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US20130001762 Semiconductor Device and Method of Using Leadframe Bodies to Form Openings Through Encapsulant for Vertical Interconnect of Semiconductor Die  
A semiconductor device has a leadframe with a plurality of bodies extending from the base plate. A first semiconductor die is mounted to the base plate of the leadframe between the bodies. An...
US20060138619 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication  
A conductive plastic lead frame and method of manufacturing the same, suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead...
US20070057354 Multi-part lead frame with dissimilar materials  
A multi-part lead frame semiconductor device assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame....
US20060125065 Multi-part lead frame with dissimilar materials  
A multi-part lead frame semiconductor device assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame....
US20160276253 SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME AND A MOUNTING STRUCTURE OF A SEMICONDUCTOR DEVICE  
The semiconductor device includes a tab including a chip supporting surface, and a back surface opposite to the chip supporting surface; a plurality of suspension leads supporting the tab; a...
US20150155226 MICROELECTRONIC FLIP CHIP PACKAGES WITH SOLDER WETTING PADS AND ASSOCIATED METHODS OF MANUFACTURING  
Processes of assembling microelectronic packages with lead frames and/or other suitable substrates are described herein. In one embodiment, a method for fabricating a semiconductor assembly...
US20130207252 Semiconductor Device  
To actualize a reduction in the on-resistance of a small surface mounted package having a power MOSFET sealed therein. A silicon chip is mounted on a die pad portion integrated with leads...
US20090230524 SEMICONDUCTOR CHIP PACKAGE HAVING GROUND AND POWER REGIONS AND MANUFACTURING METHODS THEREOF  
A semiconductor package and related methods are described. In one embodiment the semiconductor package includes a die pad, a plurality of leads, a semiconductor chip, and a package body. The die...
US20070114642 Semiconductor device having a heat spreader exposed from a seal resin  
A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a...
US20080150064 Plastic electronic component package  
A plastic package for an image sensor or other electronic component which comprises a plastic body, preferably of LCP material, molded around a leadframe and defining a cavity in which the image...
US20050093172 Electronic circuit device, and method and apparatus for manufacturing the same  
An electronic circuit device has a substrate having a wiring pattern, an electronic component electrically connected to a terminal section of the wiring pattern by contacting a projection...
US20160329306 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF  
A semiconductor package and a manufacturing method thereof are provided. The package element has a first insulating layer, and a plurality of holes are disposed on the first surface of the first...
US20120273932 POWER SUPPLY MODULE AND PACKAGING AND INTEGRATING METHOD THEREOF  
A power supply module and a packaging and integrating method thereof are provided. The power supply module includes a lead frame, a passive element, an integrated circuit (IC), and a power switch...
US20150279782 SEMICONDUCTOR DEVICE  
A semiconductor device is disclosed. One embodiment includes a carrier, a semiconductor chip attached to the carrier, a first conducting line having a first thickness and being deposited over the...
US20110089549 SEMICONDUCTOR DEVICE  
A semiconductor device comprises a lead frame having a die pad portion or a circuit board, one or more semiconductor elements mounted on the die pad portion of the lead frame or on the circuit...
US20110057298 Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging  
A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging lead-count, wherein the method lends itself to better automation of the manufacturing...
US20100258921 ADVANCED QUAD FLAT-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF  
The advanced quad flat non-leaded package structure includes a carrier, a chip, a plurality of wires, and a molding compound. The carrier includes a die pad and a plurality of leads. The inner...
US20090096073 SEMICONDUCTOR DEVICE AND LEAD FRAME USED FOR THE SAME  
A lead frame includes a first outer lead portion and a second outer lead portion which is arranged to oppose to the first outer lead portion with an element-mounting region between them. An inner...
US20140035115 SEMICONDUCTOR DEVICE  
A semiconductor device includes any one of a lead frame having a die pad portion and a circuit board, one or more semiconductor elements, a copper wire, an encapsulating member. The one or more...
US20070057353 Multi-part lead frame with dissimilar materials  
A multi-part lead frame semiconductor device assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame....
US20060113645 Microelectronic assemblies incorporating inductors  
Inductors are provided in chip assemblies such as in packaged semiconductor chips. The inductors may be incorporated in a chip carrier which forms part of the package, and may include, for...
US20050001295 Adhesion enhanced semiconductor die for mold compound packaging  
A semiconductor die includes a metal layer deposited thereon for enhancing adhesion between the die and a mold compound package. The metal layer is substantially oxide free. The die is coated with...
US20090057855 SEMICONDUCTOR DIE PACKAGE INCLUDING STAND OFF STRUCTURES  
A semiconductor die package. It includes a semiconductor die including a first surface and a second surface opposite the first surface, an optional conductive structure, and a leadframe structure....
US20080261039 Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor Device  
An adhesive sheet comprising a release substrate 10, a substrate film 14, and a first tacky-adhesive layer 12 placed between the release substrate 10 and the substrate film 14, wherein an annular...
US20080006916 Method of Manufacturing a Semiconductor Device  
The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of...
US20130154074 SEMICONDUCTOR STACK PACKAGES AND METHODS OF FABRICATING THE SAME  
Semiconductor chip stacks are provided. The semiconductor chip stack includes a semiconductor chip stack including a plurality of first semiconductor chips vertically stacked on a top surface of...
