AcclaimIP-ad

Match Document Document Title
US20120012460 SODIUM / MOLYBDENUM METAL ARTICLES AND POWDER COMPACTS  
A metal article formed by compacting a sodium/molybdenum composite metal powder under sufficient pressure to form a preformed article; placing the preformed article in a sealed container; raising...
US20150235818 MAGNETRON SPUTTERING COATING DEVICE, A NANO-MULTILAYER FILM, AND THE PREPARATION METHOD THEREOF  
A magnetron sputtering coating device includes a deposition chamber, sputtering cathodes, a rotating stand within the deposition chamber, a support platform on the rotating stand, a first rotation...
US20100326816 LOW-MAINTENANCE COATING TECHNOLOGY  
The invention provides methods and equipment for depositing a low-maintenance coating.
US20120267243 SYSTEMS AND METHODS FOR A TARGET AND BACKING PLATE ASSEMBLY  
A target and backing plate assembly and method of making the same. The target and backing plate assembly provides a mechanical interlock between the target and backing plate in addition to...
US20110240115 DOPED BUFFER LAYER  
A solar cell with a doped buffer layer includes silicon and tin.
US20120094429 Sodium Salt Containing CIG Targets, Methods of Making and Methods of Use Thereof  
A sputtering target includes at least one metal selected from copper, indium and gallium and a sodium containing compound.
US20130306467 MONOLITHIC ALUMINUM ALLOY TARGET AND METHOD OF MANUFACTURING  
Aluminum or aluminum alloy sputter targets and methods of making same are provided. The pure aluminum or aluminum alloy is mechanically worked to produce a circular blank, and then the blank is...
US20110056828 MONOLITHIC ALUMINUM ALLOY TARGET AND METHOD OF MANUFACTURING  
Aluminum or aluminum alloy sputter targets and methods of making same are provided. The pure aluminum or aluminum alloy is mechanically worked to produce a circular blank, and then the blank is...
US20150170889 DIFFUSION BONDED HIGH PURITY COPPER SPUTTERING TARGET ASSEMBLIES  
The present invention relates to novel and improved high purity diffusion bonded copper (Cu) sputtering targets having a Cu purity level of 99.9999% (6N) or greater. The target assemblies of the...
US20120228131 METHOD FOR CONSOLIDATING AND DIFFUSION-BONDING POWDER METALLURGY SPUTTERING TARGET  
Methods for manufacturing sputtering target assemblies and assemblies thereof are provided, particularly targets made of powders. Powders are adhered to a backing plate by use of a vacuum hot...
US20120328468 PROCESSED HIGH-PURITY COPPER MATERIAL HAVING UNIFORM AND FINE CRYSTALLINE STRUCTURE, AND PROCESS FOR PRODUCTION THEREOF  
This worked high-purity copper material includes Cu having a purity of 99.9999% by mass or more, wherein an average crystal grain size is in a range of 20 μm or less, and in a grain size...
US20120067721 TARGET ASSEMBLY  
A target assembly includes a base comprising a first surface and a second surface opposite to the first surface. The base defining a threaded hole; a magnetron mounted on a first surface; a target...
US20140034490 DIFFUSION-BONDED SPUTTER TARGET ASSEMBLY AND METHOD OF MANUFACTURING  
A method of making a diffusion bonded sputter target assembly is provided. A target blank comprising a first metal or alloy has a first surface defining a sputtering surface and a second surface....
US20140048782 SPUTTERING TARGET AND ORGANIC LIGHT-EMITTING DISPLAY DEVICE INCLUDING BLACK MATRIX DEPOSITED THEREBY  
A sputtering target and an organic light-emitting display device including a black matrix deposited thereby. The sputtering target is used in a sputtering process for depositing a black matrix in...
US20120318669 SPUTTERING TARGET-BACKING PLATE ASSEMBLY  
Provided is a sputtering target-backing plate assembly where a raw material powder prepared so as to have the composition of a magnetic material sputtering target is filled in a die together with...
US20120228132 SPUTTERING TARGET-BACKING PLATE ASSEMBLY, AND ITS PRODUCTION METHOD  
A sputtering target-backing plate assembly obtained by bonding a target material of Mg to a backing plate of Cu—Cr alloy, wherein the target material and the backing plate are bonded via a layer...
US20110203921 METHOD OF BONDING ROTATABLE CERAMIC TARGETS TO A BACKING STRUCTURE  
This invention relates to a rotatable cylindrical magnetron sputtering apparatus and related process. More specifically, the invention relates to a cylindrical target assembly for a cylindrical...
US20120305393 SPUTTER TARGET  
In one aspect of the invention, a sputter target is provided comprising a backing plate (40) comprising a front surface and a back surface; and a sputtering plate mounted on said backing plate,...
