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US20120125680 MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF  
An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal...
US20120085731 METHOD OF FABRICATING MEMS DEVICES (SUCH AS IMod) COMPRISING USING A GAS PHASE ETCHANT TO REMOVE A LAYER  
Improvements in an interferometric modulator that cavity defined by two walls.
US20090057149 Method of Manufacturing a Diagnostic Test Strip  
A method for manufacturing a biosensor is provided. The method may include positioning a shadow mask containing a pattern of a plurality of feature sets over a substantially planar base layer...
US20090229855 ELECTRODE AND METHOD OF FORMING THE MASTER ELECTRODE  
An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier (1) provided with an insulating layer (7) which is...
US20080258742 Conductivity measurement device, its manufacture and use  
The invention relates to a method of manufacturing a device for measuring conductivity of a liquid, in particular ultrapure water, of the kind comprising two conductivity measurement electrodes...
US20120287138 ELECTROMECHANICAL DEVICE CONFIGURED TO MINIMIZE STRESS-RELATED DEFORMATION AND METHODS FOR FABRICATING SAME  
Embodiments of MEMS devices include a movable layer supported by overlying support structures, and may also include underlying support structures. In one embodiment, the residual stresses within...
US20090183992 METHOD OF FORMING A MULTILAYER STRUCTURE  
Method of forming a multilayer structure by electroetching or electroplating on a substrate. A seed layer is arranged on the substrate and a master electrode is applied thereto. The master...
US20090071933 ETCHING PROCESSES USED IN MEMS PRODUCTION  
The efficiency of an etching process may be increased in various ways, and the cost of an etching process may be decreased. Unused etchant may be isolated and recirculated during the etching...
US20160107472 METHOD OF PROVIDING A SECURITY DOCUMENT WITH A SECURITY FEATURE, AND SECURITY DOCUMENT  
A method of providing a security document with a security feature includes the steps of providing a conductive layer, and removing part of the conductive layer to convert at least a portion of the...
US20140116491 BULK-SIZE NANOSTRUCTURED MATERIALS AND METHODS FOR MAKING THE SAME BY SINTERING NANOWIRES  
Thermoelectric solid material and method thereof. The thermoelectric solid material includes a plurality of nanowires. Each nanowire of the plurality of nanowires corresponds to an aspect ratio...
US20130049891 FILTER  
A multi-mode cavity filter, comprising: at least one dielectric resonator body incorporating a piece of dielectric material, the piece of dielectric material having a shape such that it can...
US20120103932 METHODS FOR FABRICATING CURRENT-CARRYING STRUCTURES USING VOLTAGE SWITCHABLE DIELECTRIC MATERIALS  
A method includes providing a voltage switchable dielectric material having a characteristic voltage, exposing the voltage switchable dielectric material to a source of ions associated with an...
US20120061346 Conductivity Measurement Device, Its Manufacture And Use  
The invention relates to a method of manufacturing a device for measuring conductivity of a liquid, in particular ultrapure water, of the kind comprising two conductivity measurement electrodes...
US20110143105 TRANSPARENT CONDUCTIVE FILM, METHOD FOR PRODUCTION THEREOF AND TOUCH PANEL THEREWITH  
A transparent conductive film includes: a transparent film substrate; a transparent conductor layer provided on one or both sides of the transparent film substrate; and at least one undercoat...
US20090184090 THIN-FILM ASSEMBLY AND METHOD FOR PRODUCING SAID ASSEMBLY  
A thin-film assembly (1) including a substrate (2) and at least one electronic thin-film component (8) applied on the substrate by thin-film technology, wherein a base electrode (4) is provided on...
US20090074646 ETCHING PROCESSES USED IN MEMS PRODUCTION  
The efficiency of an etching process may be increased in various ways, and the cost of an etching process may be decreased. Unused etchant may be isolated and recirculated during the etching...
US20110147341 ETCHING SOLUTION FOR TITANIUM-BASED METAL, TUNGSTEN-BASED METAL, TITANIUM/TUNGSTEN-BASED METAL OR THEIR NITRIDES  
An etching solution for titanium-based metals, tungsten-based metals, titanium/tungsten-based metals or their nitrides. The etching solution contains 10-40 mass % hydrogen peroxide, 0.1-15 mass %...
US20110117577 MICROFLUIDIC SYSTEM FOR TRAPPING AND DETECTION OF A BIOLOGICAL ENTITY IN A SAMPLE  
According to embodiments of the present invention, a microfluidic system for detecting a biological entity in a sample volume is provided. The microfluidic system includes: an inlet configured to...
