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US20110222228 ELECTRONIC CARD CONTAINING A DISPLAY WINDOW AND METHOD FOR MANUFACTURING AN ELECTRONIC CARD CONTAINING A DISPLAY WINDOW  
One embodiment of the invention relates to an electronic card containing a clear display window. The electronic card includes a printed circuit board, having a top surface and a bottom surface and...
US20150008021 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD  
A printed wiring board includes an interlayer resin insulation layer, multiple pads formed on the interlayer resin insulation layer, and multiple metal posts having bonding material portions and...
US20150034365 METHOD FOR MANUFACTURING WIRING BOARD AND WIRING BOARD  
A method for manufacturing a wiring board includes preparing a wiring board having an insulation layer, a conductive pattern and a solder-resist layer laminated such that the solder-resist layer...
US20150101848 SURFACE-TREATED COPPER FOIL AND COPPER-CLAD LAMINATE PLATE INCLUDING THE SAME, PRINTED CURCUIT BOARD USING THE SAME, AND METHOD FOR MANUFACTURING THE SAME  
Disclosed herein are a surface-treated copper foil, a copper-clad laminate plate including the same, a printed circuit board using the same, and a method for manufacturing the same. In detail, the...
US20130043564 ATTACHING A MEMS TO A BONDING WAFER  
A MEMS is attached to a bonding wafer in part by forming a support layer over the MEMS. A first eutectic layer is formed over the support layer. The eutectic layer is patterned into segments to...
US20100078200 FLEX CIRCUIT ASSEMBLY WITH A DUMMY TRACE BETWEEN TWO SIGNAL TRACES  
A flex circuit comprises a base film, a first adhesive layer coupled with the base film, at least two signal traces coupled with the first adhesive layer, and at least one dummy trace positioned...
US20150230335 COPPER CLAD LAMINATE AND METHOD FOR MANUFACTURING THE SAME  
Embodiments of the invention provide a copper clad laminate, and more particularly, to a copper clad laminate and a method for manufacturing the same capable of increasing a peel strength by...
US20130206721 METHOD FOR MANUFACTURING A TOUCH PANEL  
A method for manufacturing a touch panel includes the following steps. A mother plate is provided. A plurality of adhesive materials are formed on the mother plate. A plurality of cover glasses...
US20130147317 MEMS KINETIC ENERGY CONVERSION  
The present disclosure provides a micro device. The device has a micro-electro-mechanical systems (MEMS) movable structure, a plurality of metal loops over the MEMS movable structure, a...
US20130306357 EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USNG THE SAME  
Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin comprising a dicyclopentadiene type epoxy resin; (B) a copolymer of styrene and maleic...
US20130220685 COPPER FOIL FOR PRINTED WIRING BOARD, METHOD FOR PRODUCING SAID COPPER FOIL, RESIN SUBSTRATE FOR PRINTED WIRING BOARD AND PRINTED WIRING BOARD  
A copper foil for a printed wiring board, the copper foil being characterized by having, on at least one surface thereof, a roughed layer of the copper foil in which an average diameter at a...
US20150034590 METHOD FOR PRODUCING PRINTED-WIRING BOARD  
The present invention provides a method for producing a printed-wiring board in a semi-additive process, comprising the steps of: providing a chemical copper plating 4 on an insulation layer 3 or...
US20150101847 RIGID-FLEXIBLE PRINTED CIRCUIT BOARD,METHOD FOR MANUFACTURING SAME,AND PRINTED CIRCUIT BOARD MODULE  
A rigid-flexible printed circuit board (PCB) a method for manufacturing the rigid-flexible PCB, and a PCB module having the rigid-flexible PCB are provided. The rigid-flexible printed circuit...
US20130213701 MANUFACTURING METHOD OF PRINTED WIRING BOARD AND PRINTED WIRING BOARD  
Object of the present invention is to provide a method for manufacturing a printed wiring board which enables fine wiring formation at low costs and with high yields without introducing any...
US20150087007 MICROFLUIDIC ELECTROCAGE DEVICE AND CELL MEDIUM FOR TRAPPING AND ROTATING CELLS FOR LIVE-CELL COMPUTED TOMOGRAPHY (CT)  
A microfluidic device useable for performing live cell computed tomography imaging is fabricated with a cover portion including a first wafer with at least one metal patterned thereon, a base...
US20140124249 PCB BOARD, CORE FOR MANUFACTURING THE PCB BOARD AND METHOD FOR MANUFACTURING THE PCB BOARD  
The present invention provides a printed circuit board (PCB) board, a core for manufacturing the PCB board and a method for manufacturing the PCB board. The PCB board is in a shape of a rectangle...
