Matches 1 - 50 out of 225 1 2 3 4 5 >


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US20080079100 Fingerprint Sensor and Interconnect  
Particular embodiments of the present invention are directed to a flexible fingerprint sensor interconnect apparatus that includes a fingerprint sensor chip having at least one die contact and a...
US20070170532 Wafer encapsulated microelectromechanical structure and method of manufacturing same  
There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical...
US20070170530 Wafer encapsulated microelectromechanical structure and method of manufacturing same  
There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical...
US20050093087 Microstructured device for removable storage of small amounts of liquid and a process for removal of the liquid stored in this device  
Microstructured device for removable storage of small amounts of liquid with the following features: the device has a carrier; the device has a first cavity with at least one first section for...
US20130001710 PROCESS FOR A SEALED MEMS DEVICE WITH A PORTION EXPOSED TO THE ENVIRONMENT  
A method and system for providing a MEMS device with a portion exposed to an outside environment are disclosed. The method comprises bonding a handle wafer to a device wafer to form a MEMS...
US20070170529 Wafer encapsulated microelectromechanical structure and method of manufacturing same  
There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical...
US20070170531 Wafer encapsulated microelectromechanical structure and method of manufacturing same  
There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical...
US20060076634 Method and system for packaging MEMS devices with incorporated getter  
Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant...
US20110101474 METHOD FOR PROTECTING ENCAPSULATED SENSOR STRUCTURES USING STACK PACKAGING  
A method of protecting a micro-mechanical sensor structure embedded in a micro-mechanical sensor chip, in which the micro-mechanical sensor structure is fabricated with a protective membrane, the...
US20070170528 Wafer encapsulated microelectromechanical structure and method of manufacturing same  
There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical...
US20140026661 MEMS DEVICE  
A MEMS gyroscope is disclosed herein, wherein the MEMS gyroscope comprised a magnetic sensing mechanism and a magnetic source that is associated with the proof-mass. The magnetic sensing mechanism...
US20100295138 METHODS AND SYSTEMS FOR FABRICATION OF MEMS CMOS DEVICES  
A MEMS integrated circuit including a plurality of layers where a portion includes one or more electronic elements on a semiconductor material substrate. The circuit includes a structure of...
US20060220160 Structure of a structure release and a method for manufacturing the same  
A structure of a structure release and a manufacturing method are provided. The structure and manufacturing method are adapted for an interference display cell. The structure of the interference...
US20140264655 SURFACE ROUGHENING TO REDUCE ADHESION IN AN INTEGRATED MEMS DEVICE  
In an integrated MEMS device, moving silicon parts with smooth surfaces can stick together if they come into contact. By roughening at least one smooth surface, the effective area of contact, and...
US20060086994 Nanoelectromechanical components  
A nanotube device is disclosed which includes a nanotube with a longitudinal and a lateral extension, a structure for supporting at least a first part of the nanotube, and a first device for...
US20050133877 Chemical sensor  
The invention concerns a chemical sensor comprising at least one cantilever sensor unit with a capture surface for a chemical substance to be detected. The cantilever comprises a piezoresistor of...
US20130032861 TOUCH PANEL AND METHOD FOR MANUFACTURING THE SAME  
A touch panel includes a first substrate having a plurality of lower electrodes; a second substrate spaced a distance apart from the lower substrate and having a plurality of upper electrodes that...
US20090194829 MEMS Packaging Including Integrated Circuit Dies  
MEMS packaging schemes having a system-on-package (SOP) configuration and a system-on-board (SOB) configuration are provided. The MEMS package comprises one or more MEMS dies, a cap section having...
US20080164542 METHODS AND SYSTEMS FOR WAFER LEVEL PACKAGING OF MEMS STRUCTURES  
A method of forming a package for a MEMS structure coupled to a substrate includes depositing an encapsulant material on the substrate and patterning the encapsulant material to form a plurality...
