Matches 1 - 50 out of 259 1 2 3 4 5 6 >


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US20150156885 METHOD FOR MANUFACTURING AN ELECTRIC DEVICE BY CONNECTING A WIRING BOARD TO AN OBJECT AND ELECTRIC DEVICE INCLUDING A BOARD  
A method for manufacturing an electric device by connecting a wiring board to an object is disclosed. This method for manufacturing an electric device comprises: applying a wiring board having a...
US20140053899 Increasing the Efficiency of Solar Cells By Transfer of Solder  
Thickening a contact grid of a solar cell for increased efficiency. A mold containing soldering material is heated. The mold is aligned with the contact grid such that the soldering material is in...
US20110308847 Method for high-temperature circuit board assembly  
The creation of a circuit board which contains electrical interconnections between the circuit board traces and electronic devices mounted on the circuit board where the circuit board assembly can...
US20130180772 WIRING BOARD AND METHOD OF MANUFACTURING THE SAME  
Embodiments provide a wiring board which is structured to be suitable for connection with components, whereby its reliability can be improved. An embodied wiring board of the invention has pads...
US20120177814 METHOD FOR IMPROVING COATING  
A system and a method, the method includes determining or receiving a multiple iteration printing scheme indicative of multiple printing iterations of a coating material to be applied on an...
US20130299561 FRICTION STIR JOINING OF CURVED SURFACES  
A system and method for joining curved surfaces such as pipes by obtaining pipes having additional rough stock material on the pipe ends, the rough stock material being precision machine processed...
US20110147440 Solder in Cavity Interconnection Technology  
An interconnection technology may use molded solder to define solder balls. A mask layer may be patterned to form cavities and solder paste deposited in the cavities. Upon heating, solder balls...
US20130220805 Sputtering Target-Backing Plate Assembly and Method for Producing Same  
Provided is a sputtering target-backing plate assembly wherein a Cu—Cr alloy backing plate is bonded to a Ti target via a layer of a strain absorbing material placed at an interface between the Ti...
US20150132143 WELDING PROCESS AND REDUCED RESTRAINT WELD JOINT  
A weld joint (30) having asymmetric sides and providing reduced restraint of weld metal shrinkage and a reduced propensity for weld centerline cracking. The weld joint may have a first side (38)...
US20110315051 Erosion Resistant Hard Composite Materials  
A hard composite composition comprises a binder; and a polymodal blend of matrix powder. In an embodiment, the polymodal blend of matrix powder has at least one local maxima at a particle size of...
US20110241943 METHODS FOR FORMING CAVITY ANTENNAS  
An antenna resonating element may be mounted in an antenna cavity. The antenna resonating element may have a printed circuit board substrate with a patterned metal layer. Components may be...
US20140197228 FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY  
A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture...
US20120312410 FLEXIBLE PIPE CONNECTED WITH FLEXIBLE PIPE CONNECTING STRUCTURE AND METHOD OF CONNECTING FLEXIBLE PIPE CONNECTING STRUCTURE WITH FLEXIBLE PIPE  
The flexible pipe connected with the flexible pipe connecting structure according to an embodiment of the present invention, wherein the connecting structure includes a body part, and a connecting...
US20120312447 MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAKING SAME  
A multi-layer pillar and method of fabricating the same is provided. The multi-layer pillar is used as an interconnect between a chip and substrate. The pillar has at least one low strength, high...
US20120286026 WIRE SOLDER, METHOD OF FEEDING THE SAME AND APPARATUS THEREFOR  
Provided is a solder with high tensile strength and pull cut resistance. The wire solder has an extended wire solder and a core wire having a higher tensile strength than the wire solder. The wire...
US20140124365 METHOD OF FORMING A CYLINDRICAL SPUTTER TARGET ASSEMBLY  
In a method of forming a cylindrical sputter target assembly, comprising the steps of: (a) providing a cylindrical backing tube; (b) providing a cylindrical sputter target, the inner diameter of...
US20150044041 CRACK RESISTANT TURBINE VANE AND METHOD FOR VANE CONTAINMENT CAP ATTACHMENT  
A gas turbine vane containment cap is attached to an inboard surface of the vane inner shroud by penetrating flat weld filler, formed in a root gap between the cap and inner shroud. A...
