Matches 1 - 50 out of 129 1 2 3 >


Match Document Document Title
US20130270329 3D Packaging With Low-Force Thermocompression Bonding Of Oxidizable Materials  
Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold...
US20150060527 NON-UNIFORM HEATER FOR REDUCED TEMPERATURE GRADIENT DURING THERMAL COMPRESSION BONDING  
Embodiments of a method for performing a thermal compression bonding process with a non-uniform temperature pattern and a heater having the non-uniform temperature pattern are disclosed. In some...
US20120181075 FLEXIBLE FLAT CABLE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME  
A flexible flat cable assembly (1), comprises: a printed circuit board (3) defining a plurality of conductive pads (31) formed thereon; and a flexible flat cable (2) electrically connected with...
US20140254124 Stud Bump Bonding in Implantable Medical Devices  
Presented herein are stud bump bonding techniques for electrically connecting an elongate conductor, such as a wire or pin, to a bonding pad. A plurality of stud bumps are bonded to a surface of a...
US20150195920 DOUBLE SOLDER BUMPS ON SUBSTRATES FOR LOW TEMPERATURE FLIP CHIP BONDING  
Multiple injections of molten solder are employed to form double solder bumps having outer layers that melt at lower temperatures than the inner portions thereof. During a flip chip assembly...
US20110226841 ROOM TEMPERATURE DIRECT METAL-METAL BONDING  
A method for forming direct metal-metal bond between metallic surfaces is disclosed. The method comprises depositing a first nanostructured organic coating (118) on a first metallic surface (116)...
US20130200135 COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME  
Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic...
US20120018498 PRE-SOLDER METHOD AND REWORK METHOD FOR MULTI-ROW QFN CHIP  
A pre-solder method for a multi-row quad flat no-lead (QFN) packaged chip is provided. Solder paste is applied on at least one pad of the multi-row QFN packaged chip. The multi-row QFN packaged...
US20120186857 METHOD FOR MANUFACTURING WIRING BOARD FOR MOUNTING ELECTRONIC COMPONENT, WIRING BOARD FOR MOUNTING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING WIRING BOARD HAVING AN ELECTRONIC COMPONENT  
A method for manufacturing a wiring board for mounting an electronic component, a wiring board for mounting an electronic component, and a method for manufacturing an electronic-component-mounted...
US20150223346 DUAL SOLDER LAYER FOR FLUIDIC SELF ASSEMBLY AND ELECTRICAL COMPONENT SUBSTRATE AND METHOD EMPLOYING SAME  
A dual solder layer for fluidic self assembly, an electrical component substrate, and method employing same is described. The dual solder layer comprises a layer of a self-assembly solder disposed...
US20150115020 SOLDER BUMP, METHOD FOR FORMING A SOLDER BUMP, SUBSTRATE PROVIDED WITH SOLDER BUMP, AND METHOD FOR MANUFACTURING SUBSTRATE  
Provided is a solder bump forming method capable of forming solder bumps having a desired constant thickness, without any failure such as copper corrosion, on a mounting board such as a printed...
US20120298406 REDUCED STRESS GULL WING SOLDER JOINTS FOR PRINTED WIRING BOARD CONNECTIONS  
Micro-vias that are conventionally used for vertical connections in wire or circuit boards may be used for an entirely different purpose; the micro-vias may be used in the creation of solder...
US20090181223 METHOD OF FABRICATING SOLDER BUMPS  
A semiconductor solder bump structure having a solder bump with at least a first solder and a second solder attached to the first solder, producing one solder bump having at least two different...
US20070102478 Optimal imaging system and method for a stencil printer  
A stencil printer for depositing solder paste onto an electronic substrate includes a frame and a stencil coupled to the frame. A dispenser is coupled to the frame, with the dispenser and the...
US20070007323 STANDOFF STRUCTURES FOR SURFACE MOUNT COMPONENTS  
Increasing standoff height for surface mount components mounted to a laminate by image screening at least one standoff structure in a footprint area on the laminate surface. The standoff structure...
