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US20080156654 |
Identification Based On Compositionally Encoded Nanostructures
Designs, fabrication and applications of nanostructures made of an alloy of two or more different metal elements to provide a unique identification code based on the composition of the alloy. Such... |
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US20130327651 |
PLATING BATHS AND METHODS FOR ELECTROPLATING SELENIUM AND SELENIUM ALLOYS
Plating bath solutions and methods for depositing selenium generally include an aqueous plating bath containing a soluble selenium source and a soluble surfactant additive, wherein the soluble... |
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US20130264215 |
DIRECT-CONTACT MEMBRANE ANODE FOR USE IN ELECTROLYSIS CELLS
The present invention relates to an anode system for conventional electrolysis cells, a process for the production thereof and its use for the deposition of electrolytic coatings. The anode system... |
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US20140291156 |
HIGH STRENGTH, HIGH HEAT RESISTANCE ELECTRODEPOSITED COPPER FOIL AND MANUFACTURING METHOD FOR SAME
Task: To provide an electrodeposited copper alloy foil with large mechanical strength under normal conditions, and that does not easily degrade due to heat when heated to about 300° C. Resolution... |
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US20150245502 |
METHOD FOR SURFACE-TREATING COPPER FOIL AND COPPER FOIL SURFACE-TREATED THEREBY
The present invention relates to a method for surface-treating a copper foil, and the method includes steps of: a) forming a nodule on a surface of a copper foil; b) introducing the copper foil... |
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US20150090600 |
COPPER-NICKEL ALLOY ELECTROPLATING BATH AND PLATING METHOD
The present invention provides a copper-nickel alloy electroplating bath which is characterized by containing (a) a copper salt and a nickel salt, (b) a metal complexing agent, (c) a plurality of... |
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US20150152566 |
METHODS AND ELECTROLYTES FOR ELECTRODEPOSITION OF SMOOTH FILMS
Electrodeposition involving an electrolyte having a surface-smoothing additive can result in self-healing, instead of self-amplification, of initial protuberant tips that give rise to roughness... |
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US20100084278 |
Novel Cyanide-Free Electroplating Process for Zinc and Zinc Alloy Die-Cast Components
The proposed invention comprises a process for plating upon zinc die cast articles without the use of cyanide in the plating solution The process proposes the plating of the zinc die cast articles... |
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US20120006687 |
METHOD OF FORMING CIGS THIN FILM
Disclosed herein is a method of forming a CIGS thin film, comprising the steps of: immersing a substrate comprising an electrode into an electrolyte solution comprising Na2SO4, a water-soluble... |
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US20100206739 |
METHOD OF OBTAINING A YELLOW GOLD ALLOY DEPOSITION BY GALVANOPLASTY WITHOUT USING TOXIC METALS OR METALLOIDS
The invention relates to an electrolytic deposition in the form of a gold alloy with a thickness of between 1 and 800 microns and which includes copper. According to the invention, the deposition... |
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US20100294669 |
ELECTROLYTIC DEPOSITION OF METAL-BASED COMPOSITE COATINGS COMPRISING NANO-PARTICLES
A method is provided for imparting corrosion resistance onto a surface of a substrate. The method comprises contacting the surface of the substrate with an electrolytic plating solution comprising... |
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US20070151862 |
POST DEPOSITION TREATMENTS OF ELECTRODEPOSITED CUINSE2-BASED THIN FILMS
Single bath electrodeposition of polycrystalline Cu(In,Ga)Se2 thin films for photovoltaic applications is disclosed. Specifically, Cu(In,Ga)Se2 was deposited onto Mo electrodes from low... |
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US20130252020 |
Electro-Depositing Metal Layers of Uniform Thickness
The invention is an apparatus and method for forming highly uniform layers of metal on a substrate by electro-deposition. The substrate is electroplated in a bath composed of a quiescent (i.e., no... |
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US20140045061 |
