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US20100308431 Mechanical Isolation For MEMS Electrical Contacts  
In accordance with the disclosure, a MEMS substrate is provided that includes: a central planar portion configured to support a MEMS device; and a first electrical pad coplanar with the central...
US20110140181 Removal of Masking Material  
Methods for removing a masking material, for example, a photoresist, and electronic devices formed by removing a masking material are presented. For example, a method for removing a masking...
US20150166334 MEMS Device with Release Aperture  
The present disclosure provides a micro-electro-mechanical systems (MEMS) device. In an embodiment, a device includes a substrate; a MEMS structure disposed above a sacrificial layer opening above...
US20120098074 MEMS DEVICE WITH RELEASE APERTURE  
The present disclosure provides a method of fabricating a micro-electro-mechanical systems (MEMS) device. In an embodiment, a method includes providing a substrate including a first sacrificial...
US20130193527 MICRO-ELECTRO MECHANICAL SYSTEM (MEMS) STRUCTURES WITH THROUGH SUBSTRATE VIAS AND METHODS OF FORMING THE SAME  
The present disclosure includes micro-electro mechanical system (MEMS) structures and methods of forming the same. Substrates of the MEMS structures are bonded together by fusion bonding at high...
US20070108539 Stable organic devices  
Stable organic devices, as well as related components, systems, and methods, are disclosed.
US20090057649 Assembly of Ordered Carbon Shells on Semiconducting Nanomaterials  
In some embodiments of the invention, encapsulated semiconducting nanomaterials are described. In certain embodiments the nanostructures described are semiconducting nanomaterials encapsulated...
US20130140649 TRANSIENT DEVICES DESIGNED TO UNDERGO PROGRAMMABLE TRANSFORMATIONS  
The invention provides transient devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus....
US20080251865 NANOELECTROMECHANICAL SYSTEMS AND METHODS FOR MAKING THE SAME  
Nanoelectromechanical systems are disclosed that utilize vertically grown or placed nanometer-scale beams. The beams may be configured and arranged for use in a variety of applications, such as...
US20130119488 THINNED FINGER SENSOR AND ASSOCIATED METHODS  
An electronic device may include a housing with a connector member opening therein, electronic circuitry within the housing, and a finger sensor assembly carried by the housing. The finger...
US20070259639 Multi-standard module integration  
An electronic module that operates at various radio frequency standards is provided. The module includes a first integrated circuit die formed in a first semiconductor substrate and manufactured...
US20130168781 TWO-WAFER MEMS IONIZATION DEVICE  
A microelectromechanical system (MEMS) assembly includes at least one emission source; a top wafer having a plurality of side walls and a generally horizontal portion, the horizontal portion...
US20120098075 INTEGRATED ELECTRONIC DEVICE FOR DETECTING MOLECULES AND METHOD OF MANUFACTURE THEREOF  
An integrated electronic device for detecting gases or biological molecules having a microchip comprising integrated electronics manufactured by the CMOS process. The microchip includes a...
US20110198711 SYSTEM AND METHOD FOR AN INTEGRATED ELECTRONIC AND OPTICAL MEMS BASED SENSOR  
This patent discloses an integrated electronic and optical MEMS (micro-electro-mechanical systems) based sensor wherein the same embossed diaphragm is used as the sensing element of both...
US20110156176 Leadframe-Based Premolded Package Having Acoustic Air Channel for Micro-Electro-Mechanical System  
A low-cost micro-electro-mechanical system (MEMS) has a mass-produced carrier fabricated as a pre-molded leadframe so that the space of the leadframe center is filled with compound and a two-tier...
US20150239734 ELECTRONIC DEVICE  
An electronic device is obtained in such a way that a MEMS substrate having a MEMS element mounted thereon and a CMOS substrate are bonded together at bonding surfaces and with a bonding material...
US20070114621 WIRELESSLY POWERED FLEXIBLE TAG  
A wirelessly powered flexible tag configured to be in contact with a substrate is provided. The tag includes a coupling layer configured to couple the tag to the substrate. An electrical circuit...
