Matches 1 - 28 out of 28


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US20150014177 METHOD FOR PRODUCING MATT COPPER DEPOSITS  
The present invention relates to a method for deposition of a matte copper coating wherein a first copper layer is deposited from an aqueous copper electrolyte which does not contain an organic...
US20120217166 PROCESS FOR THE ELECTROLYTIC COPPER PLATING OF ZINC DIECASTING HAVING A REDUCED TENDENCY TO BLISTER FORMATION  
In the electroplating of zinc diecastings with a copper layer, the electrolyte penetrates into the pores of the zinc diecasting. When the temperature is increased later, this leads to vaporization...
US20140120262 Method of Forming Tool Marking Structure  
A method of forming a tool marking structure includes: a coloring step of coloring a predetermined position of the first protective layer so as to form a marking area with a color layer and...
US20130277225 Method to Produce Golden Bronze by Diffusion of Tin Into Copper Under Controlled Conditions  
The present invention relates to the production of a bronze plated substrate having a golden appearance thanks to a multiple-layer plating method. The method notably comprises plating a substrate...
US20110065804 ELECTRODEPOSITED METALLIC FINISHES INCLUDING ANTIMICROBIAL AGENTS  
Articles having metallic finishes including antimicrobial agents dispersed throughout the finish and methods of electroplating said metallic finishes on a material. The metallic finishes include...
US20050241954 Electrolytic gold plating method of printed circuit board  
Disclosed is an electrolytic gold plating method of a PCB, which includes (A) forming an electrolytic copper-plated layer, corresponding to a predetermined copper plating resist pattern, on a...
US20080050611 Tin-Based Plating Film and Method for Forming the Same  
The present invention provides a tin-based two-layered plating film exhibiting suppressed whisker growth comprising a lower layer of a tin plating film or tin alloy plating film comprising 5% by...
US20120315502 METAL LAMINATED STRUCTURE AND METHOD FOR PRODUCING THE SAME  
There is provided a metal laminated structure in which a first metal layer containing tungsten is provided on a first surface of a second metal layer containing copper and a third metal layer...
US20050178668 Method for depositing nickel- and chromium (VI) -free metal matte layers  
A method for depositing metal matte layers free of nickel and chromium(VI).
US20120100392 METAL LAMINATED STRUCTURE AND METHOD FOR PRODUCING THE METAL LAMINATED STRUCTURE  
There is provided a metal laminated structure comprising a first metal layer, a second metal layer and a third metal layer, the first metal layer being disposed on one surface of the second metal...
US20100213851 PLASMA SOURCE  
An RF based, gridless improved plasma source and method of operating a plasma source comprising a RF coupler, a first stage with a helicon-like system, a ICH second stage, a ionization chamber,...
US20100187084 SILVER-COATED STAINLESS STEEL STRIP FOR MOVABLE CONTACTS AND METHOD OF PRODUCING THE SAME  
An electrical contact comprising a silver-coated stainless steel strip, which has an underlying layer comprising any one of nickel, cobalt, nickel alloys, and cobalt alloys, on at least a part of...
US20090291319 COPPER FOIL WITH CARRIER SHEET, METHOD FOR MANUFACTURING COPPER FOIL WITH CARRIER SHEET, SURFACE-TREATED COPPER FOIL WITH CARRIER SHEET AND COPPER-CLAD LAMINATE USING THE SURFACE-TREATED COPPER FOIL WITH CARRIER SHEET  
An object of the present invention is to provide a copper foil with carrier sheet which permits releasing of the carrier sheet from the copper foil layer even when hot pressing at a temperature...
US20130008798 ELECTRODEPOSITION METHODS OF GALLIUM AND GALLIUM ALLOY FILMS AND RELATED PHOTOVOLTAIC STRUCTURES  
Photovoltaic devices and methods for preparing a p-type semiconductor generally include electroplating a layer of gallium or a gallium alloy onto a conductive layer by contacting the conductive...
US20120055612 ELECTRODEPOSITION METHODS OF GALLIUM AND GALLIUM ALLOY FILMS AND RELATED PHOTOVOLTAIC STRUCTURES  
Photovoltaic devices and methods for preparing a p-type semiconductor layer for the photovoltaic devices generally include electroplating a layer of gallium or a gallium alloy onto a conductive...
US20090324992 Metal clad laminate and manufacturing method thereof  
A metal clad laminate and a method of manufacturing the metal clad laminate are disclosed. The metal clad laminate can include a barrier layer made of a metallic material, a metal foil formed on...
US20110005935 PLATING METHOD FOR A RADIO FREQUENCY DEVICE AND A RADIO FREQUENCY DEVICE PRODUCED BY THE METHOD  
A plating method for an RF device is disclosed. The method includes (a) pre-treating the RF device made from a substrate material; (b) forming a copper plating layer by applying copper plating to...
US20150116969 ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE  
An electronic device of the present invention includes an insulating base substrate in which a plurality of through electrodes are formed; an electronic element which is electrically connected to...
US20100215982 Metal Covered Polyimide Composite, Process for Producing the Composite, and Apparatus for Producing the Composite  
Provided is a metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method, and a copper...
US20090294297 METHOD OF FORMING PLATING LAYER  
There is provided a method of forming a plating layer, the method including: forming a seed layer on a substrate; forming a pattern layer on the seed layer, the pattern layer formed of a...
US20090202862 ELECTROPLATED DEVICE AND PREPARATION METHOD THEREOF  
Disclosed is an electroplated product, comprising a base material and an electroplated metal layer including a copper layer on the surface of the base material, wherein the electroplated metal...
US20090255824 METHOD FOR SURFACE TREATING A SUBSTRATE  
A method for surface treating a substrate includes following steps. Firstly, a substrate including a metallic surface capable of being electroplated with a metal coating is provided. Secondly, a...
US20130161809 SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE DEVICE, AND MANUFACTURING METHOD OF SUBSTRATE STRUCTURE  
A substrate structure, a semiconductor package device and a manufacturing method of substrate structure are provided. The substrate structure comprises a conductive structure comprising a first...
US20060237320 Method for forming a metal layer in multiple steps  
A method for forming a metal layer having a predetermined thickness on an underlying material is disclosed. According to the method, the underlying material is electroplated to form the metal...
US20080128019 METHOD OF METALLIZING A SOLAR CELL SUBSTRATE  
Embodiments of the invention contemplate the formation of a low cost solar cell using a novel high speed electroplating method and apparatus to form a metal contact structure having selectively...
US20080023336 TECHNIQUE FOR DOPING COMPOUND LAYERS USED IN SOLAR CELL FABRICATION  
The present invention includes methods and apparatus therefrom for preparing thin films of doped semiconductors for radiation detector and photovoltaic applications, and particularly method and...
US20160189981 MANUFACTURING METHOD OF SUBSTRATE STRUCTURE  
A manufacturing method of a substrate structure is provided. The method includes the following steps. Firstly, a conductive carrier is provided. Then, a first metal layer is formed on the...
US20150366493 ROD SHAPED IMPLANTABLE BIOSENSOR  
A biosensor includes a biosensor unit with an electrode, wherein the electrode is rod-shaped, wherein the electrode further comprises a support with an electrically conductive first layer and an...

Matches 1 - 28 out of 28