ELECTROLYSIS COPPER-ALLOY FOIL, METHOD OF THE SAME, ELECTROLYTIC-SOLUTION USING THE PRODUCTION, NEGATIVE ELECTRODE AGGREGATION USED THE SAME, SECONDARY BATTERY, AND ELECTRODE OF THE SAME
The invention relates to an electrolytic copper alloy foil having large mechanical strength in an ordinary state and showing resistant to heat deterioration even when it is heated to 300° C. or... |
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US20130051715 |
ANTI-FRETTING LAYER
The invention relates to an anti-fretting layer (5) for a multi-layer plain bearing (1), the anti-fretting layer being composed of a copper-based alloy, which in addition to copper as the main... |
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US20090123789 |
METHODS OF GAS CONFINEMENT WITHIN THE VOIDS OF CRYSTALLINE MATERIAL AND ARTICLES THEREOF
There is disclosed articles for and methods of confining volatile materials in the void volume defined by crystalline void materials. In one embodiment, the hydrogen isotopes are confined inside... |
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US20070284257 |
Apparatus for Manufacturing Metal Nanotube and Process for manufacturing Metal Nanotube
Disclosed is a low-cost, high quality metal nanotube comprising Ni, Fe, Co or the like. A metal thin film having a thickness of 10 to 80 nm is formed as a cathode on one surface of a film having... |
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US20110180414 |
ELECTROPLATING METHODS AND CHEMISTRIES FOR DEPOSITION OF COPPER-INDIUM-GALLIUM CONTAINING THIN FILMS
Described is an electrodeposition solution for deposition of a Group IB-IIIA thin film on a conductive surface. In a preferred embodiment, the electrodeposition solution comprises a solvent; a... |
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US20110094583 |
ELECTROPLATING ADDITIVE FOR THE DEPOSITION OF METAL, A BINARY, TERNARY, QUATERNARY OR PENTANARY ALLOY OF ELEMENTS OF GROUP 11 (IB)-GROUP 13 (IIIA)-GROUP 16 (VIA)
The invention relates to electroplating additives for the deposition of a group IB metal/binary or ternary group IB-group IIIA/ternary, quaternary or pentanary group IB-group IIIA-group VIA alloy... |
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US20090283415 |
ELECTROPLATING METHODS AND CHEMISTRIES FOR DEPOSITION OF COPPER-INDIUM-GALLIUM CONTAINING THIN FILMS
Described is an electrodeposition solution for deposition of a Group IB-IIIA thin film on a conductive surface. In a preferred embodiment, the electrodeposition solution comprises a solvent; a... |
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US20120214293 |
ELECTRODEPOSITING DOPED CIGS THIN FILMS FOR PHOTOVOLTAIC DEVICES
Aspects of the present inventions include an electrodeposition solution for deposition of a thin film that includes a Group VA material, a method of electroplating to deposit a thin film that... |
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US20090020434 |
Substrate processing method and substrate processing apparatus
A substrate processing method makes it possible to fill interconnect recesses, such as trenches, with a defect-free interconnect material by carrying out electroplating directly on a surface of a... |
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US20170101389 |
LEVELING COMPOSITION AND METHOD FOR ELECTRODEPOSITION OF METALS IN MICROELECTRONICS
The present disclosure relates to a leveling composition for electrodepositing metals. The composition comprises a compound of formula (I): |
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US20160186349 |
SULFONAMIDE BASED POLYMERS FOR COPPER ELECTROPLATING
Sulfonamide based polymers are reaction products of sulfonamides and epoxides. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction... |
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US20160186346 |
REACTION PRODUCTS OF AMINO ACIDS AND EPOXIES
Reaction products of one or more amino acids and one or more epoxies are included in copper and copper alloy electroplating baths to provide good throwing power. Such reaction products may plate... |
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US20160186345 |
SULFONAMIDE BASED POLYMERS FOR COPPER ELECTROPLATING
Sulfonamide based polymers are reaction products of sulfonamides and epoxides. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction... |
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US20150368819 |
LEVELING COMPOSITION AND METHOD FOR ELECTRODEPOSITION OF METALS IN MICROELECTRONICS
The present disclosure relates to a leveling composition for electrodepositing metals. The composition comprises a compound of formula (I): |