Matches 1 - 50 out of 220 1 2 3 4 5 >


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US20130187252 BONDPAD INTEGRATED THEROMELECTRIC COOLER  
An integrated circuit has thermoelectric cooling devices integrated into bondpads. A method for operating the integrated circuit includes turning a thermal switch to a thermoelectric cooler...
US20130264610 TEMPERATURE STABILITIZED MEMS  
A semiconductor device with temperature control system. Embodiments of the device may include a MEMS chip including a first heater with a dedicated first temperature control loop and a CMOS chip...
US20150137303 MECHANISMS FOR FORMING MICRO-ELECTRO MECHANICAL DEVICE  
Embodiments of mechanisms for forming a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a substrate and a MEMS sensor over the substrate. The MEMS sensor...
US20060163685 THERMO-MECHANICAL CLEAVABLE STRUCTURE  
A thermo-mechanical cleavable structure is provided and may be used as a programmable fuse for integrated circuits. As applied to a programmable fuse, the thermo-mechanical cleavable structure...
US20120261785 SHARED MEMBRANE THERMOPILE SENSOR ARRAY  
A thermopile sensor array is provided. The thermopile sensor array may include multiple pixels formed by multiple thermopiles arranged on a single common shared support membrane. A separation...
US20150054114 VERTICALLY STACKED THERMOPILE  
A vertically stacked thermopile and an IR sensor using said stacked thermopiles are provided. The vertically stacked thermopile may include multiple thermocouples stacked vertically on one...
US20120012966 MULTI-CAVITY OPTICAL SENSING AND THERMOPILE INFRARED SENSING SYSTEM  
The present invention discloses a multi-cavity optical sensing and thermopile infrared sensing system, which comprises an optical sensing part, a dielectric layer, a plurality of optical cavities,...
US20130069194 GRAPHENE-BASED THERMOPILE  
Graphene-based thermopiles are provided. The graphene-based thermopiles may include thermocouples having one or more graphene strips that may be polarized to adjust their Seebeck coefficients. The...
US20130292789 Optically Transitioning Thermal Detector Structures  
A thermal absorption structure of a radiation thermal detector element may include an optically transitioning material configured such that optical conductivity of the thermal absorption structure...
US20120319226 FABRICATION OF ROBUST ELECTROTHERMAL MEMS WITH FAST THERMAL RESPONSE  
Embodiments of the invention provide robust electrothermal MEMS with fast thermal response. In one embodiment, an electrothermal bimorph actuator is fabricated using aluminum as one bimorph layer...
US20130334646 METALLIC THERMAL SENSOR FOR IC DEVICES  
A thermal sensor for use in an IC device is formed of a plurality of metal resistor units connected in series where each of the plurality of metal resistor units are formed on different wiring...
US20110095390 THERMOELECTRIC CONVERSION MATERIAL AND THERMOELECTRIC CONVERSION ELEMENT  
The present invention provides a thermoelectric conversion material composed of an oxide material represented by chemical formula A0.8-1.2Ta2O6-y, where A is calcium (Ca) alone or calcium (Ca) and...
US20140092939 Thermal Sensor with Second-Order Temperature Curvature Correction  
Some embodiments of the present disclosure relate to a stacked integrated chip structure having a thermal sensor that detects a temperature of one or a plurality of integrated chips. In some...
US20110210415 FREESTANDING CARBON NANOTUBE NETWORKS BASED TEMPERATURE SENSOR  
The present invention introduces a small-size temperature sensor, which exploits a random or oriented network of un-functionalized, single or multi-walled, carbon nanotubes to monitor a wide range...
US20060170070 Cover, in particular for inscription fields  
The invention relates to a cover, in particular for covering inscription fields, comprising a cover element which is provided for insertion into a base body which is in the form of a holder, with...
US20130062722 CHIP MODULE AND A METHOD FOR MANUFACTURING A CHIP MODULE  
In various embodiments, a chip module may include a first chip; and a leadframe with a first leadframe area and a second leadframe area, wherein the first leadframe area is electrically insulated...
US20150168221 BLACK SILICON-BASED HIGH-PERFORMANCE MEMS THERMOPILE IR DETECTOR AND FABRICATION METHOD  
This invention involves structure and fabrication method of a black silicon-based MEMS thermopile IR detector. The high-performance black silicon-based MEMS thermopile IR detector includes a...
US20130020670 TEMPERATURE SENSOR ELEMENT, METHOD FOR MANUFACTURING SAME, AND TEMPERATURE SENSOR  
A temperature sensing element includes a thermistor composed of Si-base ceramics and a pair of metal electrodes bonded onto the surfaces of the thermistor. The metal electrodes contain Cr and a...
