Matches 1 - 21 out of 21


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US20120177945 Whisker-Free Coating Structure and Method for Fabricating the Same  
The present invention relates to a whisker-free coating structure and a method for fabricating the same. The whisker-free coating structure comprises a substrate, a tungsten doped copper layer and...
US20080237053 STRUCTURE COMPRISING A BARRIER LAYER OF A TUNGSTEN ALLOY COMPRISING COBALT AND/OR NICKEL  
An interconnection structure comprising a substrate having a dielectric layer with a via opening therein; wherein the opening has an underlayer of cobalt and/or nickel therein, barrier layer of an...
US20140311966 MODIFIED SURFACES  
The invention provides a method for producing a modified surface (5) comprising: patterning a surface (7) by forming thereon a porous molecular network (9) defined by non-covalent interactions...
US20150247744 HIGH-TEMPERATURE-RESISTANT METAL-PACKAGED FIBER BRAGG GRATING SENSOR AND MANUFACTURING METHOD THEREFOR  
A manufacturing method for a high-temperature-resistant metal-packaged fiber Bragg grating sensor includes using a regenerated fiber Bragg grating obtained via high-temperature annealing as a...
US20140011047 Two-Layered Copper-Clad Laminate Material, and Method for Producing Same  
A two-layered copper-clad laminate material, in which one surface or both surfaces of a polyimide film having a thickness of 12.5 to 50 μm is subjected to a modification treatment by means of a...
US20090263237 Coated turbine component and method of coating a turbine component  
Turbine components with different types of coatings on different parts thereof are described. The coatings are chosen such that they are especially adapted to the thermal and corrosive conditions...
US20120129004 HOUSING AND METHOD FOR MANUFACTURING HOUSING  
A housing includes a magnesium or magnesium alloy substrate, a first metal layer formed on the substrate by physical vapor deposition, and a second metal layer formed on the first metal layer by...
US20130146468 CHEMICAL VAPOR DEPOSITION (CVD) OF RUTHENIUM FILMS AND APPLICATIONS FOR SAME  
Methods for depositing ruthenium-containing films are disclosed herein. In some embodiments, a method of depositing a ruthenium-containing film on a substrate may include depositing a...
US20120085656 COLOR FILTER BY COPPER AND SILVER FILM AND METHOD FOR MAKING SAME  
The present invention discloses a color filter by copper and silver film, comprising: a lower copper layer; a lower silver layer formed on the lower copper layer; a medium formed on the lower...
US20100297461 COLOR FILTER BY COPPER AND SILVER FILM AND METHOD FOR MAKING SAME  
The present invention discloses a color filter by copper and silver film, comprising: a lower copper layer; a lower silver layer formed on the lower copper layer; a medium formed on the lower...
US20110297551 METHOD FOR FABRICATING ELECTRONIC COMPONENT AND ELECTRO-PLATING APPARATUS  
A method for fabricating an electronic component according to an Embodiment, includes a seed film forming process and an electro-plating process. In the seed film forming process, a seed film is...
US20150230343 MOUNTING DEVICE AND METHOD OF MANUFACTURING THE SAME  
A mounting device in which a conductive film that is not separated is formed on a resin substrate. Alloy thin films, which contain more than 50% by atom of Cu, 5% by atom or more and 30% by atom...
US20140048420 METHOD FOR FABRICATING ONE-DIMENSIONAL METALLIC NANOSTRUCTURES  
A method for fabricating one-dimensional metallic nanostructures comprises steps: sputtering a conductive film on a flexible substrate to form a conductive substrate; placing the conductive...
US20090246554 LAMINATE HAVING PEELABILITY AND PRODUCTION METHOD THEREFOR  
A metal conductor layer is provided on at least one surface of a heat resistant base. The heat resistant base is peelable from the metal conductor layer. The heat resistant base is preferably a...
US20090053426 COBALT DEPOSITION ON BARRIER SURFACES  
Embodiments of the invention provide processes for depositing a cobalt layer on a barrier layer and subsequently depositing a conductive material, such as copper or a copper alloy, thereon. In one...
US20120164328 FILM FORMATION METHOD AND STORAGE MEDIUM  
A substrate is transferred to a processing container, and a film formation raw material containing cobalt amidinate and a reducing agent containing a carbonic acid in a vapor phase are introduced...
US20110174630 FILM FORMATION METHOD AND STORAGE MEDIUM  
A film formation method includes preparing a substrate formed a Co film as a seed layer on a surface of the substrate, applying a negative voltage to the substrate such that a surface potential of...
US20150010772 METALLIZATION OF FLUOROELASTOMER FILMS  
This disclosure relates metalized fluoroelastomer materials such as films. The fluoroelastomer materials bear a conductive metal layer bound to the fluoroelastomer material through a thin layer of...
US20160064763 APPARATUS AND METHOD ASSOCIATED WITH REFORMER-LESS FUEL CELL  
An electrolyte membrane for a reformer-less fuel cell is provided. The electrolyte membrane is assembled with fuel and air manifolds to form the fuel cell. The fuel manifold receives an oxidizable...
US20160032455 HIGH THROUGH-PUT AND LOW TEMPERATURE ALD COPPER DEPOSITION AND INTEGRATION  
Methods of depositing a metal layer utilizing organometallic compounds. A substrate surface is exposed to a gaseous organometallic metal precursor and an organometallic metal reactant to form a...
US20160010205 METALLIZATION OF FLUOROELASTOMER FILMS  
This disclosure relates metalized fluoroelastomer materials such as films. The fluoroelastomer materials bear a conductive metal layer bound to the fluoroelastomer material through a thin layer of...

Matches 1 - 21 out of 21