US20100216646 METHOD OF PATTERNING OXIDE SUPERCONDUCTING FILMS  
A process for preparing a superconductor article includes depositing a precursor solution onto a substrate to form a precursor film, the precursor solution comprising precursor components to a...
US20150318085 Deposition and Selective Removal of Conducting Helplayer for Nanostructure Processing  
A method for making one or more nanostructures is disclosed, the method comprising: depositing a conducting layer on an upper surface of a substrate; depositing a patterned layer of catalyst on...
US20140166612 ANALYTE SENSOR AND FABRICATION METHODS  
Methods for fabricating analyte sensor components using IC- or MEMs-based fabrication techniques and sensors prepared therefrom. Fabrication of the analyte sensor component comprises providing an...
US20090032492 APPARATUS AND METHOD FOR WET-CHEMICAL PROCESSING OF FLAT, THIN SUBSTRATES IN A CONTINUOUS METHOD  
The invention relates to a method and apparatus for wet-chemical processes (cleaning, etching, stripping, coating, dehydration) in a continuous method for flat, thin and fracture-sensitive...
US20130161285 AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATE MATERIALS FOR ELECTRICAL, MECHANICAL AND OPTICAL DEVICES  
An aqueous polishing composition comprising (A) abrasive particles which are positively charged when dispersed in an aqueous medium having a pH in the range of from 3 to 9 as evidenced by the...
US20120273454 ETCHING LIQUID FOR CONDUCTIVE POLYMER, AND METHOD FOR PATTERNING CONDUCTIVE POLYMER  
An etching liquid for a conductive polymer is disclosed which comprises greater than 0.5 wt % but no greater than 30 wt % of (NH4)4Ce(S04)4.
US20110204020 Method of and Printable Compositions for Manufacturing a Multilayer Carbon Nanotube Capacitor  
Multilayer carbon nanotube capacitors, and methods and printable compositions for manufacturing multilayer carbon nanotubes (CNTs) are disclosed. A first capacitor embodiment comprises: a first...
US20110140744 FLEXIBLE ELECTRONIC CIRCUITS AND DISPLAYS  
A backplane for use in an electro-optic display comprises a patterned metal foil having a plurality of apertures extending therethrough, coated on at least side with an insulating polymeric...
US20090208843 ELECTRODE FOR A BATTERY  
An electrode for a bipolar cell or battery includes a plate-like body made of hardened resin containing particles of titanium suboxide or other electrically conductive particulate arranged to form...
US20070114203 High density printed circuit board and method of manufacturing the same  
The present invention relates to a high density printed circuit board and a method of manufacturing the same which enable a thin printed circuit board to be manufactured and can overcome problems...
US20150277097 FLEXIBLE EMS DEVICE USING ORGANIC MATERIALS  
This disclosure provides apparatus, systems and methods for an electromechanical systems (EMS) device made of organic materials. In one aspect, the EMS device includes a stationary electrode over...
US20130186850 SLURRY FOR COBALT APPLICATIONS  
A slurry for chemical mechanical of a cobalt layer or a conductive layer over a cobalt layer includes abrasive particles, an organic complexing compound for Cu or Co ion complexion, a Co corrosion...
US20130120288 TOUCH-SENSING PANEL INCLUDING ELECTRODE-INTEGRATED WINDOW, AND MANUFACTURING METHOD THEREOF  
The present invention relates to a touch-sensing panel including an electrode-integrated window, and a manufacturing method thereof. The disclosed touch-sensing panel includes a transparent window...
US20090218312 METHOD AND SYSTEM FOR XENON FLUORIDE ETCHING WITH ENHANCED EFFICIENCY  
Provided herein is an apparatus and a method useful for manufacturing MEMS devices. An aspect of the disclosed apparatus provides a substrate comprising an etchable material exposed to a...
US20110147340 TRANSPARENT CONDUCTIVE FILM, METHOD FOR PRODUCTION THEREOF AND TOUCH PANEL THEREWITH  
A transparent conductive film includes: a transparent film substrate; a transparent conductor layer provided on one or both sides of the transparent film substrate; and at least one undercoat...
US20100102025 METHOD AND APPARATUS FOR MARKING COATED OPHTHALMIC SUBSTRATES OR LENS BLANKS HAVING ONE OR MORE ELECTRICALLY CONDUCTIVE LAYERS  
A method for marking an ophthalmic substrate or other ophthalmic article comprising the steps of providing an ophthalmic substrate of suitable organic or mineral glass having opposed optical...