US20130082345 Hybrid FPA for Thz imaging with an antenna array, coupled to CMOS-MEMS thermal sensors, implementing per-pixel ES actuation and enabling tuning, correlated double sampling and AM modulation  
A THz radiation detector comprising a vertical antenna separated from a suspended platform by an isolating thermal air gap for concentrating THz radiation energy into a smaller suspended MEMS...
US20150137304 STRUCTURE AND FABRICATION METHOD OF A HIGH PERFORMANCE MEMS THERMOPILE IR DETECTOR  
The invention involves structure and fabrication method of a high performance IR detector. The structure comprises a substrate; a releasing barrier band on the substrate; a thermal isolation...
US20100122976 THERMISTOR WITH 3 TERMINALS, THERMISTOR-TRANSISTOR, CIRCUIT FOR CONTROLLING HEAT OF POWER TRANSISTOR USING THE THERMISTOR-TRANSISTOR, AND POWER SYSTEM INCLUDING THE CIRCUIT  
Provided are a thermistor with 3 terminals, a thermistor-transistor including the thermistor, a circuit for controlling heat of a power transistor using the thermistor-transistor, and a power...
US20140252531 SYSTEMS AND METHODS FOR HARVESTING DISSIPATED HEAT FROM INTEGRATED CIRCUITS (ICS) IN ELECTRONIC DEVICES INTO ELECTRICAL ENERGY FOR PROVIDING POWER FOR THE ELECTRONIC DEVICES  
Systems and methods for harvesting dissipated heat from integrated circuits (ICs) in electronic devices into electrical energy for providing power for the electronic devices are disclosed. In one...
US20120161273 THERMOELECTRIC CONVERSION MATERIAL  
A thermoelectric conversion material is provided, in which only a desired crystal is selectively precipitated. An MxV2O5 crystal is selectively precipitated in vanadium-based glass, wherein M is...
US20120228733 MEMS-BASED GETTER MICRODEVICE  
A MEMS (micro-electro-mechanical system) getter microdevice for controlling the ambient pressure inside the hermetic packages that enclose various types of MEMS, photonic, or optoelectronic...
US20140015088 THREE-DIMENSIONAL INTEGRATED STRUCTURE CAPABLE OF DETECTING A TEMPERATURE RISE  
A three-dimensional integrated structure is formed from a first integrated circuit with a first cavity filled with a first conductive material and a second integrated circuit with a second cavity...
US20110166045 WAFER SCALE PLASMONICS-ACTIVE METALLIC NANOSTRUCTURES AND METHODS OF FABRICATING SAME  
Plasmonics-active nanostructure substrates—developed on a wafer scale in a reliable and reproducible manner such that these plasmonics-active nanostructures have nano-scale gaps (that include but...
US20120181651 Temperature Sensor Based on Magnetic Tunneling Junction Device  
A temperature sensor, based on magnetic tunneling junction (MTJ) device, includes an MTJ device, a PMOS device and an analog switch. Source electrode of the PMOS device is connected to a power...
US20120074514 ETCH-RESISTANT COATING ON SENSOR WAFERS FOR IN-SITU MEASUREMENT  
A sensor wafer may be configured for in-situ measurements of parameters during an etch process. The sensor wafer may include a substrate, a cover, and one or more components positioned between the...
US20120126345 MEMS DEVICE WITH STRESS ISOLATION AND METHOD OF FABRICATION  
A MEMS device (20) with stress isolation includes elements (28, 30, 32) formed in a first structural layer (24) and elements (68, 70) formed in a second structural layer (26), with the layer (26)...
US20110316111 PYROELECTRIC DETECTOR, PYROELECTRIC DETECTION DEVICE, AND ELECTRONIC INSTRUMENT  
A pyroelectric detector includes a pyroelectric detection element mounted on a first side of a support member with a second side facing a cavity. The pyroelectric detection element has a capacitor...
US20110304005 RESONATOR ELEMENT AND RESONATOR PIXEL FOR MICROBOLOMETER SENSOR  
A resonator element for the absorption and/or conversion of electromagnetic waves having a predefined wavelength, in particular infrared radiation having a wavelength of 2 μm to 200 μm, into heat,...
US20110204231 THERMAL DETECTION AND IMAGING OF ELECTROMAGNETIC RADIATION  
The current invention provides a method for improving the sensitivity of bolometric detection by providing improved electromagnetic power/energy absorption. In addition to its role in...
US20120161260 Method for packaging a sensor chip, and a component produced using such a method  
Measures are introduced to make possible a low-cost packaging of sensor chips having a media access. For this purpose, the sensor chip is first mounted on a substrate and is contacted. The sensor...
