Matches 1 - 46 out of 46


Match Document Document Title
US20050061660 System and method for electrolytic plating  
An electrolytic plating system for plating a via in a printed circuit board. The electrolytic plating system includes an electrolytic plating bath, a support rod supporting the printed circuit...
US20130228455 SUPPORT MECHANISM  
A support mechanism used in an electro plasma polishing process includes a support beam, a first electrically conducting assembly, and a second electrically conducting assembly. The first...
US20150014173 MACHINE FOR THE ELECTRO-MARKING OF LARGE METALLIC SURFACES AND RELATIVE PROCESS  
A machine for the electrochemical marking treatment of metallic surfaces, includes an electrode placed in sliding movement on the metallic surface to be treated, a buffer impregnated with etching...
US20130056358 DROPLET BILAYER FORMATION USING THROUGHPUT LIQUID HANDLING TECHNIQUES  
The invention relates to methods and devices for forming and measuring lipid bilayers, for example, by joining lipid monolayers that self-assemble at the interface of aqueous and organic phases...
US20070108044 Plating tank  
Provides a plating tank that can transport platy work securely without causing abrasion and attain uniform plating quality and uniform plating film thickness. The shields are comprised of four...
US20130008780 AUTOMATED ELECTROPOLISHING PROCESS  
An electropolishing system including an anode, a cathode, a rolling block and a motion controller. The anode is configured to removably retain a metal device to be electropolished, and may be...
US20130081939 SERIAL PLATING SYSTEM  
A serial plating system includes a plating tank that receives a plating solution, a plurality of workpieces that are serially transferred along a transfer path being simultaneously plated in the...
US20140360865 COPPER ELECTROPLATING APPARATUS  
A copper electroplating apparatus is disclosed. The copper electroplating apparatus includes: a plating bath configured to hold a plating solution therein; a soluble anode of phosphorus-containing...
US20060060468 System for treating, in particular, cataphoretically immersion painting vehicle bodies  
In a system for treating, in particular, cataphoretically immersion painting objects, the objects (4) to be treated pass through at least one bath (100) and a drip zone (101) located down from...
US20140076737 ELECTROPOLISHING FIXTURE WITH PLUNGER MECHANISM  
An electropolishing fixture with a plunger mechanism. The plunger mechanism can establish contact between a device and an anode mandrel during an electropolishing process while the device is...
US20140083842 SERIAL PLATING SYSTEM  
A serial plating system includes a plurality of nozzles that are disposed in a plating tank at a position opposite to a plurality of workpieces, and that discharge a plating solution toward the...
US20070144433 Electrophoretic dip coating plant  
An electrophoretic dip coating plant comprises at least one dip tank, which is filled with a coating fluid. The objects which are to be coated are carried by means of a conveyor system through the...
US20150096895 METHOD AND APPARATUS FOR ELECTROLYTICALLY DEPOSITING A DEPOSITION METAL ON A WORKPIECE  
For improving the current transfer during the electrolytic metallization of workpieces, a method is proposed: (a) providing a metal depositing apparatus 17, in which the workpiece, at least one...
US20110042201 In situ Plating And Soldering Of Materials Covered With A Surface Film  
The disclosed subject matter provides systems and methods for etching and/or metal plating of substrate materials. An exemplary method in accordance with the disclosed subject matter for...
US20050006243 Plating method and plating apparatus  
The present invention provides a plating method and a plating apparatus capable of plating small parts effectively without any deformation. A object product to be plated is put in each...
US20140076719 ELECTROPOLISHING METHOD INCLUDING MULTI-FINGER CONTACTS  
Systems and methods for electropolishing devices are disclosed. The electropolishing system includes electropolishing fixtures configured to reposition the devices during the electropolishing process.
US20110168548 DEVICE FOR THE DIP PAINTING OF A BODY PART  
A device for the dip painting of a body part with a basin for receiving a coating liquid has two parallel guides for guiding the body part and an anode body. The body part is connected to a...
US20090255827 AUTOMATED ELECTROPOLISHING PROCESS  
An electropolishing system including an anode, a cathode, a rolling block and a motion controller. The anode is configured to removably retain a metal device to be electropolished, and may be...
US20130161197 SUBSTRATE PLATING APPARATUS AND SUBSTRATE PLATING CONTROL METHOD  
Disclosed herein is a substrate plating apparatus, including: a constant current device supplying power; cathode hangers that includes a plurality of clamps holding substrates, hall current...
US20140295093 PLATING APPARATUS AND PLATING METHOD  
A plating apparatus includes a processing bath configured to store a processing liquid therein, a transporter configured to immerse a substrate holder, holding a substrate, in the processing...
US20100300886 CONTINUOUS MICRO ANODE GUIDED ELECTROPLATING DEVICE AND METHOD THEREOF  
A continuous micro anode guided electroplating device and a method thereof are revealed. By real-time image monitoring and capillary action of the micro/nanoscale tube, a three-dimensional...
US20070284243 Modular system for improving electro-metallurgical processes  
A modular system for improving electro-metallurgical processes comprising a nucleus formed by upper and lower rectangular frames, the nucleus. At least one cathode guide is attached to at least...
US20050279640 Method of forming a lead-free bump and a plating apparatus therefor  
The present invention relates to a lead-free bump with suppressed formation of voids, obtained by reflowing a plated film of Sn—Ag solder alloy having an adjusted Ag content, and a method of...
US20050072682 Process and apparatus for coating components of a shopping cart and a product  
A process and apparatus for coating components against corrosion and for durability. The process including cleaning the metal parts with cleaners and acid dips, rinsing, then dip coating the...
