Matches 1 - 24 out of 24


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US20140209468 SYSTEMS AND METHODS FOR TIN ANTIMONY PLATING  
Systems and methods for tin antimony plating are provided. One plating method includes doping a tin (Sn) plating solution with antimony (Sb). One method also includes electroplating a component...
US20120208044 TIN-CONTAINING ALLOY PLATING BATH, ELECTROPLATING METHOD USING SAME, AND SUBSTRATE WITH THE ELECTROPLATING DEPOSITED THEREON  
Provided are a tin-containing alloy plating bath being capable of manufacturing a tin-containing alloy plated product suitable for electric and electronic members with excellent anti-oxidation...
US20150008131 METHODS AND APPARATUSES FOR MITIGATING TIN WHISKER GROWTH ON TIN AND TIN-PLATED SURFACES BY DOPING TIN WITH GOLD  
The present disclosure generally relates to the field of tin electroplating. More specifically, the present disclosure relates to methods for mitigating tin whisker formation on tin-plated films...
US20150010774 METHODS AND APPARATUSES FOR MITIGATING TIN WHISKER GROWTH ON TIN AND TIN-PLATED SURFACES BY DOPING TIN WITH GERMANIUM  
The present disclosure generally relates to the field of tin electroplating. More specifically, the present disclosure relates to methods for mitigating tin whisker formation on tin-plated films...
US20130264215 DIRECT-CONTACT MEMBRANE ANODE FOR USE IN ELECTROLYSIS CELLS  
The present invention relates to an anode system for conventional electrolysis cells, a process for the production thereof and its use for the deposition of electrolytic coatings. The anode system...
US20110233065 ELECTROLYTE AND METHOD FOR DEPOSITION OF MATTE METAL LAYER  
This invention relates to an electrolyte as well as a method for the deposition of a matte metal layer on a substrate surface, where the matte metal layer is V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh,...
US20100300890 PYROPHOSPHATE-BASED BATH FOR PLATING OF TIN ALLOY LAYERS  
An aqueous cyanide-free electrolyte bath for plating of tin alloy layers on substrate surfaces comprising (i) a tin ion source and a source for another alloy element, characterised in that it...
US20150245502 METHOD FOR SURFACE-TREATING COPPER FOIL AND COPPER FOIL SURFACE-TREATED THEREBY  
The present invention relates to a method for surface-treating a copper foil, and the method includes steps of: a) forming a nodule on a surface of a copper foil; b) introducing the copper foil...
US20050077186 Electrolysis bath for electrodepositing silver-tin alloys  
The invention relates to an electrolysis bath for electrodepositing silver-tin alloys that, in addition to water serving as a solvent with a pH value of less than 1.5, contains a water-soluble...
US20080283406 Tin or tin alloy electroplating solution  
An additive obtained from the reaction product obtained by reacting glutaraldehyde and at least one type of compound selected from hydrocarbon compounds containing a hydroxyl group, and at least...
US20080171244 Standalone Hydrogen Generating System  
A standalone hydrogen generating system is provided using a hydrogen generating device which can generate a hydrogen-containing gas at a low temperature and can be operated only by electric energy...
US20060011482 Electrocodeposition of lead free tin alloys  
A method of electrocodeposition of lead free tin alloys is disclosed. The method includes the following steps: electrocodepositing tin metal and particles of a noble metal to form a composite; and...
US20130277226 IMMERSION TIN OR TIN ALLOY PLATING BATH WITH IMPROVED REMOVAL OF CUPROUS IONS  
The invention concerns an immersion tin plating bath which comprises at least one aromatic sulfonic acid, at least one first precipitation additive and at least one second precipitation additive....
US20130089751 STEEL SHEET FOR CONTAINER AND METHOD OF MANUFACTURING THE SAME  
The present invention provides a steel sheet for a container including a cold-rolled steel sheet and a composite film formed on the cold-rolled steel sheet through an electrolysis process in a...
US20100040899 PLATING MEMBER AND PROCESS FOR PRODUCING THE SAME  
A plating member comprising a lead-free plating material is obtained by the present invention in a manner such that whisker formation on a plating layer 16 of the plating member can be suppressed...
US20140299351 CONTACT ELEMENT AND METHOD FOR THE PRODUCTION THEREOF  
The invention relates to a contact element for a solder-free electrical connection. The contact element has at least one contact section that is designed to produce an electrical contact, in...
US20070199827 Method for electroplating with tin-zinc alloy  
The object of the present invention is to provide an electroplating method that enables the high-speed treatment of articles to be plated that was difficult to achieve with the conventional...
US20130252020 Electro-Depositing Metal Layers of Uniform Thickness  
The invention is an apparatus and method for forming highly uniform layers of metal on a substrate by electro-deposition. The substrate is electroplated in a bath composed of a quiescent (i.e., no...
US20090123789 METHODS OF GAS CONFINEMENT WITHIN THE VOIDS OF CRYSTALLINE MATERIAL AND ARTICLES THEREOF  
There is disclosed articles for and methods of confining volatile materials in the void volume defined by crystalline void materials. In one embodiment, the hydrogen isotopes are confined inside...
US20050279640 Method of forming a lead-free bump and a plating apparatus therefor  
The present invention relates to a lead-free bump with suppressed formation of voids, obtained by reflowing a plated film of Sn—Ag solder alloy having an adjusted Ag content, and a method of...
US20100170804 Plating film and forming method thereof  
Tin plating film composed of tin or tin alloy is formed on a front surface and a rear surface of a substrate composing a lead frame. As tin alloy, for example, tin-copper alloy (content of copper:...
US20140348450 SLIDING BEARING  
A sliding bearing having a composite layer comprising carbon nanostructures (6) incorporated within a metallic matrix (5), and a method of manufacture of such a sliding bearing by electroplating.
US20160071648 Electronic Component and Method for the Passivation Thereof  
An electronic component has a main body. The main body includes a porous material having surface pores at a surface of the main body. A passivation liquid is arranged in the surface pores. A...
US20150354076 Process for Electrolytically Depositing a Tin- and Rutenium-Based Alloy, the Electrolytic Bath That Permits Said Alloy to Deposit and the Alloy Obtained by Means of Said Process  
The invention refers to the electrolytic deposit of a tin- and ruthenium-based alloy having good features of corrosion resistance. In particular, the invention refers to an ecologically compatible...

Matches 1 - 24 out of 24