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US20110222228 |
ELECTRONIC CARD CONTAINING A DISPLAY WINDOW AND METHOD FOR MANUFACTURING AN ELECTRONIC CARD CONTAINING A DISPLAY WINDOW
One embodiment of the invention relates to an electronic card containing a clear display window. The electronic card includes a printed circuit board, having a top surface and a bottom surface and... |
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US20150008021 |
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
A printed wiring board includes an interlayer resin insulation layer, multiple pads formed on the interlayer resin insulation layer, and multiple metal posts having bonding material portions and... |
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US20150034365 |
METHOD FOR MANUFACTURING WIRING BOARD AND WIRING BOARD
A method for manufacturing a wiring board includes preparing a wiring board having an insulation layer, a conductive pattern and a solder-resist layer laminated such that the solder-resist layer... |
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US20150101848 |
SURFACE-TREATED COPPER FOIL AND COPPER-CLAD LAMINATE PLATE INCLUDING THE SAME, PRINTED CURCUIT BOARD USING THE SAME, AND METHOD FOR MANUFACTURING THE SAME
Disclosed herein are a surface-treated copper foil, a copper-clad laminate plate including the same, a printed circuit board using the same, and a method for manufacturing the same. In detail, the... |
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US20130043564 |
ATTACHING A MEMS TO A BONDING WAFER
A MEMS is attached to a bonding wafer in part by forming a support layer over the MEMS. A first eutectic layer is formed over the support layer. The eutectic layer is patterned into segments to... |
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US20100078200 |
FLEX CIRCUIT ASSEMBLY WITH A DUMMY TRACE BETWEEN TWO SIGNAL TRACES
A flex circuit comprises a base film, a first adhesive layer coupled with the base film, at least two signal traces coupled with the first adhesive layer, and at least one dummy trace positioned... |
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US20150230335 |
COPPER CLAD LAMINATE AND METHOD FOR MANUFACTURING THE SAME
Embodiments of the invention provide a copper clad laminate, and more particularly, to a copper clad laminate and a method for manufacturing the same capable of increasing a peel strength by... |
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US20130206721 |
METHOD FOR MANUFACTURING A TOUCH PANEL
A method for manufacturing a touch panel includes the following steps. A mother plate is provided. A plurality of adhesive materials are formed on the mother plate. A plurality of cover glasses... |
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US20130147317 |
MEMS KINETIC ENERGY CONVERSION
The present disclosure provides a micro device. The device has a micro-electro-mechanical systems (MEMS) movable structure, a plurality of metal loops over the MEMS movable structure, a... |
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US20130306357 |
EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USNG THE SAME
Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin comprising a dicyclopentadiene type epoxy resin; (B) a copolymer of styrene and maleic... |
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US20130220685 |
COPPER FOIL FOR PRINTED WIRING BOARD, METHOD FOR PRODUCING SAID COPPER FOIL, RESIN SUBSTRATE FOR PRINTED WIRING BOARD AND PRINTED WIRING BOARD
A copper foil for a printed wiring board, the copper foil being characterized by having, on at least one surface thereof, a roughed layer of the copper foil in which an average diameter at a... |
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US20150034590 |
METHOD FOR PRODUCING PRINTED-WIRING BOARD
The present invention provides a method for producing a printed-wiring board in a semi-additive process, comprising the steps of: providing a chemical copper plating 4 on an insulation layer 3 or... |
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US20150101847 |
RIGID-FLEXIBLE PRINTED CIRCUIT BOARD,METHOD FOR MANUFACTURING SAME,AND PRINTED CIRCUIT BOARD MODULE
A rigid-flexible printed circuit board (PCB) a method for manufacturing the rigid-flexible PCB, and a PCB module having the rigid-flexible PCB are provided. The rigid-flexible printed circuit... |
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US20130213701 |
MANUFACTURING METHOD OF PRINTED WIRING BOARD AND PRINTED WIRING BOARD
Object of the present invention is to provide a method for manufacturing a printed wiring board which enables fine wiring formation at low costs and with high yields without introducing any... |
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US20150087007 |
MICROFLUIDIC ELECTROCAGE DEVICE AND CELL MEDIUM FOR TRAPPING AND ROTATING CELLS FOR LIVE-CELL COMPUTED TOMOGRAPHY (CT)
A microfluidic device useable for performing live cell computed tomography imaging is fabricated with a cover portion including a first wafer with at least one metal patterned thereon, a base... |
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US20140124249 |
PCB BOARD, CORE FOR MANUFACTURING THE PCB BOARD AND METHOD FOR MANUFACTURING THE PCB BOARD
The present invention provides a printed circuit board (PCB) board, a core for manufacturing the PCB board and a method for manufacturing the PCB board. The PCB board is in a shape of a rectangle... |
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US20140296078 |
