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US20130206589 Sputtering Target Having Alarm Function  
The present invention provides a sputtering target having alarm function. The sputtering target comprises: a target body including a target material and having a bonding plane; a backing body...
US20120097529 MAGNETRON COATING MODULE AND MAGNETRON COATING METHOD  
The invention relates to a new basic technology for magnetron sputtering of ceramic layers, in particular for optical applications. The new concept enables the construction of magnetron sputtering...
US20150235818 MAGNETRON SPUTTERING COATING DEVICE, A NANO-MULTILAYER FILM, AND THE PREPARATION METHOD THEREOF  
A magnetron sputtering coating device includes a deposition chamber, sputtering cathodes, a rotating stand within the deposition chamber, a support platform on the rotating stand, a first rotation...
US20120267243 SYSTEMS AND METHODS FOR A TARGET AND BACKING PLATE ASSEMBLY  
A target and backing plate assembly and method of making the same. The target and backing plate assembly provides a mechanical interlock between the target and backing plate in addition to...
US20150235821 UNIFORM FORCE FLANGE CLAMP  
A clamp is provided that incorporates a plurality of flexible links with V flexures between the links to maintain even spacing of the links before and during installation. Each link has multiple...
US20120228131 METHOD FOR CONSOLIDATING AND DIFFUSION-BONDING POWDER METALLURGY SPUTTERING TARGET  
Methods for manufacturing sputtering target assemblies and assemblies thereof are provided, particularly targets made of powders. Powders are adhered to a backing plate by use of a vacuum hot...
US20110203920 TARGET SHAPING  
A target for a physical vapor deposition system includes a top, a bottom, and a base. The base essentially is defined by the surface of the target to be sputtered. A first, inner ring and a...
US20120037500 HOLLOW TARGET ASSEMBLY  
A hollow target assembly has a support tube, a target body and a plurality of elastic elements. The target body includes a plurality of hollow target materials and they pass through the support...
US20120067721 TARGET ASSEMBLY  
A target assembly includes a base comprising a first surface and a second surface opposite to the first surface. The base defining a threaded hole; a magnetron mounted on a first surface; a target...
US20110203921 METHOD OF BONDING ROTATABLE CERAMIC TARGETS TO A BACKING STRUCTURE  
This invention relates to a rotatable cylindrical magnetron sputtering apparatus and related process. More specifically, the invention relates to a cylindrical target assembly for a cylindrical...
US20120305393 SPUTTER TARGET  
In one aspect of the invention, a sputter target is provided comprising a backing plate (40) comprising a front surface and a back surface; and a sputtering plate mounted on said backing plate,...
US20150114824 PHYSICAL VAPOR DEPOSITION TILE ARRANGEMENT AND PHYSICAL VAPOR DEPOSITION ARRANGEMENT  
In various embodiments, a physical vapor deposition tile arrangement is provided. The physical vapor deposition tile arrangement may include a plurality of physical vapor deposition tiles arranged...
US20130126343 SPUTTER TARGET STRUCTURE OF TRANSPARENT CONDUCTIVE LAYER  
The present invention discloses a sputter target structure of a transparent conductive layer, which comprises a middle plate potion, two short-edge thickness-variation end portions, and two...
US20150170888 PHYSICAL VAPOR DEPOSITION (PVD) TARGET HAVING LOW FRICTION PADS  
Embodiments of target assemblies for use in substrate processing chambers are provided herein. In some embodiments, a target assembly includes a plate comprising a first side including a central...
US20110005925 TARGET BACKING TUBE, CYLINDRICAL TARGET ASSEMBLY AND SPUTTERING SYSTEM  
The present application concerns a target backing tube for a rotatable cylindrical target assembly comprising: a tube for at least one target element to be disposed there around, wherein the tube...
US20120006676 POTASSIUM/MOLYBDENUM COMPOSITE METAL POWDERS, POWDER BLENDS, PRODUCTS THEREOF, AND METHODS FOR PRODUCING PHOTOVOLTAIC CELLS  
A method for producing a composite metal powder according to one embodiment of the invention may comprise: Providing a supply of molybdenum metal powder; providing a supply of a potassium...
