Matches 1 - 50 out of 175 1 2 3 4 >


Match Document Document Title
US20140097231 SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF  
A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are...
US20110299259 CIRCUIT BOARD WITH CONDUCTOR POST STRUCTURE  
Various circuit board interconnect conductor structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is disclosed that includes forming a conductor post...
US20130206820 SOLDER IN CAVITY INTERCONNECTION TECHNOLOGY  
An interconnection technology may use molded solder to define solder balls. A mask layer may be patterned to form cavities and solder paste deposited in the cavities. Upon heating, solder balls...
US20130062398 Method for Reliably Soldering Microwave Dielectric Ceramics with Metal  
A method for reliably soldering microwave dielectric ceramics with metal adopting the way of vapor soldering, a strict process of heating up, then soldering under heat preservation and finally...
US20080185422 Stainless steel for fume extracters  
A stainless steel for a fume extractor which has a main body formed by stamping and soldering includes a stainless steel base board of a selected thickness. The stainless steel base board has the...
US20110226842 WATER HEATER THREADED WELD FITTING HAVING IMPROVED WELD INTEGRITY  
A threaded weld fitting and a method of welding a threaded weld fitting to the tank wall of a water storage tank are provided. The threaded weld fitting comprises a body defining an aperture and...
US20110100692 Circuit Board with Variable Topography Solder Interconnects  
Various circuit boards and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes applying a solder mask to a first side of a first circuit...
US20110139856 BONDING STRUCTURE AND METHOD FOR MANUFACTURING SAME  
A bonding structure that a bonding region can endure a high temperature environment and the bonding can be maintained with high reliability is provided as a bonding material capable of maintaining...
US20120305633 INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON SUBSTRATES  
Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a...
US20120305631 INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON SUBSTRATES  
Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a...
US20110159310 Methods of fabricating low melting point solder reinforced sealant and structures formed thereby  
Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a...
US20110197666 Pressure Measuring Glow Plug  
The invention relates to a device for determining the combustion chamber pressure. The device includes a tubular base, a glow filament which projects from the tubular base, and at least one sensor...
US20130027963 TEXTILE PRODUCT HAVING A LIGHTING FUNCTION AND METHOD FOR THE PRODUCTION THEREOF  
The invention provides a textile product (1) having a lighting function. The textile product (1) comprises (a) a coated textile structure (2) comprising a textile (200) with a first textile...
US20140124365 METHOD OF FORMING A CYLINDRICAL SPUTTER TARGET ASSEMBLY  
In a method of forming a cylindrical sputter target assembly, comprising the steps of: (a) providing a cylindrical backing tube; (b) providing a cylindrical sputter target, the inner diameter of...
US20090250507 Soldering method and system thereof  
A soldering system includes a circuit board having first soldering terminals, a soldering object having second soldering terminals, soldering blocks disposed between the circuit board and the...
US20130032189 High Temperature Thermoelectrics  
In accordance with one embodiment of the present disclosure, a thermoelectric device includes a plurality of thermoelectric elements that each include a diffusion barrier. The diffusion barrier...
US20120111927 ALUMINUM BOND PADS WITH ENHANCED WIRE BOND STABILITY  
A method of forming an electronic device bond pad includes providing an electronic device substrate having an Al bond pad located thereover. An aluminum layer is formed over the Al bond pad. A...
US20120160361 Construction and Manufacturing of Long Tubes with Embedded Corrosion- and Wear-Resistant Coatings Applied Directly to the Interior Surfaces  
The invention relates to the manufacture of protective coatings onto interior surface of long-length tubes or pipes having relatively small diameter, in order to prevent corrosion-, erosion-, or...
US20140069817 DIRECT INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON WAFERS  
Solder bumps are provided on round wafers through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned mask...
US20120273483 COOKING VESSEL APPLICABLE FOR INDUCTION HEATING AND METHOD FOR MANUFACTURING THEREOF  
A cooking vessel, such as kettle, frying pan or cooking pot, has a bottom part suitable for heating by induction. In solutions known before, an attachment of ferromagnetic plate, placed at the...
US20080233426 Steel sheeting for use in room size radio frequency shielded enclosures and method for making improved steel sheeting  
A radio-frequency shield comprised of a sheet of steel and tin-plating on at least one side of said sheet of steel. In addition, a method of making a radio-frequency shielding consisting of...
US20100065246 Methods of fabricating robust integrated heat spreader designs and structures formed thereby  
Methods and associated structures of forming an indium containing solder material directly on an active region of a copper HIS is enabled. A copper indium containing solder intermetallic is formed...
US20120305298 BUMP WITH NANOLAMINATED STRUCTURE, PACKAGE STRUCTURE OF THE SAME, AND METHOD OF PREPARING THE SAME  
A bump with nanolaminated structure is provided. The bump with nanolaminated structure includes a bump, a nanolaminated structure and an organic layer. The nanolaminated structure is located on...
US20120325899 Dross Removal  
This invention relates to for devices, systems, and methods for separating dross, carried by molten solder, into solder and residue.
US20090214890 BRAZED ALUMINUM LAMINATE MOLD TOOLING  
A laminate aluminum block for forming an article includes a series of aluminum laminate plates to collectively form a tool body for forming an article in a forming operation. A series of aluminum...
US20120052313 OBJECTS ASSEMBLY THROUGH A SEALING BEAD INCLUDING INTERMETALLIC COMPOUNDS  
An assembly of two objects integral with each other through at least one linking element provided between both objects, said linking element including at least a first material portion comprising...
US20070164087 Method for repair of housings  
A method is provided for repairing a housing having a bore formed therein, wherein the bore has an original diameter and a surface defined in part by the housing. The method may include the steps...