METHODS OF SPLICING 2G REBCO HIGH TEMPERATURE SUPERCONDUCTORS USING PARTIAL MICRO-MELTING DIFFUSION PRESSURIZED SPLICING BY DIRECT FACT-TO-FACE CONTACT OF HIGH TEMPERATURE SUPECONDCTING LAYERS AND RECOVERING SUPERCONDUCTIVITY BY OXYGENATION ANNEALING
Disclosed is a splicing method of two second-generation ReBCO high temperature superconductor coated conductors (2G ReBCO HTS CCs), in which, with stabilizing layers removed from the two strands... |
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US20150053465 |
THIN FLEXIBLE CIRCUITS
An approach for making thin flexible circuits. A layer of dielectric may have one or two surfaces coated with metal. The dielectric and the metal may each have a sub-mil thickness. The dielectric... |
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US20150042906 |
TOUCH SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME
Disclosed herein is a touch sensor module, including: a window substrate; a touch sensor formed to face the window substrate and having an electrode pattern on a surface; an adhesive layer... |
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US20130319737 |
MULTILAYER ELECTRONIC STRUCTURE WITH INTEGRAL STEPPED STACKED STRUCTURES
A multilayer electronic support structure comprising a plurality of layers extending in an X-Y plane consisting of a dielectric material surrounding metal via posts that conduct in a Z direction... |
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US20150250030 |
METHOD FOR MANUFACTURING GRAPHENE ELECTROMAGNETIC WAVE BLOCKING PLATE AND MICROWAVE OVEN USING SAME
The present invention relates to graphene and, more particularly, to a method for manufacturing a graphene electromagnetic wave blocking plate capable of blocking electromagnetic waves by using... |
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US20140338452 |
TRI-AXIAL MEMS ACCELEROMETER
A tri-axial MEMS accelerometer includes a top cap silicon wafer and a bottom cap silicon wafer coupled with a measurement mass. The measurement mass has a two level structure, each level having an... |
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US20120312776 |
METHOD FOR MAKING TOUCH PANEL
A method for making a plurality of touch panels one time which includes the following steps. A substrate is provided. The substrate has a surface defining a plurality of target areas with each... |
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US20110100952 |
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING BUMP
A method of manufacturing a printed circuit board having a bump is disclosed. The method includes preparing a first carrier having a first circuit formed thereon, compressing the first carrier to... |
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US20150047884 |
Copper Foil with Carrier, Method of Producing Same, Copper Foil with Carrier for Printed Wiring Board, and Printed Wiring Board
Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart... |
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US20120199736 |
MICRO-REFLECTRON FOR TIME-OF-FLIGHT MASS SPECTROMETER
A micro-reflectron for a time-of-flight mass spectrometer including a substrate and integrated with the volume of the substrate, means for application of a potential gradient in a volume suitable... |
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US20130310933 |
RETINAL PROSTHESIS SYSTEM USING NANOWIRE LIGHT DETECTOR, AND MANUFACTURING METHOD THEREOF
A retinal prosthesis system can comprise: a flexible substrate; a nanowire light detector which is placed on the substrate, and comprises one or more nanowires of which the resistance changes... |
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US20130319747 |
MULTILAYER ELECTRONIC STRUCTURES WITH VIAS HAVING DIFFERENT DIMENSIONS
A multilayer composite electronic structure comprising at least two feature layers extending in an X-Y plane and separated by a via layer comprising a dielectric material that is sandwiched... |
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US20150040675 |
Absolute Pressure Sensor With Improved Bonding Boundary
A pressure sensor includes a top cap with a recess formed in an end of the top cap and a cavity formed in the end of the top cap to communicate with the recess. The cavity extends further axially... |
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US20150129293 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
A printed circuit board and a method of manufacturing the same. In one embodiment, a printed circuit board includes: a core made of a glass material; an insulator surrounding the core; and a via... |
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US20090266578 |
FLEX CABLE WITH BIASED NEUTRAL AXIS
Systems and methods for biasing a neutral axis of a flex cable in a hard drive are discussed. The hard drive comprises a flex cable, a read/write head, and a control card. The flex cable comprises... |
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US20110233055 |
CATHODE AND A METHOD OF FORMING A CATHODE
A cathode for receiving electro deposition of metal, the cathode comprising a planar conductive sheet and raised portions disposed on at least one surface of the planar conductive sheet, wherein... |
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US20130270220 |
HEAT SPREADER WITH HIGH HEAT FLUX AND HIGH THERMAL CONDUCTIVITY
A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to... |
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US20150195922 |
METHOD FOR MANUFACTURING WIRING BOARD
A method for manufacturing a wiring board includes steps of forming a groove portion in an outer periphery portion of a support metal foil provided metal foil in a shape of frame, in which a metal... |
