Matches 1 - 50 out of 118 1 2 3 >


Match Document Document Title
US20110308847 Method for high-temperature circuit board assembly  
The creation of a circuit board which contains electrical interconnections between the circuit board traces and electronic devices mounted on the circuit board where the circuit board assembly can...
US20130334292 Printed Circuit Boards  
A printed circuit board to which a localised solder connection is to be made, the surface of said printed circuit board having a continuous or non-continuous coating of a composition comprising a...
US20120267422 SOLDERING ASSISTANCE DEVICE AND SOLDERING METHOD THEREOF  
A soldering assistance device is used for soldering a multi-pin electronic element with a row of pins on a PCB. The row of pins includes an outer pin at two ends thereof. The soldering assistance...
US20130288544 COST OPTIMIZED CELL VOLTAGE TAP-OFF CONNECTION  
A voltage tap element configured to tap off the voltage of a battery cell of a battery unit by an electronics unit, a cell supervisory unit having such voltage tap elements, and a battery unit...
US20120292088 ELECTRONIC DEVICE WITH OBLIQUELY CONNECTED COMPONENTS  
According to the disclosure, an electronic device comprising a circuit board and an electrical component is disclosed. The circuit board has a first surface and includes a solder pad array...
US20120080508 LINEAR CELL STRINGING  
Techniques for linear cell stringing are disclosed. In some embodiments, a plurality of sets of solar cells are linearly positioned, a plurality of tabbing ribbon segments are placed in contact...
US20110100692 Circuit Board with Variable Topography Solder Interconnects  
Various circuit boards and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes applying a solder mask to a first side of a first circuit...
US20110308850 NOTCH POSITIONING TYPE SOLDERING STRUCTURE AND METHOD FOR PREVENTING PIN DEVIATION  
A notch positioning type soldering structure and a method for preventing a pin deviation can prevent a plurality of pins of an electronic component from being deviated when the pins are soldered...
US20060037995 Heatslug to leadframe attachment  
A method for coupling a heat slug to a lead frame, comprising aligning a heat slug and a lead frame depositing a material between the heat slug and the lead frame, and clamping together the heat...
US20110293971 Battery Module  
The present invention discloses a battery module including a casing capable of supporting a plurality of battery cells and having a circuit board holding structure, a circuit board held by the...
US20130105195 Carbon Nanotube Enhanced Conductors for Communications Cables and Related Communications Cables and Methods  
A conductor for a communications cable includes an elongated metal wire and a metal sheet that includes a plurality of carbon nanotubes that at least partially surrounds the elongated metal wire....
US20120175404 METHOD OF MANUFACTURING LED LIGHT BAR AND MANUFACTURING EQUIPMENT THEREOF  
A manufacturing equipment for manufacturing an LED light bar includes a reflow oven and a clamping device. The LED light bar includes a printed circuit board and a plurality of LEDs arranged on...
US20150194236 WELDING WASHERS FOR MICROWIRE WELDING  
In various embodiments, welding washers are utilized to establish electrical connections between electrically conductive wires and electrically conductive pins.
US20050045696 Method of securing a flat cable to a circuit board  
A method of securing a flat cable to a circuit board including the steps of providing a flat cable with a plurality of round conductors therein and a circuit board having a plurality of solder...
US20060124702 Method of soldering electronic part and soldering device for soldering the same  
In a soldering method of soldering a lead of an electronic part to a land of a printed circuit board, a heating ray is applied in a condition that a shielding member is arranged on a surface of...
US20110304086 SHADOW FRAME AND MANUFACTURING METHOD THEREOF  
A shadow frame and a method of manufacturing the shadow frame are disclosed. The shadow frame is utilized in photoelectrical semiconductor manufacturing processes and is utilized for fixing a...
US20150224892 INTEGRATED VOLTAGE SENSE AND BUS BAR SYSTEM AND METHOD FOR VEHICLES HAVING A TRACTION BATTERY  
A vehicle includes a traction battery having a plurality of battery cells positioned in an array with a non-conductive bus bar housing having a plurality of compartments insulated from one another...
US20130077948 SURFACE MOUNT ACTUATOR  
A silicon MEMS device can have at least one solder contact formed thereupon. The silicon MEMS device can be configured to be mounted to a circuit board via the solder contact(s). The silicon MEMS...
