|
Match
|
Document |
Document Title |
|
|
US20090014855 |
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor integrated circuit device includes a die pad and a semiconductor chip mounted over the die pad, having a main surface with surface electrodes and a back surface. Suspension leads... |
|
|
US20080087996 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
An object of the invention is to improve a reliability of a semiconductor device. The semiconductor device comprises a semiconductor chip, a tab having an outside dimension smaller than that of... |
|
|
US20130341780 |
CHIP ARRANGEMENTS AND A METHOD FOR FORMING A CHIP ARRANGEMENT
A chip arrangement is provided. The chip arrangement including: a chip including at least one electrically conductive contact; a passivation material formed over the at least one electrically... |
|
|
US20120313234 |
QFN PACKAGE AND MANUFACTURING PROCESS THEREOF
The present invention provides a Quad Flat Non-leaded (QFN) package, which comprises a chip, a lead frame, a plurality of composite bumps and an encapsulant. The chip has a plurality of pads, and... |
|
|
US20080290487 |
LEAD FRAME FOR SEMICONDUCTOR DEVICE
A lead frame for a semiconductor device includes at least one row of contact terminals and a die pad for receiving an integrated circuit die. An isolation material is located between the contact... |
|
|
US20080083973 |
Lead frame for an optical semiconductor device, optical semiconductor device using the same, and manufacturing method for these
There is provided a lead frame for an optical semiconductor device, an optical semiconductor device using such lead frame, and a manufacturing method for these, where the optical semiconductor... |
|
|
US20080122050 |
Semiconductor Device And Production Method For Semiconductor Device
A power semiconductor device in which a semiconductor element is die-mount-connected onto a lead frame in a Pb-free manner. In a die-mount-connection with a large difference of thermal expansion... |
|
|
US20090051022 |
LEAD FRAME STRUCTURE
A lead frame structure includes a lead frame, a partial plated portion, a semiconductor element, a Pb-free solder and a mold resin. The partial plated portion is formed on a part of a surface of... |
|
|
US20100187651 |
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THE SAME
Aspects of the invention are directed towards an integrated circuit package and method of forming the same, and more particularly to a redistributed chip packaging for an integrated circuit. The... |
|
|
US20080150108 |
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
A semiconductor package includes: a semiconductor chip and a plurality of frames. A plurality of electrodes are formed on a surface of the semiconductor chip. The plurality of frames are connected... |
|
|
US20140001622 |
CHIP PACKAGES, CHIP ARRANGEMENTS, A CIRCUIT BOARD, AND METHODS FOR MANUFACTURING CHIP PACKAGES
A chip package is provided, the chip package including: a chip carrier; a chip disposed over and electrically connected to a chip carrier top side; an electrically insulating material disposed... |
|
|
US20080079128 |
LEAD FRAME TYPE STACK PACKAGE AND METHOD O FABRICATING THE SAME
A lead frame type stack package in which a lead of the package is well connected to a semiconductor module, and a method of fabricating the same are provided. A lead of an upper package and a lead... |
|
|
US20070085179 |
Automotive plastic lead frame sensor
A plastic lead frame, electrical component system, and method using plastic-injection, plating, and known photolithography techniques are disclosed. The plastic lead frame and electrical component... |