Matches 1 - 50 out of 58 1 2 >


Match Document Document Title
US20120014048 Cable Kink Protection Unit and Method for Producing Same  
A cable kink protection unit, in particular a cable kink protection unit of a portable tool, includes at least one basic body unit. The cable kink protection unit has at least one electric device...
US20140190736 RADIATION-CURABLE RUBBER ADHESIVE/SEALANT  
A radiation-curable adhesive/sealant composition comprises a radiation-curable rubber resin, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers.
US20110017506 MODULAR OVER-MOLD HARNESS  
An over-molded harness including a plurality of bundled flexible electric wires, an electrical or electronic element electrically connected between at least two of the wires, and at least a...
US20080185182 ELECTRICAL UNIT FOR BOAT AND OUTBOARD MOTOR  
An electrical unit includes one of a large current relay, a circuit protection fuse, and an operation time display section fixed on a circuit board having an external connector. The electrical...
US20100089636 NANOPARTICULATE ENCAPSULATION BARRIER STACK  
A barrier stack for encapsulating a moisture and/or oxygen sensitive electronic device is provided. The barrier stack comprises a multilayer film having at least one barrier layer having low...
US20100155247 RADIATION-CURABLE RUBBER ADHESIVE/SEALANT  
A radiation-curable adhesive/sealant composition comprises a radiation-curable rubber resin, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers.
US20120043131 Method for Producing a Sensor with Seamless Extrusion Coating of a Sensor Element  
A method for producing a sensor with seamless extrusion coating of a sensor element and a sensor produced by said method. The sensor element is enclosed in as sealed a manner as possible by the...
US20130106868 ENCAPSULATION OF EMS DEVICES ON GLASS  
This disclosure provides systems, methods and apparatus for fabricating encapsulated devices, including electromechanical systems devices. In one aspect, a cover plate including one or more...
US20130333675 SENSOR ASSEMBLY WITH PROTECTIVE COATING AND METHOD OF APPLYING SAME  
A sensor assembly with a protective coating and a method of applying the coating is disclosed. The sensor assembly includes a sensor, a first conductive lead extending from the sensor, a second...
US20110290552 METHOD AND SYSTEM FOR PACKAGING MEMS DEVICES WITH INCORPORATED GETTER  
Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant...
US20140291012 Electronic Device  
An electronic device is disclosed having a housing with a single opening, and an inner space accessible solely through the opening. A covering plate is positioned within the opening. An...
US20070175660 Warpage-reducing packaging design  
A flange and packaging assembly characterized by a structural lip configured to impart resistance to thermal-induced deformation (i.e. “stiffness”) to the flange during elevated temperature die...
US20140027172 HOUSING-SIDE SEPARATING LAYER FOR THE STRESS DECOUPLING OF POTTED ELECTRONICS  
The invention relates to a device, which includes a substrate for carrying an electrical circuit, a housing for enclosing the substrate, and a potting compound accommodated in the housing, which...
US20070230103 Application of electronic components in printed products  
The invention provides a method and apparatus for integrating electronic components on conductor tracks as well as corresponding electronic components. With the invention, the electronic component...
US20140000955 Conformal Coating Capable of Scavenging a Corrosive Agent  
A corrosion-resistant apparatus may contain an electronic component having a metal covered by a conformal coating. The conformal coating may contain polymer chains with unsaturated groups capable...
US20060201709 Low profile small outline leadless semiconductor device package  
A molded leadless package encapsulates a small outline integrated circuit or small outline transistor through contact bumps. Electrical contacts extend from the encapsulated device to an exposed...
US20090057006 ELECTRONIC UNIT AND PRODUCTION METHOD OF THE SAME  
A method of producing an electronic unit in which components are housed in a case and molded with resin, wherein an opening portion of the case housing the components of the unit is closed by a...
US20090120685 Method For Encapsulating Electrical And/Or Electronic Components In A Housing  
The invention relates to a method for encapsulating electrical and/or electronic components in a housing, the components being arranged on a printed circuit or a strip conductor in an assembly....
US20130264110 ELECTRICAL GROUNDING PLANE  
An electrical assembly including electrical raft having electrical conductors embedded in a rigid material is provided. The electrical assembly has an electrically conductive screen layer. The...
US20130077264 Sealed Overmolded Circuit Board With Sensor Seal and Edge Connector Seal and Production Method Of The Same  
An electronic apparatus partially overmolded with a overmold sealing material that seals the circuit board, protects the electrical components on the circuit board and provides seals between the...
US20090266606 ELECTRIC APPARATUS MODULE  
The invention provides an electric apparatus unit which can be easily assembled. The electric apparatus module includes an upper case, a lower case assembled with the upper case and having an...
US20110011640 INSULATING MEDIUM AND ITS USE IN HIGH VOLTAGE DEVICES  
An insulating composition for use in high voltage devices is formed from a soft dielectric casting compound, such as a silicone gel, comprising ferroelectric particles such as barium titanate...
US20100101817 CONNECTING BOX FOR FIELD DEVICE  
A connecting box is provided for a field device. To simplify installation even in the case of physically small devices, a connecting terminal of the connecting box is arranged in a cover of the...
US20140083760 METHOD FOR PRODUCTION OF SEALED BODY, FRAME-SHAPED SPACER FOR PRODUCTION OF SEALED BODY, SEALED BODY AND ELECTRONIC INSTRUMENT  
Provided is a method for production of a sealed body which is capable of improving workability and reducing costs owing to resin-sealing in which a mold is not used, while an electronic instrument...
US20150047897 METHOD AND APPARATUS FOR USE IN PROVIDING WIRE STRAIN RELIEF WITH ENVIRONMENTALLY PROTECTED IRRIGATION DEVICES  
Some embodiments comprise apparatuses providing an electrical conductor guide for use with an irrigation device comprising: a housing having a volume and containing an electronic component and one...
