Matches 1 - 50 out of 107 1 2 3 >


Match Document Document Title
US20110194973 ALUMINUM ALLOY WELDING WIRE  
A composition for welding or brazing aluminum comprises silicon (Si) and magnesium (Mg) along with aluminum in an alloy suitable for use in welding and brazing. The Si content may vary between...
US20130315659 METALLIC COMPOSITIONS USEFUL FOR BRAZING, AND RELATED PROCESSES AND DEVICES  
A braze alloy composition is disclosed, containing nickel, about 5% to about 40% of at least one refractory metal selected from niobium, tantalum, or molybdenum; about 2% to about 32% chromium;...
US20140199115 SOLDER COMPOSITIONS  
A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a...
US20130042912 SOLDER BONDED BODY, METHOD OF PRODUCING SOLDER BONDED BODY, ELEMENT, PHOTOVOLTAIC CELL, METHOD OF PRODUCING ELEMENT AND METHOD OF PRODUCING PHOTOVOLTAIC CELL  
The solder bonded body according to the present invention contains: an oxide body to be bonded having an oxide layer on the surface thereof; and a solder layer bonded to the oxide layer, which the...
US20110272453 METHOD AND DEVICE FOR INTRODUCING SOLDER ONTO A WORKPIECE  
A method and a device for introducing solder onto a solar cell is provided. The method and device employ a solder wire introduced in the molten state onto the solar cell under the action of...
US20100328895 Composite, Thermal Interface Material Containing the Composite, and Methods for Their Preparation and Use  
A composite includes a thermally conductive metal matrix and silicone particles dispersed therein. The composite can be used to form a thermal interface material in an electronic device. The...
US20150231732 ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS  
A microelectronic assembly includes a first substrate having a surface and a first conductive element and a second substrate having a surface and a second conductive element. The assembly further...
US20080236655 Solar module manufacturing processes  
Solar module manufacturing methods for manufacturing a solar electric module including photovoltaic cells. The method includes applying an interconnect material to a flexible electrical backplane...
US20130087605 CONDUCTIVE BONDING MATERIAL, CONDUCTOR BONDING METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD  
A conductive bonding material comprising: a first metal particle; a second metal particle having an average particle diameter larger than an average particle diameter of the first metal particle;...
US20140144971 In System Reflow of Low Temperature Eutectic Bond Balls  
Low temperature bond balls connect two structures having disparate coefficients of linear thermal expansion. An integrated circuit is made to heat the device such that the low temperature bond...
US20130152990 SOLID-LIQUID INTERDIFFUSION BONDING STRUCTURE OF THERMOELECTRIC MODULE AND FABRICATING METHOD THEREOF  
A solid-liquid interdiffusion bonding structure of a thermoelectric module and a fabricating method thereof are provided. The method includes coating a silver, nickel, or copper layer on surfaces...
US20130180772 WIRING BOARD AND METHOD OF MANUFACTURING THE SAME  
Embodiments provide a wiring board which is structured to be suitable for connection with components, whereby its reliability can be improved. An embodied wiring board of the invention has pads...
US20130084467 BRAZING MATERIAL, A METHOD OF BRAZING, A BRAZED ARTICLE, AND A PASTE COMPRISING THIS BRAZING MATERIAL  
A method is provided for brazing products of stainless steel. The method comprises applying an iron-based brazing material to parts of stainless steel wherein the brazing material comprises an...
US20090197114 MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS  
A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead free solder selected from the group comprising Sn—Ag—Cu solder and Sn—Ag solder adhered to the solder...
US20120227886 Substrate Assembly Carrier Using Electrostatic Force  
A portable electrostatic chuck carrier includes a holder having a dielectric top surface, and bipolar electrodes under the dielectric top surface. The bipolar electrodes includes positive...
US20150266137 LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES  
A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt. % of silver, 2.5 to 4 wt. % of bismuth, 0.3 to 0.8 wt. % of copper, 0.03 to 1 wt. %...
US20150072170 FUSION WELDABLE FILLER ALLOYS  
Al—Mg and Al—Mg—Zn weld filler alloy compositions for use with fusion weldable 7xxx, 6xxx, 5xxx and 2xxx series aluminum alloy base metals are disclosed. The weld filler alloys may be used for...
US20080156852 SOLDER FLUX COMPOSITION AND PROCESS OF USING SAME  
A solder flux composition is formulated to lower contact wetting angles on bond pads, and to remain stable until the reflow temperature of the solder. A process includes contacting a bond pad with...
