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US20110139626 ELECTROLYTIC COPPER COATING, METHOD OF MANUFACTURING THE SAME, AND COPPER ELECTROLYTE FOR MANUFACTURING ELECTROLYTIC COPPER COATING  
An object of the present invention is to provide an electrolytic copper coating that exhibits a bendability and flexibility equal to or better than those of rolled copper foil after the heat...
US20140246326 Method Of Electrolytic Deposition Of Arsenic From Industrial Electrolytes Including Waste Electrolytes Used In Electrorefining Of Copper After Prior Decopperisation Of Electrolyte  
The subject of the present invention is a method of the electrolytic isolation of arsenic from industrial electrolytes including waste electrolytes used in the electrorafination of copper after...
US20140299480 Copper Plating Solutions and Method of Making and Using Such Solutions  
The present technology generally relates to copper plating solutions. Specifically, the present technology includes a copper plating solution comprising a source of copper ions and a conductivity...
US20140183052 COPPER ELECTROPLATING SOLUTION AND METHOD OF COPPER ELECTROPLATING  
A copper electroplating solution which contains compounds with the structure —X—S—Y— wherein X and Y are, independently atoms selected from a group consisting of hydrogen, carbon, sulfur,...
US20120064462 BY-PRODUCT MITIGATION IN THROUGH-SILICON-VIA PLATING  
Methods, systems, and apparatus for plating a metal onto a work piece with a plating solution having a low oxygen concentration are described. In one aspect, a method includes reducing an oxygen...
US20120175264 WAFER PRETREATMENT FOR COPPER ELECTROPLATING  
The present invention is directed to a pretreatment process for copper electroplating of via or trench features on a wafer, comprising filling the via or trench feature with a pretreatment...
US20140097087 ELECTROLYTIC COPPER PLATING LIQUID AND THE ELECTROLYTIC COPPER PLATING METHOD  
Copper electroplating liquid which does not use formaldehyde, which is harmful to the environment, and which exhibits excellent via filling ability is offered. The copper electroplating liquid of...
US20140151238 COPPER PLATING SOLUTION  
The present invention relates to a copper plating solution for relieving the deposit stress of an electroplated copper film. In the copper electroplating solution of the present invention,...
US20140138252 Aqueous Acidic Bath for Electrolytic Deposition of Copper  
The invention relates to an aqueous acidic bath for electrolytic deposition of copper, comprising, at least one source of copper ions, at least one acid, at least one brightener compound, and at...
US20130180860 METHOD FOR FORMING ELECTROLYTIC COPPER PLATING FILM ON SURFACE OF RARE EARTH METAL-BASED PERMANENT MAGNET  
An object of the present invention is to provide a novel method for forming an electrolytic copper plating film having excellent adhesion on the surface of a rare earth metal-based permanent...
US20060151330 Device for the metallisation of printed forms which are equipped with electrically conductive tracks and associated metallisation method  
The invention relates to a printed circuit which is equipped with electrically conductive tracks and which can be obtained by means of gravure printing. Gravure printing can be used to obtain...
US20110233065 ELECTROLYTE AND METHOD FOR DEPOSITION OF MATTE METAL LAYER  
This invention relates to an electrolyte as well as a method for the deposition of a matte metal layer on a substrate surface, where the matte metal layer is V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh,...
US20120230861 SWASH PLATE AND METHOD OF MANUFACTURING THE SAME  
A swash plate includes aluminum (Al) as a main component and 35˜45 wt % of zinc (Zn), 1.5˜3.5 wt % of copper (Cu), 6˜10 wt % of silicon (Si), 0.2˜0.5 wt % of magnesium (Mg) and other inevitable...
US20120199491 METHODS FOR ELECTROPLATING COPPER  
Embodiments of the invention are directed to methods of electroplating copper onto at least one surface of a substrate in which more uniform electrical double layers are formed adjacent to the at...
US20050241954 Electrolytic gold plating method of printed circuit board  
Disclosed is an electrolytic gold plating method of a PCB, which includes (A) forming an electrolytic copper-plated layer, corresponding to a predetermined copper plating resist pattern, on a...
US20100300888 PULSE SEQUENCE FOR PLATING ON THIN SEED LAYERS  
A plating protocol is employed to control plating of metal onto a wafer comprising a conductive seed layer. Initially, the protocol employs cathodic protection as the wafer is immersed in the...
