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US20080079100 |
Fingerprint Sensor and Interconnect
Particular embodiments of the present invention are directed to a flexible fingerprint sensor interconnect apparatus that includes a fingerprint sensor chip having at least one die contact and a... |
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US20070170532 |
Wafer encapsulated microelectromechanical structure and method of manufacturing same
There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical... |
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US20070170530 |
Wafer encapsulated microelectromechanical structure and method of manufacturing same
There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical... |
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US20050093087 |
Microstructured device for removable storage of small amounts of liquid and a process for removal of the liquid stored in this device
Microstructured device for removable storage of small amounts of liquid with the following features: the device has a carrier; the device has a first cavity with at least one first section for... |
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US20130001710 |
PROCESS FOR A SEALED MEMS DEVICE WITH A PORTION EXPOSED TO THE ENVIRONMENT
A method and system for providing a MEMS device with a portion exposed to an outside environment are disclosed. The method comprises bonding a handle wafer to a device wafer to form a MEMS... |
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US20070170529 |
Wafer encapsulated microelectromechanical structure and method of manufacturing same
There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical... |
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US20070170531 |
Wafer encapsulated microelectromechanical structure and method of manufacturing same
There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical... |
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US20060076634 |
Method and system for packaging MEMS devices with incorporated getter
Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant... |
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US20110101474 |
METHOD FOR PROTECTING ENCAPSULATED SENSOR STRUCTURES USING STACK PACKAGING
A method of protecting a micro-mechanical sensor structure embedded in a micro-mechanical sensor chip, in which the micro-mechanical sensor structure is fabricated with a protective membrane, the... |
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US20070170528 |
Wafer encapsulated microelectromechanical structure and method of manufacturing same
There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical... |
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US20140026661 |
MEMS DEVICE
A MEMS gyroscope is disclosed herein, wherein the MEMS gyroscope comprised a magnetic sensing mechanism and a magnetic source that is associated with the proof-mass. The magnetic sensing mechanism... |
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US20100295138 |
METHODS AND SYSTEMS FOR FABRICATION OF MEMS CMOS DEVICES
A MEMS integrated circuit including a plurality of layers where a portion includes one or more electronic elements on a semiconductor material substrate. The circuit includes a structure of... |
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US20060220160 |
Structure of a structure release and a method for manufacturing the same
A structure of a structure release and a manufacturing method are provided. The structure and manufacturing method are adapted for an interference display cell. The structure of the interference... |
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US20140264655 |
SURFACE ROUGHENING TO REDUCE ADHESION IN AN INTEGRATED MEMS DEVICE
In an integrated MEMS device, moving silicon parts with smooth surfaces can stick together if they come into contact. By roughening at least one smooth surface, the effective area of contact, and... |
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US20060086994 |
Nanoelectromechanical components
A nanotube device is disclosed which includes a nanotube with a longitudinal and a lateral extension, a structure for supporting at least a first part of the nanotube, and a first device for... |
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US20050133877 |
Chemical sensor
The invention concerns a chemical sensor comprising at least one cantilever sensor unit with a capture surface for a chemical substance to be detected. The cantilever comprises a piezoresistor of... |
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US20130032861 |
TOUCH PANEL AND METHOD FOR MANUFACTURING THE SAME
A touch panel includes a first substrate having a plurality of lower electrodes; a second substrate spaced a distance apart from the lower substrate and having a plurality of upper electrodes that... |
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US20090194829 |
MEMS Packaging Including Integrated Circuit Dies
MEMS packaging schemes having a system-on-package (SOP) configuration and a system-on-board (SOB) configuration are provided. The MEMS package comprises one or more MEMS dies, a cap section having... |
