Matches 1 - 50 out of 85 1 2 >


Match Document Document Title
US20110319300 Systems for Filling a Sample Array by Droplet Dragging  
A method and an array filling system for loading a plurality of disparate sample containers, the sample containers comprising an integral structure. Each receptacle is characterized by a...
US20060213885 MICRO-MACHINING EMPLOYING MULTIPLE INDEPENDENTLY FOCUSED AND INDEPENDENTLY STEERED BEAMS  
A system for delivering energy to a substrate includes a laser energy source providing at least two laser beams, wherein each of the beams is steered to an independently selectable location on a...
US20050064137 Method for forming nanoscale features and structures produced thereby  
The invention provides a versatile technique for machining of nanometer-scale features using tightly-focused ultrashort laser pulses. By the invention, the size of features can be reduced far...
US20080197120 Method For Producing a Hole and Associated Device  
Conventional methods for producing a hole in a component make use of special lasers with short laser pulse lengths. The aim of the invention is to reduce the time and money required for producing...
US20090194516 METHOD AND APPARATUS FOR VIA DRILLING AND SELECTIVE MATERIAL REMOVAL USING AN ULTRAFAST PULSE LASER  
A method and apparatus for selective material removal and via drilling for semiconductor applications using an ultrafast laser pulse directly from an ultrafast pulse laser oscillator without...
US20050087522 Laser processing of a locally heated target material  
A method and laser system effect rapid removal of material from a workpiece by applying heating energy in the form of a light beam to a target location on the workpiece to elevate its temperature...
US20090057282 Laser machining method utilizing variable inclination angle  
A method of laser machining is disclosed. The method of laser machining may include directing a laser beam emitted by an optical device onto a workpiece at an inclination angle to create a cut in...
US20120102959 SUBSTRATE WITH SHAPED COOLING HOLES AND METHODS OF MANUFACTURE  
A substrate having one or more shaped effusion cooling holes formed therein. Each shaped cooling hole has a bore angled relative to an exit surface of the combustor liner. One end of the bore is...
US20110017280 PARTIALLY TRANSPARENT SOLAR PANEL  
A method is described for forming a partially transparent thin film solar panel by providing an array of unconnected holes in an opaque layer of the panel the holes being sufficiently small so...
US20120164376 METHOD OF MODIFYING A SUBSTRATE FOR PASSAGE HOLE FORMATION THEREIN, AND RELATED ARTICLES  
A method for the formation of at least one passage hole in a high-temperature substrate is described. For each desired passage hole or group of passage holes, a node is first formed on the...
US20110163078 DEVICE AND METHOD FOR MACHINING WORKPIECE WITH A LASER BEAM  
A laser machining device machines a workpiece having a machining portion where a hole is machined and a non-machining portion positioned on an extension of the hole. The laser machining device...
US20050029238 Method for laser machining  
A method for laser machining includes the steps of: providing a workpiece (10); coating a protective layer (102) of polyimide on the workpiece; machining the workpiece with laser; and removing the...
US20110114610 Controlling Slag Adhesion When Piercing a Workpiece With a Laser Beam  
Piercing a workpiece with a laser beam, while directing multiple gas flows onto the workpiece at angles and locations that cause the gas flows to blow slag away from the piercing location and...
US20060065648 Method and device for removing burr by high-density energy beam  
A burr removing device for removing a burr, which is formed at a connection between a first hole and a second hole that are angled relative to each other inside a workpiece. According to the burr...
US20120043497 Working Component for Magnetic Heat Exchange and Method of Producing a Working Component for Magnetic Refrigeration  
A working component for magnetic heat exchange comprises a magnetocalorically active phase comprising La1-aRa(Fe1-x-yTyMx)13Hz, a hydrogen content, z, 90% or higher of a hydrogen saturation value,...
US20090230103 LASER BEAM PROCESSING MACHINE  
A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, a...
US20160005654 SYSTEM FOR MANUFACTURING A SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME  
Provided are a system and method for manufacturing a semiconductor package. The system includes: a laser marker configured to irradiate a first laser beam on a strip to make a mark on the strip;...
US20050230369 System for and method of manufacturing gravure printing plates  
A method of operating a laser drilling system to manufacture gravure printing plates without etching or the use of hazardous chemicals includes activating a laser drilling system, including a...
US20060091126 Ultraviolet laser ablative patterning of microstructures in semiconductors  
Patterns with feature sizes of less than 50 microns are rapidly formed directly in semiconductors, particularly silicon, GaAs, indium phosphide, or single crystalline sapphire, using ultraviolet...
US20130210245 INTERPOSER AND METHOD FOR PRODUCING HOLES IN AN INTERPOSER  
An interposer for electrical connection between a CPU chip and a circuit board is provided. The interposer includes a board-shaped base substrate made of glass having a coefficient of thermal...
US20050230367 System for and method of manufacturing gravure printing plates  
A method of operating a laser drilling system to manufacture gravure printing plates without etching or the use of hazardous chemicals includes activating a laser drilling system, including a...
US20050184035 Pulsed laser beam machining method and apparatus for machining a wiring board at multiple locations  
In a laser beam machining method for a wiring board, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to 200 μs and...
US20110272387 Laser drilling without burr formation  
A process for making a hole into a substrate by a laser is provided. According to the proposed process, in a first step, at least one intermediate hole is produced into the substrate by at least...
US20070138154 Method of forming via hole using laser beam  
Provided is a method of forming a via hole using a laser beam. The method includes forming a first hole in the first metal layer by irradiating a laser beam having a predetermined frequency;...
US20070045254 Wafer drilling method  
A wafer drilling method for forming via holes reaching electrodes in a wafer having a plurality of devices formed on the front surface of a substrate and electrodes formed on the devices by...