US20130221455 Methods for Embedding Controlled-Cavity MEMS Package in Integration Board  
An embedded micro-electro-mechanical system (MEMS) (100) comprising a semiconductor chip (101) embedded in an insulating board (120), the chip having a cavity (102) including a radiation sensor...
US20110108931 ANODIC BONDABLE PORCELAIN AND COMPOSITION FOR THE PORCELAIN  
An anodic bondable low-temperature fired porcelain having high-strength and low-thermal-expansion, wherein a conductive ion during anodic bonding is an Li ion, containing a complex oxide having a...
US20060157806 Multilayered semiconductor susbtrate and image sensor formed thereon for improved infrared response  
An image sensor is formed on a multilayered substrate to improve infrared response. The multilayered substrate uses a silicon-germanium alloy to improve infrared response. In one embodiment, the...
US20070145499 Photovoltaic ultraviolet sensor  
A photovoltaic ultraviolet sensor comprises a zinc oxide single crystal substrate. On the +c face of the zinc oxide single crystal substrate, an ultraviolet receiver is formed. The exemplary...
US20120256280 PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE  
A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host...
US20060027884 Silicon carbide MEMS structures and methods of forming the same  
MEMS structures that include silicon carbide micromechanical components, as well as methods of forming and using the same, are provided. The silicon carbide micromechanical components may be...
US20100148293 Miniaturized implantable sensor platform having multiple devices and sub-chips  
An implantable, miniaturized platform and a method for fabricating the platform is provided, where the e platform includes a top cover plate and a bottom substrate, top cover plate including an...
US20140373600 GAS SENSORS AND METHODS OF PREPARATION THEREOF  
Embodiments of the present disclosure include sensors, arrays of conductometric sensors, devices including conductometric sensors, methods of making conductometric sensors, methods of using...
US20110068422 Mems coupler and method to form the same  
A MEMS coupler and a method to form a MEMS structure having such a coupler are described. In an embodiment, a MEMS structure comprises a member and a substrate. A coupler extends through a portion...
US20110151574 DETECTION OF TRACE CHEMICALS AND METHOD THEREFOR  
The invention provides devices, systems, and methods for detecting an analyte vapor. Particularly, electronegative analyte vapors, such as those vapors evolving from explosive compounds, are...
US20070194395 Capacity type sensor  
In a capacity type sensor including a guard electrode which is disposed between a first electrode and a second electrode, an alternating current potential difference between the first electrode...
US20110101473 Junction deveice  
This invention relates to a junction device, especially a p-n junction device. This invention also relates to a backward current decoupler which is also a good sensor. An induced backward current...
US20140183668 NANOPORE SENSOR DEVICE  
A pair of electrode plates can be provided by directional deposition and patterning of a conductive material on sidewalls of a template structure on a first dielectric layer. An electrode line...
US20140183667 NANOPORE SENSOR DEVICE  
A pair of electrode plates can be provided by directional deposition and patterning of a conductive material on sidewalls of a template structure on a first dielectric layer. An electrode line...
US20070001248 MEMS DEVICE HAVING COMPACT ACTUATOR  
A MEMS device including a plurality of actuator layers formed over a substrate and a bimorph actuator having a substantially serpentine pattern. The serpentine pattern is a staggered pattern...
US20120032285 Electronic Device Including MEMS Devices And Holed Substrates, In Particular Of The LGA Or BGA Type  
An electronic device includes a substrate provided with a passing opening and a MEMS device including an active surface wherein a portion of the MEMS device is integrated sensitive to...
US20110084343 Monolithic IC and MEMS microfabrication process  
Monolithic IC/MEMS processes are disclosed in which high-stress silicon nitride is used as a mechanical material while amorphous silicon serves as a sacrificial layer. Electronic circuits and...