US20130220804 Ferromagnetic Material Sputtering Target  
Provided is a ferromagnetic material sputtering target having a metal composition comprising 5 mol % or more of Pt and the balance of Co, wherein the target has a structure including a metal base...
US20140048783 SPUTTERING TARGET AND ORGANIC LIGHT-EMITTING DISPLAY DEVICE INCLUDING BLACK MATRIX DEPOSITED THEREBY  
A sputtering target that can form a black matrix having high-resistance and low-reflection characteristics and an organic light-emitting display device including the black matrix deposited...
US20100065424 ZINC-OXIDE-BASED TARGET  
The invention provides a zinc-oxide-based target, having excellent environmental durability. The target contains zinc oxide as a predominant component, and both titanium (Ti) and gallium (Ga) in...
US20110005925 TARGET BACKING TUBE, CYLINDRICAL TARGET ASSEMBLY AND SPUTTERING SYSTEM  
The present application concerns a target backing tube for a rotatable cylindrical target assembly comprising: a tube for at least one target element to be disposed there around, wherein the tube...
US20130001078 SPUTTERING TARGET AND METHOD FOR PRODUCING SAME  
[Problems to be Solved] To provide a sputtering target that is capable of forming a Cu—Ga film to which Na is favorably added by a sputtering method, and a method for producing the same.[Means to...
US20130220803 TUNGSTEN TARGET AND METHOD FOR PRODUCING SAME  
[Problem] To suppress the generation of particles by reducing the average particle diameter to several dozen μm or less. [Solution] After forming a preform of a tungsten powder, the preform is...
US20150170887 LOW DEFLECTION SPUTTERING TARGET ASSEMBLY AND METHODS OF MAKING SAME  
Described is a design and method for producing a sputtering target assembly with low deflection made from target material solder bonded to composite backing plate with coefficient of thermal...
US20140272345 METHOD OF GROWING ALUMINUM OXIDE ONTO SUBSTRATES BY USE OF AN ALUMINUM SOURCE IN AN ENVIRONMENT CONTAINING PARTIAL PRESSURE OF OXYGEN TO CREATE TRANSPARENT, SCRATCH-RESISTANT WINDOWS  
A system and process for inter alia coating a substrate such as glass substrate with a layer of aluminum oxide to create a scratch-resistant and shatter-resistant matrix comprised of a thin...
US20130337602 Sputtering Target Including a Feature to Reduce Chalcogen Build Up and Arcing on a Backing Tube  
A sputtering target has a cylindrical backing tube having two edges and a sidewall comprising a middle portion located between two end portions. The sputtering material is on the backing tube. The...
US20140174913 TARGET FOR BARIUM-SCANDATE DISPENSER CATHODE  
The invention relates to the field of production of barium-scandate dispenser cathodes or other barium-scan-date materials. A target (66) containing a mixture of BaO, CaO, Al2O3 and SC2O3 tends to...
US20130098758 POWDER, SINTERED BODY AND SPUTTERING TARGET, EACH CONTAINING ELEMENTS OF CU, IN, GA AND SE, AND METHOD FOR PRODUCING THE POWDER  
The present invention provides a Cu—In—Ga—Se powder containing Cu, In, Ga and Se in which cracks do not occur during sintering or processing, and a sintered body and sputtering target, each using...
US20140124365 METHOD OF FORMING A CYLINDRICAL SPUTTER TARGET ASSEMBLY  
In a method of forming a cylindrical sputter target assembly, comprising the steps of: (a) providing a cylindrical backing tube; (b) providing a cylindrical sputter target, the inner diameter of...
US20110147208 SODIUM/MOLYBDENUM METAL ARTICLES AND METHODS FOR MAKING THE SAME  
A method for producing a metal article may include: Producing a supply of a composite metal powder by: providing a supply of molybdenum metal powder; providing a supply of a sodium compound;...
US20140352786 ZnO-BASED SPUTTERING TARGET AND PHOTOVOLTAIC CELL HAVING PASSIVATION LAYER DEPOSITED USING THE SAME  
A zinc oxide (ZnO)-based sputtering target which is available for DC sputtering and a photovoltaic cell having a passivation layer deposited using the same. The ZnO-based sputtering target...
US20130048488 Impermeable PVD Target Coating for Porous Target Materials  
A method of making a sputtering target includes forming a sputtering target containing a relatively porous sputtering material. The sputtering material may be initially formed to be substantially...
US20120037502 Sintered Body for ZnO-Ga2O3-Based Sputtering Target and Method of Producing the Same  
[Object] To provide a sintered body for a ZnO—Ga2O3-based sputtering target, which has a low resistivity and is capable of suppressing the formation of nodules and flakes, and a method of...
US20110067997 SYNTHESIS OF HIGH-PURITY BULK COPPER INDIUM GALLIUM SELENIDE MATERIALS  
A method for forming a high purity, copper indium gallium selenide (CIGS) bulk material is disclosed. The method includes sealing precursor materials for forming the bulk material in a reaction...