US20080047831 Segmented/modular magnet bars for sputtering target  
A modular and/or segmented magnetic bar for magnetron sputtering targets is provided. A magnet bar is made up of a plurality of magnet segments aligned in a substantially linear manner. One or...
US20150170887 LOW DEFLECTION SPUTTERING TARGET ASSEMBLY AND METHODS OF MAKING SAME  
Described is a design and method for producing a sputtering target assembly with low deflection made from target material solder bonded to composite backing plate with coefficient of thermal...
US20110256356 Metallic Structures with Variable Properties  
Variable property deposit, at least partially of fine-grained metallic material, optionally containing solid particulates dispersed therein, is disclosed. The electrodeposition conditions in a...
US20090127106 MAGNET CHOIR DESIGN FOR TARGET MATERIAL EROSION  
A magnetic choir layout capable of enabling material erosion from a target providing a substantially uniform wear pattern.
US20130337602 Sputtering Target Including a Feature to Reduce Chalcogen Build Up and Arcing on a Backing Tube  
A sputtering target has a cylindrical backing tube having two edges and a sidewall comprising a middle portion located between two end portions. The sputtering material is on the backing tube. The...
US20110062021 SPUTTER-COATING APPARATUS  
A sputter-coating apparatus for coating a plurality of workpieces includes a deposition case defining a cavity, a supporting assembly received in the cavity, and a target assembly received in the...
US20140076716 Low Pressure Arc Plasma Immersion Coating Vapor Deposition And Ion Treatment  
A vacuum coating and plasma treatment system includes a magnetron cathode with a long edge and a short edge. The magnetic pole of the magnetron results in an electromagnetic barrier. At least one...
US20140124365 METHOD OF FORMING A CYLINDRICAL SPUTTER TARGET ASSEMBLY  
In a method of forming a cylindrical sputter target assembly, comprising the steps of: (a) providing a cylindrical backing tube; (b) providing a cylindrical sputter target, the inner diameter of...
US20120211352 SPUTTERING MAGNETRON ASSEMBLY  
The present specification concerns a sputtering magnetron assembly 104,204,304 comprising a rotatable tubular target cathode 105,205,305 and a magnetic field generating device 106,206,306...
US20110005924 TARGET BACKING TUBE, CYLINDRICAL TARGET, AND CYLINDRICAL TARGET ASSEMBLY  
A target backing tube is described. The target backing tube is for a rotatable target and includes a tube adapted for one or more non-bonded target cylinders to be disposed around the tube, the...
US20130087453 METHOD FOR FORMING SPUTTER TARGET ASSEMBLIES HAVING A CONTROLLED SOLDER THICKNESS  
The present invention relates to a method and apparatus of forming a sputter target assembly having a controlled solder thickness. In particular, the method includes the introduction of a bonding...
US20130264199 CYLINDRICAL MAGNETRON SPUTTERING TARGET ASSEMBLY  
A cylindrical magnetron sputtering target assembly includes a head and a main body connecting to the head. The main body includes a target, a protecting element located partially around the...
US20050072668 Sputter target having modified surface texture  
The effects of sputter re-deposition are reduced by macroscopically roughening the non-sputter areas of the sputter target. The macroscopic roughening is obtained by forming a macroscopic trough...
US20050236270 Controlled cooling of sputter targets  
A method for manufacturing a sputter target in which cooling rates are selectively controlled, by generating a sputter surface and a backside surface obverse to the sputter surface. The backside...
US20110303535 SPUTTERING TARGETS AND METHODS OF FORMING THE SAME  
In various embodiments, sputtering targets incorporate an intermediate plate having a coefficient of thermal expansion (CTE) between a CTE of the backing plate and a CTE of the target material.
US20090277787 ROTATABLE SPUTTER TARGET COMPRISING AN END-BLOCK WITH A LIQUID COOLANT SUPPLY SYSTEM  
A tube target with an end block for supplying coolant to the tube target is provided. The end block comprises a rotatably mounted carrier shaft for holding and rotating the tube target; a...
US20140102890 SPUTTERING APPARATUS  
A sputtering apparatus includes a substrate, a sputtering target disposed to face the substrate and formed of a sputtering material to be deposited on the substrate, wherein the sputtering target...
US20070102288 Tantalum sputtering target and method of manufacturing same  
Provided is a tantalum sputtering target manufactured by working a molten and cast tantalum ingot or billet through forging, annealing and rolling, wherein the structure of the tantalum target...