US20110309463 ELECTROCALORIC EFFECT MATERIALS AND THERMAL DIODES  
Examples are generally described that include a substrate, an electrocaloric effect material at least partially supported by the substrate, and a thermal diode at least partially supported by the...
US20120049313 UNCOOLED INFRARED IMAGE SENSOR  
An uncooled infrared image sensor according to an embodiments includes: a plurality of pixel cells formed in a first region on a semiconductor substrate; a reference pixel cell formed in a second...
US20140210036 MEMBRANE-BASED SENSOR DEVICE AND METHOD FOR MANUFACTURING THE SAME  
A sensing device has a semiconductor substrate with an opening and a membrane spanning the opening. A heater is arranged on the membrane. To reduce the thermal conductivity of the membrane, a...
US20060151849 Phase change memory that switches between crystalline phases  
A phase change memory may transition between two crystalline states. In one embodiment, the phase change material is a chalcogenide which transitions between face centered cubic and hexagonal...
US20140264712 INFRARED DETECTOR MADE UP OF SUSPENDED BOLOMETRIC MICRO-PLATES  
An array bolometric detector for detecting an electromagnetic radiation in a predetermined infrared or terahertz wavelength range, including a substrate, and an array of bolometric microplates for...
US20120211857 PYROELECTRIC DETECTOR, PYROELECTRIC DETECTION DEVICE, AND ELECTRONIC INSTRUMENT  
A pyroelectric detector includes a substrate, a support member and a pyroelectric detection element, which includes a capacitor, first and second reducing gas barrier layers, an insulating layer,...
US20130119504 Thermal Airlflow Sensor  
An object of the present invention is to provide a thermal airflow sensor that prevents moisture absorption by a silicon oxide film formed closest to a surface (formed to be located on an...
US20110186956 ELECTRICALLY CONDUCTIVE POLYMER COMPOSITE AND THERMOELECTRIC DEVICE USING ELECTRICALLY CONDUCTIVE POLYMER MATERIAL  
An electrically conductive composite material that includes an electrically conductive polymer, and at least one metal nanoparticle coated with a protective agent, wherein said protective agent...
US20120032283 SENSOR MODULE  
A sensor module includes a substrate system which has multiple substrates situated one on top of the other and connected in each case via a wafer bond connection. The substrate system includes at...
US20150187708 Thermal Flow Meter  
Provided is a thermal flow meter that can be prevented from being eroded due to adhesion of water or like to a cut end portion of the lead exposed from the mold resin of the circuit package. A...
US20100001360 LEVEL POSTURE SENSING CHIP AND ITS MANUFACTURING METHOD, LEVEL POSTURE SENSOR  
The present invention discloses a gas pendulum style level posture sensing chip and its manufacturing method and a level posture sensor. The gas pendulum style level posture sensing chip includes:...
US20120139077 METHOD AND APPARATUS FOR REDUCING THERMOPILE VARIATIONS  
Here, an apparatus is provided. The apparatus generally comprises a substrate and a thermopile. The thermopile includes a cavity that is etched into the substrate, a functional area that is formed...
US20150097260 Single Silicon Wafer Micromachined Thermal Conduction Sensor  
A single silicon wafer micromachined thermal conduction sensor is described. The sensor consists of a heat transfer cavity with a flat bottom and an arbitrary plane shape, which is created in a...
US20140036953 TEMPERATURE SENSOR DEVICE AND RADIATION THERMOMETER USING THIS DEVICE, PRODUCTION METHOD OF TEMPERATURE SENSOR DEVICE, MULTI-LAYERED THIN FILM THERMOPILE USING PHOTO-RESIST FILM AND RADIATION THERMOMETER USING THIS THERMOPILE, AND PRODUCTION METHOD OF MULTI-LAYERED THIN FILM THERMOPILE  
Disclosed are a temperature sensor device using a thermopile, the total number n of thermocouples thereon can be increased without greatly increasing the internal resistance of the thermopile r,...
US20110298080 METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION MODULE, AND THERMOELECTRIC CONVERSION MODULE  
There is provided a method for manufacturing a thermoelectric conversion module that can yield a thermoelectric conversion module with a high insulating property and high density without requiring...
US20130134544 ENERGY HARVESTING IN INTEGRATED CIRCUIT PACKAGES  
An energy harvesting integrated circuit (IC) includes electrical connectors, each having a portion of a first material and a portion of a second material. The first and the second materials have a...
US20150177028 SENSOR PACKAGE AND PORTABLE TERMINAL HAVING THE SAME  
A sensor package may allow a fluid to flow smoothly to thus increase response characteristics. The sensor package may include: a terminal part; at least one electronic element electrically...

Matches 1 - 50 out of 220 1 2 3 4 5 >