Matches 1 - 13 out of 13


Match Document Document Title
US20090014855 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME  
A semiconductor integrated circuit device includes a die pad and a semiconductor chip mounted over the die pad, having a main surface with surface electrodes and a back surface. Suspension leads...
US20080087996 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME  
An object of the invention is to improve a reliability of a semiconductor device. The semiconductor device comprises a semiconductor chip, a tab having an outside dimension smaller than that of...
US20130341780 CHIP ARRANGEMENTS AND A METHOD FOR FORMING A CHIP ARRANGEMENT  
A chip arrangement is provided. The chip arrangement including: a chip including at least one electrically conductive contact; a passivation material formed over the at least one electrically...
US20120313234 QFN PACKAGE AND MANUFACTURING PROCESS THEREOF  
The present invention provides a Quad Flat Non-leaded (QFN) package, which comprises a chip, a lead frame, a plurality of composite bumps and an encapsulant. The chip has a plurality of pads, and...
US20080290487 LEAD FRAME FOR SEMICONDUCTOR DEVICE  
A lead frame for a semiconductor device includes at least one row of contact terminals and a die pad for receiving an integrated circuit die. An isolation material is located between the contact...
US20080083973 Lead frame for an optical semiconductor device, optical semiconductor device using the same, and manufacturing method for these  
There is provided a lead frame for an optical semiconductor device, an optical semiconductor device using such lead frame, and a manufacturing method for these, where the optical semiconductor...
US20080122050 Semiconductor Device And Production Method For Semiconductor Device  
A power semiconductor device in which a semiconductor element is die-mount-connected onto a lead frame in a Pb-free manner. In a die-mount-connection with a large difference of thermal expansion...
US20090051022 LEAD FRAME STRUCTURE  
A lead frame structure includes a lead frame, a partial plated portion, a semiconductor element, a Pb-free solder and a mold resin. The partial plated portion is formed on a part of a surface of...
US20100187651 INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THE SAME  
Aspects of the invention are directed towards an integrated circuit package and method of forming the same, and more particularly to a redistributed chip packaging for an integrated circuit. The...
US20080150108 SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME  
A semiconductor package includes: a semiconductor chip and a plurality of frames. A plurality of electrodes are formed on a surface of the semiconductor chip. The plurality of frames are connected...
US20140001622 CHIP PACKAGES, CHIP ARRANGEMENTS, A CIRCUIT BOARD, AND METHODS FOR MANUFACTURING CHIP PACKAGES  
A chip package is provided, the chip package including: a chip carrier; a chip disposed over and electrically connected to a chip carrier top side; an electrically insulating material disposed...
US20080079128 LEAD FRAME TYPE STACK PACKAGE AND METHOD O FABRICATING THE SAME  
A lead frame type stack package in which a lead of the package is well connected to a semiconductor module, and a method of fabricating the same are provided. A lead of an upper package and a lead...
US20070085179 Automotive plastic lead frame sensor  
A plastic lead frame, electrical component system, and method using plastic-injection, plating, and known photolithography techniques are disclosed. The plastic lead frame and electrical component...

Matches 1 - 13 out of 13