US20090038951 Copper plating bath formulation  
To provide a copper plating solution composition that precipitates copper plated membranes that are both uniform and smooth and which has good external appearance even if the copper plated...
US20090038949 Copper plating process  
Providing a copper plating method with which to precipitate copper-plated membranes that are uniform and flat, and that have good mirror gloss even when relatively thin copper plated membranes are...
US20110311834 TWO-LAYER FLEXIBLE SUBSTRATE, AND COPPER ELECTROLYTIC SOLUTION FOR PRODUCING SAME  
It is an object of the invention to provide a two-layer flexible substrate that excels in folding endurance and free from occurrence of Kirkendall voids or the like even when lead portions of COF...
US20070218284 Graphite product and its fabrication method  
A graphite product fabrication method includes the steps of (1) using a press mold to mold graphite into a graphite blank, (2) processing the graphite blank to set the shape of the graphite blank,...
US20080179076 METHOD FOR PREVENTING SIPHONING EFFECT IN TERMINAL AND TERMINAL MANUFACTURED USING THE SAME  
The invention relates to a method for preventing siphoning effect in a terminal. The terminal of the invention comprises a conductive portion connected to an external component by a solder and a...
US20070170069 Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith  
The object of the present invention is to obtain a low profile electrolytic copper foil with low surface roughness at the rough surface side (opposite side from the glossy side) in the...
US20130199936 Methods and Electrolytes for Electrodeposition of Smooth Films  
Electrodeposition involving an electrolyte having a surface-smoothing additive can result in self-healing, instead of self-amplification, of initial protuberant tips that give rise to roughness...
US20080035489 Plating process  
Methods of plating electrical contacts on a photosensitive device are provided. Also provided are methods of plating electrical contacts on solar cells.
US20090236232 ELECTROLYTIC PLATING SOLUTION, ELECTROLYTIC PLATING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE  
An electrolytic plating solution includes a polar solvent, copper sulfate dissolved in the polar solvent, an accelerator including a sulfur compound, and a reducing agent having a smaller...
US20060234855 Preparation of solid oxide fuel cell electrodes by electrodeposition  
A method for preparing an electrode for a solid oxide fuel cell, in which a conductive material, such as a metal, is electrodeposited onto a porous electrode comprising a conductive material and...
US20080023218 Electrolytic plating method  
A novel electrolytic plating method suitable for filling non-through holes with metal is disclosed. The electrolytic plating method uses a plating solution containing additives such as a...
US20090242414 ELECTRONCHEMICAL DEPOSITION OF TANTALUM AND/OR COPPER IN IONIC LIQUIDS  
The invention relates to a process for the electrochemical deposition of tantalum and/or copper on a substrate in an ionic liquid comprising at least one tetraalkylammonium, tetraalkylphosphonium,...
US20120097547 Method for Copper Electrodeposition  
The present invention is related to a method for electroplating a copper deposit onto a substrate, wherein the method comprises the steps of: a) immersing the substrate into an electroplating bath...
US20090050488 ELECTROLYTIC CATHODE ASSEMBLIES AND METHODS OF MANUFACTURING AND USING SAME  
The present invention relates to electrolytic cathode assemblies typically used in the refining or winning of metals and to methods of manufacturing and using same. The cathode assembly comprises...
US20150228380 MANUFACTURING METHOD OF SUPERCONDUCTING WIRE AND SUPERCONDUCTING WIRE MADE THEREBY  
Provided is a method of manufacturing a superconducting wire. A superconducting tape having an outer surface is provided, a copper layer is formed on the outer surface of the superconducting tape,...
US20050045485 Method to improve copper electrochemical deposition  
A method for reducing or avoiding copper layer pitting in a copper electrochemical deposition process to improve deposition uniformity including providing a substrate for carrying out at least a...
US20140311966 MODIFIED SURFACES  
The invention provides a method for producing a modified surface (5) comprising: patterning a surface (7) by forming thereon a porous molecular network (9) defined by non-covalent interactions...
US20150096895 METHOD AND APPARATUS FOR ELECTROLYTICALLY DEPOSITING A DEPOSITION METAL ON A WORKPIECE  
For improving the current transfer during the electrolytic metallization of workpieces, a method is proposed: (a) providing a metal depositing apparatus 17, in which the workpiece, at least one...