US20060000719 Method and apparatus for feeding chips to a deposition location in a coating system  
A device for storing and feeding chips to a deposition location in a coating system comprises a holder stack comprising a plurality of holders including first and last holders, a biasing element...
US20060191784 Methods and systems for electroplating wafers  
Improved methods and systems for electroplating wafers are described herein. The method includes the acts of introducing a wafer which is coupled to an electrode into an electroplating cell having...
US20090090633 ELECTROPLATING SYSTEM WITH MOVABLE SUPPORT STRUCTURE PROVIDING CATHODE POTENTIAL  
A processing system, electroplating cell, transport system, cathode contact subsystem and method of providing a cathode contact to the articles being transported within an electroplating cell. The...
US20150122634 ELECTROCHEMICAL MACHINING APPARATUS  
An electrochemical machining apparatus includes a fastening bracket, a first drive member positioned on the fastening bracket, a connecting member, a first electrode connected to the connecting...
US20130015075 PLATING APPARATUS AND PLATING METHOD  
A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting...
US20080006526 Device for plating contacts in hermetic connector assemblies  
This invention relates generally to a method and apparatus for electroplating selected portions of elongate and generally cylindrical metallic articles pre assembled and held in spaced-apart...
US20140076739 ELECTROPOLISHING DEVICE AND METHOD  
A device for repositioning a device during an electropolishing process. A fixture is disclosed that is configured to reposition the device during the electropolishing process in order to more...
US20150090584 PLATING APPARATUS AND CLEANING DEVICE USED IN THE PLATING APPARATUS  
A plating apparatus for plating a substrate is disclosed. The plating apparatus includes: a dip-type plating bath; a dry-type plating bath having a hole in a sidewall thereof; and a pressing...
US20050224357 Method and device for treating flat and flexible work pieces  
The device in accordance with the invention and the method serve to treat flat and flexible work pieces (1) with a fluid, preferably in electroplating plants and etching facilities. The device and...
US20050241955 Substrate processing apparatus and substrate processing method  
A substrate processing apparatus and a substrate processing method can appropriately control the charge of a substrate depending on the type of wet processing, thereby reducing defective...
US20070114125 System and method for electroplating flexible substrates  
A processing system for processing flexible substrates is disclosed. The system includes a loading station having an input spool adapted to support a wounded, unprocessed flexible substrate; a...
US20070272545 APPARATUS FOR PROCESSING SUBSTRATE AND METHOD OF PROCESSING SUBSTRATE  
A substrate processing apparatus comprises an applying part for applying droplets of cleaning solution onto a substrate, a ring-shaped induction electrode located close to an outlet of the...
US20130061920 PHOTOVOLTAIC CELL WITH POROUS SEMICONDUCTOR REGIONS FOR ANCHORING CONTACT TERMINALS, ELECTROLITIC AND ETCHING MODULES, AND RELATED PRODUCTION LINE  
A photovoltaic cell (100) is proposed. The photovoltaic cell includes a substrate (105; 105′) of semiconductor material, and a plurality of contact terminals (Tf,Tb) each one arranged on a...
US20130313124 ELECTRO CHEMICAL DEPOSITION APPARATUS  
This invention relates to apparatus for electrochemical deposition onto the surface of a substrate. The apparatus includes an anode electrode 13 a support 12 for supporting the substrate 11 with...
US20100171409 CARBON NANOTUBES, SUBSTRATE AND ELECTRON EMISSION DEVICE WITH SUCH CARBON NANOTUBES AND CARBON NANOTUBE SYNTHESIZING SUBSTRATE AS WELL AS METHODS OF AND APPARATUS FOR MAKING THEM  
A novel carbon nanotube (64) is featured in that it has the highest Raman scattering intensity in the vicinity of 1580 cm−1 in its Raman spectrum. Carbon nanotubes can be grown on and from the...
US20090038960 APPARATUS AND METHOD OF ELECTROLYTIC REMOVAL OF METALS FROM A WAFER SURFACE  
An apparatus and method designed to remove metals from a wafer surface using an electrolytic removal process. The apparatus includes a conductive pad having a plurality of alternating cathodes and...
US20060201817 Device and method for electrolytically treating electrically insulated structures  
In order to permit continuous electrolytic treatment of small electrically conductive structures that are electrically insulated against each other on electrically insulating foil material, a...
US20050236268 Substrate processing apparatus  
A substrate processing apparatus has a plating apparatus configured to plate a substrate to deposit a metal on a surface of the substrate and an additional process apparatus configured to perform...
US20140315381 INTERCONNECT FABRICATION AT AN INTEGRATED SEMICONDUCTOR PROCESSING STATION  
A stand-alone processing station of a semiconductor manufacturing system may be configured to fabricate interconnects on a semiconductor wafer. The stand-alone processing station may include a...
US20120292179 ELECTROCHEMICAL PROCESSOR  
An electrochemical processor may include a head having a rotor configured to hold a workpiece, with the head moveable to position the rotor in a vessel. Inner and outer anodes are in inner and...
US20120048727 SEMICONDUCTOR WAFER HOLDER AND ELECTROPLATING SYSTEM FOR PLATING A SEMICONDUCTOR WAFER  
A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact...
US20110259734 Apparatus for Electrochemical Plating Semiconductor Wafers  
An electroplating apparatus for depositing a conductive material on a semiconductor wafer includes a vessel for holding an electroplating bath, a support for holding a semiconductor wafer within...

Matches 1 - 46 out of 46