US20140296078 METHODS OF SPLICING 2G REBCO HIGH TEMPERATURE SUPERCONDUCTORS USING PARTIAL MICRO-MELTING DIFFUSION PRESSURIZED SPLICING BY DIRECT FACT-TO-FACE CONTACT OF HIGH TEMPERATURE SUPECONDCTING LAYERS AND RECOVERING SUPERCONDUCTIVITY BY OXYGENATION ANNEALING  
Disclosed is a splicing method of two second-generation ReBCO high temperature superconductor coated conductors (2G ReBCO HTS CCs), in which, with stabilizing layers removed from the two strands...
US20150053465 THIN FLEXIBLE CIRCUITS  
An approach for making thin flexible circuits. A layer of dielectric may have one or two surfaces coated with metal. The dielectric and the metal may each have a sub-mil thickness. The dielectric...
US20150042906 TOUCH SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME  
Disclosed herein is a touch sensor module, including: a window substrate; a touch sensor formed to face the window substrate and having an electrode pattern on a surface; an adhesive layer...
US20130319737 MULTILAYER ELECTRONIC STRUCTURE WITH INTEGRAL STEPPED STACKED STRUCTURES  
A multilayer electronic support structure comprising a plurality of layers extending in an X-Y plane consisting of a dielectric material surrounding metal via posts that conduct in a Z direction...
US20150250030 METHOD FOR MANUFACTURING GRAPHENE ELECTROMAGNETIC WAVE BLOCKING PLATE AND MICROWAVE OVEN USING SAME  
The present invention relates to graphene and, more particularly, to a method for manufacturing a graphene electromagnetic wave blocking plate capable of blocking electromagnetic waves by using...
US20140338452 TRI-AXIAL MEMS ACCELEROMETER  
A tri-axial MEMS accelerometer includes a top cap silicon wafer and a bottom cap silicon wafer coupled with a measurement mass. The measurement mass has a two level structure, each level having an...
US20120312776 METHOD FOR MAKING TOUCH PANEL  
A method for making a plurality of touch panels one time which includes the following steps. A substrate is provided. The substrate has a surface defining a plurality of target areas with each...
US20110100952 METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING BUMP  
A method of manufacturing a printed circuit board having a bump is disclosed. The method includes preparing a first carrier having a first circuit formed thereon, compressing the first carrier to...
US20150047884 Copper Foil with Carrier, Method of Producing Same, Copper Foil with Carrier for Printed Wiring Board, and Printed Wiring Board  
Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart...
US20120199736 MICRO-REFLECTRON FOR TIME-OF-FLIGHT MASS SPECTROMETER  
A micro-reflectron for a time-of-flight mass spectrometer including a substrate and integrated with the volume of the substrate, means for application of a potential gradient in a volume suitable...
US20130310933 RETINAL PROSTHESIS SYSTEM USING NANOWIRE LIGHT DETECTOR, AND MANUFACTURING METHOD THEREOF  
A retinal prosthesis system can comprise: a flexible substrate; a nanowire light detector which is placed on the substrate, and comprises one or more nanowires of which the resistance changes...
US20130319747 MULTILAYER ELECTRONIC STRUCTURES WITH VIAS HAVING DIFFERENT DIMENSIONS  
A multilayer composite electronic structure comprising at least two feature layers extending in an X-Y plane and separated by a via layer comprising a dielectric material that is sandwiched...
US20150040675 Absolute Pressure Sensor With Improved Bonding Boundary  
A pressure sensor includes a top cap with a recess formed in an end of the top cap and a cavity formed in the end of the top cap to communicate with the recess. The cavity extends further axially...
US20150129293 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME  
A printed circuit board and a method of manufacturing the same. In one embodiment, a printed circuit board includes: a core made of a glass material; an insulator surrounding the core; and a via...
US20090266578 FLEX CABLE WITH BIASED NEUTRAL AXIS  
Systems and methods for biasing a neutral axis of a flex cable in a hard drive are discussed. The hard drive comprises a flex cable, a read/write head, and a control card. The flex cable comprises...
US20110233055 CATHODE AND A METHOD OF FORMING A CATHODE  
A cathode for receiving electro deposition of metal, the cathode comprising a planar conductive sheet and raised portions disposed on at least one surface of the planar conductive sheet, wherein...
US20130270220 HEAT SPREADER WITH HIGH HEAT FLUX AND HIGH THERMAL CONDUCTIVITY  
A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to...