US20100294669 ELECTROLYTIC DEPOSITION OF METAL-BASED COMPOSITE COATINGS COMPRISING NANO-PARTICLES  
A method is provided for imparting corrosion resistance onto a surface of a substrate. The method comprises contacting the surface of the substrate with an electrolytic plating solution comprising...
US20100219081 COPPER ELECTROPLATING BATH  
A copper electroplating bath useful in filling non-through holes formed on a substrate which contains a water-soluble copper salt, sulfuric acid, and chloride ions and further contains a...
US20140121145 TREATMENT OF SHAPED BODIES COMPRISING COPPER WITH A MIXTURE COMPRISING CHLORINE-FREE ACIDS AND OXIDIZING AGENT  
A process for treatment of shaped bodies comprising copper, wherein an aqueous mixture (M) comprising (a.) chlorine-free acids without carboxyl groups, (b.) oxidizing agents, (c.) aqueous solvent...
US20070108062 Acidic bath for electrolytically depositing a copper deposit containing halogenated or pseudohalogenated monomeric phenazinium compounds  
For manufacturing particularly uniform and mirror bright copper coatings that are leveled and ductile as well using a relatively high current density, halogenated or pseudohalogenated monomeric...
US20110284386 THROUGH SILICON VIA FILLING USING AN ELECTROLYTE WITH A DUAL STATE INHIBITOR  
A method for electrofilling large, high aspect ratio recessed features with copper without depositing substantial amounts of copper in the field region is provided. The method allows completely...
US20050199507 Chemical structures and compositions of ECP additives to reduce pit defects  
A composition and method which is suitable to enhance the wetting of an electroplating bath solution on an electroplating surface. Optimum wetting of the electroplating bath solution to the...
US20090223830 METHOD OF SURFACE TREATMENT FOR THE INHIBITION OF WHISKERS  
A surface treatment method of cladding a Sn or Sn alloy coating with one or more metals selected from among Mn, Fe, Ru, Os, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, In, Ti, Ge, Pb, Sb and...
US20050092611 Bath and method for high rate copper deposition  
A plating bath for electroplating copper on a microelectronic workpiece in a through-mask plating application at a rate of at least 2 μm/min where the bath includes: (a) 50-85 g/L of Cu2+; (b)...
US20080102305 Adhesiveless Copper Clad Laminates And Method For Manufacturing Thereof  
The present invention provides adhesiveless copper clad laminates wherein there is formed a copper film layer having high adhesiveness and insulation reliability, and a method for manufacturing...
US20130122326 Electrodeposited Nano-Twins Copper Layer and Method of Fabricating the Same  
An electrodeposited nano-twins copper layer, a method of fabricating the same, and a substrate comprising the same are disclosed. According to the present invention, at least 50% in volume of the...
US20090212801 METHOD OF MAKING HIGH-FREQUENCY PROBE, PROBE CARD USING THE HIGH-FREQUENCY PROBE  
A high frequency probe preparation method for making a high frequency probe for high frequency testing to assure signal integrity by means of making a sleeve assembly subject to the size of a...
US20110259750 METHOD OF DIRECT PLATING OF COPPER ON A RUTHENIUM ALLOY  
A method is disclosed for depositing a copper seed layer onto a substrate surface. In one embodiment, the method includes providing a substrate having a barrier layer disposed on a substrate...
US20060065538 Alloy composition and plating method  
Disclosed are electrolyte compositions for depositing tin-copper alloys that are substantially free of lead. Also disclosed are methods of plating tin-copper alloys that are substantially free of...
US20060121255 Parallel multilayer printed circuit board having interlayer conductivity due to via ports and method of fabricating same  
Disclosed is a parallel multilayer printed circuit board (MLB), in which conductivity is provided to a through hole, formed through an interlayer connection layer, using a pair of via posts formed...
US20140295211 METHOD OF FORMING COPPER FILM ON MO/SUS FLEXIBLE SUBSTRATE  
This invention relates to a method of forming a copper film on a Mo/SUS flexible substrate, which enables the copper film to be uniformly formed on the Mo/SUS flexible substrate in a short period...
US20070170066 METHOD FOR PLANARIZATION DURING PLATING  
A method and apparatus are provided for plating metal onto a substrate. The method generally includes applying a plating solution comprising at least a leveler to a substrate; substantially...

Matches 1 - 50 out of 92 1 2 >