Matches 1 - 50 out of 229 1 2 3 4 5 >


Match Document Document Title
US20150114707 NANO-COPPER SOLDER FOR FILLING THERMAL VIAS  
A method of and device for forming vias on an electronic board (such as a PCB board) comprises forming one or more holes on the electronic board, placing a nanomaterial inside the one or more...
US20120168221 RELAY BOARD FOR TRANSMISSION CONNECTOR USE  
A relay board for relaying plurality of electric wires to a transmission connector, the relay board provided with first and second front ground pads 12a, 12b which are arranged on a front surface,...
US20130153269 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME  
A wiring board includes a first multilayer wiring board having first conductive layers and having a surface, a second multilayer wiring board having second conductive layers and positioned such...
US20130199833 CIRCUIT BOARD  
Disclosed herein is a circuit board including: a base substrate including a via for power and a via pad for power connected to the via for power; and an insulating layer formed on the base...
US20110303454 LAMINATED CIRCUIT BOARD AND BOARD PRODUCING METHOD  
A laminated circuit board includes a first wiring board that has a first land formed on a surface thereof; a second wiring board that has a second land formed on a surface thereof; a bonding layer...
US20120111625 Printed circuit board and method for filling via hole thereof  
Disclosed herein is a method for filling a via hole of a printed circuit board, the method including: a dividing step of dividing a via hole that is to be formed in a base substrate into a...
US20110290549 WIRING BOARD, WIRING BOARD MANUFACTURING METHOD, AND VIA PASTE  
A wiring board includes a plurality of wirings laid via an insulating resin layer, and a via-hole conductor provided for electrically connecting the wirings. The via-hole conductor includes metal...
US20140332262 OPTICALLY TRANSPARENT ELECTRODE  
Provided is an optically transparent electrode of which the visibility of the electrode pattern is low. The optically transparent electrode is produced by joining two optically transparent...
US20110303453 LAMINATED CIRCUIT BOARD AND BOARD PRODUCING METHOD  
A laminated circuit board includes a first wiring board that has a first land formed on a surface thereof; a second wiring board that has a second land formed on a surface thereof; a bonding layer...
US20110168439 MULTILAYER CERAMIC CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME  
There is provided a method of manufacturing a multilayer ceramic circuit board. A multilayer ceramic circuit board according to an aspect of the invention may include: preparing a plurality of...
US20120199389 METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD  
A method for manufacturing a printed wiring board, in which filled vias with a reduction in faulty connections are formed, and providing such a printed wiring board. After an electroless plated...
US20110139494 EMBEDDED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME  
A method for manufacturing an embedded wiring board is provided. An activating insulation layer is formed, in which the activating insulation layer includes a plurality of catalyst particles, and...
US20110261557 Metal Core Circuit Board With Conductive Pins  
A metal core circuit board assembly includes a circuit board having a through hole in an embodiment. A shaft for a pin is inserted in the through hole such that cap of the pin abuts a foil layer...
US20130092429 CROSS TALK REDUCTION FOR HIGH-SPEED ELECTRICAL CONNECTORS  
An electrical connector includes a printed circuit board that includes a body that carries a plurality of ground conductors that define respective ground contact pads, and a plurality of signal...
US20130341077 METHOD FOR REPAIRING DISCONNECTION IN WIRING BOARD, METHOD FOR MANUFACTURING WIRING BOARD, METHOD FOR FORMING WIRING IN WIRING BOARD AND WIRING BOARD  
A method for repairing a disconnection in a wiring board includes positioning a substrate including an insulation layer and a conductive layer formed on the insulation layer, the conductive layer...
US20090008145 EMBEDDED CIRCUIT STRUCTURE AND FABRICATING PROCESS OF THE SAME  
A fabricating process for an embedded circuit structure is provided. A through hole is formed in a core panel and penetrates the core panel. Two indent patterns are respectively formed on two...
US20110147064 BORON NITRIDE AGGLOMERATED POWDER  
Novel boron nitride agglomerated powders are provided having controlled density and fracture strength features. In addition methods for producing same are provided. One method calls for providing...
US20110100698 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME  
A wiring board has a first rigid wiring board having a substrate with a penetrating hole, a first insulation layer formed on the substrate to cover at least one opening of the penetrating hole,...
US20120318567 WIRING STRUCTURES  
A wiring structure includes a first plug extending through a first insulating interlayer on a substrate, a first wiring extending through a second insulating interlayer on the first insulating...
US20110180310 PRINTED CIRCUIT BOARD  
A printed circuit board includes a substrate including through holes, pad portions arranged on surfaces of the substrate, and insulating areas. Each of the pad portions includes a first pad...
US20110232948 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD  
A printed wiring board includes a core substrate having a penetrating hole, a first circuit on a first surface of the substrate, a second circuit on a second surface of the substrate, and a...
US20110220405 METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD  
A method for manufacturing a multilayer printed wiring board, the method includes forming a group of first through holes in a first insulating substrate; forming a group of second through holes in...
US20110214915 PRINTED WIRING BOARD  
A printed wiring board comprises a wiring substrate provided with at least one conductor circuit, a solder resist layer provided on the surface of the wiring substrate, at least one conductor pad...
US20130146345 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME  
A printed wiring board includes a first insulation layer, a first conductive pattern formed on a first surface of the first insulation, a second conductive pattern formed on a second surface of...
US20140251659 CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRCUIT BOARD  
A circuit board, onto which an electronic component is to be mounted, is provided with insulating core substrates and patterned metal plates. The metal plates are bonded to at least one side of...
