Matches 1 - 50 out of 259 1 2 3 4 5 6 >


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US20080179301 Systems and methods for etching materials  
Systems and methods for etching materials are disclosed herein. Embodiments of the disclosed subject matter include methods for marking at least one capillary, including etching the at least one...
US20060200981 Method of making a biosensor  
A method of making a biosensor is provided. The biosensor includes an electrically conductive material on a base and electrode patterns formed on the base, the patterns having different feature...
US20060207975 High-speed, precision, laser-based method and system for processing material of one or more targets within a field  
A precision, laser-based method and system for high-speed, sequential processing of material of targets within a field are disclosed that control the irradiation distribution pattern of imaged...
US20060180580 High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby  
An improved method of laser marking semiconductor wafers is provided wherein undesirable subsurface damage to a silicon semiconductor wafer is avoided while providing a relative improvement in...
US20060138108 Processing a memory link with a set of at least two laser pulses  
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of...
US20060131287 Processing a memory link with a set of at least two laser pulses  
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of...
US20060131284 Processing a memory link with a set of at least two laser pulses  
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of...
US20060138110 Processing a memory link with a set of at least two laser pulses  
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of...
US20060138109 Processing a memory link with a set of at least two laser pulses  
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of...
US20060138107 Processing a memory link with a set of at least two laser pulses  
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of...
US20060138106 Processing a memory link with a set of at least two laser pulses  
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of...
US20060131286 Processing a memory link with a set of at least two laser pulses  
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of...
US20060054608 Method and system for calibrating a laser processing system and laser marking system utilizing same  
A method of calibrating a laser marking system includes calibrating a laser marking system in three dimensions. The step of calibrating includes storing data corresponding to a plurality of...
US20060000814 Laser-based method and system for processing targeted surface material and article produced thereby  
A laser-based method and system for processing targeted surface material and article produced thereby are provided. The system processes the targeted surface material within a region of a...
US20110276090 MEDICAL PRODUCT , A SURGICAL KIT, AND A METHOD FOR PRODUCING THE MEDICAL PRODUCT  
A medical product including a biocompatible material includes two mutually opposite main surfaces, wherein at least one of the two main surfaces that anchor biological tissues, wherein the barbs...
US20070075058 High-speed, precision, laser-based method and system for processing material of one or more targets within a field  
A precision, laser-based method and system for high-speed, sequential processing of material of targets within a field are disclosed that control the irradiation distribution pattern of imaged...
US20060255023 Processing spot defined by a plurality of laser beams  
In a method for forming printing indicia to accept printing ink on a processing surface of a printing form associated with a printing cylinder, at least first and second laser beams are provided...
US20060249495 Methods for preparing ball grid array substrates via use of a laser  
A method of using a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the...
US20060186096 High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby  
An improved method of laser marking semiconductor wafers is provided wherein undesirable subsurface damage to a silicon semiconductor wafer is avoided while providing a relative improvement in...
US20060131288 Processing a memory link with a set of at least two laser pulses  
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of...
US20150049593 METHOD FOR ENGRAVING A TIMEPIECE COMPONENT AND TIMEPIECE COMPONENT OBTAINED USING SUCH A METHOD  
Method for engraving a component (1; 3) involving application to the component of a laser beam (5) the pulses of which each last less than one picosecond, so as to machine or remove material from...
US20060249493 Methods for preparing ball grid array substrates via use of a laser  
A method of using a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the...
US20060249492 Methods for preparing ball grid array substrates via use of a laser  
A method of using a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the...
US20060163573 Method for preparing ball grid array substrates via use of a laser  
A method of using a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the...
US20050199598 Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site  
A high-speed method and system for precisely positioning a waist of a material-processing laser beam to dynamically compensate for local variations in height of microstructures located on a...
US20150001194 LASER PROCESSING SYSTEMS AND METHODS FOR BEAM DITHERING AND SKIVING  
A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining...
US20130180966 LASER CUTTING SYSTEM AND METHODS FOR CREATING SELF-RETAINING SUTURES  
A laser-machining system and method is disclosed for forming retainers on a suture thread. The laser system is preferably a femtosecond laser system which is capable of creating submicron features...
US20060249494 Methods for preparing ball grid array substrates via use of a laser  
A method of using a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the...
US20140151347 METHOD OF FORMING A WELD NOTCH IN A SHEET METAL PIECE  
Sheet metal pieces intended to be welded can be made with weld notches located along one or more edges. A weld notch is characterized by the absence of certain material constituents so that they...
US20130200050 LINK PROCESSING WITH HIGH SPEED BEAM DEFLECTION  
The present invention relates to the field of laser processing methods and systems, and specifically, to laser processing methods and systems for laser processing multi-material devices. Systems...