US20120255992 Flux preparation with increased dynamic viscosity containing dehydrated K2A1F5, method to produce it and method to use it  
Aqueous flux preparations with increased dynamic viscosity are provided. In the flux preparations, irreversibly dehydrated K2AlF5 (also denoted as orthorhombic K2AlF5 or phase II salt) provides...
US20120223127 COMPONENTS AND METHODS OF FORMING PROTECTIVE COATING SYSTEMS ON COMPONENTS  
Components and methods of forming a protective coating system on the components are provided. In an embodiment, and by way of example only, the component includes a ceramic substrate and a braze...
US20080011815 METHODS FOR PLACING SUBSTRATES IN CONTACT WITH MOLTEN SOLDER  
Methods and devices for placing a semiconductor wafer or other substrate in contact with solder are described. A wave soldering apparatus includes a solder bath, a nozzle for producing a solder...
US20100028716 NICKEL-BASED BRAZING ALLOY AND METHOD FOR BRAZING  
Brazing alloy with a composition consisting essentially of FeaNiRestCrbMocCudSieBfPg, wherein 0 atomic %<=a<=50 atomic %; 5 atomic %<=b<=18 atomic %; 0.2 atomic %
US20100006336 LID OR CASE FOR SEALED PACKAGE AND METHOD FOR MANUFACTURING THE SAME  
The present invention provides a lid or a case for a sealed package, which is provided with a frame-shaped soldering material on its face to be joined, wherein the frame-shaped soldering material...
US20130224561 BRAZE COMPOSITIONS, AND RELATED ARTICLES AND METHODS  
A braze alloy composition for sealing a ceramic component to a metal component in an electrochemical cell is presented. The braze alloy composition includes nickel, germanium, and an active metal...
US20100288823 Application of Solder to Holes, Coating Processes and Small Solder Rods  
A small solder rod with a stop-off at the end in order to prevent the solder from dripping from an opening is provided. A process for applying solder to a hole in a substrate, wherein the solder...
US20050263571 Injection molded continuously solidified solder method and apparatus  
A method and apparatus for forming solder bumps by molten solder deposition into cavity arrays in a substrate immediately followed by solidification of molten solder such that precise replication...
US20130299561 FRICTION STIR JOINING OF CURVED SURFACES  
A system and method for joining curved surfaces such as pipes by obtaining pipes having additional rough stock material on the pipe ends, the rough stock material being precision machine processed...
US20120205425 MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL VOID FORMATION IN SOLDER JOINTS  
A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead containing or a lead free solder selected from the group comprising Sn—Ag—Cu solder, Sn—Cu solder and...
US20160059361 SINTER PASTE WITH COATED SILVER OXIDE ON NOBLE AND NON-NOBLE SURFACES THAT ARE DIFFICULT TO SINTER  
A mixture contains metal oxide particles that are coated with an organic compound. The mixture may be used to connect components and/or to produce a module. A method for producing the mixture is...
US20150232329 Method for eutectic bonding of two carrier devices  
A method for eutectic bonding of two carrier devices, including the tasks of putting a first layer of a first bonding material on the first carrier device, putting a first layer of a second...
US20100012708 OILFIELD TOOLS COMPRISING MODIFIED-SOLDERED ELECTRONIC COMPONENTS AND METHODS OF MANUFACTURING SAME  
Oilfield tools, assemblies and methods of manufacturing same are described comprising a modified-soldered electronic component, wherein the modified-solder includes a high-melting metal matrix and...
US20100012709 Reflow furnace  
A reflow furnace includes a suction pipe extending within a heating region along a rail on which a conveyor travels. Suction ports are formed on the inner side of the suction pipe. Flux fumes...
US20130075455 REFLOW PRETREATMENT APPARATUS AND REFLOW PRETREATMENT METHOD  
This invention is to prevent tin from being adhered to a surface of part of an object to be soldered, a solder bump being formed in the part thereof. A reflow pretreatment apparatus includes a...
US20100297468 METHODS OF JOINING AND MATERIAL DEPOSITION FOR A WORKPIECE WITH A WORKPIECE AREA MADE FROM A TITANIUM-ALUMINIDE ALLOY  
The invention concerns a method to create fusion-integrated joints of workpieces, in which a workpiece area formed on a workpiece made from a TiAl alloy and a workpiece area formed on another...