US20120105385 ELECTROMECHANICAL SYSTEMS APPARATUSES AND METHODS FOR PROVIDING ROUGH SURFACES  
This disclosure provides systems, methods, and apparatus for producing roughness in an electromechanical device by nucleation under plasma CVD conditions. In one aspect, a substrate and at least a...
US20060091485 Piezoelectric device and manufacturing method thereof  
A surface acoustic wave device includes a SAW element having an IDT provided on a piezoelectric substrate and electroconductive pads connected to the IDT, and a bonding substrate having...
US20110108932 Micromechanical Capacitive Sensor Element  
A manufacturing method for producing a micromechanical sensor element which may be produced in a monolithically integrable design and has capacitive detection of a physical quantity is described....
US20090115735 Sensor with pressure-induced varied capacitance  
A sensor with pressure-induced varied capacitance is disclosed. Each sensor pixel circuit of the sensor includes a touch capacitor, a charge TFT for storing charge at the touch capacitor according...
US20090115008 MANUFACTURING METHOD OF AN ELECTRONIC DEVICE INCLUDING OVERMOLDED MEMS DEVICES  
A method manufactures an electronic device comprising a MEMS device overmolded in a protective casing. The MEMS device includes an active surface wherein a portion of the MEMS device is...
US20070222008 METHOD FOR MANUFACTURING PLASTIC PACKAGING OF MEMS DEVICES AND STRUCTURE THEREOF  
A plastic packaging of MEMS device and a method therefore are provided. The method includes the steps of: provide a carrier having a surface; provide at least one MEMS device having an active...
US20110147859 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME  
A semiconductor device includes a base substrate made of silicon, a cap substrate and a leading electrode having a metal part. The base substrate has base semiconductor regions being insulated and...
US20130119489 METHOD AND APPARATUS FOR WAFER-LEVEL SOLDER HERMETIC SEAL ENCAPSULATION OF MEMS DEVICES  
A plurality of MEMS devices are formed on a substrate, a sacrificial layer is formed to cover each of the MEMS devices and a protective cap layer is formed on the sacrificial layer. A release hole...
US20080093691 MEM switching device and method for making same  
A MEM device and method for fabricating a MEM device. A MEM device comprising a lever mechanism residing along a substrate is disclosed. A contact material is deposited on a first surface of the...
US20070158769 Integrated CMOS-MEMS technology for wired implantable sensors  
Disclosed are wired implantable integrated CMOS-MEMS sensors and fabrication methods. A first ceramic substrate comprising a biocompatible material such as fused silica is provided. A polysilicon...
US20050218466 Thin-film lamination, and actuator device, filter device, ferroelectric memory, and optical deflection device employing the thin -film lamination  
A thin-film lamination includes: a monocrystal substrate; an intermediate layer having zirconia as a main constituent produced in an epitaxial growth manner on the monocrystal substrate; a C-rare...
US20060006484 Functional material for micro-mechanical systems  
A MEMS device includes a first material structure. A second material structure includes TiN. The second material structure is moveable relative to the first material structure.
US20110215429 MANUFACTURING METHOD OF ELECTRONIC DEVICE PACKAGE, ELECTRONIC DEVICE PACKAGE, AND OSCILLATOR  
An electronic device package manufacturing method includes: forming a metal film on both surfaces of the cover substrate so that the metal film on one surface and the metal surface on the other...
US20110108933 MEMS DEVICE  
A MEMS device according to the present invention includes a movable member, a supporting member supporting the movable member, an opposing member opposed to the movable member, and a wall member...
US20120012950 FUNCTIONAL DEVICE AND MANUFACTURING METHOD THEREOF  
A functional device includes: a substrate; a functional structure formed on the substrate; a cavity in which the functional structure is disposed; and a cover which covers the cavity, wherein the...