US20150179595 SOLDER-ON-DIE USING WATER-SOLUBLE RESIST SYSTEM AND METHOD  
This disclosure relates generally to generating a solder-on-die using a water-soluble resist, system, and method. Heat may be applied to solder as applied to a hole formed in a water-soluble...
US20100059883 METHOD OF FORMING BALL BOND  
A method of forming a ball bond (10) includes forming a bonding ball (12) at an end of a bonding wire (16). The bonding ball (12) is preformed to a substantially ball bond shape at a preform...
US20050017056 Method for setting a protective coating on the inner wall of a tube, tube and in particular weapon tube obtained by said method  
The invention concerns a method for setting a protective coating (4) on the inner wall of a tube (2). Said method is characterized in that it consists in producing a cylindrical bushing having a...
US20140017509 BONDED OBJECT OF TUNGSTEN CARBIDE-BASED SUPERHARD ALLOY AND PROCESS FOR PRODUCING SAME  
Provided in the present invention is a bonded tungsten carbide-based super hard alloy assembly equipped with a first metal member having a first bonding surface and comprised of a steel material...
US20090261147 Dross Removal  
This invention relates to for devices, systems, and methods for separating dross, carried by molten solder, into solder and residue.
US20050184133 Laser cleaning system for a wire bonding machine  
A wire bonding system for attaching a wire between bonding pads on a semiconductor device and a substrate. The wire bonding system includes a frame and a bonding head attached to the frame and...
US20120148870 SELF-REMOVAL ANTI-STICTION COATING FOR BONDING PROCESS  
A bond free of an anti-stiction layer and bonding method is disclosed. An exemplary method includes forming a first bonding layer; forming an interlayer over the first bonding layer; forming an...
US20110017338 ALUMINUM FOIL BASED HOSE  
An ultra low permeability fluid member for conveying a fluid (e.g., a hose, tube, etc.) having a metal vapor barrier layer (22) formed around an inner tube (14). The metal vapor layer (22) is...
US20130004685 Method for Sealing Curved Vacuum Glass and Curved Vacuum Glass  
A method for sealing the curved vacuum glass comprises: first preparing metallized layer bonded with the glass plate on the edge surface of the curved glass to be sealed by locally heating the...
US20090197114 MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS  
A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead free solder selected from the group comprising Sn—Ag—Cu solder and Sn—Ag solder adhered to the solder...
US20110195267 FLUX AND SOLDER MATERIAL AND METHOD OF MAKING SAME  
A flux for use in soldering comprises a primary solids constituent present in an amount greater than about 50 wt. % and one or more secondary constituents that is selected from solvents,...
US20110274484 METHOD FOR PRODUCING A HOLLOW PROFILE JOINT AND A HOLLOW PROFILE  
In a method for producing a joint between a hollow profile made from steel and a component made from an aluminum material, a positive and material joint is produced by a braze welding process in...
US20080097248 Mechanical honing of metallic tubing for soldering in a medical device construction  
Medical devices and methods for manufacturing medical devices. An example manufacturing method includes providing a metallic tubular member having a inner surface with a metal oxide layer disposed...
US20070267464 CYCLIC HYDROFLUOROETHER COMPOUNDS AND PROCESSES FOR THEIR PREPARATION AND USE  
A hydrofluoroether compound comprises at least one five- or six-membered, perfluorinated heterocyclic ring, each ring comprising four or five ring carbon atoms and one or two catenated heteroatoms...
US20090001138 Method for preventing void formation in a solder joint  
In one disclosed embodiment, the present method for preventing void formation in a solder joint formed between two metallic surfaces includes forming at least one slit in a layer of solder to form...
US20080110963 METHODS OF SECURING A THERMOCOUPLE TO A CERAMIC SUBSTRATE  
Methods of securing a thermocouple to a ceramic substrate are provided. The thermocouple includes a pair of wires that define a junction, and the method comprises directly bonding the junction of...
US20080166585 Sprayed weld strip for improved weldability  
A method for welding to a superalloy material without causing cracking of the material. The method includes the steps of depositing a weld strip (18) of a weldable material onto a superalloy...
US20140087171 Carbon Fiber Reinforced Eutectic Alloy Materials and Methods of Manufacture  
Certain embodiments here include compositions of matter and methods of manufacturing a ply composition, comprising a piece of fabric, wherein the fabric includes a plurality of plated tows, and...
US20150060030 PLATE HEAT EXCHANGER  
Disclosed is a method for producing a permanently joined plate heat exchanger comprising a plurality of metal heat exchanger plates having a solidus temperature above 1100° C., provided beside...
US20060037996 Pre-treatment of galvanized steel sheets and aluminum plates for improved weldability  
A method for the improvement of welding properties of galvanized steel panels by pretreatment of the surface in the joint zone provided for the welding connection in which a stream of an...
US20060213957 Conductive trace formation via wicking action  
A wetting zone is defined within a substrate. A conductive material is applied to the wetting zone. A conductive trace is at least partially formed within the wetting zone from the conductive...
US20080191367 SEMICONDUCTOR PACKAGE WIRE BONDING  
A stacked die semiconductor package comprises a die coupled to a substrate, the first die having a die bonding area, a bonding wire supporting layer affixed to a top surface of the first die, and...
US20090242617 Permanent Magnet Temporary Demagnetization Temperature Rise Technique and Their Application for Soldering  
A method for raising a demagnetization temperature of a permanent magnet is disclosed. The method provides a ferromagnetic arrangement around the magnet to increase demagnetization thresholds for...

Matches 1 - 50 out of 175 1 2 3 4 >