US20130256863 EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE  
A highly reliable semiconductor device with the improved humidity resistance reliability is disclosed. A disclosed epoxy resin composition for semiconductor encapsulation encapsulates, in the...
US20150123255 METHOD FOR MANUFACTURING A CHIP ARRANGEMENT, AND CHIP ARRANGEMENT  
A method for manufacturing a chip arrangement in accordance with various embodiments may include: placing a chip on a carrier within an opening of a metal structure disposed over the carrier;...
US20100019362 ISOLATED STACKED DIE SEMICONDUCTOR PACKAGES  
Semiconductor packages that contain isolated stacked dies and methods for making such devices are described. The semiconductor package contains both a first die with a first integrated circuit and...
US20090309201 LEAD FRAME, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING LEAD FRAME AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE  
A lead frame has a die pad on which a semiconductor chip is mounted, a plurality of leads, a first recess provided so as to sink in from the front surface of the die pad, and second recesses and...
US20070200210 Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages  
Methods and apparatus for improved thermal performance and electromagnetic interference (EMT) shielding in integrated circuit (IC) packages is described. A die-up or die-down package includes a...
US20050116322 Circuit module  
A circuit module of the present invention has leads serving as terminals for performing electrical input from, and output to exterior, a circuit device in which a first circuit element...
US20120001311 PACKAGE FOR SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE  
In a package for a semiconductor device according to the present invention, steps 10 are provided at least on the sides of lead frames 1 and 2 at exposed portions in the opening of a resin part 3,...
US20110291254 SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH PROJECTING BUMPS OR BALLS  
Embodiments of the present invention relate to semiconductor device packages featuring encapsulated leadframes in electrical communication with at least one die through electrically conducting...
US20050263873 Interposer substrate, semiconductor package and semiconductor device, and their producing methods  
A semiconductor package comprises a semiconductor chip, an interposer substrate, a plurality of unfilled end face through holes arrayed at the periphery of the semiconductor package, a plurality...
US20050098863 Lead frame and method for fabricating semiconductor package employing the same  
A lead frame and a method of fabricating a semiconductor package including the lead frame, where the lead frame includes a die pad, a tie bar supporting the die pad, and a plurality of leads. The...
US20170069564 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME  
Disclosed herein is a wire-bonding type semiconductor package in which a fan out metal pattern is formed and a method of manufacturing the same. The semiconductor package includes a frame...
US20140167237 POWER MODULE PACKAGE  
Disclosed herein is a power module package, including: a substrate; semiconductor chips mounted on one surface of the substrate; external connection terminals connected to one surface of the...
US20080251902 Plastic package and method of fabricating the same  
A plastic package includes a plurality of terminal members each having an outer terminal, an inner terminal, and a connecting part connecting the outer and the inner terminal; a semiconductor...
US20080079127 Pin Array No Lead Package and Assembly Method Thereof  
A microelectronics package comprising: a die, a lead frame comprising: a substrate having a first side and a second side, an array of contacts positioned on the first side and the second side, and...
US20070226996 HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME  
An object of the present invention is to provide a method of manufacturing a hybrid integrated circuit device, in which multiple circuit boards are manufactured from one large metal board by...
US20050242417 Semiconductor chip package and method for manufacturing the same  
A semiconductor chip package may have through holes extending from a chip contact surface of a film type die attaching material to a second surface of a die pad. A resin encapsulant may extend...
US20150054146 SEMICONDUCTOR DEVICE  
A semiconductor device of the present invention includes a semiconductor element having an electrode pad; a substrate over which the semiconductor element is mounted and which has an electrical...
US20130001761 LEAD CARRIER WITH THERMALLY FUSED PACKAGE COMPONENTS  
A lead carrier provides support for a semiconductor device during manufacture. The lead carrier includes a temporary support member with multiple package sites. Each package site includes a die...
US20060255449 Lid used in package structure and the package structure having the same  
The present invention relates to a lid and a package structure having the same. The package structure comprises a first substrate, a first chip, a lid and a second package. The first chip is...
US20050146002 Multi-part lead frame with dissimilar materials  
A multi-part lead frame semiconductor device assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame....
US20110012245 SEMICONDUCTOR DEVICE  
There is provided a semiconductor device adopting, as a layout of pads connected to an external package on an LSI, a zigzag pad layout in which the pads are arranged shifted alternately, which can...
US20110291111 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD  
A chip size package includes: a radio frequency substrate having a radio frequency semiconductor circuit formed on a principal surface; a semiconductor cover substrate arranged at a position...
US20070257343 DIE-ON-LEADFRAME (DOL) WITH HIGH VOLTAGE ISOLATION  
A high voltage semiconductor module has a leadframe with spaced pads which is connected to a heat sink plate by a curable insulation layer on the top of the plate. Semiconductor die may be...
US20060249823 SEMICONDUCTOR PACKAGE HAVING ULTRA-THIN THICKNESS AND METHOD OF MANUFACTURING THE SAME  
A semiconductor package having an ultra thin thickness and a method of manufacturing the same are provided. The ultra thin semiconductor package comprises a circuit board in which a through hole...

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