Matches 1 - 50 out of 275 1 2 3 4 5 6 >


Match Document Document Title
US20060216860 Flip chip interconnection having narrow interconnection sites on the substrate  
A flip chip interconnect of a die on a substrate is made by mating the interconnect bump onto a narrow interconnect pad on a lead or trace, rather than onto a capture pad. The width of the narrow...
US20070164412 METHOD OF WIRE BONDING OVER ACTIVE AREA OF A SEMICONDUCTOR CIRCUIT  
A method and structure are provided to enable wire bond connections over active and/or passive devices and/or low-k dielectrics, formed on an Integrated Circuit die. A semiconductor substrate...
US20060076661 Attachment of integrated circuit structures and other substrates to substrates with vias  
Vias (210, 210B) are formed in a surface of a substrate. At least portions of contact pads (139, 350) are located in the vias. Contact pads (150, 340) of an integrated circuit structure are...
US20050224940 Method for maintaining solder thickness in flipchip attach packaging processes  
A packaging assembly for semiconductor devices and a method for making such packaging is described. The invention provides a non-Pb bump design during a new flip-chip method of packaging. The...
US20050082654 Structure and self-locating method of making capped chips  
A method of making the lidded chip assembly are provided which includes the steps of: (a) aligning a lid member with a chip member including one or more chips so that electrically conductive...
US20070235852 METHOD AND SYSTEM FOR SEALING PACKAGES FOR OPTICS  
A system for wafer-level packaging of a plurality of MEMS devices includes a substrate having a plurality of individual chips. Each of the plurality of individual chips includes a plurality of...
US20070018294 Packaging for high speed integrated circuits  
An integrated circuit package comprises an integrated circuit die comprising N pads, where N is an integer greater than one. A lead frame comprising N adjacent leads. N connections individually...
US20070018293 Packaging for high speed integrated circuits  
An integrated circuit package comprises an integrated circuit die comprising N adjacent pads, where N is an integer greater than three. A lead frame comprises first, second, third and fourth leads...
US20050218494 Semiconductor device, a method of manufacturing the same and an electronic device  
A novel semiconductor device high in both heat dissipating property and connection reliability in mounting is to be provided. The semiconductor device comprises a semiconductor chip, a resin...
US20070096277 Packaging for high speed integrated circuits  
An integrated circuit package comprises an integrated circuit die comprising at least four pads that at least one of transmit and receive differential signals. A lead frame comprising at least...
US20050156297 Semiconductor package including flex circuit, interconnects and dense array external contacts  
A chip scale semiconductor package and a method for fabricating the package are provided. The package includes a semiconductor die and a flex circuit bonded to the face of the die. The flex...
US20050127486 Chip-scale package and carrier for use therewith  
A carrier for use in a chip-scale package includes a film with at least one aperture defined therethrough. The aperture, which is alignable with a corresponding bond pad of a semiconductor device...
US20060237832 Standoffs for centralizing internals in packaging process  
A semiconductor device, semiconductor die package, mold tooling, and methods of fabricating the device and packages are provided. In one embodiment, the semiconductor device comprises a pair of...
US20060138649 Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package  
A semiconductor multi-package module has stacked lower and upper packages, each of which includes a die attached to a substrate, in which the second package is inverted, and in which the first and...
US20060033190 Vertically mountable and alignable semiconductor device packages and assemblies including the same  
A semiconductor device package includes a die, a package encapsulating at least a portion of the die, and a plurality of leads. Each lead of the plurality includes an external portion. The...
US20060033188 Electronic component packaging  
One embodiment of an electronic component packaging system includes a base adapted for supporting an electronic component and including a mechanically planarized sealing surface, and a lid...
US20060267171 Semiconductor device modules, semiconductor devices, and microelectronic devices  
Supports (40) of microelectronic devices (10) are provided with underfill apertures (60) which facilitate filling underfill gaps (70) with underfill material (74). The underfill aperture may have...
US20060189030 Heat shrinkable insulated packaging  
A method for preparing an insulating packaging material for a container is disclosed. A first layer of insulating material can be placed around a container, a second layer of heat-shrinkable...
US20050214973 Semiconductor device and manufacturing method thereof  
In manufacturing a semiconductor device, the first gettering layer is formed on the backside of a wafer, and the second gettering layers are then formed on the backside and side surfaces of a...
US20050040505 Substantially hermetic packages for semiconductor devices and substantially hermetically packaged, semiconductor devices  
A package for a semiconductor device includes a plurality of adjacent, mutually adhered regions of substantially hermetic packaging material, such as thermoplastic glass, other types of glass,...
US20060267169 Image sensitive electronic device packages  
The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the...
US20060157838 Multimedia card and transfer molding method  
A semiconductor card is made using a method which, in one molding step, forms a plastic body on a substrate attached to a surrounding frame by narrow connecting segments spanning a peripheral...
US20050067681 Package having integral lens and wafer-scale fabrication method therefor  
A covered chip having an optical element integrated in the cover is provided which includes a chip having a front surface, an optically active circuit area, and bond pads disposed at the front...
US20050023663 Method of forming a package  
A method of forming a package. The method includes attaching a device to a baseplate to form a subassembly, and placing the subassembly into an opening defined by a cover that includes a plastic...
US20070158799 Interconnected IC packages with vertical SMT pads  
An electronic component is disclosed including a plurality of semiconductor packages soldered together in a side-by-side configuration. The packages are batch processed on a substrate panel. The...