US20130140173 ROTARY SPUTTER TARGET ASSEMBLY  
This invention utilizes a co-extrusion or co-drawing process to directly bond a tubular target to an inner backing tube. The co-extrusion or co-drawing process reduces the inner and outer...
US20070240980 Sputtering target and sputtering equipment  
A sputtering target having at least one flat first sputtering surface and at least one second sputtering surfaces respectively and laterally abutted against the flat first sputtering surface and...
US20070068796 METHOD OF USING A TARGET HAVING END OF SERVICE LIFE DETECTION CAPABILITY  
A method and system for detecting a lifetime of a slab of consumable material used by a process tool. In the method and system, the slab of consumable material is provided with at least one...
US20130043120 SPUTTERING TARGET WITH REVERSE EROSION PROFILE SURFACE AND SPUTTERING SYSTEM AND METHOD USING THE SAME  
A sputtering target is provided that includes a planar backing plate and a target material formed over the planar backing plate and including an uneven sputtering surface including thick portions...
US20050161322 Replaceable target sidewall insert with texturing  
This invention provides a sputter target (30) and backing plate (60) assembly having a replaceable sputter target sidewall insert (10). The replaceable sidewall insert (10) enhances the...
US20070074969 Very long cylindrical sputtering target and method for manufacturing  
The present invention includes a long cylindrical sputtering target assembly and a method for manufacturing the assembly. The long cylindrical sputtering target assembly comprises a cylindrical...
US20120006680 ROTARY TARGET BACKING TUBE BONDING ASSEMBLY  
A rotary sputtering target bonded to a backing tube such that the bonding material is applied only proximate the ends of the rotary sputtering target and is also between the target and the backing...
US20060081465 Assembly for sputtering aluminum-neodymium alloys  
To reduce warp caused by bonding or film deposition and enable stable film deposition over a long time, an assembly for sputtering Al—Nd alloys includes an Al—Nd alloy sputtering target containing...
US20070084719 Inertial bonding method of forming a sputtering target assembly and assembly made therefrom  
A method of forming a sputtering target assembly and the sputtering target assembly made therefrom are described. The method can include bonding a sputtering target to a backing plate with the use...
US20150197848 Sputtering Target  
Provided is a sputtering target-backing plate assembly for a 450-mm wafer, wherein the amount of warpage of the target developed during sputtering is 4 mm or less. Further provided is a method of...
US20110089030 CIG sputtering target and methods of making and using thereof  
A sputtering target includes a copper indium gallium sputtering target material on a backing structure. The sputtering target material has a density of at least 100% or more as defined by the rule...
US20110220489 ROTATABLE TARGET, BACKING TUBE, SPUTTERING INSTALLATION AND METHOD FOR PRODUCING A ROTATABLE TARGET  
A rotatable target for a sputtering installation and a method for producing a rotatable target are provided. The target includes a backing tube to which a target tube is shrink-fitted. The method...
US20070215463 PRE-CONDITIONING A SPUTTERING TARGET PRIOR TO SPUTTERING  
A sputtering target is pre-conditioned prior to use of the target in a sputtering process by removing a damaged surface layer of a sputtering surface of the target. In one version, the sputtering...
US20070209928 Indium Oxide-Cerium Oxide Based Sputtering Target, Transparent Electroconductive Film, and Process for Producing a Transparent Electroconductive Film  
A transparent conductive film for constructing a transparent electrode that is free from the generation of residue, etc. by etching with a weak acid (for example, organic acid). Further, there is...
US20120273347 SPUTTERING TARGET WITH REDUCED PARTICLE GENERATION AND METHOD OF PRODUCING SAID TARGET  
Provided is a sputtering target with reduced particle generation having a target surface in which intermetallic compounds, oxides, carbides, carbonitrides and other substances without ductility...
US20140174921 Multi-Piece Target and Magnetron to Prevent Sputtering of Target Backing Materials  
An apparatus for sputtering wherein magnets within the magnetron of a sputtering source are positioned such that Ar+ ions arriving at the surface of a multi-piece target do not strike the target...

Matches 1 - 50 out of 353 1 2 3 4 5 6 7 8 >