US20100126974 METHOD OF PRODUCING DRIP IRRIGATION TUBES  
In a method for producing drip irrigation tubes, a tube body is extruded, in which tube body dosing elements are inserted and are connected to the inner surface of the tube body. In the region of...
US20150231738 LASER PROCESSING METHOD  
A laser processing method includes steps of providing a mask material of which thickness is equal to or greater than 10 μm onto an object, and forming a hole in the object or cutting the object in...
US20160243655 COMPONENT REPAIR USING CONFINED LASER DRILLING  
A method for repairing one or more holes in a near wall of a component is provided. The method includes determining updated hole information, including an updated location, of a first hole in the...
US20060231536 Method for the introduction of an integrated predetermined rupture line in a planar expansive body  
The invention is directed to a method for introducing an integrated predetermined breaking line in a planar extending article. The method is particularly suitable for introducing an invisible...
US20050230368 System for and method of manufacturing gravure printing plates  
A method of operating a laser drilling system to manufacture gravure printing plates without etching or the use of hazardous chemicals includes activating a laser drilling system, including a...
US20140312015 LASER PROCESSING APPARATUS, METHOD OF LASER PROCESSING, METHOD OF FABRICATING SUBSTRATE, AND METHOD OF FABRICATING INKJET HEAD  
In the case where the workpiece (1) is processed, the laser beam is S-polarized by an optical modulator (7). Thus, the laser beam is mainly diverted toward a workpiece (1) by a polarizer (6). An...
US20100276505 DRILLING IN STRETCHED SUBSTRATES  
The present invention provides a method and apparatus for drilling a plurality of holes in a stretched substrate in at least two directions not in the same plane, including providing a substrate...
US20150352671 LASER CUTTING SAME SIDE SLUG REMOVAL  
A method of laser cutting a slug from a workpiece may include angling a laser cutting head other than perpendicular relative to a cutting surface of a layer of the workpiece from which the slug...
US20140332512 LASER DRILLING WITHOUT BURR FORMATION  
A process for making a hole into a substrate by at least one laser includes a first step which involves producing at least one intermediate hole with a diameter which is smaller than a final...
US20100116799 ROLLER MACHINING METHOD AND ROLLER MACHINING APPARATUS  
A laser beam 21 outputted by a laser oscillator 3 is collected by a machining head 4, so that the surface of a roller 2 is irradiated with the laser beam. An encoder 5c outputs a signal in...
US20160199943 METHOD AND SYSTEM FOR CONFINED LASER DRILLING  
A method for drilling a hole in a component is provided. The method includes directing a confined laser beam of the confined laser drill towards a first hole position on a near wall of the...
US20150251277 METHOD OF LASER DRILLING A COMPONENT  
A method of laser drilling a component is disclosed. The method includes contacting a sacrificial material with the component. The method also includes aligning a laser drilling tool with the...
US20160279738 LASER MACHINING METHOD AND LASER MACHINING APPARATUS  
A laser machining method includes forming a through-hole in a workpiece by emitting a laser light; generating image data by taking an image, with a camera, of the workpiece in which the...
US20080237205 SMALL HOLE LASER MACHINING METHOD  
A method of laser machining a small hole with high machining precision in a machined object. The method includes the steps of emitting a laser beam with a fixed optical axis onto a machined object...
US20120205355 Method for producing an asymmetric diffuser using different laser positions  
A process for producing a hole with an asymmetrical diffuser is produced. The angular position of the laser with respect to the substrate is changed discontinuously during the processing. The...
US20060064153 Intravascular stent and method for producing the stent  
An intravascular stent or a similar filigree structure is produced in one piece from a cylindrical thin-walled tube. The stent has a plurality of bridges with side faces and apertures delimited by...
US20140151348 METHOD FOR GENERATING AT LEAST ONE THROUGH-HOLE AND DEVICE FOR CARRYING OUT SUCH A METHOD  
The invention relates to a method for generating at least one through-hole (3, 4) in a wall of a workpiece (2) bounding a hollow space (12) of the workpiece (2), said method using a laser beam (7)...
US20150075845 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME  
Disclosed herein are a printed circuit board and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board includes: a base...
US20050263497 System for laser drilling of shaped holes  
A laser drilling apparatus comprising an apparatus for emitting a plurality of laser pulses, an apparatus for deflecting the plurality of laser pulses at a part, an apparatus for positioning the...
US20110147351 LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD  
A laser processing apparatus for piercing a workpiece and cutting the pierced workpiece by irradiating the workpiece with a laser beam. The apparatus includes: a laser beam projection unit for...
US20130020291 LASER DRILLING METHODS OF SHALLOW-ANGLED HOLES  
A method for providing a shallow-angled hole through a metal component, such as a turbine combustor, includes a step of applying a pulse laser beam to drill a section of the hole substantially...
US20160263707 LASER DRILLING METHODS OF SHALLOW-ANGLED HOLE  
A method for providing a hole through a metal engine component having a base metal and thermal barrier coating layer forming a top surface of the component, the hole having a central axis...
US20160199941 METHOD AND SYSTEM FOR CONFINED LASER DRILLING  
A method for drilling a hole in a component is provided. The method includes positioning a confined laser drill within a predetermined distance of a near wall of the component for directing a...
US20150367451 HIGH POWER FIBER LASER EFFUSION HOLE DRILLING APPARATUS AND METHOD OF USING SAME  
A fiber laser-treated workpiece is configured with a body having a discontinuous surface which defines a plurality of spaced through-going passages so that each passage is delimited by a...
US20100062214 Method for drilling micro-hole and structure thereof  
Disclosed is a micro-hole structure and a method for forming the micro-hole. A working energy source is projected onto a predetermined drilling site on a first surface of a substrate for a given...

Matches 1 - 50 out of 85 1 2 >