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US20080164542 |
METHODS AND SYSTEMS FOR WAFER LEVEL PACKAGING OF MEMS STRUCTURES
A method of forming a package for a MEMS structure coupled to a substrate includes depositing an encapsulant material on the substrate and patterning the encapsulant material to form a plurality... |
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US20120105385 |
ELECTROMECHANICAL SYSTEMS APPARATUSES AND METHODS FOR PROVIDING ROUGH SURFACES
This disclosure provides systems, methods, and apparatus for producing roughness in an electromechanical device by nucleation under plasma CVD conditions. In one aspect, a substrate and at least a... |
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US20060091485 |
Piezoelectric device and manufacturing method thereof
A surface acoustic wave device includes a SAW element having an IDT provided on a piezoelectric substrate and electroconductive pads connected to the IDT, and a bonding substrate having... |
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US20110108932 |
Micromechanical Capacitive Sensor Element
A manufacturing method for producing a micromechanical sensor element which may be produced in a monolithically integrable design and has capacitive detection of a physical quantity is described.... |
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US20090115735 |
Sensor with pressure-induced varied capacitance
A sensor with pressure-induced varied capacitance is disclosed. Each sensor pixel circuit of the sensor includes a touch capacitor, a charge TFT for storing charge at the touch capacitor according... |
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US20090115008 |
MANUFACTURING METHOD OF AN ELECTRONIC DEVICE INCLUDING OVERMOLDED MEMS DEVICES
A method manufactures an electronic device comprising a MEMS device overmolded in a protective casing. The MEMS device includes an active surface wherein a portion of the MEMS device is... |
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US20070222008 |
METHOD FOR MANUFACTURING PLASTIC PACKAGING OF MEMS DEVICES AND STRUCTURE THEREOF
A plastic packaging of MEMS device and a method therefore are provided. The method includes the steps of: provide a carrier having a surface; provide at least one MEMS device having an active... |
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US20110147859 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device includes a base substrate made of silicon, a cap substrate and a leading electrode having a metal part. The base substrate has base semiconductor regions being insulated and... |
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US20130119489 |
METHOD AND APPARATUS FOR WAFER-LEVEL SOLDER HERMETIC SEAL ENCAPSULATION OF MEMS DEVICES
A plurality of MEMS devices are formed on a substrate, a sacrificial layer is formed to cover each of the MEMS devices and a protective cap layer is formed on the sacrificial layer. A release hole... |
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US20080093691 |
MEM switching device and method for making same
A MEM device and method for fabricating a MEM device. A MEM device comprising a lever mechanism residing along a substrate is disclosed. A contact material is deposited on a first surface of the... |
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US20070158769 |
Integrated CMOS-MEMS technology for wired implantable sensors
Disclosed are wired implantable integrated CMOS-MEMS sensors and fabrication methods. A first ceramic substrate comprising a biocompatible material such as fused silica is provided. A polysilicon... |
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US20050218466 |
Thin-film lamination, and actuator device, filter device, ferroelectric memory, and optical deflection device employing the thin -film lamination
A thin-film lamination includes: a monocrystal substrate; an intermediate layer having zirconia as a main constituent produced in an epitaxial growth manner on the monocrystal substrate; a C-rare... |
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US20060006484 |
Functional material for micro-mechanical systems
A MEMS device includes a first material structure. A second material structure includes TiN. The second material structure is moveable relative to the first material structure. |
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US20110215429 |
MANUFACTURING METHOD OF ELECTRONIC DEVICE PACKAGE, ELECTRONIC DEVICE PACKAGE, AND OSCILLATOR
An electronic device package manufacturing method includes: forming a metal film on both surfaces of the cover substrate so that the metal film on one surface and the metal surface on the other... |
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US20110108933 |
MEMS DEVICE
A MEMS device according to the present invention includes a movable member, a supporting member supporting the movable member, an opposing member opposed to the movable member, and a wall member... |
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US20120012950 |
FUNCTIONAL DEVICE AND MANUFACTURING METHOD THEREOF
