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US20080179301 |
Systems and methods for etching materials
Systems and methods for etching materials are disclosed herein. Embodiments of the disclosed subject matter include methods for marking at least one capillary, including etching the at least one... |
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US20060200981 |
Method of making a biosensor
A method of making a biosensor is provided. The biosensor includes an electrically conductive material on a base and electrode patterns formed on the base, the patterns having different feature... |
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US20060207975 |
High-speed, precision, laser-based method and system for processing material of one or more targets within a field
A precision, laser-based method and system for high-speed, sequential processing of material of targets within a field are disclosed that control the irradiation distribution pattern of imaged... |
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US20060180580 |
High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby
An improved method of laser marking semiconductor wafers is provided wherein undesirable subsurface damage to a silicon semiconductor wafer is avoided while providing a relative improvement in... |
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US20060138108 |
Processing a memory link with a set of at least two laser pulses
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of... |
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US20060131287 |
Processing a memory link with a set of at least two laser pulses
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of... |
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US20060131284 |
Processing a memory link with a set of at least two laser pulses
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of... |
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US20060138110 |
Processing a memory link with a set of at least two laser pulses
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of... |
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US20060138109 |
Processing a memory link with a set of at least two laser pulses
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of... |
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US20060138107 |
Processing a memory link with a set of at least two laser pulses
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of... |
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US20060138106 |
Processing a memory link with a set of at least two laser pulses
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of... |
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US20060131286 |
Processing a memory link with a set of at least two laser pulses
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of... |
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US20060054608 |
Method and system for calibrating a laser processing system and laser marking system utilizing same
A method of calibrating a laser marking system includes calibrating a laser marking system in three dimensions. The step of calibrating includes storing data corresponding to a plurality of... |
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US20060000814 |
Laser-based method and system for processing targeted surface material and article produced thereby
A laser-based method and system for processing targeted surface material and article produced thereby are provided. The system processes the targeted surface material within a region of a... |
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US20110276090 |
MEDICAL PRODUCT , A SURGICAL KIT, AND A METHOD FOR PRODUCING THE MEDICAL PRODUCT
A medical product including a biocompatible material includes two mutually opposite main surfaces, wherein at least one of the two main surfaces that anchor biological tissues, wherein the barbs... |
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US20070075058 |
High-speed, precision, laser-based method and system for processing material of one or more targets within a field
A precision, laser-based method and system for high-speed, sequential processing of material of targets within a field are disclosed that control the irradiation distribution pattern of imaged... |
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US20060255023 |
Processing spot defined by a plurality of laser beams
In a method for forming printing indicia to accept printing ink on a processing surface of a printing form associated with a printing cylinder, at least first and second laser beams are provided... |
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US20060249495 |
Methods for preparing ball grid array substrates via use of a laser
A method of using a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the... |
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US20060186096 |
High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby
An improved method of laser marking semiconductor wafers is provided wherein undesirable subsurface damage to a silicon semiconductor wafer is avoided while providing a relative improvement in... |
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US20060131288 |
Processing a memory link with a set of at least two laser pulses
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of... |
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US20150049593 |
METHOD FOR ENGRAVING A TIMEPIECE COMPONENT AND TIMEPIECE COMPONENT OBTAINED USING SUCH A METHOD
Method for engraving a component (1; 3) involving application to the component of a laser beam (5) the pulses of which each last less than one picosecond, so as to machine or remove material from... |
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US20060249493 |
Methods for preparing ball grid array substrates via use of a laser
A method of using a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the... |
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US20060249492 |
Methods for preparing ball grid array substrates via use of a laser
A method of using a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the... |
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US20060163573 |
Method for preparing ball grid array substrates via use of a laser
A method of using a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the... |
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US20050199598 |
Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site
A high-speed method and system for precisely positioning a waist of a material-processing laser beam to dynamically compensate for local variations in height of microstructures located on a... |
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US20150001194 |
LASER PROCESSING SYSTEMS AND METHODS FOR BEAM DITHERING AND SKIVING
A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining... |
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US20130180966 |
LASER CUTTING SYSTEM AND METHODS FOR CREATING SELF-RETAINING SUTURES
A laser-machining system and method is disclosed for forming retainers on a suture thread. The laser system is preferably a femtosecond laser system which is capable of creating submicron features... |