US20080246076 Methods for nanopatterning and production of nanostructures  
Methods for nanopatterning and methods for production of nanoparticles utilizing such nanopatterning are described herein. In exemplary embodiments, masking nanoparticles are disposed on various...
US20080145798 METHOD OF PROCESSING SUBSTRATE AND CHEMICAL USED IN THE SAME  
A method of processing a substrate, including a step of processing an organic film pattern formed on a substrate, the step including, in sequence, a removal step of removing one of an alterated...
US20060191869 Method for roughening copper surfaces for bonding to substrates  
The invention is directed to a method and composition for providing roughened copper surfaces suitable for subsequent multilayer lamination. A smooth copper surface is contacted with an adhesion...
US20150034369 RESIN COMPOSITION FOR PRINTED WIRING BOARDS  
Provided is a resin composition which enables the formation of a roughened surface having a low roughness degree on the surface of an insulation layer in a printed wiring board material when used...
US20130200039 AQUEOUS POLISHING COMPOSITIONS CONTAINING N-SUBSTITUTED DIAZENIUM DIOXIDES AND/OR N'-HYDROXY-DIAZENIUM OXIDE SALTS  
An aqueous polishing composition comprising (A) at least one water-soluble or water-dispersible compound selected from the group consisting of N-substituted diazenium dioxides and...
US20130130115 COMPOSITE NEGATIVE ACTIVE MATERIAL, METHOD OF PREPARING THE SAME, AND LITHIUM SECONDARY BATTERY INCLUDING THE SAME  
A composite negative active material including metal nanostructures disposed on one or more of a surface and inner pores of a porous carbon-based material, a method of preparing the material, and...
US20120094192 COMPOSITE NANOWIRE COMPOSITIONS AND METHODS OF SYNTHESIS  
Nanowire array compositions in which nanowires containing at least one Group IV metal (e.g., Si or Ge) in a single layer or core-shell nanowire structure, wherein, in particular embodiments, the...
US20090321113 HIGH CONTRAST TRANSPARENT CONDUCTORS AND METHODS OF FORMING THE SAME  
Methods of enhancing contrast ratio of conductive nanostructure-based transparent conductors are described. Contrast ratio is significantly improved by reduction of light scattering and...
US20120134631 Molded Interconnect Device (MID) with Thermal Conductive Property and Method for Production Thereof  
A molded interconnect device (MID) with a thermal conductive property and a method for production thereof are disclosed. A thermal conductive element is set in a support element to improve the...
US20050194353 Laser micromachining and electrical structures formed thereby  
A unified process of making an electrical structure includes performing a plurality of laser etching operations on a workpiece, without removing the workpiece from a laser processing system. The...
US20150262927 ELECTRONIC PACKAGE, PACKAGE CARRIER, AND METHODS OF MANUFACTURING ELECTRONIC PACKAGE AND PACKAGE CARRIER  
A method of manufacturing package carrier is provided. In the method, a holding substrate and a conductive layer are provided. The conductive layer is on the holding substrate. Next, an insulating...
US20150212537 MICRO-WIRE ELECTRODES WITH EQUI-POTENTIAL DUMMY MICRO-WIRES  
A micro-wire multi-electrode structure having an area of substantially uniform optical density includes a plurality of spatially separated patterned electrodes located in an electrode layer in the...
US20140218872 ELECTRONIC CIRCUIT AND METHOD OF FABRICATING THE SAME  
Provided is an electronic circuit. The electronic circuit includes: a substrate including a device region and a wiring region; an electronic device disposed on the device region; and a conductive...
US20140099539 NEGATIVE ELECTRODE FOR LITHIUM-ION SECONDARY BATTERY, MANUFACTURING METHOD THEREOF, AND LITHIUM-ION SECONDARY BATTERY  
To provide a lithium-ion secondary battery which has high charge and discharge capacity, is capable of being charged and discharged at high rate and has good cycle characteristics. A negative...
US20110220610 FLEXIBLE SUBSTRATE WITH ELECTRONIC DEVICES AND TRACES  
A method of manufacturing an electronic device (10) provides a substrate (20) that has a plastic material and has a metallic coating on one surface. A portion of the metallic coating is etched to...
US20110186542 SLURRY CONTAINING MULTI-OXIDIZER AND MIXED NANO-ABRASIVES FOR TUNGSTEN CMP  
A chemical mechanical polishing slurry containing multiple oxidizers and nano abrasive particles (including engineered nano diamond particles) suitable for polishing multilayer substrate with...