around a plurality of MEMS device areas previously formed on the first substrate. Then, a plurality of seal...
US20090160040 LOW TEMPERATURE CERAMIC MICROELECTROMECHANICAL STRUCTURES  
A method of providing microelectromechanical structures (MEMS) that are compatible with silicon CMOS electronics is provided. The method provides for processing and manufacturing is steps limiting...
US20060006510 Plastic encapsulated semiconductor device with reliable down bonds  
Plastic encapsulated semiconductor devices having elevated topographical features on the chip mount pad to control the extent of delamination at the plastic to substrate interface, thereby...
US20070045800 Opto-coupler with high reverse breakdown voltage and high isolation potential  
An opto-coupler and a process for fabricating an opto-coupler are disclosed. The opto-coupler includes at least one light-emitting diode and a photodiode for galvanically isolating electric...
US20070210427 Warp compensated package and method  
Methods and apparatus are provided for an electronic panel assembly (EPA) (82, 83), comprising: providing one or more electronic devices (30) with primary faces (31) having electrical contacts...
US20070052100 Spring clip for a portable electronic device  
A portable electronic device spring clip including a first retention section adapted to attach the spring clip to a framework; a second retention section adapted to be located at a top side of a...
US20060055012 LED package with zener diode protection circuit  
A light emitting diode (LED) package is fabricated with protection circuit against static electricity. The protection circuit includes series connection of more than one Zener diodes which limit...
US20060220198 Semiconductor integrated circuit (IC) packaging with carbon nanotubes (CNT) to reduce IC/package stress  
A packaged integrated circuit (IC) is described having an integrated circuit that is electrically coupled to its package's wiring with Carbon nanotubes (CNTs) placed within an electrically...
US20140332945 Method of Etching a Wafer  
A method of etching a plurality of cavities in a wafer provides a wafer having a patterned hard mask layer. The patterned hard mask has open areas defining locations for first cavities and second...
US20100207261 CHIP ATTACH ADHESIVE TO FACILITATE EMBEDDED CHIP BUILD UP AND RELATED SYSTEMS AND METHODS  
Present embodiments are directed to an adhesive and method for assembling a chip package. The adhesive may be used to couple a chip to a substrate, and the adhesive may include an epoxy-based...
US20050161778 Power module and power module assembly  
The one-piece power module (12) comprises at least one cut-out metal trace (14), at least one electronic power component (16) electrically connected to the cut-out metal trace, and an electrically...
US20070241438 Strip format of package board and array of the same  
Disclosed herein is a strip format of a semiconductor package board and an array thereof, in which a dummy area of the strip format of the semiconductor package board is formed into a...
US20050224935 Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages  
Organic electronic packages having sealed edges. More specifically, packages having organic electronic devices are provided. A number of sealing mechanisms are provided to hermetically seal the...
US20060091510 Probe card interposer  
A probe card interposer includes a substrate with a plurality of conductive bumps disposed on first surface of the substrate. Each conductive bump comprises a dielectric core and a plurality of...
US20060087883 Anti-tamper module  
An anti-tamper module is provided for protecting the contents and functionality of an integrated circuit incorporated in the module. The anti-tamper module is arranged in a stacked configuration...
US20050253236 Semiconductor device capable of being connected to external terminals by wire bonding in stacked assembly  
A semiconductor device includes a rectangular chip having four sides, wires connected respectively to different external terminals, and a bonding pad disposed along one of the four sides of the...
US20100090714 SENSING CIRCUIT FOR DEVICES WITH PROTECTIVE COATING  
An integrated circuit has an inhomogeneous protective layer or coating over a circuit to be protected, and a sensing circuit (80) arranged to sense a first impedance of a part of the protective...
US20090045494 METHOD FOR MANUFACTURING A MICROELECTRONIC PACKAGE  
The invention relates to a method of packaging an electronic microsystem (200) and further to such a packaged device. With the method a packaged electronic microsystem (200) can be manufactured...
US20060076690 Stacked Die Module  
Semiconductor dies are stacked offset from one another so that terminals located along two edges of each die are exposed. The two edges of the dies having terminals may be oriented in the same...
US20090152698 INTEGRATED MATCHING NETWORKS AND RF DEVICES THAT INCLUDE AN INTEGRATED MATCHING NETWORK  
An integrated matching network includes a first die on a substrate, a second die on the substrate, and a metallization layer on the first and second dies. The second die has a capacitance, the...
US20060211167 METHODS AND SYSTEMS FOR IMPROVING MICROELECTRONIC I/O CURRENT CAPABILITIES  
Disclosed are microelectronic structures based on improved design and material combinations to provide improved current capabilities per I/O. The preferred embodiment of the invention uses a...

Matches 1 - 50 out of 342 1 2 3 4 5 6 7 >