A functional device includes: a substrate; a functional structure formed on the substrate; a cavity in which the functional structure is disposed; and a cover which covers the cavity, wherein the... |
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US20100108132 |
NANO-DEVICES AND METHODS OF MANUFACTURE THEREOF
Disclosed herein is a nanodevice. Disclosed herein too is a method of manufacturing a nanodevice. In one embodiment the nanodevice includes a first substrate; a second substrate; a nanowire; the... |
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US20070040231 |
Partially etched leadframe packages having different top and bottom topologies
A package for a micro-electromechanical (MEMS) device is described. A premolded leadframe base has opposing top and bottom surfaces. Each surface is defined by a topology having at least one... |
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US20050263837 |
Bump style MEMS switch
A microelectromechanical system switch may be formed with a protrusion defined on the substrate which makes contact with a deflectable member arranged over the substrate. The deflectable member... |
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US20130001550 |
HERMETICALLY SEALED MEMS DEVICE WITH A PORTION EXPOSED TO THE ENVIRONMENT WITH VERTICALLY INTEGRATED ELECTRONICS
A system and method for providing a MEMS device with integrated electronics are disclosed. The MEMS device comprises an integrated circuit substrate and a MEMS subassembly coupled to the... |
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US20080099860 |
SEMICONDUCTOR ARRAY AND METHOD FOR MANUFACTURING A SEMICONDUCTOR ARRAY
a semiconductor Array and method for Manufacturing a semiconductor array is provided that includes a substrate, an element layer of a single-crystal semiconductor material, an isolation layer that... |
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US20060278942 |
Antistiction MEMS substrate and method of manufacture
A composite wafer for fabricating MEMS devices is provided with a plurality of antistiction bumps, buried under a device layer of the composite wafer. The antistiction bumps are prepared... |
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US20060091484 |
MICRO ELECTROMECHANICAL SYSTEMS THERMAL SWITCH
A Micro Electro-Mechanical Systems (MEMS) thermal switch. The switch includes a FET having a source and drain in a substrate and a beam isolated from the substrate, wherein the beam is a... |
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US20110303994 |
MEMS DEVICE AND PROCESS
A micro-electrical-mechanical system (MEMS) transducer comprises a layer of dielectric material having an electrode formed in the layer of dielectric material. A region of the layer of the... |
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US20110012211 |
SEMICONDUCTOR DEVICE AND METHOD
Disclosed is a semiconductor device comprising a stack of patterned metal layers (12) separated by dielectric layers (14), said stack comprising a first conductive support structure (20) and a... |
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US20060249801 |
Semiconductor device
A semiconductor device has a first substrate and a second substrate. The first substrate has first electrodes on at least one surface. The second substrate has concave portions on a surface, and... |
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US20150260519 |
MEMS MOTION SENSOR AND METHOD OF MANUFACTURING
A MEMS motion sensor and its manufacturing method are provided. The sensor includes a MEMS wafer including a proof mass and flexible springs suspending the proof mass and enabling the proof mass... |
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US20120267730 |
MICRO-ELECTROMECHANICAL SYSTEM (MEMS) DEVICE
A micro-electromechanical system (MEMS) device for measuring accelerations, angular rates, or for actuation comprises at least two substrates and at least one movable structure arranged in a... |
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US20130028450 |
LID, FABRICATING METHOD THEREOF, AND MEMS PACKAGE MADE THEREBY
A lid for a MEMS device and the relative manufacturing method. The lid includes: a first board with opposite first and second surfaces having first and second metal layers disposed thereon,... |
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US20090072334 |
Semiconductor device, pre-mold package, and manufacturing method therefor
A pre-mold package of a semiconductor device is constituted of a lead frame, a mold resin having a box-like shape constituted of a side wall and a bottom for mounting at least one semiconductor... |
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US20090134481 |
Molded Sensor Package and Assembly Method
A method of forming a molded sensor includes providing a sensor assembly having a sensor, and a cap coupled to a portion of the sensor, the cap having an opening and forming an interior area. The... |
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US20070158768 |
Electrical contacts formed of carbon nanotubes
An apparatus and method for a micromachined mechanical switch device having first and second cooperating electrical switch contacts formed by respective first and second patterns of robust carbon... |