US20130153279 WIRING BOARD AND MOUNTING STRUCTURE THEREOF  
A wiring board according to an embodiment includes an inorganic insulating layer provided with a via-hole which is a penetrating hole, and a via-conductor which is a penetrating conductor disposed...
US20150083469 WIRING BOARD  
A wiring board includes a substrate body provided with a through hole penetrating the substrate body from one surface to another surface; and a through wiring formed in the through hole and...
US20120024586 PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC EQUIPMENT  
A printed wiring board including a substrate that includes wiring through-hole portions where wiring through-holes which each penetrate the substrate from a surface on a front side of the...
US20140231126 STRUCTURES FOR Z-AXIS INTERCONNECTION OF MULTILAYER ELECTRONIC SUBSTRATES  
Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration....
US20130319736 MULTILAYER ELECTRONIC STRUCTURES WITH INTEGRAL VIAS EXTENDING IN IN-PLANE DIRECTION  
A multilayer electronic support structure comprising at least one pair of adjacent feature layers extending in an X-Y plane that are separated by a via layer; said via layer comprising a...
US20130141191 ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD  
An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an...
US20150083480 INTERPOSER BOARD AND METHOD OF MANUFACTURING THE SAME  
Disclosed herein are an interposer board and a method of manufacturing the same. According to a preferred embodiment of the present invention, the interposer substrate may include: a base...
US20050016764 Wiring substrate for intermediate connection and multi-layered wiring board and their production  
There is provided a wiring substrate for intermediate connection comprising: (1) a wiring board having a plurality of wiring layers which are connected through a via hole conductor(s) with each...
US20130062108 WIRING BOARD AND METHOD OF MANUFACTURING THE SAME  
A wiring board includes: a first wiring layer; a first insulating layer formed on the first wiring layer and including a reinforcing material therein, the first insulating layer having a first...
US20140363927 Novel Terminations and Couplings Between Chips and Substrates  
A method of attaching a chip to the substrate with an outer layer comprising via pillars embedded in a dielectric such as solder mask, with ends of the via pillars flush with said dielectric, the...
US20140097009 WIRING SUBSTRATE  
A wiring substrate includes a first wiring layer, a first insulating layer, a second wiring layer, and a first wiring pattern. The second wiring layer includes a first metal foil that is thinner...
US20120247824 SUSPENSION BOARD WITH CIRCUIT  
A suspension board with circuit includes a conductive pattern on a top surface thereof. A folded-back portion that is capable of being folded back toward a back surface side is provided therein....
US20110120762 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD  
A printed wiring board including a substrate having first and second surfaces and a penetrating hole extending through the substrate between the surfaces, a first conductive circuit on the first...
US20100307808 WIRING BOARD  
A wiring board includes a core substrate having a structure including an insulating base material and a large number of filamentous conductors densely provided in the insulating base material and...
US20050257953 Method of creating gold contacts directly on printed circuit boards and product thereof  
A method of creating domed shaped contacts on a printed circuit board includes etching a central opening in each copper pad, and then screening a mound of silver epoxy into the opening. The silver...
US20130175078 PRINTED CIRCUIT BOARD  
The printed circuit board comprises two first signal traces, a first grounding layer, two first signal traces, a second grounding layer, two signal conductive pillars and two grounding conductive...
US20130062101 MULTILAYER WIRING SUBSTRATE, AND MANUFACTURING METHOD FOR MULTILAYER SUBSTRATE  
A multilayer wiring board includes inner-layer wiring boards each having wirings on both sides thereof; electrically insulating substrates each having through-holes filled with a conductive paste;...
US20070187137 CERAMIC MULTILAYER SUBSTRATE  
A ceramic multilayer substrate includes a plurality of laminated ceramic layers and at least one conductor pattern and disposed on at least one of the ceramic layers. The ceramic multilayer...
US20140353027 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD  
A printed wiring board includes an insulative substrate having a penetrating hole, a first conductive layer formed on a first surface of the insulative substrate, a second conductive layer formed...
US20100096178 NON-SHIRINKAGE CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREOF  
A non-shrinkage ceramic substrate includes: a ceramic laminated body formed by laminating a plurality of green sheets; an electrode part including a via electrode penetratingly formed at the...
US20120298410 Interposer Testing Using Dummy Connections  
An interconnection component includes a substrate, and an active through-substrate via (TSV) penetrating through the substrate. Active metal connections are formed over the substrate and...
US20110108311 MULTILAYER PRINTED WIRING BOARD  
A multilayered printed circuit board including a substrate, a multilayered structure built thereon and having conductor circuits and interlaminar resin insulating layers in an alternate fashion,...
US20150075848 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME  
A wiring board includes multiple insulating layers including first, second, third, fourth and fifth insulation layers laminated in the order of the first, second, third, fourth and fifth...
US20100032202 Wiring substrate, wiring material, copper-clad laminate, and method of manufacturing the wiring substrate  
A wiring substrate of the invention comprises electrical insulation substrate (1), through-hole (3) formed in the electrical insulation substrate, electrically conductive paste (4) filled inside...
US20130299221 SPACE TRANSFORMER FOR PROBE CARD AND METHOD OF MANUFACTURING THE SAME  
There is provided a space transformer for a probe card, including: a substrate having a first surface and a second; a plurality of first pads formed on the first surface to be spaced apart from...

Matches 1 - 50 out of 229 1 2 3 4 5 >