US20150195922 METHOD FOR MANUFACTURING WIRING BOARD  
A method for manufacturing a wiring board includes steps of forming a groove portion in an outer periphery portion of a support metal foil provided metal foil in a shape of frame, in which a metal...
US20130056440 METHOD FOR MANUFACTURING TRANSPARENT PRINTED CIRCUIT AND METHOD FOR MANUFACTURING TRANSPARENT TOUCH PANEL  
To peel an etching resist easily and reliably without damaging a transparent conductive layer coated with the etching resist. A method for manufacturing a transparent printed circuit in an...
US20090324899 FULL PERIMETER CHEMICAL STRENGTHENING OF SUBSTRATES  
Methods and apparatus for protecting the thin films during chemical and/or thermal edge strengthening treatment. In one embodiment, a portion of each individual sheet is laminated. Pairs of sheets...
US20130240242 ELECTRICALLY ISOLATED, HIGH MELTING POINT, METAL WIRE ARRAYS AND METHOD OF MAKING SAME  
A method of making a wire array includes the step of providing a tube of a sealing material and having an interior surface, and positioning a wire in the tube, the wire having an exterior surface....
US20150083688 SYSTEM FOR MANUFACTURING ELECTROSURGICAL SEAL PLATES  
A system for the manufacture of an end effector assembly which is configured for use with an electrosurgical instrument configured for performing an electrosurgical procedure is provided. The...
US20110278258 Device and Method for Indirect Modulation of Detection Environment  
A system and method of indirectly modifying an environmental condition at a test site in one embodiment includes providing a test site on a substrate, providing a first activatable stimulant at...
US20140091054 METHOD OF FABRICATING AN IMPLANTABLE MEDICAL DEVICE THAT INCLUDES ONE OR MORE THIN FILM POLYMER SUPPORT LAYERS  
An implantable medical device formed from one or more layers of thin film polymer is assembled by providing by adhesively securely one or more polymer coupons on individual rigid backings. After...
US20130319743 WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF  
A wired circuit board includes a wire, and a terminal formed continuously to the wire to be electrically connected to an electronic element at one surface thereof in a thickness direction of the...
US20080190885 Method For Manufacturing Cantilever Structure of Probe Card  
A method for manufacturing a cantilever structure of a probe card is disclosed. In accordance with the method of the present invention, a first sacrificial wafer is used as a mold to form a...
US20130146337 MULTI-LAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF  
A multi-layered printed circuit board and a method of manufacturing the multi-layered printed circuit board are disclosed. The multi-layered printed circuit board in accordance with an embodiment...
US20050109728 End point detector for etching equipment  
The present invention relates to an end point detector for etching equipment. The embodiment of the present invention has a unique feature which allows for a minimal contact between a connector...
US20150150504 METHOD OF FABRICATING IMPLANTABLE MEDICAL DEVICES FROM A POLYMER COUPON THAT IS BONDED TO RIGID SUBSTRATE  
Plural medical device formed from one or more layers of thin film polymer are assembled from a single polymer coupon. Initially the coupon is bonded to a rigid substrate. Force, heat and a suction...
US20110254171 Integrated Method for High-Density Interconnection of Electronic Components through Stretchable Interconnects  
Stretchable multi-chip modules (SMCMs) are capable of withstanding large mechanical deformations and conforming to curved surfaces. These SMCMs may find their utilities in elastic consumer...
US20130270219 MAKING STACKED PANCAKE MOTORS USING PATTERNED ADHESIVES  
A method of making a shaped electrical conductor (610, 630) includes providing a first sheet of metal (319) and applying a first and second thermoplastic adhesive pattern (311, 312) to a first and...
US20080280112 Method fo Manufacturing a Microsystem, Such a Microsystem, a Stack of Foils Comprising Such a Microsystem, an Electronic Device Comprising Such a Microsystem and Use of the Electronic Device  
The invention relates to a method of manufacturing a microsystem and further to such microsystem. With the method a microsystem can be manufactured by stacking pre-processed foils (10) having a...
US20130295349 TRANSPARENT CONDUCTIVE FILM WITH PRESSURE-SENSITIVE ADHESIVE LAYER, METHOD FOR PRODUCING SAME, AND TOUCH PANEL  
The transparent conductive film is capable of preventing a situation in which level differences formed due to patterning exceed a design value, even when the film base used is a thin film base...
US20110284496 Method of Forming Electronic Circuit  
Provided is a method of forming an electronic circuit, wherein a nickel or nickel alloy layer is formed on an etching side of a rolled copper foil or an electrolytic copper foil, the rolled copper...
Matches 1 - 50 out of 205 1 2 3 4 5 >