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US20110012219 OPTIMIZATION OF DESICCANT USAGE IN A MEMS PACKAGE  
A MEMS device may be package with a desiccant to provide a moisture-free environment. In order to avoid undesirable effects on the MEMS device, the desiccant may be selected or treated so as to be...
US20150155453 OPTOELECTRONIC CHIP-ON-BOARD MODULE  
A method is provided for coating an optoelectronic chip-on-board module, including a flat substrate populated with one or more optoelectronic components, having a transparent, UV-resistant, and...
US20090127579 Optoelectronic device  
An optoelectronic device includes a base, a first and a second stands mounted on the base, a chip mounted on the first stand, a copper wire for bonding the chip to the second stand, and a molding...
US20090016202 METHOD OF PRODUCING A PHOTOELECTRIC TRANSDUCER AND OPTICAL PICK UP  
A photoelectric transducer comprises a board, which carries at least an optical sensor on one face, and a spacer defining a recess that houses the optical sensor. The recess is at least partly...
US20130009264 MOISTURE BARRIER  
A moisture barrier, device or product having a moisture barrier or a method of fabricating a moisture barrier having at least a polymer layer, and interfacial layer, and a barrier layer. The...
US20080135966 SMART CARD CAPABLE OF SENSING LIGHT  
A smart card is formed of a memory having light-sensing cells to sense externally supplied light and generate a detection signal in response to the externally supplied light being sensed by the...
US20050167773 Semiconductor element for solid state image sensing device and solid state image sensing device using the same  
A semiconductor element for solid state image sensing device includes a semiconductor element body (semiconductor chip) in which an image sensing area having an image sensor portion and a...
US20140306312 MEMS Sensor Packaging and Method Thereof  
A micro electro mechanical systems (MEMS sensor packaging includes a first wafer having a readout integrated circuit (ROIC) formed thereon., a second wafer disposed corresponding to the first...
US20070145506 Assembly of image-sensing chip and circuit board with inward wire bonding  
An assembly of image-sensing chip and circuit boardwith inward wire bonding, including an image-sensing chip, a circuit board and a glass board. The circuit board is formed with a window and...
US20070108545 Infrared-blocking encapsulant with organometallic colloids  
Organometallic colloid(s) is dispersed in a polymer matrix to form an infrared-blocking encapsulant.
US20130105929 RESIN COMPOSITION  
A resin composition for obtaining a cured resin material exhibiting improved heat resistance and a higher glass transition temperature is disclosed. The resin composition contains a resin selected...
US20110304001 FINGERPRINT SENSING CIRCUIT  
Fingerprint sensing circuit packages and methods of making such packages may comprise a first substrate having a top side and a bottom side; the top side comprising a fingerprint image sensing...
US20090242926 PACKAGE FOR OPTICAL SEMICONDUCTOR ELEMENT  
A package for an optical semiconductor element is provided. The package includes: a stem body having a sealing hole therein; and a lead pin having a glass sealing portion which is sealed with...
US20090060126 Photodetection unit, photodetector, and x-ray computed tomography apparatus  
A photodetecting unit having a favorable attaching operability is provided. In a photodetecting unit 1, two structures for attachment 30 are fixed to the rear face of a supporting substrate 20...
US20090152659 REFLOWABLE CAMERA MODULE WITH IMPROVED RELIABILITY OF SOLDER CONNECTIONS  
A reflowable camera module has a set of solder joints formed on a bottom surface of the camera module that provide electrical signal and power connections between the camera module and a printed...
US20140061838 SELF-ALIGNING HYBRIDIZATION METHOD  
A self-aligning hybridization method enabling small pixel pitch hybridizations with self-alignment and run-out protection. The method requires providing a first IC, the surface of which includes...
US20090315133 IMAGE SENSOR MODULE AND CAMERA MODULE HAVING SAME  
An exemplary image sensor module includes a heat pipe and an image sensor. The heat pipe includes a main body and a working fluid. The main body includes a top flat cover, an opposite bottom flat...