US20100108132 NANO-DEVICES AND METHODS OF MANUFACTURE THEREOF  
Disclosed herein is a nanodevice. Disclosed herein too is a method of manufacturing a nanodevice. In one embodiment the nanodevice includes a first substrate; a second substrate; a nanowire; the...
US20070040231 Partially etched leadframe packages having different top and bottom topologies  
A package for a micro-electromechanical (MEMS) device is described. A premolded leadframe base has opposing top and bottom surfaces. Each surface is defined by a topology having at least one...
US20050263837 Bump style MEMS switch  
A microelectromechanical system switch may be formed with a protrusion defined on the substrate which makes contact with a deflectable member arranged over the substrate. The deflectable member...
US20130001550 HERMETICALLY SEALED MEMS DEVICE WITH A PORTION EXPOSED TO THE ENVIRONMENT WITH VERTICALLY INTEGRATED ELECTRONICS  
A system and method for providing a MEMS device with integrated electronics are disclosed. The MEMS device comprises an integrated circuit substrate and a MEMS subassembly coupled to the...
US20080099860 SEMICONDUCTOR ARRAY AND METHOD FOR MANUFACTURING A SEMICONDUCTOR ARRAY  
a semiconductor Array and method for Manufacturing a semiconductor array is provided that includes a substrate, an element layer of a single-crystal semiconductor material, an isolation layer that...
US20060278942 Antistiction MEMS substrate and method of manufacture  
A composite wafer for fabricating MEMS devices is provided with a plurality of antistiction bumps, buried under a device layer of the composite wafer. The antistiction bumps are prepared...
US20060091484 MICRO ELECTROMECHANICAL SYSTEMS THERMAL SWITCH  
A Micro Electro-Mechanical Systems (MEMS) thermal switch. The switch includes a FET having a source and drain in a substrate and a beam isolated from the substrate, wherein the beam is a...
US20110303994 MEMS DEVICE AND PROCESS  
A micro-electrical-mechanical system (MEMS) transducer comprises a layer of dielectric material having an electrode formed in the layer of dielectric material. A region of the layer of the...
US20110012211 SEMICONDUCTOR DEVICE AND METHOD  
Disclosed is a semiconductor device comprising a stack of patterned metal layers (12) separated by dielectric layers (14), said stack comprising a first conductive support structure (20) and a...
US20060249801 Semiconductor device  
A semiconductor device has a first substrate and a second substrate. The first substrate has first electrodes on at least one surface. The second substrate has concave portions on a surface, and...
US20150260519 MEMS MOTION SENSOR AND METHOD OF MANUFACTURING  
A MEMS motion sensor and its manufacturing method are provided. The sensor includes a MEMS wafer including a proof mass and flexible springs suspending the proof mass and enabling the proof mass...
US20120267730 MICRO-ELECTROMECHANICAL SYSTEM (MEMS) DEVICE  
A micro-electromechanical system (MEMS) device for measuring accelerations, angular rates, or for actuation comprises at least two substrates and at least one movable structure arranged in a...
US20130028450 LID, FABRICATING METHOD THEREOF, AND MEMS PACKAGE MADE THEREBY  
A lid for a MEMS device and the relative manufacturing method. The lid includes: a first board with opposite first and second surfaces having first and second metal layers disposed thereon,...
US20090072334 Semiconductor device, pre-mold package, and manufacturing method therefor  
A pre-mold package of a semiconductor device is constituted of a lead frame, a mold resin having a box-like shape constituted of a side wall and a bottom for mounting at least one semiconductor...
US20090134481 Molded Sensor Package and Assembly Method  
A method of forming a molded sensor includes providing a sensor assembly having a sensor, and a cap coupled to a portion of the sensor, the cap having an opening and forming an interior area. The...
US20070158768 Electrical contacts formed of carbon nanotubes  
An apparatus and method for a micromachined mechanical switch device having first and second cooperating electrical switch contacts formed by respective first and second patterns of robust carbon...

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