US20070045387 Method for hybridisation of two components by using different sized solder protrusions and a device that uses two components hybridised according to this method  
The hybridisation method involves: providing a first component 1 with first pads 3 for accommodating protrusions, providing a second component 2 with second pads 5 for accommodating protrusions,...
US20060255092 Spreading apparatus with vibrator and spreading method thereof  
The present invention provides a spreading apparatus with a vibrator and a spreading method. The spreading apparatus includes a pattern plate, a scraper module, and a vibrator. The pattern plate...
US20070130755 Electronics assembly machine with embedded solder paste inspection  
A pick and place machine includes a placement head configured to releasably grasp a component for placement. A robotic system is coupled to the placement head to generate relative movement between...
US20060091184 METHOD OF MITIGATING VOIDS DURING SOLDER REFLOW  
A Solder bump is formed by providing solder material on a conductive site of a substrate. The solder material is reflowed to provide a solder bump on the substrate. The solder material is...
US20130105559 CONDUCTIVE SIDEWALL FOR MICROBUMPS  
Electromigration in microbump connections causes voids in the microbumps, which reduces the lifetime of an integrated circuit containing the microbump, Electromigration lifetime may be increased...
US20090250814 Flip Chip Interconnection Structure Having Void-Free Fine Pitch and Method Thereof  
A semiconductor device is made by providing a semiconductor die having a contact pad, forming a circular solder bump on the contact pad, providing a substrate having a trace line, disposing a...
US20060011712 IMPROVED DECAL SOLDER TRANSFER METHOD  
A method is provided for forming alloy deposits at selected areas on a receiving substrate, including providing a decal alloy carrier, having alloy loadable areas in selected positions thereof,...
US20120104076 JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT  
A practical bonding technique is provided for solid-phase room-temperature bonding not requiring a profile irregularity of the order of several nanometers, in which a high-vacuum energy wave...
US20140246481 BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATMENT METHOD, AND SYSTEM THEREFOR  
A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided. A temporary bonding agent 55 is applied onto...
US20050269385 Soldering method and solder joints formed therein  
This invention forms an indium or indium alloy layer on top of a Sn based lead-free solder. The indium or indium alloy layer can be formed by various methods, such as plating, deposition,...
US20120061705 Method for Treating Metal Surfaces  
A method for treating a metal surface to reduce corrosion thereon and/or to increase the reflectance of the treated surface, the method comprising a) plating a metal surface with an electroless...
US20090078745 Method for forming interconnects  
A method for forming interconnects between a component and a substrate. The method comprises determining at least one location of differential flexing between a component and a substrate during...
US20080244900 Flux for Soldering and Soldering Process  
There is provided a flux for soldering and a soldering process which form better solder connection without the occurrence of the poor connection nor the insulation degradation. Such flux which is...
US20110220398 METHOD OF MANUFACTURING ELECTRONIC APPARATUS, ELECTRONIC COMPONENT-MOUNTING BOARD, AND METHOD OF MANUFACTURING THE SAME  
A method of manufacturing an electronic apparatus including a first and a second components, includes: forming a first solder bump on one of the first component and the second component; forming a...
US20090020591 CONDUCTIVE BALL MOUNTING METHOD  
There is provided a method of mounting one conductive ball on each of a plurality of connection pads on a substrate. The method includes: (a) providing a pre-alignment base including: a support...
US20150027224 Micromechanical Measuring Element and Method for Producing a Micromechanical Measuring Element  
A micromechanical measuring element includes a carrier and a sensitive element connected to the carrier by a first solder connection and a second solder connection. The sensitive element is...
US20090289101 METHOD FOR BALL GRID ARRAY (BGA) SOLDER ATTACH FOR SURFACE MOUNT  
A method is provided for solder reflow which includes the steps of providing a receptacle having receptacle pads formed on an upper surface and placing a component on the receptacle, the component...
US20050072834 Connection site coating method and solder joints  
Disclosed are methods and apparatus forming a solder joint (18) for electronic components and PCB assembly (10). Disclosed representative embodiments of the methods and resulting apparatus include...
US20140063748 METHOD FOR PRODUCING A CIRCUIT BOARD SYSTEM AND A CIRCUIT BOARD ARRANGEMENT  
Methods for producing a circuit board system and a circuit board arrangement are disclosed. One method for producing a circuit board system includes: providing a first circuit board including a...