US20150211107 METHOD FOR PREPARING HIGH-PERFORMANCE TANTALUM TARGET  
A method for preparing a high-performance tantalum target, a high-performance target prepared by the method, and a use of the high-performance target. The method for preparing the high-performance...
US20120111723 METHODOLOGY FOR RECYCLING RU AND RU-ALLOY DEPOSITION TARGETS & TARGETS MADE OF RECYCLED RU AND RU-BASED ALLOY POWDERS  
A recycled deposition source is ruthenium (Ru) or Ru-based alloy material in the form of a powder material having a size not greater than a 325 mesh size and having an average tap density greater...
US20120024699 COMPOSITE TARGET MATERIAL AND METHOD FOR PRODUCING THE SAME  
A composite target material includes titanium oxide in a range between about 50 wt % and about 85 wt % and the remaining comprising stannic oxide or aluminum oxide or a combination of stannic...
US20150184280 ITO Ceramic Sputtering Targets with Reduced In2O3 Contents and Method of Producing It  
The embodiments of the invention cover a ceramic sputtering target comprising at least 85 wt. % of an (In4Sn3O12 phase, wherein the ceramic sputtering target has a density of greater than 7.0...
US20140360871 Fe-Pt-Ag-C-Based Sputtering Target Having C Grains Dispersed Therein, and Method for Producing Same  
An Fe—Pt—Ag—C-based sintered compact sputtering target having a composition represented by a formula (Fe100-X—PtX)100-Y-Z—AgY-CZ (wherein X represents a numerical value satisfying a formula...
US20130334581 Device with MOS Device Including a Secondary Metal and PVD Tool with Target for Making Same  
A device includes a substrate and a metal-oxide-semiconductor (MOS) device. The MOS device includes a gate dielectric over the substrate, a gate electrode over the gate dielectric, a source/drain...
US20120199469 PVD SPUTTERING TARGET WITH A PROTECTED BACKING PLATE  
Embodiments of the invention provide sputtering targets utilized in physical vapor deposition (PVD) and methods to form such sputtering targets. In one embodiment, a sputtering target contains a...
US20130192986 METHOD FOR PRODUCING CU-GA ALLOY POWDER, CU-GA ALLOY POWDER, METHOD FOR PRODUCING CU-GA ALLOY SPUTTERING TARGET, AND CU-GA ALLOY SPUTTERING TARGET  
Provided are a method for producing a Cu—Ga alloy powder, by which a high quality Cu—Ga alloy powder to be produced readily; a Cu—Ga alloy powder; a method for producing a Cu—Ga alloy sputtering...
US20110290643 Low Melting Point Sputter Targets for Chalcogenide Photovoltaic Applications and Methods of Manufacturing the Same  
In one example embodiment, a sputter target structure for depositing semiconducting chalcogenide films is described. The sputter target includes a target body having a target body composition that...
US20130087453 METHOD FOR FORMING SPUTTER TARGET ASSEMBLIES HAVING A CONTROLLED SOLDER THICKNESS  
The present invention relates to a method and apparatus of forming a sputter target assembly having a controlled solder thickness. In particular, the method includes the introduction of a bonding...
US20140346038 CRYSTALLINE ALLOY HAVING GLASS-FORMING ABILITY, PREPARATION METHOD THEREOF, ALLOY TARGET FOR SPUTTERING, AND PREPARATION METHOD THEREOF  
Provided are a crystalline alloy having significantly better thermal stability than an amorphous alloy as well as glass-forming ability, and a method of manufacturing the crystalline alloy. The...
US20090211904 ZINC OXIDE BASED SPUTTERING TARGET, METHOD OF MANUFACTURING THE SAME, AND ZINC OXIDE BASED THIN FILM  
Disclosed are a zinc (Zn) oxide based sputtering target, a method of manufacturing the same, and a Zn oxide based thin film deposited using the Zn oxide based sputtering target. The Zn oxide based...
US20090139859 Chromic Oxide Powder for Sputtering Target, and Sputtering Target Manufactured from such Chromic Oxide Powder  
Provided is chromic oxide powder for a sputtering target comprised of chromic oxide wherein sulfur is 100 wtppm or less. This sputtering target contains chromic oxide of 5 molar % or higher or...
US20100320085 Sputtering Target for Producing Metallic Glass Membrane and Manufacturing Method Thereof  
A sputtering target for producing a metallic glass membrane characterized in comprising a structure obtained by sintering atomized powder having a composition of a ternary compound system or...
US20070051624 Copper or copper alloy target/copper alloy backing plate assembly  
Provided is a copper or copper alloy target/copper alloy backing plate assembly in which the anti-eddy current characteristics and other characteristics required in a magnetron sputtering target...