US20140369644 LIGHT-RECEIVING PACKAGE FOR FLAT-PLATE MOUNTING, AND OPTICAL MODULE  
A light-receiving package for flat-plate mounting which can make monitor reception sensitivity of an optical signal constant without increasing the size of a module. The light-receiving package...
US20050121736 Receiver optical subassembly  
A receiver optical subassembly for transforming received optical signal into electrical signal includes at least a ceramic substrate, a photo receiver and a transimpedance amplifier. There are...
US20080012085 PACKAGING STRUCTURE OF AN OPTICAL MOTION SENSOR  
A packaging structure of an optical motion sensor includes a packaging substrate, an optical detection module, and a packaging mask. The optical detection module is provided on the packaging...
US20090321726 ENCAPSULATION FOR ORGANIC OPTOELECTRONIC DEVICES  
An organic optoelectronic device includes a substrate, an anode, a cathode, an active region comprising an organic material, an encapsulation that isolates the active region from an ambient...
US20110024860 Device For The Detection Of Electromagnetic Waves And Method For Producing Such A Device  
Device for the detection of electromagnetic waves with a first plate that contains a membrane and a detector structure fixed at least partially to the membrane,a second plate attached to the first...
US20120032291 Stand-Alone Device  
A stand-alone device comprising a silicon wafer having its front surface including a first layer of a first conductivity type and a second layer of a second conductivity type forming a...
US20070090479 Controlling bond fronts in wafer-scale packaging  
A system for controlling bond front propagation in wafer-scale packaging includes a first substrate, a second substrate, and a bonder pressure plate having protruded structures thereon to...
US20120217535 Method of Encapsulating a Flexible Optoelectronic Multi-Layered Structure  
The invention relates to a method of encapsulating a flexible optoelectronic multi-layered structure (6) provided on a polymer substrate (2) comprising the steps of providing the flexible...
US20140138788 PACKAGE OF FINGER PRINT SENSOR AND FABRICATING METHOD THEREOF  
Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present...
US20090212381 WAFER LEVEL PACKAGES FOR REAR-FACE ILLUMINATED SOLID STATE IMAGE SENSORS  
A solid state image sensor includes a microelectronic element having a front face and a rear face remote from the front face, the rear face having a recess extending towards the front surface. A...
US20150102447 METHOD FOR PRODUCING PHOTOSENSITIVE INFRARED DETECTORS  
A method for producing at least one photosensitive infrared detector by assembling a first electronic component including plural photodiodes sensitive to infrared radiation and a second electronic...
US20050151141 Luminescence diode chip  
A luminescence diode chip with a semiconductor body having an epitaxially grown semiconductor layer sequence with an active zone and a radiation coupling-out area, the active zone emitting an...
US20050263841 Package for housing at least an electro-optic active element, electro-optic and assembling method  
A package houses at least one electro-optic active element for transmission using an optical fiber. The package has a bearing element for the at least one electro-optic active element....
US20100065879 Optoelectronic Device with Housing Body  
A housing body for an optoelectronic component comprises a main surface having a first area region and a second area region. The first area region and the second area region form a step in the...
US20140225211 SOLAR POWERED IC CHIP  
A self-powered circuit package includes a substrate and an integrated circuit (IC). The IC is mounted on a surface of the substrate. An electrical interconnector electrically couples the IC to the...
US20130175649 Sensor  
An apparatus including: a transparent substrate including a first surface and an opposing second surface; a sensor connected to the first surface of the transparent substrate; and a casing,...
US20140138734 MODULE STRUCTURE  
Disclosed is a module structure including a front sheet, a back sheet, and an optoelectronic device disposed between the front sheet and the back sheet. A first packaging layer is disposed between...
US20140231861 CURABLE COMPOSITION AND METHOD FOR MANUFACTURING THE SAME  
A curable composition comprises the following: (A) a branched polymer having an average unit formula (I′): [(R″)2SiO2/2]a″[(CH2═CH)(R″)2SiO1/2]b″[R″SiO3/2]c″[O1/2Si(R″ )2(CH2CH2)(R″)2SiO1/2]e″;...