US20070119911 Method of forming a composite standoff on a circuit board  
A composite standoff is formed on a circuit board during the processing of the circuit board while an array of electrical circuit traces including contact pads are formed, portions of the...
US20070102477 Imaging system and method for a stencil printer  
A stencil printer for depositing solder paste onto a plurality of pads of an electronic substrate includes a frame and a stencil coupled to the frame. The stencil has a plurality of apertures...
US20100320258 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE  
In one embodiment, a first substrate having first solder bumps and a second substrate having second solder bumps are stacked while temporarily tacking the solder bumps to each other, and then a...
US20140124925 MULTI-SOLDER TECHNIQUES AND CONFIGURATIONS FOR INTEGRATED CIRCUIT PACKAGE ASSEMBLY  
Embodiments of the present disclosure are directed towards multi-solder techniques and configurations for integrated circuit (IC) package assembly. In one embodiment, a method includes depositing...
US20120318854 THERMALLY DECOMPOSABLE POLYMER COMPOSITIONS INCORPORATING THERMALLY ACTIVATED BASE GENERATORS  
Embodiments in accordance with the present invention provide sacrifical polymer compositions and methods for fabricating electronic devices using such sacrifical polymer compositions where such...
US20140218881 MOUNTING METHOD OF ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MOUNT BODY, AND MANUFACTURING METHOD THEREOF  
An electronic component is provided with two or more component terminals. A mount board is provided with two or more board terminals. The board terminal is provided with an inclined portion on a...
US20130223014 MECHANISMS FOR CONTROLLING BUMP HEIGHT VARIATION  
The mechanisms for forming bumps on packaged dies and package substrates reduce variation of bump heights across the packaged dies and packaged substrates. Bumps are designed to have different...
US20130153645 Process for Hybrid Integration of Focal Plane Arrays  
A method for aligning a first substrate relative to a second substrate by enabling reflow of low-melting-temperature solder bumps is disclosed. Reflow of the solder bumps induces a force that...
US20120249659 CIRCUITS AND METHODS USING A NON-GOLD CORROSION INHIBITOR  
A circuit can include a die configured to electronically control particular elements and a flex circuit having copper leads coated with a non-gold corrosion inhibitor, the flex circuit being...
US20120318853 HEATER BLOCK FOR WIRE BONDING SYSTEM  
A heater block for a wire bonding system includes a mounting base configured to receive a lead frame and a semiconductor die mounted on the lead frame. A heating structure is removably coupled to...
US20140092565 OPTICAL MODULE WITH AN ELECTRONIC CONNECTOR ALIGNED WITH A SUBSTRATE AND A METHOD TO ASSEMBLE THE SAME  
An optical module having a substrate and an electrical connector whose terminals are precisely aligned with pads on the substrate is disclosed. The electrical connector provides upper and lower...
US20140061285 CONNECTION VERIFICATION TECHNIQUE  
Some embodiments of the present invention are generally directed to testing connections of a memory device to a circuit board or other device. In one embodiment, a memory device that is configured...
US20150165537 3D TSV ASSEMBLY METHOD FOR MASS REFLOW  
Disclosed herein is a method that includes picking up a plate with a nozzle, the plate including at least one opening to allow air to flow therethrough. The method includes picking up a die with...
US20050133572 Methods of forming solder areas on electronic components and electronic components having solder areas  
Disclosed are methods of forming solder areas on electronic components. The methods involve: (a) providing a substrate having one or more contact pads; and (b) applying a solder paste over the...
US20150041974 SINTERED BODY OF SILVER FINE PARTICLE  
A sintered body of silver fine particles for a bonding member to bond components of a semiconductor device, wherein an activation energy for creep of the sintered body of the silver fine particles...
US20140231492 ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMENT MACHINE, AND ELECTRONIC COMPONENT MOUNTING SYSTEM  
Disclosed is an electronic component mounting method including the steps of: providing a first electronic component having a principal surface provided with a plurality of bumps; providing a...

Matches 1 - 50 out of 129 1 2 3 >