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US20140319575 ORGANOPOLYSILOXANE  
Provided is an organopolysiloxane and its use. The organopolysiloxane may exhibit excellent processibility and workability. In addition, when the organopolysiloxane is used as an encapsulant, it...
US20120256213 LED STRUCTURE AND MANUFACTURING METHOD THEREOF  
The present invention discloses an LED structure and a manufacturing method thereof. The LED structure has a housing, an LED chip and a transparent encapsulant. The housing has a recess and at...
US20110272733 ENCAPSULATION STRUCTURE FOR LIGHT-EMITTING DIODE  
The present invention relates to an encapsulation structure for light-emitting diode, primarily assembled from an encapsulation base, light-emitting diode chips and transparent encapsulation...
US20060220055 Light emitting diode systems  
Light emitting diode systems are disclosed. An optical display system that includes a light emitting diode (LED) and a cooling system is disclosed. The cooling system is configured so that, during...
US20110272722 ENCAPSULATION STRUCTURE FOR LIGHT-EMITTING DIODE  
The present invention relates to an encapsulation structure for light-emitting diode, which includes an encapsulation base, at least one light-emitting diode chip, a first encapsulation material...
US20150014739 LED MODULE, METHOD FOR MANUFACTURING THE SAME, AND LED CHANNEL LETTER INCLUDING THE SAME  
A light emitting diode (LED) module including: a circuit board; at least one LED disposed on the circuit board; a molding cover spaced apart from the LED by a predetermined gap and covering upper...
US20090309125 GLASS FOR ENCAPSULATING OPTICAL ELEMENT AND LIGHT-EMITTING DEVICE ENCAPSULATED WITH GLASS  
A glass for encapsulating an optical element that can seal the optical element at a temperature in the vicinity of 500° C., and a glass-encapsulated light-emitting device encapsulated with the...
US20150060935 LED MODULE  
An light emitting diode (LED) module includes a circuit board, a set of LED chips formed on and electrically connected to the circuit board, and an encapsulant arranged on the circuit board and...
US20110156092 SMT ENCAPSULATION BODY OF A LIGHT-EMITTING DIODE WITH A WIDE-ANGLE ILLUMINATION LIGHT SHAPE  
An SMT encapsulation body of a light-emitting diode with a wide-angle illumination light shape, comprising: a) a substrate; b) an LED die mounted on the substrate by use of SMT; and c) an...
US20140110750 CURABLE COMPOSITION  
A curable composition is provided. A cured product showing excellent light extraction efficiency, crack resistance, hardness, thermal shock resistance and adhesive strength after a curing, as well...
US20130009201 CURABLE COMPOSITION  
A curable composition is provided. A cured product showing excellent light extraction efficiency, crack resistance, hardness, thermal shock resistance and adhesive strength after a curing, as well...
US20140209969 POLYAMIDE COMPOSITIONS FOR LED APPLICATIONS  
The invention relates to polyamide composition comprising at least one polyamide featuring a melting temperature (Tm), at least one metal oxide selected from magnesium oxide, zinc oxide and...
US20130292652 DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME  
A display device includes a display panel, a metal encapsulation sheet facing the display panel, a sealing member combining the display panel and the metal encapsulation sheet, and a coating layer...
US20140103390 CURABLE COMPOSITON  
Provided is a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency,...
US20140110749 CURABLE COMPOSITION  
The present application relates to a curable composition. A curable composition may be provided; which shows excellent processability and workability; which shows excellent light extraction...
US20130009200 CURABLE COMPOSITION  
The present invention relates to a curable composition. A curable composition may be provided; which shows excellent processability and workability; which shows excellent light extraction...
US20150155453 OPTOELECTRONIC CHIP-ON-BOARD MODULE  
A method is provided for coating an optoelectronic chip-on-board module, including a flat substrate populated with one or more optoelectronic components, having a transparent, UV-resistant, and...
US20130168647 Organic Lighting Device and Lighting Equipment  
An organic luminous means and an illumination device comprising such a luminous means are specified. An optical display apparatus, emergency lighting, motor vehicle interior lighting, an item of...
US20150129921 UNIFORM EMISSION LED PACKAGE  
An emitter package comprising a light emitting diode (LED) mounted to the surface of a submount with the surface having a first meniscus forming feature around the LED. A matrix encapsulant is...
US20130264588 COMPACT LED PACKAGE  
A light emitting package includes a base and one or more LED units coupled to the base. The LED unit includes a plurality of vertically stacked epitaxial structures. Each epitaxial structure...
US20070040502 High CRI LED lamps utilizing single phosphor  
Disclosed are phosphor compositions having the formulas [Ba1-x-y-w-2zSrxCayCez(Li,Na)zEu2]2Si5N8, where 0
US20130126940 LIGHT EMITTING DIODE ASSEMBLY AND THERMAL CONTROL BLANKET AND METHODS RELATING THERETO  
The present disclosure relates generally to a light emitting diode assembly and a thermal control blanket. The light emitting diode assembly and the thermal control blanket have advantageous...
US20080164487 CERAMIC PACKAGE FOR LED  
A ceramic light emitted diode (LED) package has a pair of discrete reflection walls to reflect light emission from the LED. With two opposite reflection walls and two opposite openings around the...
US20060187980 Thin laser module  
A thin laser module comprises a casing having a light emitting window on one side; a circuit board installed in the casing for containing components; a laser chip installed on the circuit board...