US20120168412 APPARATUS AND METHOD FOR FORMING AN APERTURE IN A SUBSTRATE  
A method of forming an aperture in a substrate having a first side and a second side opposite the first side includes irradiating the substrate with a laser beam to form a laser-machined feature...
US20070272666 Infrared laser wafer scribing using short pulses  
Systems and methods are provided for scribing wafers to efficiently ablate passivation and/or encapsulation layers while reducing or eliminating chipping and cracking in the passivation and/or...
US20060207976 Laser material micromachining with green femtosecond pulses  
Various embodiments of a system described herein relate to micromachining materials using ultrashort visible laser pulses. The ultrashort laser pulses may be green and have a wavelength between...
US20050211680 Systems and methods for laser texturing of surfaces of a substrate  
The present application is directed to a method of modifying a surface of an article and includes irradiating pulsed laser light output at repetition rates in excess of about 1kHz, directing the...
US20150086677 METHOD AND APPARATUS FOR LASER MARKING OBJECTS  
Embodiments of the present invention comprise an apparatus for laser marking individual objects with indicia at a marking station wherein a predetermined window exists during which each object can...
US20100252543 LASER-SCRIBING TOOL ARCHITECTURE  
The present disclosure relates to apparatuses and systems for laser scribing a vertically-oriented workpiece. In many embodiments, a laser-scribing apparatus includes a frame, a first fixture...
US20060283845 Laser processing  
The invention provides a system and method for vaporizing a target structure on a substrate. According to the invention, a calculation is performed, as a function of wavelength, of an incident...
US20050203637 Structures and devices for parenteral drug delivery and diagnostic sampling  
A structure for and method of manufacture of structures for implantation within the tissue of a mammalian subject are disclosed. These structures can be utilized in applications such as the...
US20130164506 APPARATUS FOR THE SELECTIVE SEPARATION OF TWO LAYERS OF MATERIAL USING AN ULTRASHORT PULSE SOURCE OF ELECTROMAGNETIC RADIATION  
A direct-write apparatus and end use device for selective separation of at least one layer of material from another layer of material at the interface between them using a beam of electromagnetic...
US20100164220 Secure Identification Document and Method for Producing It  
The invention relates to a secure identification document having two main surfaces (S1, S2; S3,S4) and at least one edge, and comprising at least two constitution layers (20,22; 24,26), said...
US20060021977 Process and apparatus for scoring a brittle material incorporating moving optical assembly  
A method for scoring flat glass sheet includes moving an optical assembly, which is adapted to direct electromagnetic radiation from a radiation source. The method also includes impinging the...
US20050035097 Altering the emission of an ablation beam for safety or control  
The present invention includes an apparatus and a method of controlling the emission of a surgical ablation beam in a beam path from a surgical-probe end, including setting a maximum distance for...
US20110282454 Interbody Spinal Implant Having Internally Textured Surfaces  
An interbody spinal implant including a body, the body comprising: a top surface; a bottom surface; opposing lateral sides; and opposing anterior and posterior portions; the top surface, bottom...
US20110278269 METHOD AND SYSTEM FOR ELECTRICAL CIRCUIT REPAIR  
A system and method of repairing electrical circuits including employing a laser and at least one laser beam delivery pathway for laser pre-treatment of at least one conductor repair area of a...
US20090255911 LASER SCRIBING PLATFORM AND HYBRID WRITING STRATEGY  
Laser scribing can be performed on a workpiece (104) such as substrates with layers formed thereon for use in a solar panel without need to rotate the workpiece (104) during the scribing process....
US20050167405 Optical ablation using material composition analysis  
The present invention relates to methods and systems for controlling ablation based on analysis of material removed from a surface, that includes the steps of generating an initial...
US20050155956 Laser processing method and processing device  
Laser beam is irradiated to a surface of a processing target after reforming a cross section of the laser beam with a mask having a pierced hole by concentrating the laser beam passing through the...
US20050064137 Method for forming nanoscale features and structures produced thereby  
The invention provides a versatile technique for machining of nanometer-scale features using tightly-focused ultrashort laser pulses. By the invention, the size of features can be reduced far...
US20140202742 TWO-SIDED LASER PATTERNING ON THIN FILM SUBSTRATES  
Disclosed herein are double-sided transparent conductive films suitable for patterning by laser ablation.
US20130075941 METHOD FOR BONDING PLASTIC MOLD MEMBER ONTO METAL HOUSING  
A method for bonding a plastic member onto a metal housing is provided. A metal housing having an inner surface and an outer surface is prepared. A hollow-carved area is provided on the metal...

Matches 1 - 50 out of 259 1 2 3 4 5 6 >