US20100319967 INHIBITION OF COPPER DISSOLUTION FOR LEAD-FREE SOLDERING  
A device fabrication method, according to which a tin-copper-alloy layer is formed adjacent to a copper-plated pad or pin that is used to electrically connect the device to external wiring....
US20140117001 ALUMINUM ALLOY WELDING WIRE  
A composition for welding or brazing aluminum comprises silicon (Si) and magnesium (Mg) along with aluminum in an alloy suitable for use in welding and brazing. The Si content may vary between...
US20110194973 ALUMINUM ALLOY WELDING WIRE  
A composition for welding or brazing aluminum comprises silicon (Si) and magnesium (Mg) along with aluminum in an alloy suitable for use in welding and brazing. The Si content may vary between...
US20130153646 METHOD FOR SUPPRESSING KIRKENDALL VOIDS FORMATION AT THE INTERFACE BETWEEN SOLDER AND COPPER PAD  
The embodiment of the present invention relates to a method for suppressing Kirkendall voids formation in a solder joint. A solder alloy doped with 0.1˜0.7 weight percent (wt. %) of palladium (Pd)...
US20120255992 Flux preparation with increased dynamic viscosity containing dehydrated K2A1F5, method to produce it and method to use it  
Aqueous flux preparations with increased dynamic viscosity are provided. In the flux preparations, irreversibly dehydrated K2AlF5 (also denoted as orthorhombic K2AlF5 or phase II salt) provides...
US20150235982 APPARATUS FOR EUTECTIC BONDING  
An apparatus for eutectic bonding includes (a) a bonding frame that includes two substrates and (b) a frame device situated on the substrates, the frame device including two frames, the apparatus...
US20120069528 Method for Control of Solder Collapse in Stacked Microelectronic Structure  
A process and product made from the process is disclosed to minimize solder collapse during solder reflow. Predetermined bond pads on a layer or component have a solder paste such as Sn63 solder...
US20150236438 PANE HAVING AN ELECTRICAL CONNECTION ELEMENT  
A pane having a connection element, having; a substrate having an electrically conductive structure on at least a subregion of the substrate, the electrical connection element on at least a...
US20140023777 METHOD FOR PRODUCING WIRING BOARD HAVING THROUGH HOLE OR NON-THROUGH HOLE  
There is provided a circuit board including a substrate having a hole. Inside the hole, a metal wiring is formed. The wiring is made of a solder alloy having a melting point of 100 to 600° C., and...
US20140134459 SOLDER, SOLDER JOINT STRUCTURE AND METHOD OF FORMING SOLDER JOINT STRUCTURE  
A solder and a solder joint structure formed by the solder are provided. The solder includes a zinc-based material, a copper film, and a noble metal film. The copper film completely covers the...
US20130240610 SOLDER PASTE TRANSFER PROCESS  
A solder paste transfer process is provided and includes defining multiple arrangements of solder pad locations on a surface, applying solder paste onto multiple transfer tools coupled to a...
US20110272454 WIRE SOLDER, METHOD OF FEEDING THE SAME AND APPARATUS THEREFOR  
Provided is a wire solder with high tensile strength and pull cut resistance. An apparatus for feeding the wire solder is also provided. The wire solder has an extended wire solder and a core wire...
US20100006336 LID OR CASE FOR SEALED PACKAGE AND METHOD FOR MANUFACTURING THE SAME  
The present invention provides a lid or a case for a sealed package, which is provided with a frame-shaped soldering material on its face to be joined, wherein the frame-shaped soldering material...
US20130277416 REMOTE MELT JOINING METHODS AND REMOTE MELT JOINING SYSTEMS  
Remote melt joining methods include melting a filler material to produce a molten filler material, wherein melting the filler material occurs at a remote distance away from a target site of a...
US20140069817 DIRECT INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON WAFERS  
Solder bumps are provided on round wafers through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned mask...
US20140345939 JOINING METHOD, METHOD FOR PRODUCING ELECTRONIC DEVICE AND ELECTRONIC PART  
In joining a first metal member composed of a first metal to a second metal member composed of a second metal with a joining material interposed therebetween, the joining material including a low...
US20150260316 System and Method for Producing Chemicals at High Temperature  
A system for producing chemicals, such as, ethylene or gasoline, at high temperature (above 1100 degrees C.) having a feedstock source. The system includes a chemical conversion portion connected...