US20150008253 TRANSIENT LIQUID PHASE BONDING PROCESS FOR DOUBLE SIDED POWER MODULES  
A double-sided bonding process using transient liquid phase (TLP) bonding structure. A first side of an electronic device is processed to partially complete bonding. A second side of the...
US20120018493 METHOD FOR MANUFACTURING A HIGH-TEMPERATURE ELECTROLYSER OR A HIGH-TEMPERATURE FUEL CELL COMPRISING A STACK OF ELEMENTARY CELLS  
A method for manufacturing a high temperature electrolyzer <> or a high temperature fuel cell <>, comprising a vertical stack of n elementary planar cells alternating with n+1 interconnection...
US20110132423 Photovoltaic solar module comprising bifacial solar cells  
A photovoltaic solar cell module comprises a plurality of bifacial solar cells and electrical conductors. Each bifacial solar cell comprises a plurality of bus-bar contacts. A phosphorous silicon...
US20110122590 EPOXY RESIN FORMULATIONS FOR UNDERFILL APPLICATIONS  
Disclosed is a low viscosity, low to no chloride containing epoxy resin formulation including a divinylbenzene dioxide as a component in the formulation; wherein the formulation is useful for the...
US20140263582 LOW COST INTERPOSER AND METHOD OF FABRICATION  
A method for making an interposer is provided. A conductive layer is formed by contacting a replicate such that a shape of a surface of the conductive layer conforms to a shape of the contacted...
US20130014801 BACK CONTACT SOLAR MODULE AND ELECTRODE SOLDERING METHOD THEREFOR  
A back contact solar module and an electrode soldering method therefor are disclosed. The back contact solar module includes a substrate, two solar cells formed on the substrate, and a curved...
US20070157464 Soldering driving elements in LCD panels  
An apparatus and method for soldering an LED driving element to an LCD panel includes a panel holding unit, a rotating unit and a soldering unit. The panel holding unit holds the display panel....
US20120189901 BATTERY CELL, BATTERY MODULE INCORPORATED WITH SAME AND METHOD FOR PRODUCING THE BATTERY MODULE  
The invention relates to a battery cell provided on its peripheral side surface, instead of on its bottom surface, with a welding zone for connection to a metal strip. The invention also relates...
US20090321501 METHOD OF FABRICATING WIRE ON WIRE STITCH BONDING IN A SEMICONDUCTOR DEVICE  
A low profile semiconductor package is disclosed including at least first and second stacked semiconductor die mounted to a substrate. The first semiconductor die may be electrically coupled to...
US20130105980 SINTERABLE BONDING MATERIAL USING COPPER NANOPARTICLES, PROCESS FOR PRODUCING SAME, AND METHOD OF BONDING ELECTRONIC COMPONENT  
Disclosed is a sinterable bonding material which is a liquid or a paste containing copper nanoparticles having a particle diameter of 1,000 nm or less, in which the copper nanoparticles have one...
US20130334291 METHOD OF FORMING SOLDER ON PAD ON FINE PITCH PCB AND METHOD OF FLIP CHIP BONDING SEMICONDUCTOR USING THE SAME  
Disclosed are a method of forming a solder on pad on a fine pitch PCB and a method of flip chip bonding a semiconductor device using the same. The method of forming a solder on pad on a fine pitch...
US20150214534 DEVICES AND METHODS FOR CONNECTING BATTERY CELLS  
A vehicle traction battery assembly includes a bus bar insulator having a recess configured to receive a bus bar and an opposite side covering the bus bar and defining a welding slot sized to...
US20150144390 WIRING BOARD AND METHOD FOR MOUNTING SEMICONDUCTOR ELEMENT ON WIRING BOARD  
A wiring board of the present invention includes an insulating board having a mounting portion on an upper surface to mount a semiconductor element, and semiconductor element connection pads...
US20100310964 Sealing assembly for a fuel cell stack and method for manufacturing a fuel cell stack  
In order to provide a sealing assembly for a fuel cell stack comprising a plurality of fuel cell units, which are arranged consecutively in a stacking direction, wherein each of the fuel cell...
US20130105558 Bonding Structure Manufacturing Method, Heating And Melting Treatment Method, And System Therefor  
A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided. A temporary bonding agent 55 is applied onto...