US20100147500 CLAD PLATE AND PROCESS FOR PRODUCTION THEREOF  
The invention provides a clad member excellent in strength and brazability and a production method thereof. A clad member comprises a core material, an outer skin layer provided on one surface of...
US20130153646 METHOD FOR SUPPRESSING KIRKENDALL VOIDS FORMATION AT THE INTERFACE BETWEEN SOLDER AND COPPER PAD  
The embodiment of the present invention relates to a method for suppressing Kirkendall voids formation in a solder joint. A solder alloy doped with 0.1˜0.7 weight percent (wt. %) of palladium (Pd)...
US20140097232 BONDING METHOD AND PRODUCTION METHOD  
A bonding method of the present invention is a method of bonding two members (A and B) to each other with use of an Au—Sn solder. According to the bonding method of the present invention, after...
US20120152598 WIRING BOARD AND METHOD OF MANUFACTURING THE SAME  
Disclosed is a method for manufacturing a wiring board including a conductor layer, a solder resist layer laminated on the conductor layer, and a conductor post to be electrically connected to a...
US20130168146 METAL TERMINAL BLOCK ADAPTED FOR SURFACE MOUNTING AND METHOD OF MOUNTING THE SAME  
Provided is a metal terminal block adapted for surface mounting, which includes a metal body having a three-dimensional shape, an outer surface of which includes at least one portion appropriate...
US20050061857 Method for bonding a sputter target to a backing plate and the assembly thereof  
A method for solder bonding a sputter target to a backing plate having a plurality of spaced-apart ridges on its bonding surface to provide a uniform spacing and a uniform solder bonded interface;...
US20150171054 SEMICONDUCTOR COMPONENT AND METHOD FOR MANUFACTURING SEMICONDUCTOR COMPONENT  
According to an embodiment, a semiconductor component includes a circuit board; a semiconductor chip; and a bond part formed by sintering a paste containing metal particles between the circuit...
US20140124365 METHOD OF FORMING A CYLINDRICAL SPUTTER TARGET ASSEMBLY  
In a method of forming a cylindrical sputter target assembly, comprising the steps of: (a) providing a cylindrical backing tube; (b) providing a cylindrical sputter target, the inner diameter of...
US20120279563 SOLDERABLE INTERCONNECT APPARATUS FOR INTERCONNECTING SOLAR CELLS  
Interconnect apparatus and methods for their manufacture are disclosed. An example method for forming a solderable connection to a conductive surface may include forming one or more solderable...
US20100247955 JOINT WITH FIRST AND SECOND MEMBERS WITH A JOINING LAYER LOCATED THEREBETWEEN CONTAINING SN METAL AND ANOTHER METALLIC MATERIAL; METHODS FOR FORMING THE SAME  
The present invention relates to a joint (10) that includes a first member (11) to be jointed, a second member (12) to be jointed and a jointing layer (13) located between the first member (11)...
US20140241897 ALUMINUM BRAZING OF HOLLOW TITANIUM FAN BLADES  
A fan blade includes first and second titanium portions that are secured to one another with an aluminum alloy braze. A method of manufacturing a fan blade includes providing first and second...
US20140226285 Component and Method for Producing a Component  
A component includes a substrate, a chip, and a frame. The frame, the substrate, and the chip enclose a volume. A metal sealing layer is provided which is designed to hermetically seal the volume....
US20130028659 APPARATUS AND METHOD FOR COHESIVE JOINING  
The invention relates to an apparatus and to a process for cohesively joining two plates (1 and 2) having differing melting points, one of which plates, the end plate (1), includes a light metal...
US20120018498 PRE-SOLDER METHOD AND REWORK METHOD FOR MULTI-ROW QFN CHIP  
A pre-solder method for a multi-row quad flat no-lead (QFN) packaged chip is provided. Solder paste is applied on at least one pad of the multi-row QFN packaged chip. The multi-row QFN packaged...
US20140291006 PRINTED CIRCUIT BOARD SOLDER MOUNTING METHOD AND SOLDER MOUNT STRUCTURE  
A printed circuit board solder mounting method of solder-jointing a first-land formed on a first-printed-circuit-board and a second-land formed on a second-printed-circuit-board together,...
US20110106228 BRAZING OF CERAMIC TO METAL COMPONENTS  
A method for making a feedthrough assembly for an implantable electronic medical device comprises providing a metallic ferrule having an outer surface and an aperture defined by an inner lumen...

Matches 1 - 50 out of 107 1 2 3 >