US20150021379 ADDITIVE MANUFACTURING SYSTEM FOR JOINING AND SURFACE OVERLAY  
An additive manufacturing system includes an additive manufacturing tool configured to receive a plurality of metallic anchoring materials and to supply a plurality of droplets to a part, and a...
US20140097232 BONDING METHOD AND PRODUCTION METHOD  
A bonding method of the present invention is a method of bonding two members (A and B) to each other with use of an Au—Sn solder. According to the bonding method of the present invention, after...
US20130186946 SOLDER PASTE TRANSFER PROCESS  
A solder paste transfer process is provided and includes defining an arrangement of solder pad locations on a surface, applying solder paste onto a transfer tool in a pre-defined configuration...
US20130323529 BONDING MATERIAL AND BONDING BODY, AND BONDING METHOD  
There is provided a bonding material capable of forming a bonding body under an inert gas atmosphere such as a nitrogen atmosphere, and capable of exhibiting a bonding strength that endures a...
US20100065246 Methods of fabricating robust integrated heat spreader designs and structures formed thereby  
Methods and associated structures of forming an indium containing solder material directly on an active region of a copper HIS is enabled. A copper indium containing solder intermetallic is formed...
US20080017696 Method For Connecting Joining Parts By Hard-Soldering Or Welding, And An Insert For Use In Carrying Out Said Method  
In the case of the hard-soldering or the welding of joint parts (1,2) which form a notch shaped joint (3), an insert (4) is introduced and soldered or welded in place. As a result, a joint closure...
US20140291006 PRINTED CIRCUIT BOARD SOLDER MOUNTING METHOD AND SOLDER MOUNT STRUCTURE  
A printed circuit board solder mounting method of solder-jointing a first-land formed on a first-printed-circuit-board and a second-land formed on a second-printed-circuit-board together,...
US20150072170 FUSION WELDABLE FILLER ALLOYS  
Al—Mg and Al—Mg—Zn weld filler alloy compositions for use with fusion weldable 7xxx, 6xxx, 5xxx and 2xxx series aluminum alloy base metals are disclosed. The weld filler alloys may be used for...
US20130270327 IMPROVEMENTS OF LONG TERM BONDLINE RELIABILITY OF POWER ELECTRONICS OPERATING AT HIGH TEMPERATURES  
Alloy formation systems and methods and a mechanism, strategy and design for power electronics having high operating temperatures. The system creates a bondline targeted for performance in power...
US20140048587 BRAZING ALLOY AND PROCESSES FOR MAKING AND USING  
Disclosed is a brazing alloy composition. The composition comprises, by weight, about 94% copper, about 4% zinc, and about 2% iron. Further disclosed is a brazing process utilizing the brazing...
US20110073637 Reflow Air Management System and Method  
A reflow module of a reflow oven including a reflow fixture housed within a compartment of the reflow oven, removable side ports attached to the reflow fixture for controlling air flow through the...
US20150179595 SOLDER-ON-DIE USING WATER-SOLUBLE RESIST SYSTEM AND METHOD  
This disclosure relates generally to generating a solder-on-die using a water-soluble resist, system, and method. Heat may be applied to solder as applied to a hole formed in a water-soluble...
US20140203069 METALLIZED FILM-OVER-FOAM CONTACTS  
A metallized film-over-foam contact suitable for circuit grounding of surface mount technology devices generally includes a silicone foam resilient core member, a solderable electrically...
US20120018498 PRE-SOLDER METHOD AND REWORK METHOD FOR MULTI-ROW QFN CHIP  
A pre-solder method for a multi-row quad flat no-lead (QFN) packaged chip is provided. Solder paste is applied on at least one pad of the multi-row QFN packaged chip. The multi-row QFN packaged...
US20110174525 Method and Electronic Assembly to Attach a Component to a Substrate  
A method and an electronic assembly for attaching a component to a substrate, or printed circuit board, is recited. The printed circuit board comprises a solder-nonwettable surface and a bond pad...
US20130028659 APPARATUS AND METHOD FOR COHESIVE JOINING  
The invention relates to an apparatus and to a process for cohesively joining two plates (1 and 2) having differing melting points, one of which plates, the end plate (1), includes a light metal...

Matches 1 - 50 out of 259 1 2 3 4 5 6 >