US20110037095 ORGANIC LIGHT EMITTING DIODE DISPLAY  
An organic light emitting diode (OLED) display includes a display substrate assembly including an organic light emitting structure, an encapsulation substrate assembly disposed facing the display...
US20050146269 Gain structure of an LED  
A gain structure of an LED is disclosed. The structure comprises an LED seat block, a plurality of square LEDs, and two layered transparent hood, characterized in that the conductive pins of the...
US20130200425 PHOSPHOR-CONTAINING ADHESIVE SILICONE COMPOSITION SHEET, AND METHOD OF PRODUCING LIGHT-EMITTING DEVICE USING SAME  
An adhesive silicone composition sheet, in which a phosphor is dispersed uniformly and in which the dispersion state of the phosphor is stable over time, which is a solid or semisolid in an...
US20120098005 LED PACKAGE  
An exemplary encapsulation structure for encapsulating an LED chip includes a first encapsulation, a second encapsulation and a transparent resin layer with phosphorous compounds doped therein....
US20130082291 Light Emitting Devices with Low Packaging Factor  
A light emitting diode that when encapsulated within an overmolded hemispherical lens has a packaging factor less than 1.2.
US20080265274 Light emitting diode element having a voltage regulating capability  
An LED element having a voltage regulating capability has a body, two pins, a resistor and a conductive sleeve. The resistor is connected to a shorter pin through the conductive sleeve, so an...
US20060226772 Increased light output light emitting device using multiple phosphors  
A method for producing a light emitting device using two phosphors dispersed homogenously in a host matrix. The host matrix may be a polymer, such as heat and/or UV curable epoxy, silica glass,...
US20150048329 FLEXIBLE DISPLAY  
A flexible display may suppress a generation of cracks in an inorganic layer and suppress the spread of cracks. A flexible display includes a flexible substrate and an inorganic layer formed on...
US20060243995 WHITE LIGHT EMITTING DIODE DEVICE  
A white light emitting diode device (white LED device) is provided. The white LED device includes an LED chip and a phosphor. A first light beam with wavelength between about 380 nm and about 450...
US20150137151 HIGH POWER LEDS  
LED chips and packages are disclosed having lenses made of materials that resist degradation at higher operation temperatures and humidity, and methods of fabricating the same. The lenses can be...
US20140110748 CURABLE COMPOSITION  
Provided is a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency,...
US20140103389 CURABLE COMPOSITION  
Provided is a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency,...
US20110001149 LIGHT EMITTING DIODE DISPLAY WITH TILTED PEAK EMISSION PATTERN  
LED packages and LED displays utilizing the LED packages are disclosed where the peak emission of the LED display can be tilted or shifted to customize its peak emission to the mounting height or...
US20110073901 ADHESIVE ENCAPSULATING COMPOSITION AND ELECTRONIC DEVICES MADE THEREWITH  
Adhesive encapsulating compositions for use in electronic devices such as organic electroluminescent devices, touch screens, photovoltaic devices, and thin film transistors are disclosed herein....
US20070001182 Structured phosphor tape article  
A phosphor tape article includes a phosphor layer having a phosphor and a polymeric binder material and a structured surface, and a pressure sensitive adhesive layer disposed adjacent the phosphor...
US20060087230 Desiccant film in top-emitting OLED  
A top-emitting OLED device includes a substrate, a first electrode disposed over the substrate, and an organic EL media disposed over the first electrode. The device also includes a transparent or...
US20100127291 LIGHT EMITTING DIODE  
A light emitting diode includes a light emitting diode chip and first and second encapsulation units respectively of first and second encapsulating materials. The first encapsulation unit...
US20110278550 ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF  
An organic light emitting diode (OLED) display includes a display substrate, an encapsulation substrate facing the display substrate; a soft sealant disposed between the display substrate and the...
US20150137171 CURABLE COMPOSITION  
Provided are a curable composition and its use. The curable composition has excellent processability, workability and adhesiveness, exhibits excellent light extraction efficiency, crack...
US20060060870 Full-color organic light emitting display and method of fabricating the same  
A full-color organic light emitting display (OLED) and method of fabricating the same. The display includes a substrate with a pixel electrode, an organic layer having at least an emission layer,...
US20060102922 LED heat dissipation support  
A light emitting diode chip carrier to improve heat dissipation by providing a thicker heat dissipation area between two supports that carry the light-emitting chip; and heat absorption and...
US20070034890 Multiple die LED and lens optical system  
A light emitting device includes a number of light emitting diode dies (LEDs) mounted on a shared submount and covered with a single lens element that includes a corresponding number of lens...
US20060091418 Side emitting LED device and method of fabrication  
In one embodiment, a light emitting diode (LED) device comprises an LED die for generating output light and an encapsulant sealing the LED die, the encapsulant comprising a conical structure...
US20100025724 Resin Composition for LED Encapsulation  
Disclosed is a resin composition for LED encapsulation including an organic oligosiloxane hybrid prepared by non-hydrolytic condensation of organoalkoxysilane. More particularly, the resin...
US20070029572 LED having improved soldering structure, method for soldering the LED to PCB, and LED assembly manufactured by the method  
The invention relates to an LED with an improved soldering structure, a method of assembling the LED to a PCB, and an LED assembly manufactured by the method. The LED includes an LED chip and a...
US20140231819 LED DEVICE  
An LED device is disclosed in which an LED chip is encapsulated in a encapsulant. The LED device includes an LED chip mounted on a support and electrically connected and an encapsulant...