US20050184375 Electronic device configured as a multichip module, leadframe and panel with leadframe positions  
An electronic device has, as a multichip module, two or more semiconductor chips that are integrated into a leadframe such that a placement side of the leadframe and the active top sides of the...
US20080079129 Shape memory based mechanical enabling mechanism  
Semiconductor packages and methods to fabricate thereof are described. A decoupling assembly is disposed between a package substrate and a circuit board. The decoupling assembly engages in...
US20070018292 Packaging for high speed integrated circuits  
An integrated circuit package comprises an integrated circuit die comprising a first pad, a second pad adjacent to the first pad, a third pad adjacent to the second pad, and a fourth pad adjacent...
US20060145319 Flip chip contact (FCC) power package  
This invention discloses a power device package for containing, protecting and providing electrical contacts for a power transistor. The power device package includes a top and bottom lead frames...
US20120139097 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME  
Provided are a semiconductor package and a method of manufacturing the semiconductor package. The semiconductor package may include a circuit substrate, a semiconductor chip mounted on the circuit...
US20080067650 Electronic component package with EMI shielding  
An electronic component package having an EMI shielded space is disclosed. The package comprises a substrate having an electronic component located on its surface and a conductive enclosure having...
US20140264808 CHIP ARRANGEMENTS, CHIP PACKAGES, AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT  
A chip arrangement may include a semiconductor chip; an encapsulation layer at least partially encapsulating the semiconductor chip, the encapsulation layer having a receiving region configured to...
US20080002460 Structure and method of making lidded chips  
Methods are provided for fabricating packaged chips, each packaged chip having a protective layer, e.g., a transparent lid, metallic enclosure layer, shield layer, etc., and methods are provided...
US20060278965 Hermetically sealed package and methods of making the same  
Hermetically sealed packages having organic electronic devices are presented. A number of sealing mechanisms are provided to hermetically seal the package to protect the organic electronic device...
US20060170086 Semiconductor package and method of manufacturing the same  
Disclosed herein are a semiconductor package used in digital optical instruments and a method of manufacturing the same. The semiconductor package comprises a wafer made of a silicon material and...
US20060237831 Semiconductor device and electronic device  
This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise...
US20130241044 SEMICONDUCTOR PACKAGE HAVING PROTECTIVE LAYER AND METHOD OF FORMING THE SAME  
According to example embodiments, a semiconductor package includes a first semiconductor chip is on a first substrate, a protective layer directly on the first semiconductor chip, and an...
US20100187668 NOVEL BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING SAME  
A device is disclosed which includes, in one illustrative example, an integrated circuit die having an active surface and a molded body extending around a perimeter of the die, the molded body...
US20070063324 Structure and method for reducing warp of substrate  
A warp reducing member is bonded to an area on one surface of the substrate corresponding to other side of an electronic part for which the warp is to be reduced with respect to a substrate. An...
US20060043549 Micro-electronic package structure and method for fabricating the same  
A micro-electronic package structure and a method for fabricating the same are proposed. A carrier is prepared and provided with a cavity for receiving at least one semiconductor chip having a...
US20060180907 Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectonic devices  
Packaged microelectronic devices, interconnecting units for packaged microelectronic devices, and methods and apparatuses for packaging microelectronic devices with pressure release elements. In...
US20060118933 Stackable frames for packaging microelectronic devices  
A frame is provided for packaging a microelectronic device. The frame is formed from a unitary member, electrically conductive device-attachable pads, and terminals in electrical communication...
US20050253236 Semiconductor device capable of being connected to external terminals by wire bonding in stacked assembly  
A semiconductor device includes a rectangular chip having four sides, wires connected respectively to different external terminals, and a bonding pad disposed along one of the four sides of the...
US20050186761 Group encapsulated dicing chuck  
A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades....
US20050167806 Method and apparatus for providing an integrated circuit cover  
An integrated circuit cover incorporating a spring portion is described. The spring portion may include any structure that allows displacement between a plate portion of the integrated circuit...
US20070290307 Light emitting diode module  
A light emitting diode (LED) module includes a circuit substrate and a plurality of LED dies. The circuit substrate sequentially includes a metal layer, a first dielectric layer and an...
US20070249102 PANEL AND SEMICONDUCTOR DEVICE HAVING A STRUCTURE WITH A LOW-K DIELECTRIC  
A panel and a semiconductor device, in one embodiment composed of a composite plate with semiconductor chips and plastic housing composition and to a method for producing the same is disclosed....
US20070252257 SEMICONDUCTOR PACKAGE STRUCTURES HAVING HEAT DISSIPATIVE ELEMENT DIRECTLY CONNECTED TO INTERNAL CIRCUIT AND METHODS OF FABRICATING THE SAME  
In one embodiment, a semiconductor package structure includes a heat dissipative element connected to an internal circuit. The semiconductor package includes a semiconductor chip, an...
US20070148817 Methods for fabricating reinforced, self-aligning conductive structures for semiconductor device components  
A method for fabricating an electrical interconnection element, or conductive structure, includes disposing a jacket of a first member of the electrical interconnection element laterally around a...
US20070114643 MEMS FLIP-CHIP PACKAGING  
Packaging of MEMS and other devices, and in some cases, devices that have vertically extending structures. Robust packaging solutions for such devices are provided, which may result in superior...

Matches 1 - 50 out of 275 1 2 3 4 5 6 >