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US20130056440 |
METHOD FOR MANUFACTURING TRANSPARENT PRINTED CIRCUIT AND METHOD FOR MANUFACTURING TRANSPARENT TOUCH PANEL
To peel an etching resist easily and reliably without damaging a transparent conductive layer coated with the etching resist. A method for manufacturing a transparent printed circuit in an... |
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US20090324899 |
FULL PERIMETER CHEMICAL STRENGTHENING OF SUBSTRATES
Methods and apparatus for protecting the thin films during chemical and/or thermal edge strengthening treatment. In one embodiment, a portion of each individual sheet is laminated. Pairs of sheets... |
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US20130240242 |
ELECTRICALLY ISOLATED, HIGH MELTING POINT, METAL WIRE ARRAYS AND METHOD OF MAKING SAME
A method of making a wire array includes the step of providing a tube of a sealing material and having an interior surface, and positioning a wire in the tube, the wire having an exterior surface.... |
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US20150083688 |
SYSTEM FOR MANUFACTURING ELECTROSURGICAL SEAL PLATES
A system for the manufacture of an end effector assembly which is configured for use with an electrosurgical instrument configured for performing an electrosurgical procedure is provided. The... |
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US20110278258 |
Device and Method for Indirect Modulation of Detection Environment
A system and method of indirectly modifying an environmental condition at a test site in one embodiment includes providing a test site on a substrate, providing a first activatable stimulant at... |
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US20140091054 |
METHOD OF FABRICATING AN IMPLANTABLE MEDICAL DEVICE THAT INCLUDES ONE OR MORE THIN FILM POLYMER SUPPORT LAYERS
An implantable medical device formed from one or more layers of thin film polymer is assembled by providing by adhesively securely one or more polymer coupons on individual rigid backings. After... |
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US20130319743 |
WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF
A wired circuit board includes a wire, and a terminal formed continuously to the wire to be electrically connected to an electronic element at one surface thereof in a thickness direction of the... |
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US20080190885 |
Method For Manufacturing Cantilever Structure of Probe Card
A method for manufacturing a cantilever structure of a probe card is disclosed. In accordance with the method of the present invention, a first sacrificial wafer is used as a mold to form a... |
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US20130146337 |
MULTI-LAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
A multi-layered printed circuit board and a method of manufacturing the multi-layered printed circuit board are disclosed. The multi-layered printed circuit board in accordance with an embodiment... |
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US20050109728 |
End point detector for etching equipment
The present invention relates to an end point detector for etching equipment. The embodiment of the present invention has a unique feature which allows for a minimal contact between a connector... |
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US20150150504 |
METHOD OF FABRICATING IMPLANTABLE MEDICAL DEVICES FROM A POLYMER COUPON THAT IS BONDED TO RIGID SUBSTRATE
Plural medical device formed from one or more layers of thin film polymer are assembled from a single polymer coupon. Initially the coupon is bonded to a rigid substrate. Force, heat and a suction... |
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US20110254171 |
Integrated Method for High-Density Interconnection of Electronic Components through Stretchable Interconnects
Stretchable multi-chip modules (SMCMs) are capable of withstanding large mechanical deformations and conforming to curved surfaces. These SMCMs may find their utilities in elastic consumer... |
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US20130270219 |
MAKING STACKED PANCAKE MOTORS USING PATTERNED ADHESIVES
A method of making a shaped electrical conductor (610, 630) includes providing a first sheet of metal (319) and applying a first and second thermoplastic adhesive pattern (311, 312) to a first and... |
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US20080280112 |
Method fo Manufacturing a Microsystem, Such a Microsystem, a Stack of Foils Comprising Such a Microsystem, an Electronic Device Comprising Such a Microsystem and Use of the Electronic Device
The invention relates to a method of manufacturing a microsystem and further to such microsystem. With the method a microsystem can be manufactured by stacking pre-processed foils (10) having a... |
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US20130295349 |
TRANSPARENT CONDUCTIVE FILM WITH PRESSURE-SENSITIVE ADHESIVE LAYER, METHOD FOR PRODUCING SAME, AND TOUCH PANEL
The transparent conductive film is capable of preventing a situation in which level differences formed due to patterning exceed a design value, even when the film base used is a thin film base... |
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US20110284496 |
Method of Forming Electronic Circuit
Provided is a method of forming an electronic circuit, wherein a nickel or nickel alloy layer is formed on an etching side of a rolled copper foil or an electrolytic copper foil, the rolled copper... |