US20080197432 Microchip Assembly Produced by Transfer Molding  
The invention relates to a microchip assembly and an associated general production process, wherein an originally unshaped first component (1) is forged against the surface of a transfer molding...
US20140030819 NANOPILLAR FIELD-EFFECT AND JUNCTION TRANSISTORS WITH FUNCTIONALIZED GATE AND BASE ELECTRODES  
Systems and methods for molecular sensing are described. Molecular sensors are described which are based on field-effect or bipolar junction transistors. These transistors have a nanopillar with a...
US20120133001 TILEABLE SENSOR ARRAY  
A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side...
US20050156259 Mems array, manufacturing method thereof, and mems device manufacturing method based on the same  
A plurality of elements such as a resistor (10), capacitor (20), and coil (30) and switches 41 to 44 for connecting these elements are formed integrally on a substrate 1 and the elements are made...
US20120299126 INTEGRATED CIRCUIT WITH SENSOR AND METHOD OF MANUFACTURING SUCH AN INTEGRATED CIRCUIT  
Disclosed is an integrated circuit (IC) comprising a substrate (10) carrying a plurality of circuit elements; a metallization stack (12, 14, 16) interconnecting said circuit elements, said...
US20150137275 Titanium Nitride Electrode  
The present invention relates to a method for decreasing the impedance of a titanium nitride element for use in an electrode component. The method comprises obtaining a titanium nitride element...
US20140061823 MEMBRANE STRUCTURE FOR ELECTROCHEMICAL SENSOR  
A micro-electrochemical sensor contains magnetic compounds inserted within a substrate that exert a magnetic force of attraction on paramagnetic beads held in contact with an electrode. The...
US20060060931 Standard micro-component for calibrating or standardizing fluorescence measuring instruments and biochip comprising same  
The invention concerns a standard micro-component (4) for calibrating or standardizing fluorescence measuring instruments, comprising a substrate (1) whereon is arranged at least one thin film...
US20120217593 SENSOR MOUNTED IN FLIP-CHIP TECHNOLOGY AT A SUBSTRATE EDGE  
The sensor assembly comprises a substrate (1), such as a flexible printed circuit board, and a sensor chip (2) flip-chip mounted to the substrate (1), with a first side (3) of the sensor chip (2)...
US20130069176 INTEGRATED CIRCUIT WITH SENSOR AND METHOD OF MANUFACTURING SUCH AN INTEGRATED CIRCUIT  
An integrated circuit package for an integrated circuit having one or more sensor elements in a sensor element area of the circuit. An encapsulation covers bond wires but leaves an opening over...
US20070023850 Bonding surfaces together via plasma treatment on both surfaces with wet treatment on only one surface  
A first surface is bonded to a second surface. The first surface and the second surface are plasma treated. Only the first surface is wet treated. The first surface and the second surface are...
US20110115035 General strength and sensitivity enhancement method for micromachined device  
This invention disclosed a method to strengthen structure and enhance sensitivity for CMOS-MEMS micro-machined devices which include micro-motion sensor, micro-actuator and RF switch. The steps of...
US20110062531 SENSOR ARRAY AND A METHOD OF MANUFACTURING THE SAME  
A sensor array (100) for detecting particles, the sensor array (100) comprising a substrate (102) having a plurality of holes (104), a plurality of electronic sensor chips (106) each having a...
US20090170209 HYDROGEL CHEMICAL SENSOR  
An apparatus and method for detecting an analyte wherein a member may respond to mechanical stress induced by a volume change of a sensitive hydrogel upon sensing an analyte and wherein the...
US20140084390 CHEMICAL SENSOR  
In a method for manufacturing a chemical sensor with multiple sensor cells, a substrate is provided and an expansion inhibitor is applied to the substrate for preventing a sensitive material to be...
US20150033827 INTEGRATED METAL OXIDE CHEMICAL SENSOR  
A chemical sensor (10) is described with at least one layer of a metal oxide (11) arranged between two current injecting electrodes (16,16) with the length (L) of the layer of a metal oxide...

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