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US20060249494 |
Methods for preparing ball grid array substrates via use of a laser
A method of using a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the... |
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US20140151347 |
METHOD OF FORMING A WELD NOTCH IN A SHEET METAL PIECE
Sheet metal pieces intended to be welded can be made with weld notches located along one or more edges. A weld notch is characterized by the absence of certain material constituents so that they... |
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US20130200050 |
LINK PROCESSING WITH HIGH SPEED BEAM DEFLECTION
The present invention relates to the field of laser processing methods and systems, and specifically, to laser processing methods and systems for laser processing multi-material devices. Systems... |
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US20120168412 |
APPARATUS AND METHOD FOR FORMING AN APERTURE IN A SUBSTRATE
A method of forming an aperture in a substrate having a first side and a second side opposite the first side includes irradiating the substrate with a laser beam to form a laser-machined feature... |
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US20070272666 |
Infrared laser wafer scribing using short pulses
Systems and methods are provided for scribing wafers to efficiently ablate passivation and/or encapsulation layers while reducing or eliminating chipping and cracking in the passivation and/or... |
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US20060207976 |
Laser material micromachining with green femtosecond pulses
Various embodiments of a system described herein relate to micromachining materials using ultrashort visible laser pulses. The ultrashort laser pulses may be green and have a wavelength between... |
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US20050211680 |
Systems and methods for laser texturing of surfaces of a substrate
The present application is directed to a method of modifying a surface of an article and includes irradiating pulsed laser light output at repetition rates in excess of about 1kHz, directing the... |
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US20150086677 |
METHOD AND APPARATUS FOR LASER MARKING OBJECTS
Embodiments of the present invention comprise an apparatus for laser marking individual objects with indicia at a marking station wherein a predetermined window exists during which each object can... |
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US20100252543 |
LASER-SCRIBING TOOL ARCHITECTURE
The present disclosure relates to apparatuses and systems for laser scribing a vertically-oriented workpiece. In many embodiments, a laser-scribing apparatus includes a frame, a first fixture... |
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US20060283845 |
Laser processing
The invention provides a system and method for vaporizing a target structure on a substrate. According to the invention, a calculation is performed, as a function of wavelength, of an incident... |
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US20050203637 |
Structures and devices for parenteral drug delivery and diagnostic sampling
A structure for and method of manufacture of structures for implantation within the tissue of a mammalian subject are disclosed. These structures can be utilized in applications such as the... |
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US20130164506 |
APPARATUS FOR THE SELECTIVE SEPARATION OF TWO LAYERS OF MATERIAL USING AN ULTRASHORT PULSE SOURCE OF ELECTROMAGNETIC RADIATION
A direct-write apparatus and end use device for selective separation of at least one layer of material from another layer of material at the interface between them using a beam of electromagnetic... |
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US20100164220 |
Secure Identification Document and Method for Producing It
The invention relates to a secure identification document having two main surfaces (S1, S2; S3,S4) and at least one edge, and comprising at least two constitution layers (20,22; 24,26), said... |
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US20060021977 |
Process and apparatus for scoring a brittle material incorporating moving optical assembly
A method for scoring flat glass sheet includes moving an optical assembly, which is adapted to direct electromagnetic radiation from a radiation source. The method also includes impinging the... |
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US20050035097 |
Altering the emission of an ablation beam for safety or control
The present invention includes an apparatus and a method of controlling the emission of a surgical ablation beam in a beam path from a surgical-probe end, including setting a maximum distance for... |
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US20110282454 |
Interbody Spinal Implant Having Internally Textured Surfaces
An interbody spinal implant including a body, the body comprising: a top surface; a bottom surface; opposing lateral sides; and opposing anterior and posterior portions; the top surface, bottom... |
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US20110278269 |
METHOD AND SYSTEM FOR ELECTRICAL CIRCUIT REPAIR
A system and method of repairing electrical circuits including employing a laser and at least one laser beam delivery pathway for laser pre-treatment of at least one conductor repair area of a... |
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US20090255911 |
LASER SCRIBING PLATFORM AND HYBRID WRITING STRATEGY
Laser scribing can be performed on a workpiece (104) such as substrates with layers formed thereon for use in a solar panel without need to rotate the workpiece (104) during the scribing process.... |
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US20050167405 |
Optical ablation using material composition analysis
The present invention relates to methods and systems for controlling ablation based on analysis of material removed from a surface, that includes the steps of generating an initial... |
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US20050155956 |
Laser processing method and processing device
Laser beam is irradiated to a surface of a processing target after reforming a cross section of the laser beam with a mask having a pierced hole by concentrating the laser beam passing through the... |
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US20050064137 |
Method for forming nanoscale features and structures produced thereby
The invention provides a versatile technique for machining of nanometer-scale features using tightly-focused ultrashort laser pulses. By the invention, the size of features can be reduced far... |
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US20140202742 |
TWO-SIDED LASER PATTERNING ON THIN FILM SUBSTRATES
Disclosed herein are double-sided transparent conductive films suitable for patterning by laser ablation. |
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US20130075941 |
METHOD FOR BONDING PLASTIC MOLD MEMBER ONTO METAL HOUSING
A method for bonding a plastic member onto a metal housing is provided. A metal housing having an inner surface and an outer surface is prepared. A hollow-carved area is provided on the metal... |