US20050133241 Chip orientation and attachment method  
A chip orientation and attachment method is disclosed which eliminates or substantially reduces chip damage caused by thermal stress induced by application of a molding compound to the chip and...
US20090038843 Functional element-mounted module and a method for producing the same  
A functional element-mounted module can be decreased in size and requires no costly and special members for a light transition member. A substrate is used, on which an optical functional element...
US20100133001 Electronic Housing  
An electronic housing, which includes at least two housing parts, has at least one housing base, a housing cover, and at least one electronic connection in the form of a printed circuit board...
US20150096800 Electronic Module for Operation in a Transmission  
An electronic module for a vehicle includes a can housing and a circuit carrier having at least one connecting element. The circuit carrier is positioned in the can housing, and is cast with a...
US20060171126 Memory card with memory chip replaceable  
A memory card with its memory chip replaceable as desires includes a circuit substrate disposed with control chip, chip contact and golden finger thereon, and a package externally to the circuit...
US20130183003 Pressure-Balanced Subsea Junction Box and Cable Termination Apparatus and Method  
An apparatus and method for sealably joining cables to pressure-balanced submersible junction boxes. The apparatus maintains a balanced pressure within the termination chamber; it is field...
US20090145656 Electrical device  
A device embodied as a measuring- and/or switching-device of industrial measurements and automation technology and/or an electronic, device, has at least one housing with at least one chamber,...
US20090277682 PROTECTIVE STRUCTURE FOR A CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME  
In a protective structure for a circuit board (1) that includes a casing (3) for receiving the circuit board, the casing is provided with a recess (11) for receiving a large component part...
US20110272191 POTTING FOR ELECTRONIC COMPONENTS  
A potting material for an electronic component, an electronic component, and a process for positioning ferrites in an electronic material are disclosed. The potting material is formed by curing a...
US20100258346 PACKAGE OF ENVIRONMENTALLY SENSITIVE ELECTRONIC DEVICE AND FABRICATING METHOD THEREOF  
A package of an environmentally sensitive electronic device including a first substrate, a second substrate, an environmentally sensitive electronic device, a plurality of barrier structures, and...
US20050034887 Device and method for forming support systems for electric generator components  
A device for producing a workable material usable to form supports for supporting components, which may be stator coils, in a generator. In at least one embodiment, the supports may be braces...
US20070177362 COVERT INTELLIGENT NETWORKED SENSORS AND OTHER FULLY ENCAPSULATED CIRCUITS  
A metallic enclosure completely encapsulates an embedded electronic system, which may include sensors, wireless communications devices and other circuits. The enclosure is fabricated in layers of...
US20110121494 Method for the Production of an Electrically Insulating Cast Body and Base for a Lamp  
A method for the production of an electrically insulating cast body having one or more electronic components that are arranged in a plastic casting chamber (214) that is filled with an...
US20140291011 ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME  
An electronic device includes a substrate and a lid bonded on the substrate with a resin layer to seal an inside of the lid. The resin layer is formed at a part of the substrate to which the lid...
US20100193240 DEVICE  
A device includes: a package having a bottom and a side wall surrounding the bottom; an element adhered to the bottom of the package; an internal contact formed inside the package; a resin...
US20140034381 HOUSING COMPONENT FOR DOOR LATCH ASSEMBLY AND METHOD OF MAKING  
A component for a vehicle latch assembly is provided, the component having: an electrical sub-system having a plurality of circuit paths each being electrically connected to a common ground, the...
US20110061927 HOUSING COMPONENT FOR DOOR LATCH ASSEMBLY AND METHOD OF MAKING  
A component for a vehicle latch assembly is provided, the component having: an electrical sub-system having a plurality of circuit paths each being electrically connected to a common ground, the...
US20100051345 PACKAGE, METHOD OF MANUFACTURING A PACKAGE AND FRAME  
The package comprises a chip and a plurality of frame contact pads. The chip is attached to the frame contact pads in a die attach area with a die attach adhesive. The chips is coupled to frame...
US20110079425 TREATMENT METHOD OF A GETTER MATERIAL AND ENCAPSULATION METHOD OF SUCH GETTER MATERIAL  
A treatment method for a getter material, comprising at least one oxidation and/or nitriding step of getter material conducted under dry atmosphere of dioxygen and/or dinitrogen at pressure...
US20110114840 ENCAPSULATING PACKAGE, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ENCAPSULATING PACKAGE  
The present invention is: a package main body section having a hollow section; and an electronic device provided in the hollow section in the package main body section, in the package main body...
US20080041625 Apparatus, system and method for use in mounting electronic elements  
The present embodiments provide apparatuses, systems and methods of manufacturing surface mountable devices. Some embodiments provide surface mount devices that comprise a casing comprising a...
US20110114383 POTTED ELECTRONIC COMPONENT AND METHOD FOR ITS MANUFACTURE  
A method of manufacturing an electronic component assembly is disclosed comprising disposing an electronic component in a housing such that there is at least one void space between the component...
US20100079035 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF  
An electronic device includes: a package including a lid and a package base, the package being formed by bonding the lid to a joint surface of the package base using a bonding material; and a...
US20060169490 Molding tool and a method of forming an electronic device package  
Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an...
US20100230155 APPARATUS COMPRISING AN ELECTRONICS MODULE AND METHOD OF ASSEMBLING APPARATUS  
An apparatus comprising: a substrate; an electronics module mounted on the substrate; and an injection molded layer in contact with the substrate; wherein the substrate and the injection molded...

Matches 1 - 50 out of 58 1 2 >