US20070119910 Process for attaching components with near-zero standoff to printed circuit boards  
The present invention relates to a method and apparatus for mounting electrical components to electric circuit boards. Specifically, the present invention relates to a method for mounting...
US20150147674 SOLID ELECTROLYTE LAMINATE, METHOD FOR MANUFACTURING SOLID ELECTROLYTE LAMINATE, AND FUEL CELL  
An object is to provide a solid electrolyte laminate that allows a large amount of gas to be supplied to a fuel electrode while having improved strength and a method for manufacturing such a solid...
US20130277098 MOUNTED STRUCTURE AND MANUFACTURING METHOD OF MOUNTED STRUCTURE  
The present invention has an aspect to provide a mounted structure of which heat-resistant fatigue characteristic is improved. A mounted structure is provided with a substrate having a substrate...
US20140118881 CAPACITOR AND METHOD OF MANUFACTURING THE SAME  
There is provided a capacitor, including: a first substrate: a first capacitance generation part formed on the first substrate; a protective layer formed on the first capacitance generation part;...
US20110253767 Manufacturing method for electronic devices  
A manufacturing method for an electronic device joining a first metallic bond part formed on a first electronic component and a second metallic bond part formed on a second electronic component...
US20090267227 PLASTIC BALL GRID ARRAY RUGGEDIZATION  
A method and product which provides a thin metal or ceramic plate to the top of a plastic grid array (PGA) as a stiffener to maintain its flatness over temperature during a column attach process,...
US20090050677 METHOD OF WELDING ELECTRONIC COMPONENTS ON PCBS  
An exemplary method of welding electronic components on PCBs is disclosed. Firstly, a metal tray including a number of supporting areas is provided. At least one through hole is formed in each of...
US20120318851 CHIP BONDING PROCESS  
A chip bonding process includes the following steps. At least one chip is transferred onto a carrier, and a negative pressure environment is provided. Heat is provided to the at least one chip...
US20120153008 JOINED STRUCTURE, METHOD FOR PRODUCING THE SAME, AND ANISOTROPIC CONDUCTIVE FILM USED FOR THE SAME  
A joined structure of the present invention including a first substrate having a wiring thereon, any one of a second substrate and an electronic part, and an anisotropic conductive film containing...
US20110210954 INTEGRATED FRAME BATTERY CELL  
An electrolyte containment structure for an electrode jelly roll and electrolyte in a portable power source is described. The electrolyte containment structure comprises metal foil, such as metal...
US20080245846 HEAT CYCLE-ABLE CONNECTION  
A method of creating an electrical connection involves providing a pair of contacts each on one of two different chips, the pair of contacts defining a volume therebetween, the volume containing...
US20090224026 ELECTRONIC COMPONENT MOUNTING METHOD  
An electronic component mounting method that is to mount on a board 3 an electronic component 11 formed with solder bumps 16 on a lower surface thereof Solder paste 19 is printed onto the...
US20140043783 PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD  
Provided is a printed wiring board including a first heat dissipation pattern placed in one surface layer on which a semiconductor package is to be mounted, a second heat dissipation pattern...
US20140134473 ELECTRICAL INTERCONNECT AND METHOD OF ASSEMBLING A RECHARGEABLE BATTERY  
An electrical interconnect is disclosed that includes an inner conductive material having a top surface and a bottom surface; and an outer conductive material different from the inner conductive...
US20110071397 LARGE AREA MODULAR SENSOR ARRAY ASSEMBLY AND METHOD FOR MAKING THE SAME  
A modular and tileable sensor array with routing in the interposer carrying the signals from the sensors to the integrated circuits. In one embodiment a large area modular sensor array assembly...
US20060278617 Laser welding of battery module enclosure components  
A through transmission laser welding system for a battery module enclosure includes a first battery module enclosure component. A second battery module enclosure component interfaces with the...
US20140193658 LOW VOID SOLDER JOINT FOR MULTIPLE REFLOW APPLICATIONS  
Methods and apparatus are provided for attaching a heat spreader to a die and includes disposing a solder thermal interface material between a first surface of a die and a first surface of a heat...

Matches 1 - 50 out of 118 1 2 3 >