US20070120213 Wire under dam package and method for packaging image-sensor  
An wire under dam package and method for packaging image-sensor. The image-sensor package includes: a substrate having a first surface and a second surface, a sensing chip being laid on the first...
US20120193742 PHOTOELECTRIC CONVERSION MODULE AND METHOD OF MANUFACTURING PHOTOELECTRIC CONVERSION MODULE  
A photoelectric conversion module includes: a substrate having a light transmitting property and having a mounting surface; a photoelectric conversion element mounted on the mounting surface of...
US20150054108 WAFER LEVEL PACKAGING STRUCTURE FOR IMAGE SENSORS AND WAFER LEVEL PACKAGING METHOD FOR IMAGE SENSORS  
A wafer level packaging structure for image sensors and a wafer level packaging method for image sensors are provided. The wafer level packaging structure includes: a wafer to be packaged...
US20090014825 Flexible photo-detectors  
Apparatus including flexible line extending along a length. Flexible line includes first charge carrier-transporting body, photosensitive body over first charge carrier-transporting body, and...
US20140231862 CURABLE COMPOSITION AND METHOD FOR MANUFACTURING THE SAME  
A curable composition comprises the following: (A) a polymer having at least two silicon-bonded alkenyl groups and having an average unit formula (I′): (R12SiO2/2)a1(R23SiO1/2)b1(CH2CH2)e1; (B) a...
US20060192230 Image sensor packages and frame structure thereof  
A semiconductor package such as an image sensor package. A frame structure includes an array of frames, each having an aperture therethrough, into which an image sensor die in combination with a...
US20090127694 SEMICONDUCTOR MODULE AND IMAGE PICKUP APPARATUS  
A semiconductor module including multiple semiconductor devices prevents a signal that flows through a bonding wire connected to one semiconductor device from acting as noise which affects the...
US20080061393 PHOTOSENSITIVE CHIP MOLDING PACKAGE  
A photosensitive chip molding package includes a lead frame, a photosensitive chip mounted on the lead frame and having an photo-active zone and a photo-inactive zone surrounding the photo-active...
US20100019271 EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME  
The present invention relates to an epoxy resin composition for optical semiconductor element encapsulation, the epoxy resin composition including following components (A) to (C): (A) an epoxy...
US20120161195 Printable Composition of a Liquid or Gel Suspension of Diodes  
An exemplary printable composition of a liquid or gel suspension of diodes comprises a plurality of diodes, a first solvent and/or a viscosity modifier. In other exemplary embodiments a second...
US20110057216 Low profile optoelectronic device package  
A low profile optoelectronic device package has a matalized transparent substrate, a chip and a dam ring. The matalized transparent substrate has a transparent board, a window area, and a metal...
US20100019399 POLYORGANOSILOXANE COMPOSITION  
Disclosed is a polyorganosiloxane composition containing the following components (a)-(c). (a) 100 parts by mass of a polyorganosiloxane obtained by mixing at least one silanol compound...
US20120223404 DETECTION MATRIX WITH IMPROVED BIASING CONDITIONS AND FABRICATION METHOD  
The detection device includes a semiconductor substrate of a first conductivity type. A matrix of photodiodes organized along a first organization axis is formed on the substrate. Each photodiode...
US20100025793 Assembly for image sensing chip and assembling method thereof  
An assembly for an image sensing chip to reduce the entire thickness and an assembling method thereof are disclosed. Meanwhile, the electro-optical assembly includes an image sensing chip; and a...
US20090224350 SEMICONDUCTOR DEVICE, CAMERA MODULE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD  
A semiconductor device is provided which has a semiconductor element having an element forming surface at which a sensor element is formed, a back surface on the opposite side of the element...

Matches 1 - 50 out of 323 1 2 3 4 5 6 7 >